CN220454318U - Oxidation furnace for processing semiconductor raw materials - Google Patents

Oxidation furnace for processing semiconductor raw materials Download PDF

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Publication number
CN220454318U
CN220454318U CN202321959184.5U CN202321959184U CN220454318U CN 220454318 U CN220454318 U CN 220454318U CN 202321959184 U CN202321959184 U CN 202321959184U CN 220454318 U CN220454318 U CN 220454318U
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China
Prior art keywords
oxidation furnace
fixing seat
section
oxidation
semiconductor raw
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CN202321959184.5U
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Chinese (zh)
Inventor
曹旭锋
汪海燕
李建恒
朱思坤
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Tongling Andekeming Electronic Material Technology Co ltd
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Tongling Andekeming Electronic Material Technology Co ltd
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Abstract

The utility model discloses an oxidation furnace for processing semiconductor raw materials, which comprises an oxidation furnace upper section, an oxidation furnace middle section and an oxidation furnace lower section, wherein the bottom of the oxidation furnace upper section is connected with the oxidation furnace middle section through a first connecting component, the bottom of the oxidation furnace middle section is connected with the oxidation furnace lower section through a second connecting component, meanwhile, the upper end of the oxidation furnace upper section is provided with a feed inlet, the right side of the oxidation furnace lower section is provided with a feed outlet, and the inside of the oxidation furnace lower section is provided with a heating plate. This oxidation furnace is used in semiconductor raw and other materials processing breaks down and dismantles between with oxidation furnace upper segment, oxidation furnace middle section, oxidation furnace hypomere through first coupling assembling, second coupling assembling, can be convenient for wash oxidation furnace upper segment, oxidation furnace middle section, oxidation furnace hypomere inner wall this moment, washs the thick dirt that the inside hot plate surface of oxidation furnace hypomere adheres to, avoids influencing the heating efficiency of hot plate.

Description

Semiconductor raw material Oxidation furnace for processing
Technical Field
The utility model relates to the field of oxidizing furnaces, in particular to an oxidizing furnace for processing semiconductor raw materials.
Background
The semiconductor material is one of main raw materials which have semiconductor performance and can be used for manufacturing semiconductor devices and integrated circuits, and is developed in future information technology, and the existing semiconductor material is often subjected to high-temperature oxidation by an oxidation furnace in the production process, but the existing oxidation furnace is inconvenient to move, so that a large amount of manpower and material resources are often consumed when the oxidation furnace is required to move, and the normal production is not facilitated.
In order to solve the problems, through searching, the prior art discloses (application number: CN 202022533796.0) an oxidation furnace which is convenient to move and is used for producing and processing semiconductor materials; the bottom of the right side of the oxidation furnace body 15 is communicated with a discharge pipe 19, and the use of the fan 14, the oxidation furnace body 15, the heating plate 16, the air outlet bent pipe 17, the feeding pipe 18 and the discharge pipe 19 realizes the oxidation processing of semiconductor materials; "as shown in figure 1 of the specification: the oxidation oven body 15 is of an integral structure, the inside of the oxidation oven body 15 cannot be opened, the heating plate 16 inside the oxidation oven body 15 is cleaned, dirt on the heating plate is increased, and the heating effect is reduced.
Disclosure of Invention
The present utility model aims to provide an oxidation oven for processing semiconductor raw materials, which solves the above-mentioned drawbacks of the prior art.
In order to achieve the above purpose, the oxidizing furnace for processing semiconductor raw materials comprises an upper oxidizing furnace section, a middle oxidizing furnace section and a lower oxidizing furnace section, wherein the bottom of the upper oxidizing furnace section is connected with the middle oxidizing furnace section through a first connecting component, the bottom of the middle oxidizing furnace section is connected with the lower oxidizing furnace section through a second connecting component, meanwhile, a feed inlet is arranged at the upper end of the upper oxidizing furnace section, a discharge outlet is arranged at the right side of the lower oxidizing furnace section, and a heating plate is arranged in the lower oxidizing furnace section;
the second connecting assembly is consistent with the first connecting assembly in composition structure, the second connecting assembly comprises an upper fixing seat and a lower fixing seat, and the upper fixing seat and the lower fixing seat are uniformly fixedly installed through eight groups of fixing bolts.
Preferably, the lifting lugs arranged in a semicircular shape are welded on two sides of the middle section of the oxidizing furnace at the upper section of the oxidizing furnace, the supporting seat is welded on the bottom of the lower section of the oxidizing furnace, and meanwhile, one end, far away from the lower section of the oxidizing furnace, of the supporting seat is welded with the base, and the base is fixed on the bottom plate in a threaded manner.
Preferably, the upper fixing seat and the lower fixing seat are all circular, the diameters of the upper fixing seat and the lower fixing seat are consistent, and the thickness of the upper fixing seat is half of that of the lower fixing seat.
Preferably, the locating plates are welded on two sides of the bottom of the upper fixing seat, locating grooves are formed on two sides of the surface of the lower fixing seat, meanwhile, the locating grooves are matched with the locating plates in size, and the locating plates are inserted into the locating grooves.
Preferably, the positioning groove and the positioning plate are arranged in a C shape, the height of the positioning plate is consistent with the depth of the positioning groove, and positioning and installation are carried out between the upper fixing seat and the lower fixing seat through the positioning plate and the positioning groove.
Preferably, the upper sealing groove is formed in the right side of the bottom of the upper fixing seat, the lower sealing groove is formed in the right side of the surface of the lower fixing seat, the lower sealing groove and the upper sealing groove are arranged in an annular mode, the lower sealing groove and the upper sealing groove are combined together to form an annular mounting groove, the mounting groove is mounted in interference fit with the sealing strip, and the upper fixing seat and the lower fixing seat are sealed through the sealing strip.
Compared with the prior art, the utility model has the beneficial effects that: the upper section, the middle section and the lower section of the oxidation furnace are decomposed and disassembled through the first connecting component and the second connecting component, so that the inner walls of the upper section, the middle section and the lower section of the oxidation furnace can be conveniently cleaned, thick dirt attached to the surface of the heating plate in the lower section of the oxidation furnace is cleaned, and the heating efficiency of the heating plate is prevented from being influenced.
Drawings
FIG. 1 is a schematic elevational view of the structure of the present utility model;
FIG. 2 is a schematic view of a second connecting assembly of the present utility model;
FIG. 3 is a schematic view of the lower section of the oxidation oven according to the present utility model;
FIG. 4 shows the present utility model structure fig. 3 is a top view.
Reference numerals in the drawings: 1. an upper section of the oxidation furnace; 2. a middle section of the oxidation furnace; 3. the lower section of the oxidation furnace; 4. a support base; 5. a base; 6. a bottom plate; 7. a first connection assembly; 8. a second connection assembly; 81. an upper fixing seat; 82. a lower fixing seat; 83. an upper seal groove; 84. a lower seal groove; 85. a sealing strip; 86. a positioning groove; 87. a positioning plate; 88. and (5) fixing bolts.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the utility model provides an oxidizing furnace for processing semiconductor raw materials, which comprises an upper oxidizing furnace section 1, a middle oxidizing furnace section 2 and a lower oxidizing furnace section 3, wherein the bottom of the upper oxidizing furnace section 1 is connected with the middle oxidizing furnace section 2 through a first connecting component 7, the bottom of the middle oxidizing furnace section 2 is connected with the lower oxidizing furnace section 3 through a second connecting component 8, meanwhile, a feeding port is arranged at the upper end of the upper oxidizing furnace section 1, a discharging port is arranged at the right side of the lower oxidizing furnace section 3, and a heating plate is arranged in the lower oxidizing furnace section 3;
the second connecting assembly 8 is consistent with the composition structure of the first connecting assembly 7, the second connecting assembly 8 comprises an upper fixing seat 81 and a lower fixing seat 82, and the upper fixing seat 81 and the lower fixing seat 82 are uniformly fixedly installed through eight groups of fixing bolts 88.
Working principle: when needs are cleared up oxidation furnace upper segment 1, oxidation furnace middle segment 2, oxidation furnace hypomere 3's inside, accessible first coupling assembling 7, second coupling assembling 8 decompose and dismantle between oxidation furnace upper segment 1, oxidation furnace middle segment 2, the oxidation furnace hypomere 3 this moment, can be convenient for wash oxidation furnace upper segment 1, oxidation furnace middle segment 2, oxidation furnace hypomere 3 inner wall this moment, wash the inside thick dirt of hot plate surface adhesion of oxidation furnace hypomere 3, avoid influencing the heating efficiency of hot plate.
As a preferred embodiment, the two sides of the middle section 2 of the oxidizing furnace in the upper section 1 of the oxidizing furnace are welded with lifting lugs arranged in a semicircular shape, the bottom of the lower section 3 of the oxidizing furnace is welded with a supporting seat 4, and meanwhile, one end, far away from the lower section 3 of the oxidizing furnace, of the supporting seat 4 is welded with a base 5, and the base 5 is fixedly connected on a bottom plate 6 in a threaded manner.
As shown in fig. 1: the bottom of the lower section 3 of the oxidation furnace is supported and fixed through a supporting seat 4 and a base 5, and the lower section 3 of the oxidation furnace is detachably connected with the middle section 2 of the oxidation furnace through a second connecting component 8.
As a preferred embodiment, the upper fixing seat 81 and the lower fixing seat 82 are all circular, and the diameters of the upper fixing seat 81 and the lower fixing seat 82 are identical, and the thickness of the upper fixing seat 81 is half of the thickness of the lower fixing seat 82.
As shown in fig. 1-3: the disassembly modes between the upper section 1 and the middle section 2 are identical to the disassembly modes between the middle section 2 and the lower section 3, and only the disassembly modes between the middle section 2 and the lower section 3 are described here:
the fixing bolts 88 between the upper fixing seat 81 and the lower fixing seat 82 are detached, and the middle section 2 of the oxidation furnace is detached from the lower section 3 of the oxidation furnace through hoisting equipment.
As a preferred embodiment, the two sides of the bottom of the upper fixing seat 81 are welded with the positioning plate 87, and the two sides of the surface of the lower fixing seat 82 are provided with the positioning grooves 86, meanwhile, the positioning grooves 86 are matched with the positioning plate 87 in size, and the positioning plate 87 is inserted into the positioning grooves 86.
As shown in fig. 3-4: the locating plate 87 is inserted into the locating groove 86, so that the upper fixing seat 81 and the lower fixing seat 82 can be quickly installed when being located, and eight groups of through holes on the upper fixing seat 81 and the lower fixing seat 82 can be more quickly communicated for contra-rotating.
As a preferred embodiment, the positioning groove 86 and the positioning plate 87 are both arranged in a C shape, the height of the positioning plate 87 is consistent with the depth of the positioning groove 86, and meanwhile, the upper fixing seat 81 and the lower fixing seat 82 are positioned and installed through the positioning plate 87 and the positioning groove 86.
As a preferred embodiment, the right side of the bottom of the upper fixing seat 81 is provided with an upper sealing groove 83, the right side of the surface of the lower fixing seat 82 is provided with a lower sealing groove 84, meanwhile, the lower sealing groove 84 and the upper sealing groove 83 are all in annular arrangement, the lower sealing groove 84 and the upper sealing groove 83 are combined together to form an annular mounting groove, the mounting groove is in interference fit with a sealing strip 85, and meanwhile, the upper fixing seat 81 and the lower fixing seat 82 are sealed by the sealing strip 85.
The mounting groove is in interference fit with the sealing strip 85, the upper fixing seat 81 and the lower fixing seat 82 are compressed through the sealing strip 85, the sealing strip 85 is extruded, and annular sealing is carried out between the upper fixing seat 81 and the lower fixing seat 82.
As shown in fig. 3-4: the upper fixing seat 81 and the lower fixing seat 82 are sealed through the sealing strip 85, and the connection positions among the upper oxidation furnace section 1, the middle oxidation furnace section 2 and the lower oxidation furnace section 3 are sealed through the sealing strip 85, so that the airtight seal of the connection among the upper oxidation furnace section 1, the middle oxidation furnace section 2 and the lower oxidation furnace section 3 is ensured.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides an oxidation oven is used in semiconductor raw and other materials processing, includes oxidation oven upper segment (1), oxidation oven middle section (2) and oxidation oven hypomere (3), its characterized in that: the bottom of the upper oxidation furnace section (1) is connected with the middle oxidation furnace section (2) through a first connecting component (7), the bottom of the middle oxidation furnace section (2) is connected with the lower oxidation furnace section (3) through a second connecting component (8), a feeding port is arranged at the upper end of the upper oxidation furnace section (1), a discharging port is arranged on the right side of the lower oxidation furnace section (3), and a heating plate is arranged in the lower oxidation furnace section (3);
the second connecting assembly (8) is consistent with the composition structure of the first connecting assembly (7), the second connecting assembly (8) comprises an upper fixing seat (81) and a lower fixing seat (82), and the upper fixing seat (81) and the lower fixing seat (82) are uniformly fixedly mounted through eight groups of fixing bolts (88).
2. An oxidation oven for processing semiconductor raw materials according to claim 1, wherein: the two sides of the oxidation furnace middle section (2) of the oxidation furnace upper section (1) are welded with lifting lugs which are arranged in a semicircular mode, the bottom of the oxidation furnace lower section (3) is welded with a supporting seat (4), one end, away from the oxidation furnace lower section (3), of the supporting seat (4) is welded with a base (5), and the base (5) is fixedly connected to a bottom plate (6) in a threaded mode.
3. An oxidation oven for processing semiconductor raw materials according to claim 1, wherein: the upper fixing seat (81) and the lower fixing seat (82) are arranged in a circular shape, the diameters of the upper fixing seat (81) and the lower fixing seat (82) are consistent, and meanwhile, the thickness of the upper fixing seat (81) is half of that of the lower fixing seat (82).
4. An oxidation oven for processing semiconductor raw materials according to claim 3, wherein: the positioning plates (87) are welded on two sides of the bottom of the upper fixing seat (81), positioning grooves (86) are formed in two sides of the surface of the lower fixing seat (82), meanwhile, the positioning grooves (86) are matched with the positioning plates (87) in size, and the positioning plates (87) are inserted into the positioning grooves (86).
5. An oxidation oven for processing semiconductor raw materials according to claim 4, wherein: the locating groove (86) and the locating plate (87) are arranged in a C shape, the height of the locating plate (87) is consistent with the depth of the locating groove (86), and meanwhile, the upper fixing seat (81) and the lower fixing seat (82) are located and mounted through the locating plate (87) and the locating groove (86).
6. An oxidation oven for processing semiconductor raw materials according to claim 1, wherein: go up seal groove (83) on the fixed seat (81) bottom right side, and down seal groove (84) is offered on the surface right side of fixing base (82), and seal groove (84) and last seal groove (83) are the annular setting down simultaneously, and lower seal groove (84) and last seal groove (83) are combined together and are constituted annular mounting groove, and mounting groove and sealing strip (85) interference fit installation are gone up simultaneously and are sealed through sealing strip (85) between fixing base (81), the lower fixing base (82).
CN202321959184.5U 2023-07-25 2023-07-25 Oxidation furnace for processing semiconductor raw materials Active CN220454318U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321959184.5U CN220454318U (en) 2023-07-25 2023-07-25 Oxidation furnace for processing semiconductor raw materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321959184.5U CN220454318U (en) 2023-07-25 2023-07-25 Oxidation furnace for processing semiconductor raw materials

Publications (1)

Publication Number Publication Date
CN220454318U true CN220454318U (en) 2024-02-06

Family

ID=89735863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321959184.5U Active CN220454318U (en) 2023-07-25 2023-07-25 Oxidation furnace for processing semiconductor raw materials

Country Status (1)

Country Link
CN (1) CN220454318U (en)

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