CN220475983U

CN220475983U - Board card and electronic equipment

Info

Publication number: CN220475983U
Application number: CN202320950114.7U
Authority: CN
Inventors: 段启明; 刘琦
Original assignee: Thundercomm Technology Co ltd
Current assignee: Thundercomm Technology Co ltd
Priority date: 2023-04-24
Filing date: 2023-04-24
Publication date: 2024-02-09
Anticipated expiration: 2033-04-24

Abstract

The application discloses a board and electronic equipment belongs to board technical field. The board card comprises: the board card body is provided with a mounting surface, and the mounting surface comprises a non-edge area; the non-edge area is uniformly divided into a plurality of rows along a first direction and a plurality of columns along a second direction, wherein the first direction is perpendicular to the second direction, one row and one column form one unit area, and bonding pads are arranged in the unit areas; the center-to-center spacing between adjacent two pads in the first direction is 1.15 + -0.05 mm, and the center-to-center spacing between adjacent two pads in the second direction is 1.15 + -0.05 mm. The board that this application embodiment provided, the center-to-center spacing of adjacent pad is 1.15 + -0.05 millimeter, can make the board can satisfy under the low-size condition, can also satisfy the wiring of high-speed signal's arranging, and better adaptation is required to the pad of design high density simultaneously to when packaging the board, be convenient for encapsulate the board.

Description

Board card and electronic equipment

Technical Field

The application belongs to the technical field of board cards, and particularly relates to a board card and electronic equipment.

Background

Electronic packaging is a manufacturing process that assembles bare chips of integrated circuit design and microelectronic fabrication into electronic devices, circuit modules, and electronic complete machines, simply referred to as manufacturing electronics, or electronic manufacturing. Electronic packaging technology and semiconductor processing technology and the like together constitute electronic manufacturing science and technology. The electronic packaging technology is a subject of comprehensive cross-connection based on material science, by taking material processing and micro-nano manufacturing as means, by taking microminiaturization, high density and integration as characteristics and taking electronic product manufacturing as a research target, and relates to integrated circuit packaging, device packaging, board card packaging, assembly and the like. The board card packaging is used for designing various parameters of electronic components, chips and other devices, such as the size, length and width of the components, direct insertion, patches, the size and shape of a bonding pad, the length and width of a pin and the like, and reasonably assembling the various electronic components on the board card to realize corresponding functions, such as receiving and transmitting signals and the like.

In the related art, the size of the board is smaller, about 10-14 square centimeters, a plurality of pads, for example about 600 pads, are required to be arranged on one surface of the board, and a large amount of high-speed signals are required to be led out, in this case, the size of the board, the routing of the high-speed signals, the number of the pads, the size of the pads, the spacing between the pads and the like need to be comprehensively considered, so that the packaging of the board has certain difficulty, and in the related art, the spacing between the pads is larger, so that the packaging of the board cannot be adapted to the high-density requirements of design, namely, the packaging of the board is difficult.

Disclosure of Invention

The embodiment of the application aims to provide a board and electronic equipment, which can solve the problem that the board is difficult to package.

In a first aspect, embodiments of the present application provide a board, the board including: a board card body;

the board card body is provided with a mounting surface, and the mounting surface comprises a non-edge area; the non-edge area is uniformly divided into a plurality of rows along a first direction and a plurality of columns along a second direction, the first direction is perpendicular to the second direction, one row and one column form one unit area, and bonding pads are arranged in a plurality of unit areas;

the center-to-center spacing between two adjacent pads is 1.15 + -0.05 mm in the first direction and the center-to-center spacing between two adjacent pads is 1.15 + -0.05 mm in the second direction.

Optionally, the non-edge regions are uniformly divided into 27 rows along the first direction and the non-edge regions are uniformly divided into 32 columns along the second direction.

Optionally, the 27 rows include a first row and a last row along a first direction, and the 32 columns include a first column and a last column along a second direction;

the first row, the second row, the twenty-sixth row and the twenty-seventh row of the 27 rows comprise 28 bonding pads;

the third to seventh rows of the 27 rows, twenty-fourth and twenty-fifth rows each include 32 pads.

Optionally, the eighth to thirteenth rows of the 27 rows respectively include 6 pads arranged adjacently along the second direction from the first column; and/or

The eighth to thirteenth rows of the 27 rows respectively include 11 pads arranged adjacently along the second direction from the twenty-second column.

Optionally, the non-edge area is rectangular, and the non-edge area includes four corners, each corner includes 4 unit areas, and the four unit areas are distributed in 2 rows by 2 columns.

Optionally, each of the corners is provided with a large pad.

Optionally, the large pad disposed at one of four corners has a chamfer structure.

Optionally, each corner is provided with 4 bonding pads.

Optionally, at least one of the four corners is provided with only 1 pad, the 1 pad being disposed in a cell region distant from a first row, a first column, a last row, and a last column of the 27 rows; and/or the number of the groups of groups,

at least one corner of the four corners is provided with 3 bonding pads, wherein the bonding pads are not arranged in the unit areas which are positioned in the first row, the last column, the last row, the first column or the last row and the last column in the 4 unit areas of the corner provided with 3 bonding pads.

Optionally, a spacing between centers of two adjacent large pads along the first direction is 28.25 mm to 29.25 mm.

Optionally, in the second direction, a distance between centers of two adjacent large pads is 34 mm to 35 mm.

Optionally, the projection of the pad on the mounting surface is circular, and the diameter of the pad is 0.55 mm to 0.75 mm

In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes a device body and a board card as set forth in any one of the first aspects above;

the board card is located in the equipment body.

In this embodiment of the present application, because the non-edge area of the installation face of the board card body is divided into a plurality of rows and a plurality of columns, a row and a column form a unit area, pads are all provided in a plurality of unit areas, and in the first direction, the intermediate space between two adjacent pads is 1.15±0.05 millimeter, in the second direction, the center space between two adjacent pads is 1.15±0.05 millimeter, the center space between the pads on the board card body is less, the high density requirement to the design can be better adapted, thereby when packaging the board card, the board card is convenient for package.

Drawings

Fig. 1 shows one of the back views of a board provided in an embodiment of the present application;

FIG. 2 is a second view of a card according to the embodiment of the present application;

fig. 3 shows a third back view of a board card according to an embodiment of the present application.

Reference numerals:

001: a region; 10: a board card body; 101: a mounting surface; 100: a unit region; 20: a non-edge region; 21: a bonding pad; 200: corners; 201: first row; 202: a last row; 203: first column; 204: a final column; 30: a large bonding pad; 301: chamfering structure.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Before describing in detail the solutions provided by the embodiments of the present application, a description will be given of the technology related to the present application.

Pads, also known as solder joints, are commonly known by the application name pad or pin. The bonding pads are pins in a module or electronic device package, and in practical application, solder (including but not limited to, common circuit board soldering materials such as tin, lead-tin alloy, tin-silver-copper alloy, etc.) is used to connect the bonding pads and bonding pads of the component or module together.

A printed circuit board (Printed Circuit Board, pcb), also known as a printed circuit board, is an important electronic component, which is a support for electronic components, and is a carrier for the electronic components to be electrically connected to each other.

Packaging (Package) refers to placing an integrated circuit Die (Die) or chip on a substrate that serves as a carrier, bringing the pins out, and then fixedly packaging the Die or chip as a whole. The packaging form refers to the physical appearance and pin-out form of the chip or module.

Referring to fig. 1, one of the back views of a board provided in an embodiment of the present application is shown; referring to fig. 2, a second back view of a board card according to an embodiment of the present application is shown; referring to fig. 3, a third back view of a board card according to an embodiment of the present application is shown. As shown in fig. 1 to 3, the board includes: a board card body 10;

the card body 10 has a mounting surface 101, the mounting surface 101 including a non-edge region 20. The non-edge region 20 is uniformly divided into a plurality of rows along a first direction and a plurality of columns along a second direction, the first direction being perpendicular to the second direction, wherein one row and one column form one cell region 100, and pads 21 are disposed in each of the plurality of cell regions 100. The center-to-center spacing between adjacent two pads 21 in the first direction is 1.15±0.05 mm, and the center-to-center spacing between adjacent two pads 21 in the second direction is 1.15±0.05 mm.

In this embodiment, since the non-edge area 20 of the mounting surface 101 of the board card body 10 is divided into a plurality of rows and a plurality of columns, one row and one column form one unit area 100, the pads 21 are disposed in each of the plurality of unit areas 100, and the intermediate spacing between two adjacent pads 21 is 1.15±0.05 mm in the first direction, and the center spacing between two adjacent pads 21 is 1.15±0.05 mm in the second direction, if the center spacing of the pads exceeds this range, the spacing of the pads is larger, and it is difficult to adapt to the requirement of high density for hundreds of pads, if the spacing of the pads is lower than this range, the routing of the high-speed signal is affected, and it is difficult to meet the routing requirement. The board that this application embodiment provided, the center-to-center spacing of adjacent pad is 1.15 + -0.05 millimeter, can make the board under the condition that can satisfy the low size, when can also satisfy the wiring of high-speed signal's wiring, better adaptation is required to the pad of design high density to when packaging the board, be convenient for encapsulate the board.

Note that, in the embodiment of the present application, the center-to-center distance between two adjacent pads 21 in the first direction refers to the distance between the centers of two adjacent pads 21, for example, as shown by L1 in fig. 1. Wherein, the center-to-center spacing between two adjacent pads 21 may be any value of 1.15±0.05 mm. For example, the center-to-center spacing between adjacent two pads 21 is 1.10 mm, and for example, the center-to-center spacing between adjacent two pads 21 is 1.15 mm, and for example, the center-to-center spacing between adjacent two pads 21 is 1.20 mm. In addition, the center-to-center spacing between adjacent two pads 21 in the second direction refers to the distance between the centers of adjacent two pads 21, as shown, for example, in L2 in fig. 1. Wherein, the center-to-center spacing between two adjacent pads 21 may be any value of 1.15±0.05 mm. For example, the center-to-center spacing between adjacent two pads 21 is 1.10 mm, and for example, the center-to-center spacing between adjacent two pads 21 is 1.15 mm, and for example, the center-to-center spacing between adjacent two pads 21 is 1.20 mm.

It should be noted that, in the embodiment of the present application, fig. 1, fig. 2, and fig. 3 are all views of turning the back surface of the board card to the front surface, where the back surface is the mounting surface 101 of the board card. The front side of the board card can be provided with electronic components and other devices. Electronic components include, but are not limited to, integrated circuits (Integrated Circuit, ICs), shield boxes, shields, chips, capacitors, resistors, inductors, magnetic beads, and the like.

In some embodiments, the dimensions of the board are 39mm±1mm×33mm±1mm×0.8mm±0.2mm.

In some embodiments, the mounting surface further includes an edge region, wherein an edge region refers to an area of the mounting surface 101 other than the non-edge region 20. The area of the edge region may be larger than the area of the non-edge region, or may be smaller than the area of the non-edge region, or the areas of the two regions are the same.

It should be noted that, the shape of the board in this embodiment is not limited, and may be square, rectangular, trapezoidal, triangular, circular or irregular.

In some embodiments, components such as a pad, a capacitor, etc. may be disposed in the edge area, or no component may be disposed, which is not limited in this embodiment.

In some embodiments, the non-edge regions are provided with at least one pad on each of the first row 201 and the last row 202 along the first direction, and the mounting surface is provided with at least one pad on each of the first column 203 and the last column 204 along the second direction.

In some embodiments, the package form of the pad 21 is a Ball Grid Array (BGA) or a Land Grid Array (LGA) package form. Specifically, BGA forms include, but are not limited to, conventional pin-pitch BGAs, and different density ball-like pin grid array package forms such as FBGA (high density ball package) derived from BGAs.

In some embodiments, the package form of the pad is LGA (land grid array package form), i.e. the common shapes of the pads that make up such a package are: square, rounded rectangle, round, diamond, etc.

In some specific embodiments, the projected shape of the pads 21 on the mounting surface 101 is circular, and in some embodiments, the diameter of the circular pads 21 ranges from 0.55 millimeters to 0.75 millimeters. By such arrangement, the volume of the bonding pad 21 can be ensured to be smaller, and further, the subsequent packaging of the board is facilitated.

In some specific embodiments, the projection of the pad 21 onto the mounting surface 101 may also have other shapes, for example, the projection of the pad 21 onto the mounting surface 101 has a rectangular shape or a square shape, and for example, the projection of the pad 21 onto the mounting surface 101 has a diamond shape. For another example, the projected shape of the pad 21 on the mounting surface 101 is a rounded rectangle. For another example, the projected shape of the pad 21 on the mounting surface 101 is a triangle, a polygon, or an irregular shape. As for the specific shape of the projection of the pad 21 on the mounting surface 101, the embodiment of the present application is not limited thereto.

In addition, in the embodiment of the present application, the non-edge regions 20 are uniformly divided into 27 rows along the first direction, and the non-edge regions 20 are uniformly divided into 32 columns along the second direction. Through the arrangement, the bonding pads 21 on the board card can be tidy, and the subsequent bonding pads 21 are convenient to connect with other devices.

In some embodiments, the 27 rows include a first row 201 and a last row 202 along a first direction, and the 32 columns include a first column 203 and a last column 204 along a second direction. The first row 201, second row, twenty-sixth row, and twenty-seventh row of the 27 rows each include 28 pads 21. The third to seventh, twenty-fourth and twenty-fifth of the 27 rows each include 32 pads 21. Wherein, the first row 201 is opposite to the last row 202, the rest of the 27 rows are located between the first row 201 and the last row 202, the first column 203 is opposite to the last column 204, and the rest of the 32 columns are located between the first column 203 and the last column 204.

Specifically, the first row 201 includes 28 pads 21, and the 28 pads 21 are distributed in the direction from the first column 203 to the last column 204, that is, in the second direction. The second of the 27 rows includes 28 pads 21, and the 28 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The twenty-first one of the 27 rows includes 28 pads 21, and the 28 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction; the twenty-seventh of the 27 rows includes 28 pads 21, and the 28 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The third row of the 27 rows includes 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The fourth of the 27 rows includes 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The fifth row of the 27 rows includes 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The sixth of the 27 rows includes 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The seventh of the 27 rows includes 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The twenty-fourth of the 27 rows includes 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The twenty-fifth row of 27 rows includes 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The second sixteen rows of the 27 rows include 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction. The twenty-seventh of the 27 rows includes 32 pads 21, and the 32 pads 21 are distributed in the direction from the first column 203 to the last column 204, i.e., in the second direction.

In addition, in the embodiment of the present application, the first row 201, the second row, the twenty-first row, and the twenty-seventh row each include 28 pads 21, and one pad may be located in the first column 203 in each of the 28 pads 21 in each of the several rows, that is, the 28 pads 21 in each of the several rows may be counted from the first column 203. Of course, the 28 pads 21 in each of the rows may be counted from the 3 rd column, or may be counted from other columns, which is not limited to this embodiment.

In addition, in the embodiment of the present application, the first row 201, the second row, the twenty-first row, and the twenty-seventh row each include 28 pads 21, and the 28 pads 21 in each of the several rows may be continuously distributed, that is, the center-to-center distances between any two adjacent pads 21 in the 28 pads 21 in each row are equal.

In addition, in the embodiment of the present application, the third to seventh, twenty-fourth, and twenty-fifth rows of 27 rows each include 32 pads 21, which corresponds to 32 pads 21 of each of the several rows being respectively located in 32 columns, so that the 32 pads 21 of each row are continuously distributed, and the center-to-center distances between any adjacent two pads 21 of the 32 pads 21 of each row are equal.

In addition, in the embodiment of the present application, the eighth row to the thirteenth row of the 27 rows respectively include 6 pads 21 arranged adjacently along the second direction from the first column 203; and/or, the eighth to thirteenth rows of the 27 rows respectively include 11 pads 21 arranged adjacently along the second direction from the twenty-second column.

Here, the eighth row may include only 6 pads 21 arranged adjacently along the second direction from the first column 203, may include only 11 pads 21 arranged adjacently along the second direction from the twenty-second column, and may include both 6 pads 21 arranged adjacently along the second direction from the first column 203 and 11 pads 21 arranged adjacently along the second direction from the twenty-second column. The arrangement of the pads 21 in the ninth to twenty-third rows may refer to the arrangement of the pads 21 in the eighth row, and will not be described herein.

In addition, in the embodiment of the present application, when each of the eighth to twenty-third rows includes 6 pads 21 arranged adjacently along the second direction from the first column 203 and 11 pads 21 arranged adjacently along the second direction from the twenty-second column, as shown in fig. 1, in the eighth to twenty-third rows, a region 001 formed from the seventh to twenty-first columns may be provided in the region 001, and other electronic components may be provided according to actual needs, for example, a shielding frame and/or a shielding case may be provided, for example, an IC may be provided, for example, a resistor may be provided, for example, a capacitor may be provided, for example, a chip may be provided, for example, a magnetic bead may be provided, and in some embodiments, the region 001 is provided with a chip covered with a shielding frame for shielding interference of signals to the chip, and the shielding frame may be a metal shielding frame, for example. Of course, the region 001 may also be silk-screened, laser, solder resist, etc., and the embodiments of the present application are not limited herein for the device specifically set in the region 001. Where the pads 21 are provided in the region 001, the pads 21 in the region 001 may correspond to the pad 21 positions in the corresponding row.

In addition, in the embodiment of the present application, when the eighth row includes only 6 pads 21 that are adjacently arranged in the second direction from the first column 203, the pads 21 may be provided at other positions from the seventh column in the eighth row, the pads 21 may not be provided, and the pads 21 may be provided at some of these other positions, as required. For the arrangement of the pads 21 in the ninth to thirteenth rows, reference may be made to the arrangement of the pads 21 in the eighth row, and details thereof will not be repeated here.

In addition, in the embodiment of the present application, when the eighth row includes only 11 pads 21 arranged adjacently along the second direction from the twenty-second column, the pads 21 may be provided at other positions from the first column in the eighth row, the pads 21 may not be provided, and the pads 21 may be provided at some of these other positions. For the arrangement of the pads 21 in the ninth to thirteenth rows, reference may be made to the arrangement of the pads 21 in the eighth row, and details thereof will not be repeated here.

In addition, in some embodiments, the non-edge region 20 may be rectangular, and the non-edge region 20 includes four corners 200, each corner 200 including 4 cell regions 100, the four cell regions 100 being distributed in 2 rows by 2 columns. By such an arrangement, devices can be arranged in each corner 200 as actually needed, and the board can be subsequently connected with other devices.

Of course, the non-edge region 20 may have other shapes, for example, the non-edge region 20 is hexagonal, for example, the non-edge region 20 is octagonal, for example, the non-edge region 20 is circular, and the specific shape of the non-edge region 20 is not limited herein.

In addition, in some embodiments, as shown in fig. 1, one large pad 30 is provided per corner 200. At this time, one large pad 30 corresponds to 4 unit areas 100 covering one corner 200, and when the board is subsequently connected to other devices, the board can be connected to other devices by soldering the large pad 30. I.e., one large pad 30 is provided at each corner 200, which may facilitate connection of a subsequent board to other devices.

The large pad 30 is a pad having a size larger than that of the pad 21.

The shape of the projection of the large pad 30 on the mounting surface 101 may be set according to actual needs, for example, the shape of the projection of the large pad 30 on the mounting surface 101 is a diamond shape, and the shape of the projection of the large pad 30 on the mounting surface 101 is a circle shape. The embodiment of the present application is not limited to this specific shape of the projection of the large pad 30.

In addition, in the embodiment of the present application, as shown in fig. 1, the large pad 30 provided at one corner 200 of the four corners 200 has a chamfer structure 301.

When one large bonding pad 30 has the chamfer structure 301, at this time, the large bonding pad 30 has the marking function, and in the following mounting board card to the electronic device, the mounting direction of the board card can be distinguished through the chamfer structure 301 of the large bonding pad 30, so that the mounting board card is facilitated. That is, by providing the chamfer structure 301 on one large pad 30, the subsequent mounting board card can be facilitated.

Of course, in the embodiment of the present application, all of the large pads 30 may not be provided with the chamfer structures 301, and also the chamfer structures 301 may be provided for a part of the large pads 30. The embodiment of the present application is not limited to this as to whether the chamfer structure 301 is provided on the large pad 30 and the number of the large pads 30 on which the chamfer structure 301 is provided.

In addition, in some embodiments, each corner 200 may be provided with 4 pads 21, respectively. With such an arrangement, when the board is subsequently connected to other devices, the board can be soldered to the other devices through the 4 pads 21 at each corner 200, so that the board can be connected to the other devices conveniently.

In addition, in some embodiments, at least one corner 200 of the four corners 200 is provided with only 1 pad 21,1 pad 21 being disposed within the cell region 100 away from the first row, first column, last row, and last column of the 27 rows; and/or, at least one corner 200 of the four corners 200 is provided with 3 pads 21, wherein among the 4 unit areas 100 of the corner 200 where 3 pads 21 are provided, no pad 21 is provided within the unit area 100 located in the first row, the last column, the last row, the first column, or the last row, last column (see the corner in the upper right corner of fig. 2).

In some embodiments, only 1 pad 21 may be disposed in one corner 200 of four corners 200, only 1 pad 21 may be disposed in 2 corners 200, only 1 pad 21 may be disposed in 3 corners 200, and only 1 pad may be disposed in each corner 200 of four corners 200.

In some embodiments, there may be 3 pads 21 at one corner 200 of the four corners 200, 3 pads 21 at 2 corners 200, 3 pads 21 at 3 corners 200, and 3 pads at each corner 200 of the four corners 200.

In some embodiments, only 1 pad may be provided in one corner 200 of four corners 200, and 3 pads may be provided in each of the remaining three corners 200; only 1 pad may be provided in 2 of the four corners 200, and 3 pads may be provided in each of the remaining 2 corners 200; of the four corners 200, 3 corners 200 may be provided with only 1 pad, and the remaining 1 corner 200 is provided with 3 pads.

It will be appreciated that when only one of the four corners 200 may be provided with only 1 pad, the corner provided with 1 pad 21 has the function of identification, i.e. during the process of mounting the board card, the direction recognition can be performed through the corner, so that the subsequent board card mounting is facilitated. Only 1 bonding pad is disposed in at least two corners 200 of the four corners 200, and at this time, bonding pads 21 on the corners 200 can be welded to other devices, so that the welding position of the board card can be increased, and the board card can be connected to other devices conveniently.

It will be appreciated that when only one corner 200 of the four corners 200 is provided with 3 pads 21, this corner where 3 pads 21 are provided may also have the effect of identifying, i.e. during the mounting of the board, the direction may be identified through this corner, facilitating the subsequent mounting of the board.

Alternatively, the number of pads 21 at each corner 200 may be set according to actual needs, for example, the number of pads 21 at each corner 200 is 4, and for example, the number of pads 21 at each corner 200 is 5. The embodiments of the present application are not limited herein with respect to the specific number of pads 21 at each corner 200.

In addition, in the present embodiment, the pitch between the centers of two adjacent large pads 30 in the first direction is 28.25 mm to 29.25 mm. By such arrangement, the bonding pads 21 and the large bonding pads 30 on the board can be made compact, so that the board can be packaged later.

Note that the pitch between the centers of the adjacent two large pads 30 may be any one of 28.25 mm to 29.25 mm in the first direction, for example, the pitch between the adjacent two large pads 30 in the first direction is 28.25 mm, and for example, the pitch between the adjacent two large pads 30 in the first direction is 28.75 mm, and for example, the pitch between the adjacent two large pads 30 in the first direction is 29.25 mm. As for the specific value of the spacing between the centers of two adjacent large pads 30 in the first direction, the embodiment of the present application is not limited herein.

In addition, in some embodiments, the spacing between the centers of adjacent two large pads 30 in the second direction ranges from 34 millimeters to 35 millimeters. By such arrangement, the bonding pads 21 and the large bonding pads 30 on the board can be made compact, so that the board can be packaged later.

Note that, in the second direction, the pitch between the centers of the adjacent two large pads 30 may be any one of 34 mm to 35 mm, for example, the pitch between the adjacent two large pads 30 in the first direction is 34 mm, for example, the pitch between the adjacent two large pads 30 in the first direction is 34.5 mm, for example, and for example, the pitch between the adjacent two large pads 30 in the first direction is 35 mm.

In addition, in the embodiment of the present application, for four corners 200, one corner 200 may be provided with three pads 21, and the other 3 corners 21 are provided with 4 pads, at this time, the corner 200 provided with 3 pads 21 may serve as the chamfer structure 301, and when the board is mounted, the mounting direction of the board may be resolved by the corner 200.

In this embodiment of the present application, since the non-edge area 20 of the mounting surface 101 of the board card body 10 is divided into a plurality of rows and a plurality of columns, one row and one column form one unit area 100, pads 21 are all disposed in the plurality of unit areas 100, and the intermediate spacing between two adjacent pads 21 is 1.15±0.05 mm in the first direction, and the center spacing between two adjacent pads 21 is 1.15±0.05 mm in the second direction, the center spacing between the pads 21 on the board card body 10 is smaller in this application, so that when packaging the board card, the high density requirements for design can be better adapted, and the board card is conveniently packaged.

The embodiment of the application provides electronic equipment, which comprises an equipment body and the board card in any one of the embodiments. The board card is positioned in the equipment body.

In some embodiments, the electronic device includes, but is not limited to, a controller, a smart device, an end product, and the like, where the smart device is, for example, a smart phone, a smart television, a smart speaker, a smart robot, a VR device, an AR device, an XR device, and the like, and the end product includes, for example, a personal computer, a tablet computer, and the like.

It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.

While alternative embodiments to the embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following appended claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the scope of the embodiments of the present application.

Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude that an additional identical element is present in an article or terminal device comprising the element.

While the foregoing has been described in some detail by way of illustration of the principles and embodiments of the present application, and in accordance with the principles and implementations of the present application, those of ordinary skill in the art will readily recognize that there could be variations to the principles and implementations of the present application and, therefore, should not be construed as limited to the embodiments set forth herein.

Claims

1. A board, characterized in that, the board includes: a board card body;

2. The board of claim 1, wherein the non-edge regions are uniformly divided into 27 rows along a first direction and the non-edge regions are uniformly divided into 32 columns along a second direction.

3. The board of claim 2, wherein the 27 rows comprise a first row and a last row along a first direction, and the 32 columns comprise a first column and a last column along a second direction;

4. A board according to claim 3, wherein the eighth to thirteenth rows of the 27 rows each include 6 pads arranged adjacently along the second direction from the first column; and/or

5. The board of any of claims 2-4, wherein the non-edge area is rectangular, the non-edge area comprising four corners, each corner comprising 4 cell areas, the four cell areas being distributed in 2 rows by 2 columns.

6. The board card of claim 5, wherein each corner is provided with a large pad.

7. The board card of claim 6, wherein the large pads disposed at one of the four corners have a chamfer structure.

8. The board card of claim 5, wherein each corner is provided with 4 of the pads, respectively.

9. The board card of claim 5, wherein at least one of the four corners is provided with only 1 pad, the 1 pad being disposed in a cell area distant from a first row, a first column, a last row, and a last column of the 27 rows; and/or the number of the groups of groups,

10. The board card of claim 6, wherein a spacing between centers of two adjacent large pads in the first direction is 28.25 mm to 29.25 mm.

11. The board card of claim 6, wherein a spacing between centers of adjacent two of the large pads in the second direction is 34 mm to 35 mm.

12. The board card of any of claims 1-4, 6-11, wherein the projected shape of the pads on the mounting surface is circular, and the diameter of the pads is 0.55 mm to 0.75 mm.

13. An electronic device, characterized in that the electronic device comprises a device body and the board card of any one of claims 1 to 12;

the board card is located in the equipment body.