CN220474471U - Integrated inductance high temperature forming device - Google Patents

Integrated inductance high temperature forming device Download PDF

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Publication number
CN220474471U
CN220474471U CN202321921882.6U CN202321921882U CN220474471U CN 220474471 U CN220474471 U CN 220474471U CN 202321921882 U CN202321921882 U CN 202321921882U CN 220474471 U CN220474471 U CN 220474471U
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China
Prior art keywords
plate
die holder
temperature
heat insulation
plates
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CN202321921882.6U
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Chinese (zh)
Inventor
苏学远
苏立良
宋树华
苏立锋
刘明松
龙清寿
文彪
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Chuangyi Technology Changsha Co ltd
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Chuangyi Technology Changsha Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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Abstract

The utility model provides an integrated inductor high-temperature forming device which comprises a frame, wherein a forming table is arranged in the middle of the frame, a lifting table is arranged above the forming table, a lifting cylinder is arranged at the top of the lifting table, a piston rod of the lifting cylinder is downwards connected with an upper die holder, and an upper die unit is arranged at the bottom of the upper die holder; the forming table is provided with a lower die holder, the top of the lower die holder is provided with a lower die unit, guide posts with the number more than 2 are vertically fixed between the lifting table and the forming table, guide post holes are formed in the edges of the upper die holder and the lower die holder, and the guide post holes are sleeved with corresponding guide posts. The structure is reasonable and the use effect is good after the scheme is adopted.

Description

Integrated inductance high temperature forming device
Technical Field
The utility model relates to the technical field of inductors, in particular to an integrated inductor high-temperature forming device.
Background
With the continuous development of electronic technology, the inductor is one of basic elements forming an electronic circuit, and the type of the inductor is also endless, so that the integrally formed inductor is increasingly favored in the field of electronic devices due to the characteristics of small volume, large current, high production efficiency and the like. At present, an integrated inductor is formed by adopting an induction die heating and curing mode to form metal powder and a coil, and generally the induction die comprises an upper die and a lower die, an induction forming frame (die) is placed on a lower die table during hot pressing, the induction is pressed and heated and formed through pressing down of the upper die, the existing upper die and the lower die are all in a planar mode, the heating area of the mode is large, heat at an induction gap is easy to waste, and meanwhile, the temperature in the middle of the die is higher than that at the edge during heating, so that uneven heating is caused.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provide the integrated inductor high-temperature forming device which is reasonable in structure and good in using effect.
In order to achieve the above purpose, the technical scheme provided by the utility model is as follows: the integrated inductor high-temperature forming device comprises a frame, wherein a forming table is arranged in the middle of the frame, a lifting table is arranged above the forming table, a lifting cylinder is arranged at the top of the lifting table, a piston rod of the lifting cylinder is downwards connected with an upper die holder, and an upper die unit is arranged at the bottom of the upper die holder; the forming table is provided with a lower die holder, the top of the lower die holder is provided with a lower die unit, guide posts with the number more than 2 are vertically fixed between the lifting table and the forming table, guide post holes are formed in the edges of the upper die holder and the lower die holder, and the guide post holes are sleeved with corresponding guide posts.
The lower die unit comprises lower heat insulation strips, lower base plates and lower high-temperature plates, wherein the lower heat insulation strips with the number larger than 2 are fixed at the bottom of the lower base plates, the lower heat insulation strips are supported by lower die holders, a lower heat dissipation area is reserved between the adjacent lower heat insulation strips, a plurality of lower plate grooves formed by recessing are arranged at the top of the lower base plates, each lower plate groove is embedded with one lower high-temperature plate, the lower high-temperature plates are distributed on the lower base plates in a matrix mode, and the surfaces of the lower high-temperature plates are higher than the surfaces of the lower base plates.
The upper die unit comprises upper heat insulation strips, upper base plates and upper high-temperature plates, wherein the upper heat insulation strips with the number larger than 2 are arranged at the top of the upper base plates, the upper heat insulation strips are connected with the bottom of the upper die holder, upper heat dissipation areas are reserved between adjacent upper heat insulation strips, n-shaped upper plate grooves are distributed at the bottom of the upper base plates in a matrix mode, the upper high-temperature plates are embedded in the upper plate grooves, and the upper Wen Bande parts extend out of the bottoms of the upper base plates.
Heating plates are arranged in the upper base plate and the lower base plate, and are contacted with the corresponding lower high temperature plate and the upper high temperature plate.
After the scheme is adopted, the forming frame is placed on the lower die unit of the lower die holder, the upper die holder and the upper die unit are driven to descend by the lifting cylinder, the upper die unit and the lower die unit are respectively contacted with the top and the bottom of the forming frame, the heating plate heats the core blank in the forming frame through the high-temperature plate, and therefore solidification is formed.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present utility model.
Fig. 2 is a schematic diagram of a lower die unit structure according to the present utility model.
Detailed Description
The utility model is further described below with reference to all drawings, and in a preferred embodiment of the utility model, referring to fig. 1 and 2, a forming table 2 is arranged in the middle of the frame 1, a lifting table 3 is arranged above the forming table 2, a lifting cylinder 4 is installed at the top of the lifting table 3, a piston rod of the lifting cylinder 4 is downward connected with an upper die holder 5, and an upper die unit is installed at the bottom of the upper die holder 5; the forming table 2 is provided with a lower die holder 6, the top of the lower die holder 6 is provided with a lower die unit, guide posts 7 with the number more than 2 are vertically fixed between the lifting table 3 and the forming table 2, guide post holes are formed in the edges of the upper die holder 5 and the lower die holder 6, and the guide post holes are sleeved with the corresponding guide posts 7.
The lower die unit comprises lower heat insulation strips 8, lower base plates 9 and lower high-temperature plates 10, wherein the lower heat insulation strips 8 with the number larger than 2 are fixed at the bottom of the lower base plates 9, the lower heat insulation strips 8 are supported by lower die holders 6, a lower heat dissipation area is reserved between the adjacent lower heat insulation strips 8, a plurality of lower plate grooves formed by concave downwards are arranged at the top of the lower base plates 9, each lower plate groove is embedded with one lower high-temperature plate 10, the lower high-temperature plates 10 are distributed on the lower base plates 9 in a matrix mode, and the surface of each lower high-temperature plate 10 is higher than that of the lower base plates 9.
The upper die unit comprises upper heat insulation strips 11, upper base plates 12 and upper high-temperature plates 13, wherein the upper heat insulation strips 11 with the number larger than 2 are arranged at the top of the upper base plates 12, the upper heat insulation strips 11 are connected with the bottom of the upper die holder 5, upper heat dissipation areas are reserved between the adjacent upper heat insulation strips 11, n-shaped upper plate grooves are distributed at the bottom of the upper base plates 12 in a matrix mode, the upper high-temperature plates 13 are embedded in the upper plate grooves, and the bottoms of the upper high-temperature plates 13 extend out of the bottoms of the upper base plates 12. Heating plates are arranged in the upper base plate 12 and the lower base plate 9, and are contacted with the corresponding lower high temperature plate 10 and the upper high temperature plate 13.
Placing a forming frame on a lower die unit of a lower die holder, and an inductance core blank, wherein an upper high-temperature plate is opposite to the top of the core blank, a lower high-temperature plate is in contact with the forming frame at the bottom of the core blank, the upper die holder and the upper die unit are driven to descend by a lifting cylinder, the bottom of the lower high-temperature plate is in contact with the surface of the core blank, the heating plate heats the core blank in the forming frame through the high-temperature plate to form solidification, and an air channel can be formed between adjacent high-temperature plates by adopting the high-temperature plates distributed in a matrix mode, so that the temperature in the center of the die is prevented from being too high, a one-to-one (one group of high-temperature plates are opposite to one inductance) mode is adopted, the heat transfer effect is more uniform, and the yield after pressing is higher; the bottom and the top of the die are separated by the heat insulation strips, so that the temperature on the backing plate can be dispersed from the adjacent heat insulation strips and cannot be transferred to the die holder too much, the strength of materials required for manufacturing the die holder is reduced, and the control of the cost is facilitated.
The above-mentioned embodiments are only preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model, so that all changes made in the shape and principles of the present utility model are covered by the scope of the present utility model.

Claims (4)

1. The utility model provides an integrated inductance high temperature forming device, it is including frame (1), and frame (1) middle part is equipped with shaping platform (2), and shaping platform (2) top is equipped with elevating platform (3), its characterized in that: a lifting cylinder (4) is arranged at the top of the lifting table (3), a piston rod of the lifting cylinder (4) is downwards connected with an upper die holder (5), and an upper die unit is arranged at the bottom of the upper die holder (5); the forming table (2) is provided with a lower die holder (6), the top of the lower die holder (6) is provided with a lower die unit, guide posts (7) with the number more than 2 are vertically fixed between the lifting table (3) and the forming table (2), guide post holes are formed in the edges of the upper die holder (5) and the lower die holder (6), and the guide post holes are sleeved with corresponding guide posts (7).
2. The integrated inductor hot forming apparatus of claim 1, wherein: the lower die unit comprises lower heat insulation strips (8), lower base plates (9) and lower high-temperature plates (10), wherein the lower heat insulation strips (8) with the number larger than 2 are fixed at the bottom of the lower base plates (9), the lower heat insulation strips (8) are supported by lower die holders (6), a lower heat dissipation area is reserved between the adjacent lower heat insulation strips (8), a plurality of lower plate grooves formed by concave downwards are formed in the tops of the lower base plates (9), each lower plate groove is embedded with one lower high-temperature plate (10), the lower high-temperature plates (10) are distributed on the lower base plates (9) in a matrix mode, and the surfaces of the lower high-temperature plates (10) are higher than the surfaces of the lower base plates (9).
3. The integrated inductor hot forming apparatus of claim 1, wherein: the upper die unit comprises an upper heat insulation strip (11), an upper base plate (12) and an upper high-temperature plate (13), wherein the upper heat insulation strip (11) with the number larger than 2 is arranged at the top of the upper base plate (12), the upper heat insulation strip (11) is connected with the bottom of an upper die holder (5), an upper heat radiation area is reserved between adjacent upper heat insulation strips (11), n-shaped upper plate grooves are distributed on the bottom of the upper base plate (12) in a matrix, the upper high-temperature plate (13) is embedded in the upper plate grooves, and the bottom of the upper high-temperature plate (13) extends out of the bottom of the upper base plate (12).
4. The integrated inductor hot forming apparatus of claim 1, wherein: heating plates are arranged in the upper base plate (12) and the lower base plate (9) and are contacted with the corresponding lower high temperature plate (10) and the upper high temperature plate (13).
CN202321921882.6U 2023-07-21 2023-07-21 Integrated inductance high temperature forming device Active CN220474471U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321921882.6U CN220474471U (en) 2023-07-21 2023-07-21 Integrated inductance high temperature forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321921882.6U CN220474471U (en) 2023-07-21 2023-07-21 Integrated inductance high temperature forming device

Publications (1)

Publication Number Publication Date
CN220474471U true CN220474471U (en) 2024-02-09

Family

ID=89802178

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321921882.6U Active CN220474471U (en) 2023-07-21 2023-07-21 Integrated inductance high temperature forming device

Country Status (1)

Country Link
CN (1) CN220474471U (en)

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