CN220464610U - Injection mold of semiconductor device - Google Patents
Injection mold of semiconductor device Download PDFInfo
- Publication number
- CN220464610U CN220464610U CN202322216784.9U CN202322216784U CN220464610U CN 220464610 U CN220464610 U CN 220464610U CN 202322216784 U CN202322216784 U CN 202322216784U CN 220464610 U CN220464610 U CN 220464610U
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- fixedly connected
- mould
- linear motor
- unit
- injection mold
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000002347 injection Methods 0.000 title claims abstract description 21
- 239000007924 injection Substances 0.000 title claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 239000000498 cooling water Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract 1
- 238000007569 slipcasting Methods 0.000 abstract 1
- 230000032258 transport Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000008400 supply water Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Abstract
The utility model discloses an injection mold of a semiconductor device, which relates to the technical field of semiconductor processing and comprises an equipment platform, a mold unit and a moving unit; the equipment platform is a rectangular flat plate; the mould unit contains control stand, electric telescopic handle, mould body, spout and slider, the bottom of fixed connection control stand is not respectively in the upper surface front and back section of equipment platform, one side top that is close to each other of two control stands is fixed connection electric telescopic handle respectively, the middle part of one side that keeps away from each other of two mould bodies of one end fixed connection respectively is close to each other of two electric telescopic handle, adopt two opposite movement's mould bodies, the mould body merges into a complete mould, the inside cooling system that is provided with of mould, the drawing of patterns is accomplished to the separation mould body after the slip casting solidifies, it transports to the processing unit of next step to clamp semiconductor metal end by linear electric motor drive electric clamp, production efficiency is higher.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to an injection mold of a semiconductor device.
Background
Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion.
The prior art has an authorized bulletin number of CN217891727U, which provides an injection mold for semiconductor devices, comprising a box body, wherein the top end of the box body is rotationally connected with a cover plate, the bottom of the box body is clamped with a storage box, the inside of the box body is rotationally connected with a mold main body, and a vibration mechanism for vibrating the mold main body is arranged in the mold main body; the vibration mechanism comprises a screw rod, and the screw rod is rotationally connected in the box body. According to the injection mold of the semiconductor device, the reciprocating rod is driven to slide through the rotation of the screw rod, the sliding rod slides in the sliding groove, the connecting rod drives the vibrating rod to move, and knocking vibration can be started when the vibrating rod contacts with the mold main body.
However, the cooling speed of the device is low, the production progress is affected, and for this reason, we propose an injection mold for semiconductor devices.
Disclosure of Invention
The utility model aims to overcome the prior art, and provides an injection mold of a semiconductor device, which adopts two mold bodies moving oppositely, the mold bodies are combined into a complete mold, a cooling system is arranged in the mold, the mold bodies are separated after grouting solidification to finish demolding, and an electric clamp is driven by a linear motor to clamp a semiconductor metal end to be transported to a next processing unit, so that the production efficiency is higher, and the problems in the background art can be effectively solved.
In order to achieve the above purpose, the present utility model provides the following technical solutions: an injection mold of a semiconductor device includes an equipment stage, a mold unit, and a moving unit;
and (3) an equipment platform: is a rectangular flat plate;
a die unit: the device comprises control stand columns, electric telescopic rods, die bodies, sliding grooves and sliding blocks, wherein the middle parts of the front section and the rear section of the upper surface of a device platform are respectively and fixedly connected with the bottom ends of the control stand columns, the top ends of one sides of the two control stand columns, which are close to each other, are respectively and fixedly connected with the middle parts of one sides of the two die bodies, which are far away from each other, of the two electric telescopic rods, one ends of the two electric telescopic rods, which are close to each other, are respectively and fixedly connected with the middle parts of one sides of the two die bodies, the middle parts of the upper surface of the device platform are provided with the transverse sliding grooves, the middle parts of the bottom surfaces of the die bodies are respectively and fixedly connected with the sliding blocks, the sliding blocks are respectively and slidably connected with the sliding grooves, and the input ends of the electric telescopic rods are electrically connected with an external power supply through an external control switch group;
a mobile unit: is installed above the mold unit.
The control stand is used for installing electric telescopic handle, and electric telescopic handle is through the opposite direction motion of the flexible control mould body of self, and the mould body is used for the mould shaping, and the sliding connection of spout and slider makes the motion of mould body spacing for it is more stable to slide, prevents that the mould body staggers.
Further, the die unit further comprises a sliding sleeve and a sliding rod, the left side and the right side of the top end of the control upright post are respectively and fixedly connected with the sliding sleeve, the sliding sleeve is respectively and slidably connected with the sliding rod, and one end, close to the die body, of the sliding rod is respectively and fixedly connected with the corresponding position of the die body.
The sliding sleeve and the sliding rod enable the telescopic movement of the electric telescopic rod to be more stable.
Further, the die unit further comprises four U-shaped cooling pipes and circulating water pipes, the four U-shaped cooling pipes penetrate through the left side surface and the right side surface of the die body respectively and are connected with cooling pipelines inside the die body, the middle parts of the U-shaped cooling pipes are fixedly connected with the circulating water pipes respectively, and the circulating water pipes are connected with an external cooling water supply unit.
The circulating water pipe is used for supplying water to the U-shaped cooling pipe and discharging the used hot water. The cooling effect of the die body is better.
Further, the mobile unit comprises a linear motor, a linear motor track and an electric clamp, the linear motor is connected with the linear motor track in a matched mode, the electric clamp is fixedly connected with the middle of the bottom surface of the linear motor, and the input ends of the electric clamp and the linear motor are electrically connected with an external power supply through an external control switch group.
The linear motor drives the linear motion of the electric clamp, the electric clamp is used for clamping the metal electric connection part of the semiconductor, and the linear motor track provides a motion track for the linear motor.
Further, the mobile unit further comprises a lifting upright post and a cross rod, two ends of the linear motor rail are respectively and fixedly connected with the middle part of the cross rod, two ends of the cross rod are respectively and fixedly connected with the top end of the lifting upright post, and the bottom end of the lifting upright post is respectively and fixedly connected with four corners of the upper surface of the equipment platform.
The horizontal pole is used for connecting high stand and linear electric motor track, and the stand is used for raising the mobile unit.
Further, the device also comprises supporting feet, and four corners of the lower surface of the device platform are respectively fixedly connected with the supporting feet.
The feet are used to support the device.
Compared with the prior art, the utility model has the beneficial effects that: the injection mold of the semiconductor device has the following advantages:
1. the injection mold of the semiconductor device adopts two mold bodies which move relatively, the two molds are controlled by respective electric telescopic rods, the bodies are combined to form the mold, and the preliminary demolding work is completed after the bodies are separated.
2. This injection mold of semiconductor device designs cooling pipeline in the inside of mould, and every cooling pipeline and the outside U type cooling tube of connection, and circulating water pipe is connected simultaneously to U type cooling tube, and circulating water pipe passes through the outside cooling water supply unit of hose connection, makes and can cool off fast after pouring.
3. According to the injection mold of the semiconductor device, the metal electric connection part of the semiconductor is clamped by the electric clamp during pouring, and the electric clamp is driven by the linear motor to move after pouring cooling is finished, so that the processed semiconductor leaves the mold plate and enters a next processing unit.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a schematic view of a partial enlarged structure at a in fig. 1 according to the present utility model.
In the figure: 1 equipment platform, 2 support legs, 3 mould units, 31 control stand columns, 32 electric telescopic rods, 33 mould bodies, 34 sliding grooves, 35 sliding blocks, 36 sliding sleeves, 37 sliding rods, 38U-shaped cooling pipes, 39 circulating water pipes, 4 moving units, 41 linear motors, 42 linear motor tracks, 43 electric clamps, 44 lifting stand columns and 45 cross bars.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, the present embodiment provides the following technical solutions: an injection mold of a semiconductor device includes an apparatus stage 1, a mold unit 3, and a moving unit 4;
equipment platform 1: is a rectangular flat plate;
die unit 3: the device comprises control upright posts 31, electric telescopic rods 32, mould bodies 33, sliding grooves 34 and sliding blocks 35, wherein the middle parts of the front section and the rear section of the upper surface of the device platform 1 are respectively fixedly connected with the bottom ends of the control upright posts 31, the top ends of one sides of the two control upright posts 31, which are close to each other, are respectively fixedly connected with the electric telescopic rods 32, one ends of the two electric telescopic rods 32, which are close to each other, are respectively fixedly connected with the middle parts of one sides, which are far away from each other, of the two mould bodies 33, the middle parts of the upper surface of the device platform 1 are provided with the transverse sliding grooves 34, the middle parts of the bottom surfaces of the mould bodies 33 are respectively fixedly connected with the sliding blocks 35, the sliding blocks 35 are respectively in sliding connection with the sliding grooves 34, and the input ends of the electric telescopic rods 32 are electrically connected with an external power supply through an external control switch group;
mobile unit 4: is mounted above the die unit 3.
The moving unit 4 comprises a linear motor 41, a linear motor track 42 and an electric clamp 43, the linear motor 41 is matched and connected with the linear motor track 42, the middle part of the bottom surface of the linear motor 41 is fixedly connected with the electric clamp 43, and the input ends of the electric clamp 43 and the linear motor 41 are electrically connected with an external power supply through an external control switch group.
The linear motor 41 drives the electric clamp 43 to linearly move, the electric clamp 43 is used for clamping the metal electric coupling part of the semiconductor, and the linear motor track 42 provides a moving track for the linear motor 41.
The moving unit 4 further comprises a lifting upright post 44 and a cross rod 45, the two ends of the linear motor track 42 are respectively and fixedly connected with the middle part of the cross rod 45, the two ends of the cross rod 45 are respectively and fixedly connected with the top end of the lifting upright post 44, and the bottom end of the lifting upright post 44 is respectively and fixedly connected with four corners of the upper surface of the equipment platform 1.
The cross bar 45 is used to connect the elevation column 44 and the linear motor rail 42, and the column 44 is used to raise the moving unit 4.
The control stand 31 is used for installing electric telescopic rod 32, and electric telescopic rod 32 controls the opposite movement of mould body 33 through the flexible of self, and mould body 33 is used for the mould shaping, and the sliding connection of spout 34 and slider 35 makes the motion of mould body 33 spacing for it is more stable to slide, prevents that mould body 33 staggers.
The die unit 3 further comprises a sliding sleeve 36 and a sliding rod 37, the left side and the right side of the top end of the control upright post 31 are respectively and fixedly connected with the sliding sleeve 36, the sliding sleeve 36 is respectively and slidably connected with the sliding rod 37, and one end, close to the die body 33, of the sliding rod 37 is respectively and fixedly connected with the corresponding position of the die body 33.
The sliding sleeve 36 and the sliding rod 37 make the telescopic movement of the electric telescopic rod 32 more stable.
The die unit 3 further comprises four U-shaped cooling pipes 38 and circulating water pipes 39, the U-shaped cooling pipes 38 penetrate through the left side surface and the right side surface of the die body 33 respectively to be connected with cooling pipelines inside the die body, the middle parts of the U-shaped cooling pipes 38 are fixedly connected with the circulating water pipes 39 respectively, and the circulating water pipes 39 are connected with an external cooling water supply unit.
The circulation water pipe 39 is used to supply water to the U-shaped cooling pipe 38 and to remove the hot water after use. So that the cooling effect of the die body 33 is better.
The device further comprises support legs 2, and four corners of the lower surface of the device platform 1 are respectively fixedly connected with the support legs 2.
The feet 2 are used to support the apparatus.
The working principle of the injection mold of the semiconductor device provided by the utility model is as follows:
the control stand 31 is used for installing electric telescopic rod 32, and electric telescopic rod 32 controls the opposite movement of mould body 33 through the flexible of self, and mould body 33 is used for the mould shaping, and the sliding connection of spout 34 and slider 35 makes the motion of mould body 33 spacing for it is more stable to slide, prevents that mould body 33 staggers. The sliding sleeve 36 and the sliding rod 37 make the telescopic movement of the electric telescopic rod 32 more stable. The circulation water pipe 39 is used to supply water to the U-shaped cooling pipe 38 and to remove the hot water after use. So that the cooling effect of the die body 33 is better.
The linear motor 41 drives the electric clamp 43 to linearly move, the electric clamp 43 is used for clamping the metal electric coupling part of the semiconductor, and the linear motor track 42 provides a moving track for the linear motor 41. The cross bar 45 is used to connect the elevation column 44 and the linear motor rail 42, and the column 44 is used to raise the moving unit 4.
The feet 2 are used to support the apparatus.
It is noted that the external control switch group controls the operation of the electric telescopic rod 32, the electric clamp 43 and the linear motor 41 by the methods commonly used in the prior art.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (6)
1. An injection mold for a semiconductor device, characterized by: comprises an equipment platform (1), a mould unit (3) and a moving unit (4);
equipment platform (1): is a rectangular flat plate;
die unit (3): the automatic control device comprises control stand columns (31), electric telescopic rods (32), mould bodies (33), sliding grooves (34) and sliding blocks (35), wherein the middle parts of the front section and the rear section of the upper surface of a device platform (1) are respectively fixedly connected with the bottom ends of the control stand columns (31), the top ends of one sides of the two control stand columns (31) which are close to each other are respectively fixedly connected with the electric telescopic rods (32), one ends of the two electric telescopic rods (32) which are close to each other are respectively fixedly connected with the middle parts of one sides of the two mould bodies (33) which are far away from each other, the middle parts of the upper surface of the device platform (1) are provided with transverse sliding grooves (34), the middle parts of the bottom surfaces of the mould bodies (33) are respectively fixedly connected with the sliding blocks (35), and the input ends of the electric telescopic rods (32) are electrically connected with an external power supply through an external control switch group;
mobile unit (4): is mounted above the die unit (3).
2. An injection mold for a semiconductor device according to claim 1, wherein: the die unit (3) further comprises a sliding sleeve (36) and a sliding rod (37), the left side and the right side of the top end of the control upright post (31) are respectively and fixedly connected with the sliding sleeve (36), the sliding sleeve (36) is respectively and slidingly connected with the sliding rod (37), and one end, close to the die body (33), of the sliding rod (37) is respectively and fixedly connected with the corresponding position of the die body (33).
3. An injection mold for a semiconductor device according to claim 2, wherein: the die unit (3) further comprises four U-shaped cooling pipes (38) and circulating water pipes (39), the four U-shaped cooling pipes (38) penetrate through the left side surface and the right side surface of the die body (33) respectively to be connected with cooling pipelines inside the die unit, the middle parts of the U-shaped cooling pipes (38) are fixedly connected with the circulating water pipes (39) respectively, and the circulating water pipes (39) are connected with an external cooling water supply unit.
4. An injection mold for a semiconductor device according to claim 3, wherein: the mobile unit (4) comprises a linear motor (41), a linear motor track (42) and an electric clamp (43), wherein the linear motor (41) is matched and connected with the linear motor track (42), the electric clamp (43) is fixedly connected with the middle part of the bottom surface of the linear motor (41), and the input ends of the electric clamp (43) and the linear motor (41) are electrically connected with an external power supply through an external control switch group.
5. An injection mold for a semiconductor device according to claim 4, wherein: the mobile unit (4) further comprises a lifting stand column (44) and a cross rod (45), two ends of the linear motor track (42) are respectively and fixedly connected with the middle part of the cross rod (45), two ends of the cross rod (45) are respectively and fixedly connected with the top end of the lifting stand column (44), and the bottom end of the lifting stand column (44) is respectively and fixedly connected with four corners of the upper surface of the equipment platform (1).
6. An injection mold for a semiconductor device according to claim 5, wherein: the device further comprises support legs (2), and four corners of the lower surface of the device platform (1) are fixedly connected with the support legs (2) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322216784.9U CN220464610U (en) | 2023-08-17 | 2023-08-17 | Injection mold of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322216784.9U CN220464610U (en) | 2023-08-17 | 2023-08-17 | Injection mold of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220464610U true CN220464610U (en) | 2024-02-09 |
Family
ID=89780644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322216784.9U Active CN220464610U (en) | 2023-08-17 | 2023-08-17 | Injection mold of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220464610U (en) |
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2023
- 2023-08-17 CN CN202322216784.9U patent/CN220464610U/en active Active
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