CN220454728U - Shell temperature multipoint measuring device for power semiconductor device - Google Patents
Shell temperature multipoint measuring device for power semiconductor device Download PDFInfo
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- CN220454728U CN220454728U CN202321435988.5U CN202321435988U CN220454728U CN 220454728 U CN220454728 U CN 220454728U CN 202321435988 U CN202321435988 U CN 202321435988U CN 220454728 U CN220454728 U CN 220454728U
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- power semiconductor
- temperature sensor
- semiconductor device
- temperature
- rod
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 238000005259 measurement Methods 0.000 claims abstract description 15
- 238000009529 body temperature measurement Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 210000000078 claw Anatomy 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The utility model belongs to the technical field of power semiconductor equipment, and particularly relates to a shell temperature multipoint measurement device for a power semiconductor device. According to the utility model, the first temperature sensor, the second temperature sensor and the third temperature sensor are used for detecting the temperature of each position, then the temperature data is transmitted into the data receiver, and then the temperature data is transmitted to an operator through the wireless transmitter, so that the effects of multipoint temperature measurement and accurate measurement result can be achieved; through placing the power semiconductor that needs to measure on placing the board, insert in the spacing downthehole of difference on the bracing piece through the stopper on the adjustment auxiliary rod afterwards, can reach the device height of ability adjustment, easy operation, the stronger effect of practicality.
Description
Technical Field
The utility model relates to the technical field of power semiconductor equipment, in particular to a shell temperature multipoint measuring device of a power semiconductor device.
Background
Semiconductor devices that control currents up to 100A or operating voltages up to 1200V are generally referred to as power semiconductor devices, the primary power semiconductor devices including IGBTs, diodes, MOSFETs, etc. Heat is generated in the operation process of the power semiconductor device, the power semiconductor chip is an extremely precise device, the temperature can influence the operation of the chip, and even the chip can be directly damaged in severe cases, but the power semiconductor device and the chip are of a packaging structure, so that the temperature of the internal chip can be estimated only by measuring the temperature of the shell, and therefore, the shell temperature multipoint measuring device of the power semiconductor device is provided.
The prior art has the following problems:
1. the existing shell temperature measuring device of the power semiconductor device cannot measure temperature at multiple points, and the measuring result is inaccurate;
2. the existing power semiconductor device shell temperature measuring device cannot adjust the device height, is troublesome to operate and has poor practicability.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a shell temperature multipoint measuring device for a power semiconductor device, which solves the problems that the multipoint temperature measurement cannot be carried out and the height of the device cannot be adjusted in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a power semiconductor device shell temperature multipoint measurement device, includes the base, the base top is provided with the dead lever, the dead lever top is provided with first threaded rod, first threaded rod opposite side is provided with first gripper jaw, first gripper jaw lateral wall is provided with the screw hole, first gripper jaw surface is provided with first temperature sensor, first gripper jaw opposite side is provided with the second threaded rod, second threaded rod one side is provided with the second gripper jaw, second gripper jaw surface is provided with second temperature sensor, the base top is provided with the bracing piece, the bracing piece surface runs through and is provided with spacing hole, spacing hole top is provided with the stopper, the stopper top is provided with the auxiliary rod, auxiliary rod top is provided with the mobile jib, the mobile jib top is provided with places the board, place the board top and be provided with third temperature sensor, bracing piece one side is provided with the control box, the control box surface is provided with the display screen, the control box inside is provided with data receiver, the data receiver opposite side is provided with wireless transmitter.
As a preferred technical scheme of the utility model, the first threaded rod is in threaded connection with the first clamping jaw through a threaded hole, and the first clamping jaw is in fixed connection with the first temperature sensor.
As a preferred technical scheme of the utility model, the second threaded rod is in threaded connection with the second clamping jaw through a threaded hole, and the second clamping jaw is in fixed connection with the second temperature sensor.
As a preferable technical scheme of the utility model, the main rod is fixedly connected with the auxiliary rod, and the auxiliary rod is fixedly connected with the limiting block.
As a preferable technical scheme of the utility model, the limiting holes are provided with a plurality of groups and are clamped with the limiting blocks.
As a preferable technical scheme of the utility model, the placing plate is fixedly connected with the main rod, and the third temperature sensor is fixedly connected with the placing plate.
As a preferred technical scheme of the utility model, the first temperature sensor, the second temperature sensor and the third temperature sensor are electrically connected with a data receiver, and the data receiver is electrically connected with a wireless transmitter.
Compared with the prior art, the utility model provides a shell temperature multipoint measuring device of a power semiconductor device, which has the following beneficial effects:
1. according to the shell temperature multipoint measuring device for the power semiconductor device, the power semiconductor device to be measured is placed in the first clamping jaw and the second clamping jaw, then the first threaded rod is screwed on the second threaded rod, the first threaded rod is enabled to rotate in the threaded hole in the second threaded rod, the first clamping jaw and the second clamping jaw are enabled to be firmly clamped, then the device is placed on the placing plate, temperature detection is conducted at all positions through the first temperature sensor, the second temperature sensor and the third temperature sensor, then temperature data are transmitted into the data receiver, and then the temperature data are transmitted to an operator through the wireless transmitter, so that the effects of multipoint temperature measurement and accurate measuring results can be achieved.
2. According to the shell temperature multipoint measuring device for the power semiconductor device, the power semiconductor to be measured is placed on the placing plate, and then the limiting blocks on the auxiliary rod are inserted into different limiting holes on the supporting rod through the limiting blocks on the adjusting auxiliary rod, so that the heights of the main rod and the auxiliary rod are changed, the placing plate is changed in height, and the effects of being capable of adjusting the height of the device, simple to operate and high in practicality can be achieved.
Drawings
Fig. 1 is a schematic diagram showing a structure of a shell temperature multipoint measurement device for a power semiconductor device according to the present utility model;
fig. 2 is a schematic plan view of a shell temperature multipoint measuring device for a power semiconductor device according to the present utility model;
fig. 3 is a schematic diagram of a partial structure of a shell temperature multipoint measurement device for a power semiconductor device according to the present utility model;
fig. 4 is a schematic diagram of a partial structure of a shell temperature multipoint measurement device for a power semiconductor device according to the present utility model;
fig. 5 is a schematic diagram of a local structure of a shell temperature multipoint measurement device for a power semiconductor device according to the present utility model.
In the figure: 1. a base; 2. a fixed rod; 3. a first threaded rod; 4. a first gripper jaw; 5. a first temperature sensor; 6. a second threaded rod; 7. a second gripper jaw; 8. a second temperature sensor; 9. a support rod; 10. a limiting block; 11. a limiting hole; 12. an auxiliary rod; 13. a main rod; 14. placing a plate; 15. a third temperature sensor; 16. a control box; 17. a display screen; 18. a data receiver; 19. a wireless transmitter; 20. and (3) a threaded hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 4, in the present embodiment: a power semiconductor device shell temperature multipoint measuring device comprises a base 1 for arranging other components, a fixed rod 2 is arranged at the top of the base 1 for fixing a clamping part, a first threaded rod 3 is arranged at the top of the fixed rod 2 for installing a first clamping claw 4, a first clamping claw 4 is arranged at the other side of the first threaded rod 3 for clamping a power semiconductor device, a threaded hole 20 is arranged on the side wall of the first clamping claw 4 for connecting the first threaded rod 3, a first temperature sensor 5 is arranged on the surface of the first clamping claw 4 for measuring the power semiconductor device shell temperature, a second threaded rod 6 is arranged at the other side of the first clamping claw 4 for connecting a second clamping claw 7, a second clamping claw 7 is arranged at one side of the second threaded rod 6 for clamping the power semiconductor device, a second temperature sensor 8 is arranged on the surface of the second clamping claw 7, be used for measuring power semiconductor device shell temperature, base 1 top is provided with bracing piece 9, be used for connecting auxiliary rod 12, bracing piece 9 surface runs through and is provided with spacing hole 11, be used for connecting stopper 10, spacing hole 11 top is provided with stopper 10, be used for connecting spacing hole 11, stopper 10 top is provided with auxiliary rod 12, be used for connecting mobile jib 13, auxiliary rod 12 top is provided with mobile jib 13, be used for connecting place board 14, mobile jib 13 top is provided with place board 14, be used for placing power semiconductor device, place board 14 top is provided with third temperature sensor 15, be used for measuring power semiconductor device shell temperature, bracing piece 9 one side is provided with control box 16, be used for setting up other parts, control box 16 surface is provided with display screen 17, be used for observing the temperature of measurement, control box 16 inside is provided with data receiver 18, be used for receiving first temperature sensor 5, the mobile jib 13 top is provided with place board 14, be used for measuring power semiconductor device shell temperature, be provided with control box 16 one side is provided with other parts, be used for setting up the display screen 17 The second temperature sensor 8 and the third temperature sensor 15 are used for measuring temperature data, and a wireless transmitter 19 is arranged on the other side of the data receiver 18 and is used for transmitting data.
In this embodiment, the first threaded rod 3 is in threaded connection with the first clamping jaw 4 through the threaded hole 20, and the first clamping jaw 4 is in fixed connection with the first temperature sensor 5, so that the first clamping jaw 4 clamps the power semiconductor device and then performs temperature measurement; the second threaded rod 6 is in threaded connection with the second clamping jaw 7 through the threaded hole 20, and the second clamping jaw 7 is in fixed connection with the second temperature sensor 8, so that the first clamping jaw 4 clamps the power semiconductor device and then performs temperature measurement; the main rod 13 is fixedly connected with the auxiliary rod 12, and the auxiliary rod 12 is fixedly connected with the limiting block 10, so that the main rod 13 is firmly connected with the auxiliary rod 12; the limiting holes 11 are provided with a plurality of groups and are clamped with the limiting blocks 10, so that the heights of the main rod 13 and the auxiliary rod 12 are flexibly adjustable; the placing plate 14 is fixedly connected with the main rod 13, the third temperature sensor 15 is fixedly connected with the placing plate 14, so that the height of the placing plate 14 is changed along with the main rod 13, and the temperature measurement is carried out on the power semiconductor devices on the placing plate 14; the first temperature sensor 5, the second temperature sensor 8 and the third temperature sensor 15 are electrically connected with the data receiver 18, and the data receiver 18 is electrically connected with the wireless transmitter 19, so that the first temperature sensor 5, the second temperature sensor 8 and the third temperature sensor 15 are transmitted to the data receiver 18 and then transmitted to an operator by the wireless transmitter 19.
The working principle and the using flow of the utility model are as follows: the operator places the power semiconductor to be measured on the placing plate 14, then inserts the limiting blocks 10 on the auxiliary rod 12 into different limiting holes 11 on the supporting rod 9, changes the heights of the main rod 13 and the auxiliary rod 12, then changes the heights of the placing plate 14, places the power semiconductor device to be measured in the first clamping claw 4 and the second clamping claw 7, then screws the first threaded rod 3 on the second threaded rod 6, rotates the first threaded rod 3 in the second threaded rod 6 in the threaded hole 20, firmly clamps the first clamping claw 4 and the second clamping claw 7, then detects the temperatures at all positions through the first temperature sensor 5, the second temperature sensor 8 and the third temperature sensor 15, then transmits temperature data into the data receiver 18, and then transmits the temperature data to the operator through the wireless transmitter 19, so that the working requirement of the shell temperature multipoint measuring device for the power semiconductor device can be met.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (7)
1. A power semiconductor device shell temperature multipoint measurement device is characterized in that: including base (1), base (1) top is provided with dead lever (2), dead lever (2) top is provided with first threaded rod (3), first threaded rod (3) opposite side is provided with first gripper jaw (4), first gripper jaw (4) lateral wall is provided with screw hole (20), first gripper jaw (4) surface is provided with first temperature sensor (5), first gripper jaw (4) opposite side is provided with second threaded rod (6), second threaded rod (6) one side is provided with second gripper jaw (7), second gripper jaw (7) surface is provided with second temperature sensor (8), base (1) top is provided with bracing piece (9), bracing piece (9) surface run through and are provided with spacing hole (11), spacing hole (11) top is provided with stopper (10), stopper (10) top is provided with auxiliary rod (12), auxiliary rod (12) top is provided with mobile jib (13), mobile jib (13) top is provided with places board (14), place board (14) surface is provided with second temperature sensor (8), the top is provided with third control box (16) and is provided with display box (16), the control box (16) is internally provided with a data receiver (18), and the other side of the data receiver (18) is provided with a wireless transmitter (19).
2. The power semiconductor device shell temperature multipoint measurement apparatus according to claim 1, wherein: the first threaded rod (3) is in threaded connection with the first clamping jaw (4) through a threaded hole (20), and the first clamping jaw (4) is in fixed connection with the first temperature sensor (5).
3. The power semiconductor device shell temperature multipoint measurement apparatus according to claim 1, wherein: the second threaded rod (6) is in threaded connection with the second clamping jaw (7) through a threaded hole (20), and the second clamping jaw (7) is in fixed connection with the second temperature sensor (8).
4. The power semiconductor device shell temperature multipoint measurement apparatus according to claim 1, wherein: the main rod (13) is fixedly connected with the auxiliary rod (12), and the auxiliary rod (12) is fixedly connected with the limiting block (10).
5. The power semiconductor device shell temperature multipoint measurement apparatus according to claim 1, wherein: the limiting holes (11) are provided with a plurality of groups and are clamped with the limiting blocks (10).
6. The power semiconductor device shell temperature multipoint measurement apparatus according to claim 1, wherein: the placing plate (14) is fixedly connected with the main rod (13), and the third temperature sensor (15) is fixedly connected with the placing plate (14).
7. The power semiconductor device shell temperature multipoint measurement apparatus according to claim 1, wherein: the first temperature sensor (5), the second temperature sensor (8) and the third temperature sensor (15) are electrically connected with the data receiver (18), and the data receiver (18) is electrically connected with the wireless transmitter (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321435988.5U CN220454728U (en) | 2023-06-07 | 2023-06-07 | Shell temperature multipoint measuring device for power semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321435988.5U CN220454728U (en) | 2023-06-07 | 2023-06-07 | Shell temperature multipoint measuring device for power semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220454728U true CN220454728U (en) | 2024-02-06 |
Family
ID=89728318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321435988.5U Active CN220454728U (en) | 2023-06-07 | 2023-06-07 | Shell temperature multipoint measuring device for power semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220454728U (en) |
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2023
- 2023-06-07 CN CN202321435988.5U patent/CN220454728U/en active Active
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