CN220474656U

CN220474656U - Packaging structure, display module and display device

Info

Publication number: CN220474656U
Application number: CN202322024175.3U
Authority: CN
Inventors: 刘凌俊; 王伟棠; 余诚志; 祁峰
Original assignee: Shenzhen Zhouming Technology Co Ltd
Current assignee: Shenzhen Zhouming Technology Co Ltd
Priority date: 2023-07-28
Filing date: 2023-07-28
Publication date: 2024-02-09
Anticipated expiration: 2033-07-28

Abstract

The utility model relates to a packaging structure, a display module and a display device, wherein the packaging structure comprises a first packaging layer, a second packaging layer and a third packaging layer which are stacked, the first packaging layer is an anti-UV flame-retardant colorless transparent film layer, the second packaging layer is an adhesive layer, and the third packaging layer is an anti-UV flame-retardant black transparent film layer. The packaging structure can be used for packaging the display module, and the UV resistance and flame retardance of the display module are effectively improved by utilizing the sandwich layer principle of the packaging structure. Meanwhile, the packaging structure is used for packaging the display module, plays a role in sealing the display module, and can effectively improve the moisture resistance of the display unit in the display module, so that the service life of the display module is effectively prolonged.

Description

Packaging structure, display module and display device

Technical Field

The present utility model relates to the field of display technologies, and in particular, to a packaging structure, a display module, and a display device.

Background

Compared with other flat panel displays, the LED display screen has higher brightness and contrast, the display color is closest to the natural true color, the service life is longer, and the power consumption is lower; and the box body is used as a unit, infinite assembly can be realized, so that the limit of the size can be broken through, and the method is widely applied to the fields of meeting forums, commercial media, industry control centers, stadiums, securities trading, virtual shooting, high-end cinema screens and the like.

Along with the smaller and smaller point spacing of the LED display module, the image fineness and the gray level are higher and higher, and the module develops a small spacing below P2 and a chip-on-Board (COB) packaging process adopted by Mini LEDs below P1.0 and Micro LED modules from SMD (Surface Mount Device) and a face mask process. With the increasing perfection of the COB technology, markets such as large-space outdoor solid installation and leasing become a trend, but the current COB display module can only meet indoor requirements, and cannot meet outdoor harsh UV resistance and flame resistance requirements.

Disclosure of Invention

Based on this, this application provides a UV resistant and fire-retardant effectual packaging structure, display module assembly and display device.

The technical scheme for solving the technical problems is as follows.

The application provides a packaging structure in one aspect, packaging structure is including range upon range of first encapsulation layer, second encapsulation layer and the third encapsulation layer that sets up, first encapsulation layer is anti UV fire-retardant colorless transparent rete, the second encapsulation layer is the tie coat, the third encapsulation layer is anti UV fire-retardant black transparent rete.

In one embodiment, in the package structure, the first package layer is a polytetrafluoroethylene film layer.

In one embodiment, in the package structure, the thickness of the first package layer is 20 μm to 40 μm.

In one embodiment, the third encapsulation layer includes polytetrafluoroethylene and melanin.

In one embodiment, the thickness of the third encapsulation layer in the encapsulation structure is 20 μm to 40 μm.

In one embodiment, in the package structure, the second package layer is an epoxy adhesive layer, a silicone adhesive layer, or a silicone adhesive layer.

In one embodiment, the thickness of the second encapsulation layer is 80 μm to 350 μm in the encapsulation structure.

In one embodiment, in the package structure, the light transmittance of the first package layer is 90% -98%, and the light transmittance of the third package layer is 60% -80%.

The utility model provides a display module assembly on the other hand, display module assembly includes display structure and above-mentioned packaging structure, packaging structure locates on the display structure with encapsulation display structure, just first packaging layer is located display structure with between the second packaging layer.

In one embodiment, in the display module, the first film layer is concave-convex, the display structure includes a substrate and a display unit disposed on the substrate, and the first packaging layer coats the display unit.

In one embodiment, the display module includes a plurality of display units, the thickness of the second packaging layer corresponding to the display units is 80 μm-230 μm, and the thickness of the second packaging layer corresponding to the position where the display units are not provided is 200 μm-350 μm.

The application also provides a display device, which comprises the display module.

Compared with the prior art, the COB module packaging adhesive film has the following beneficial effects:

above-mentioned packaging structure, including range upon range of specific first encapsulation layer, second encapsulation layer and the third encapsulation layer that sets up, it can be used to package up the display module assembly, utilizes packaging structure's "sandwich layer principle, effectively promotes the anti UV ability and the fire behaviour of display module assembly. Meanwhile, the packaging structure is used for packaging the display module, plays a role in sealing the display module, and can effectively improve the moisture resistance of the display unit in the display module, so that the service life of the display module is effectively prolonged.

Drawings

Fig. 1 is a schematic structural diagram of a package structure 100 according to an embodiment;

fig. 2 is a schematic structural diagram of a display module 10 according to an embodiment.

Reference numerals illustrate:

10. a display module;

100. a package structure; 110. a first encapsulation layer; 120. a second encapsulation layer; 130. a third encapsulation layer; 200. a display structure; 210. a substrate; 220. a display unit; 230. a lamp foot; 240. and welding spots.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Referring to fig. 1, fig. 1 shows a schematic structural diagram of a package structure 100 according to an embodiment of the present utility model, and the package structure 100 according to an embodiment of the present utility model is provided, where the package structure 100 includes a first package layer 110, a second package layer 120 and a third package layer 130 stacked together, the first package layer 110 is a UV-resistant flame-retardant colorless transparent film layer, the second package layer 120 is an adhesive layer, and the third package layer 130 is a UV-resistant flame-retardant black transparent film layer.

Above-mentioned packaging structure, including range upon range of specific first encapsulation layer, second encapsulation layer and the third encapsulation layer that sets up, it can be used to package up the display module assembly, utilizes packaging structure's "sandwich layer principle, effectively promotes the anti UV ability and the fire behaviour of display module assembly.

Meanwhile, the packaging structure is used for packaging the display module, plays a role in sealing the display module, and can effectively improve the moisture resistance of the display unit in the display module, so that the service life of the display module is effectively prolonged.

In some examples, in the package structure 100, the first package layer 110 is a polytetrafluoroethylene film layer.

It can be understood that Polytetrafluoroethylene (PTFE) is also known as Teflon, commonly called "Plastic King", which is a polymer prepared by polymerizing tetrafluoroethylene as a monomer and has the chemical formula (C) ₂ F ₄ ) n, has excellent heat resistance and cold resistance, and can be up to-180 percentCan be used at 260 deg.C for a long period. The material has the characteristics of acid resistance, alkali resistance and resistance to various organic solvents.

It is further understood that the polytetrafluoroethylene film is colorless and transparent and has UV and flame retardant properties.

In some examples, the thickness of the first encapsulation layer 110 in the encapsulation structure 100 is 20 μm to 40 μm.

It is understood that the thickness of the first encapsulation layer 110 includes, but is not limited to, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 35 μm, 38 μm, 40 μm. The following holds true for the range that any two of these point values may be made up as end values in some examples. For example, the thickness of the first encapsulation layer 110 is 20 μm to 30 μm, 25 μm to 35 μm, 30 μm to 40 μm.

Optionally, the thickness of the first encapsulation layer 110 is 25 μm to 30 μm.

In some examples, the light transmittance of the first encapsulation layer 110 in the encapsulation structure 100 is 90% -98%.

In some of these examples, the third encapsulation layer 130 includes polytetrafluoroethylene and melanin in the encapsulation structure 100.

It is understood that the third encapsulation layer 130 may be obtained by mixing polytetrafluoroethylene and melanin and drying.

Further, melanin includes, but is not limited to, carbon black.

It is further understood that the third encapsulation layer 130 is black, transparent, and has UV and flame retardant properties.

In some examples, the thickness of the third encapsulation layer 130 in the encapsulation structure 100 is 20 μm to 40 μm.

It is understood that the thickness of the third encapsulation layer 130 includes, but is not limited to, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 35 μm, 38 μm, 40 μm.

Optionally, the thickness of the third encapsulation layer 130 is 25 μm to 30 μm.

In some examples, the light transmittance of the third encapsulation layer 130 in the encapsulation structure 100 is 60% -80%.

In some examples, in the package structure 100, the second package layer 120 is an epoxy glue layer, a silicone glue layer, or a silicone glue layer.

Optionally, the second encapsulation layer 120 is an epoxy layer.

Further, the epoxy glue layer 120 has a flame retardant rating of V-1/V-2.

Further, the UV resistance of the epoxy glue layer 120 is less than or equal to 500 hours.

In some examples, the thickness of the second encapsulation layer 120 in the encapsulation structure 100 is 50 μm to 350 μm.

It is understood that the thickness of the second encapsulation layer includes, but is not limited to, 50 μm, 80 μm, 100 μm, 120 μm, 140 μm, 150 μm, 160 μm, 180 μm, 200 μm, 210 μm, 220 μm, 230 μm, 250 μm, 260 μm, 280 μm, 300 μm, 320 μm, 340 μm.

Optionally, the thickness of the second encapsulation layer 120 is 200 μm to 300 μm.

Referring to fig. 2, fig. 2 shows a schematic structural diagram of a display module 10 according to another embodiment of the present utility model, and another embodiment of the present utility model provides a display module 10, including a display structure 200 and the above-mentioned packaging structure 100, wherein the packaging structure 100 is disposed on the display structure 200 to package the display structure 200, and the first packaging layer 110 is located between the display structure 200 and the second packaging layer 120.

The application provides a display module assembly, the surface of display structure is provided with above-mentioned packaging structure for the anti UV ability and the fire behaviour of display module assembly are better.

It can be appreciated that the display structure 200 is followed by the first encapsulation layer 110, the second encapsulation layer 120, and the third encapsulation layer 130.

In some examples, in the display module 10, the display structure 200 includes a substrate 210 and a display unit 220 disposed on the substrate 210, and the first encapsulation layer 110 encapsulates the display unit 220.

In some examples, in the display module 10, the first encapsulation layer 110 encapsulates the display unit 220 and the substrate 210.

In some of these examples, the display module 10, the substrate 210 includes, but is not limited to, a PCB board.

In some of these examples, display unit 220 includes, but is not limited to, an LED die in display module 10.

Further, the LED chip includes red (R), green (G), blue (B).

It will be appreciated that in some examples, the display module 10 is a COB module.

In some examples, in the display module 10, the display structure 200 further includes a lamp pin 230 and a welding point 240, the lamp pin 230 is disposed on one side of the display unit 220, and the lamp pin 230 on one side of the display unit 220 is connected to the substrate 210 through the welding point 240, so that the display unit 220 is fixed on the display unit 210.

In some examples, the display module 10 includes a plurality of display units 200.

In some examples, the LED chip in the display module 10 includes at least red (R), green (G), and blue (B).

In some examples, in the display module 10, the thickness of the first encapsulation layer at the location corresponding to the display unit may be the same as or different from the thickness of the first encapsulation layer at the location corresponding to the location where the display unit is not provided.

It is understood that the display unit has a thickness. That is, in some examples, in the display structure 200, a surface of the first encapsulation layer away from the display unit corresponding to the display unit and a surface of the first encapsulation layer away from the substrate corresponding to the display unit not provided with the display unit are in an uneven shape.

It can be understood that the first encapsulation layer corresponding to the display unit is convex, and the first encapsulation layer corresponding to the display unit not provided with the display unit is concave.

In some examples, in the display module 10, the surface of the first encapsulation layer away from the display unit corresponding to the display unit and the surface of the first encapsulation layer away from the substrate corresponding to the display unit not provided with the display unit may be parallel to the substrate or arc-shaped, respectively.

In some examples, in the display module 10, the thickness of the second encapsulation layer 120 corresponding to the display unit 210 is 80 μm to 230 μm, and the thickness of the second encapsulation layer 210 corresponding to the display unit 210 not provided is 200 μm to 350 μm.

It is understood that the thickness of the second encapsulation layer corresponding to the display unit may be different from the thickness of the second encapsulation layer corresponding to the display unit not provided with the display unit.

In some examples, in the display module 10, a surface of the second encapsulation layer 120 away from the first encapsulation layer 110 corresponding to the display unit 220 is in the same plane as a surface of the second encapsulation layer 120 away from the first encapsulation layer 110, where the display unit 220 is not disposed. I.e. the second encapsulation layer provided at the display unit and where the display unit is not provided is parallel to the substrate.

An embodiment of the utility model provides a display device, which comprises the display module.

In some examples, the display device includes one or more tiled display modules described above. That is, in one example, the display device may include a single display module. Alternatively, in another example, the display device may be a large-sized display device formed by splicing a plurality of display modules.

In some of these examples, the display device may be understood to include, but is not limited to, a display screen. Further, the display screen includes, but is not limited to, an LED display screen. Further, the LED display screen comprises the COB module.

It can be understood that the display device provided by the application comprises the display module, so that the display device is endowed with better UV resistance and flame retardance; and the packaging structure is used for packaging the display module, can play a sealing role on the display module, and can also effectively improve the moisture resistance of the display unit in the display module, so that the service life of the display module is effectively prolonged, and the service life of the display device is further prolonged.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The packaging structure is characterized by comprising a first packaging layer, a second packaging layer and a third packaging layer which are arranged in a stacked mode, wherein the first packaging layer is an anti-UV flame-retardant colorless transparent film layer, the second packaging layer is an adhesive layer, and the third packaging layer is an anti-UV flame-retardant black transparent film layer.

2. The package structure of claim 1, wherein the thickness of the first encapsulation layer is 20 μm to 40 μm.

3. The package structure of claim 1, wherein the thickness of the third encapsulation layer is 20 μm to 40 μm.

4. A package structure according to any one of claims 1 to 3, wherein the light transmittance of the first package layer is 90% to 98%, and the light transmittance of the third package layer is 60% to 80%.

5. A package structure according to any one of claims 1 to 3, wherein the second package layer is an epoxy glue layer, a silicone glue layer or a silicone glue layer.

6. A package structure according to any one of claims 1 to 3, wherein the thickness of the second encapsulation layer is 80 μm to 350 μm.

7. A display module, wherein the display module comprises a display structure and the packaging structure according to any one of claims 1 to 6, the packaging structure is disposed on the display structure to package the display structure, and the first packaging layer is disposed between the display structure and the second packaging layer.

8. The display module of claim 7, wherein the display structure comprises a substrate and a display unit disposed on the substrate, and the first encapsulation layer encapsulates the display unit.

9. The display module of claim 8, wherein the display units are plural, the thickness of the second encapsulation layer corresponding to the display units is 80 μm to 230 μm, and the thickness of the second encapsulation layer corresponding to the display units not provided with the display units is 200 μm to 350 μm.

10. A display device comprising the display module of any one of claims 8 to 9.