CN220461192U - Epoxy resin spot coating device for electronic component processing - Google Patents
Epoxy resin spot coating device for electronic component processing Download PDFInfo
- Publication number
- CN220461192U CN220461192U CN202322000758.2U CN202322000758U CN220461192U CN 220461192 U CN220461192 U CN 220461192U CN 202322000758 U CN202322000758 U CN 202322000758U CN 220461192 U CN220461192 U CN 220461192U
- Authority
- CN
- China
- Prior art keywords
- head
- glue
- wall
- electronic component
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 18
- 239000011248 coating agent Substances 0.000 title claims abstract description 10
- 238000000576 coating method Methods 0.000 title claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 46
- 238000002347 injection Methods 0.000 claims abstract description 9
- 239000007924 injection Substances 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 22
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 241001232346 Gymnosperma glutinosum Species 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 abstract description 7
- 238000012856 packing Methods 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 4
- 235000017491 Bambusa tulda Nutrition 0.000 description 4
- 241001330002 Bambuseae Species 0.000 description 4
- 241000883990 Flabellum Species 0.000 description 4
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 4
- 239000011425 bamboo Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Abstract
The utility model relates to the technical field of electronic component processing, in particular to an epoxy resin spot coating device for electronic component processing, which comprises a workbench, wherein the top end of the workbench is provided with a mounting rack; the dispensing mechanism can be used for rapidly replacing and disassembling the glue injection head and rapidly drying the electronic components after glue injection, and is arranged on the inner wall of the mounting frame; the dispensing mechanism and the replacement assembly are arranged; take out the locating pin from the mounting panel and remove the restriction to cardboard and some gluey head, rotate some glue head through with deposit a packing element threaded connection and move down and dismantle some glue head and change, convenient to use, the cardboard cooperatees with the draw-in groove and can carry out spacing to some glue head, deposit the solid fixed ring joint of packing element one end to some glue head inner wall, cooperate with two sealing rings again and can prevent epoxy leakage, improve the leakproofness of some glue head, the change is dismantled to some glue head that can be quick, improves the result of use of point coating device.
Description
Technical Field
The utility model relates to the technical field of electronic component processing, in particular to an epoxy resin spot coating device for electronic component processing.
Background
The electronic component is a component part of an electronic element and a small machine or instrument, is often composed of a plurality of parts, and can be commonly used in similar products; some parts of the industry such as electric appliances, radios, meters and the like are commonly referred to as electronic devices such as capacitors, transistors, hairsprings, springs and the like. The common diode that has when electronic components processes, in order to keep the stability of electronic components operation, often need use epoxy point application device, can play dampproofing, dustproof, anticorrosion, shockproof effect, when current point application device injecting glue head needs periodic replacement, inconvenient quick dismantlement to the injecting glue head is changed, and the unable quick drying of electrical components after the point is glued moreover influences work efficiency.
Therefore, an epoxy resin dispensing device for processing electronic components is proposed to solve the above problems.
Disclosure of Invention
The utility model aims to solve the problems and provide the epoxy resin spot coating device for processing the electronic components, which solves the problems that the glue injection head is inconvenient to detach and replace quickly, and the electronic components after glue injection cannot be dried quickly.
The utility model realizes the aim through the following technical scheme, and the epoxy resin spot coating device for processing the electronic components comprises a workbench, wherein the top end of the workbench is provided with a mounting rack; the dispensing mechanism can be used for rapidly replacing and disassembling the glue injection head and rapidly drying the electronic components after glue injection, and is arranged on the inner wall of the mounting frame; the spot coating mechanism comprises a sliding plate which is connected to the inner wall of the mounting rack in a sliding mode, a mounting plate is connected to the surface of the sliding plate in a sliding mode, a replacement assembly is arranged at the bottom end of the mounting plate, and a heating assembly is arranged at the top end of the workbench.
Preferably, the replacement assembly comprises a glue storage barrel fixedly connected to the bottom end of the mounting plate, an external thread is arranged at one end of the glue storage barrel, a dispensing head is connected to one end of the glue storage barrel through the external thread, a fixing ring is fixedly connected to one end of the glue storage barrel, one end of the fixing ring is connected with the dispensing head in a clamping mode, and two sealing rings are arranged between the glue storage barrel and the dispensing head.
Preferably, the surface rotation of the point gum head is connected with the cardboard, two draw-in grooves with cardboard assorted are seted up to the bottom of mounting panel, one side of mounting panel is provided with the locating pin, the one end of locating pin runs through mounting panel and cardboard in proper order.
Preferably, the inner wall of the dispensing head is provided with a fixed plate, the top fixedly connected with dead lever of dead lever, the one end sliding connection of dead lever has the connecting rod, be provided with compression spring between dead lever and the connecting rod, the fixed surface of connecting rod is connected with the puddler of several evenly distributed, the other end of depositing the packing element inner wall is provided with first motor, the one end fixedly connected with fixed cylinder of first motor, the other end of connecting rod is provided with two fixture blocks, the connecting rod passes through fixture block and fixed cylinder joint.
Preferably, the heating element includes the case of placing of fixed connection in workstation top one end, the one end of placing the incasement wall is provided with the second motor, the output shaft fixedly connected with flabellum of second motor, the inner wall of placing the case is provided with the heating block, the heating block sets up in the front end of flabellum, the air exit has been seted up to the one end of placing the case.
The beneficial effects of the utility model are as follows:
1. the dispensing mechanism and the replacement assembly are arranged; when dismantling the change to the point and gluing the head, take out the locating pin from the mounting panel and remove the restriction to cardboard and point and glue the head, rotate the point and glue the head and dismantle the point and glue the head and change through with depositing a section of thick bamboo threaded connection, convenient to use, the cardboard cooperatees with the draw-in groove and can carry out spacing to the point and glue the head, the solid fixed ring joint of depositing a section of thick bamboo one end is to the point inner wall of gluing, cooperate with two sealing rings again and can prevent epoxy leakage, improve the leakproofness of point and glue the head, the point is glued the head inner wall dead lever and is connected with the connecting rod rotation, first motor drives the puddler rotation on the connecting rod through fixed cylinder and two fixture blocks, can prevent to deposit the epoxy solidification in the section of thick bamboo, during the installation, the connecting rod moves to one end through cooperating with fixed cylinder joint, the dead lever slides inside the connecting rod when the point is glued the section of thick bamboo to carry out spacing to the connecting rod through compression spring, the point that can be quick is dismantled and is changed, improve the result of use of point coating device.
2. Through setting up heating element, after the electronic components point is glued, the second motor drives the flabellum and rotates, blows off the wind flow, and the heating block of flabellum front end heats, and the wind flow becomes hot-blast through the heating block and blows to electronic components, heats epoxy, accelerates epoxy's solidification, improves work efficiency, and electronic components after the point of gluing that can be quick heats for epoxy's solidification improves work efficiency.
Drawings
FIG. 1 is a schematic view of the appearance structure of the present utility model;
FIG. 2 is a schematic view of the dispensing mechanism and the replacement assembly according to the present utility model;
FIG. 3 is a schematic view of a partial structure of the dispensing mechanism of the present utility model;
fig. 4 is a schematic view of a heating assembly according to the present utility model.
In the figure: 1. a work table; 2. a mounting frame; 3. a dispensing mechanism; 301. a slide plate; 302. a mounting plate; 303. replacing the assembly; 3031. a glue storage cylinder; 3032. an external thread; 3033. dispensing heads; 3034. a seal ring; 3035. a clamping plate; 3036. a positioning pin; 3037. a clamping groove; 3038. a fixing ring; 304. a fixing plate; 305. a fixed rod; 306. a connecting rod; 307. a compression spring; 308. a stirring rod; 309. a clamping block; 310. a first motor; 311. a fixed cylinder; 312. a heating assembly; 3121. placing a box; 3122. a second motor; 3123. a fan blade; 3124. a heating block; 3125. and an air outlet.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The specific implementation method comprises the following steps: as shown in fig. 1-4, an epoxy resin dispensing device for processing electronic components is provided with a workbench 1, wherein the top end of the workbench 1 is provided with a mounting frame 2; the dispensing mechanism 3 is arranged on the inner wall of the mounting frame 2 and can be used for rapidly replacing and disassembling the glue injection head and rapidly drying the electronic components after glue injection; the dispensing mechanism 3 comprises a sliding plate 301 which is connected to the inner wall of the mounting frame 2 in a sliding manner, a mounting plate 302 is connected to the surface of the sliding plate 301 in a sliding manner, a replacement component 303 is arranged at the bottom end of the mounting plate 302, and a heating component 312 is arranged at the top end of the workbench 1.
As shown in fig. 2 and 3, the replacement assembly 303 includes a glue storage cylinder 3031 fixedly connected to the bottom end of the mounting plate 302, an external thread 3032 is provided at one end of the glue storage cylinder 3031, a dispensing head 3033 is connected to one end of the glue storage cylinder 3031 through the external thread 3032, a fixing ring 3038 is fixedly connected to one end of the glue storage cylinder 3031, one end of the fixing ring 3038 is clamped with the dispensing head 3033, two sealing rings 3034 are provided between the glue storage cylinder 3031 and the dispensing head 3033, a clamping plate 3035 is rotatably connected to the surface of the dispensing head 3033, two clamping grooves 3037 matched with the clamping plate 3035 are provided at the bottom end of the mounting plate 302, a positioning pin 3036 is provided at one side of the mounting plate 302, one end of the positioning pin 3036 sequentially penetrates through the mounting plate 302 and the clamping plate 3035, a fixing plate 304 is provided on the inner wall of the dispensing head 3033, a fixing rod 305 is fixedly connected to the top end of the fixing plate 304, a connecting rod 306 is slidingly connected to one end of the fixing rod 305, a compression spring 307 is arranged between the fixed rod 305 and the connecting rod 306, a plurality of stirring rods 308 which are uniformly distributed are fixedly connected to the surface of the connecting rod 306, a first motor 310 is arranged at the other end of the inner wall of the glue storage barrel 3031, one end of the first motor 310 is fixedly connected with a fixed barrel 311, two clamping blocks 309 are arranged at the other end of the connecting rod 306, the connecting rod 306 is clamped with the fixed barrel 311 through the clamping blocks 309, a positioning pin 3036 is taken out from the mounting plate 302 to remove the restriction on the clamping plate 3035 and the glue dispensing head 3033, the glue dispensing head 3033 is rotated to move downwards through the threaded connection with the external threads 3032 at one end of the glue storage barrel 3031, the connecting rod 306 at the inner wall of the glue dispensing head 3033 is clamped with the fixed barrel 311 through two clamping blocks 309 when being mounted, the glue dispensing head 3033 is in threaded connection with the glue storage barrel 3031, the connecting rod 305 is extruded by the compression spring 307 to prevent the connecting rod 306 from falling off from the fixed barrel 311, the first motor 310 drives the stirring rod 308 on the connecting rod 306 to rotate through the fixed cylinder 311 to stir the epoxy resin, so that the dispensing head 3033 can be quickly detached and replaced, and the using effect of the dispensing device is improved.
As shown in fig. 4, the heating assembly 312 includes a placement box 3121 fixedly connected to one end of the top of the workbench 1, a second motor 3122 is disposed at one end of the inner wall of the placement box 3121, an output shaft of the second motor 3122 is fixedly connected with a fan blade 3123, a heating block 3124 is disposed on the inner wall of the placement box 3121, the heating block 3124 is disposed at the front end of the fan blade 3123, an air outlet 3125 is disposed at one end of the placement box 3121, after dispensing is completed, the second motor 3122 drives the fan blade 3123 to rotate to blow air flow, the heating block 3124 heats, the air flow is changed into hot air through the heating block 3124 to blow toward electronic components, solidification of epoxy resin is accelerated, the electronic components after dispensing can be quickly heated, solidification of epoxy resin is accelerated, and working efficiency is improved.
When the adhesive dispensing device is used, the positioning pin 3036 is taken out from the mounting plate 302 to release the restriction on the clamping plate 3035 and the adhesive dispensing head 3033, the adhesive dispensing head 3033 is rotated to move downwards through the threaded connection with the external thread 3032 at one end of the adhesive storage barrel 3031, the adhesive dispensing head 3033 is disassembled and replaced, the connecting rod 306 on the inner wall of the adhesive dispensing head 3033 is clamped with the fixed barrel 311 through the two clamping blocks 309 during mounting, the adhesive dispensing head 3033 is in threaded connection with the adhesive storage barrel 3031, the connecting rod 306 is extruded by the fixing rod 305 through the compression spring 307 to prevent the connecting rod 306 from falling from the fixed barrel 311, the first motor 310 drives the stirring rod 308 on the connecting rod 306 to rotate to stir epoxy resin, the second motor 3122 drives the fan blade 3123 to rotate to blow out air flow, the heating block 3124 is heated, and the air flow is changed into hot air flow through the heating block 3124 to blow to electronic components and speed up the solidification of the epoxy resin.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (5)
1. An epoxy resin dispensing device for electronic component processing, comprising:
the workbench (1), wherein the top end of the workbench (1) is provided with a mounting rack (2);
the dispensing mechanism (3) can be used for quickly replacing and disassembling the glue injection head and quickly drying the electronic components after dispensing, and the dispensing mechanism (3) is arranged on the inner wall of the mounting frame (2);
the spot coating mechanism (3) comprises a sliding plate (301) which is connected to the inner wall of the mounting frame (2) in a sliding mode, a mounting plate (302) is connected to the surface of the sliding plate (301) in a sliding mode, a replacement assembly (303) is arranged at the bottom end of the mounting plate (302), and a heating assembly (312) is arranged at the top end of the workbench (1).
2. The epoxy resin dispensing apparatus for electronic component processing according to claim 1, wherein: the replacement assembly (303) comprises a glue storage cylinder (3031) fixedly connected to the bottom end of the mounting plate (302), an external thread (3032) is arranged at one end of the glue storage cylinder (3031), a dispensing head (3033) is connected to one end of the glue storage cylinder (3031) through the external thread (3032) in a threaded mode, a fixing ring (3038) is fixedly connected to one end of the glue storage cylinder (3031), one end of the fixing ring (3038) is connected with the dispensing head (3033) in a clamping mode, and two sealing rings (3034) are arranged between the glue storage cylinder (3031) and the dispensing head (3033).
3. The epoxy resin dispensing apparatus for electronic component processing according to claim 2, wherein: the surface rotation of point gum head (3033) is connected with cardboard (3035), two draw-in grooves (3037) with cardboard (3035) assorted are seted up to the bottom of mounting panel (302), one side of mounting panel (302) is provided with locating pin (3036), the one end of locating pin (3036) runs through mounting panel (302) and cardboard (3035) in proper order.
4. The epoxy resin dispensing apparatus for electronic component processing according to claim 2, wherein: the inner wall of the dispensing head (3033) is provided with a fixing plate (304), the top of the fixing plate (304) is fixedly connected with a fixing rod (305), one end of the fixing rod (305) is slidably connected with a connecting rod (306), a compression spring (307) is arranged between the fixing rod (305) and the connecting rod (306), the surface of the connecting rod (306) is fixedly connected with a plurality of evenly distributed stirring rods (308), the other end of the inner wall of the glue storage barrel (3031) is provided with a first motor (310), one end of the first motor (310) is fixedly connected with a fixing barrel (311), the other end of the connecting rod (306) is provided with two clamping blocks (309), and the connecting rod (306) is clamped with the fixing barrel (311) through the clamping blocks (309).
5. The epoxy resin dispensing apparatus for electronic component processing according to claim 1, wherein: the heating assembly (312) comprises a placing box (3121) fixedly connected to one end of the top of the workbench (1), a second motor (3122) is arranged at one end of the inner wall of the placing box (3121), a fan blade (3123) is fixedly connected to an output shaft of the second motor (3122), a heating block (3124) is arranged on the inner wall of the placing box (3121), the heating block (3124) is arranged at the front end of the fan blade (3123), and an air outlet (3125) is arranged at one end of the placing box (3121).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322000758.2U CN220461192U (en) | 2023-07-28 | 2023-07-28 | Epoxy resin spot coating device for electronic component processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322000758.2U CN220461192U (en) | 2023-07-28 | 2023-07-28 | Epoxy resin spot coating device for electronic component processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220461192U true CN220461192U (en) | 2024-02-09 |
Family
ID=89797621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322000758.2U Active CN220461192U (en) | 2023-07-28 | 2023-07-28 | Epoxy resin spot coating device for electronic component processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220461192U (en) |
-
2023
- 2023-07-28 CN CN202322000758.2U patent/CN220461192U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209380229U (en) | A kind of generator coupling provision for disengagement | |
| CN211210072U (en) | L ED is SMT chip mounter adhesive deposite device for mainboard | |
| CN220461192U (en) | Epoxy resin spot coating device for electronic component processing | |
| CN209918214U (en) | A point gum machine constructs for online point gum machine | |
| CN200974352Y (en) | Fixing structure for automatic heat transfer press glue stick | |
| CN211707264U (en) | Novel oil blanket rubber coating equipment | |
| CN210753570U (en) | Coating machine convenient to adjust | |
| CN208554833U (en) | A kind of efficient inductance side coating formula glue applying mechanism | |
| CN216573891U (en) | Automatic glue dispensing mechanism of disc machine | |
| CN116174199A (en) | Motor housing paint spraying equipment for industrial motor machining | |
| CN211838810U (en) | Electronic components adhesive deposite device | |
| CN209721946U (en) | A kind of process unit of the plating of the direct spraying on base plate glass conductive film | |
| CN208277334U (en) | A kind of efficient three colors integrated injection molding mold | |
| CN221063313U (en) | Electronic automatic dispensing machine | |
| CN212555414U (en) | Full-automatic laminating machine | |
| CN215542299U (en) | Die bonder with glue brushing device | |
| CN213032807U (en) | Auxiliary device based on metal plate spraying process | |
| CN211601063U (en) | Even adhesive device of quick setting glue | |
| CN216440974U (en) | Automatic glue dispenser for optical filter surface mounting | |
| CN213825640U (en) | Electronic magnetic shoe dispenser with high dispensing efficiency | |
| CN218765988U (en) | Maintenance frock of bag sealer glue pot device | |
| CN209850355U (en) | Clamp rotating machine table for precision machining | |
| CN221086162U (en) | High-strength compound paperboard glue spreader | |
| CN207625897U (en) | A kind of pcb board printing bearing fixture | |
| CN216857244U (en) | High-efficient heat sink is used to point gum machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |