CN220438874U - Edge computing board-mounted device - Google Patents
Edge computing board-mounted device Download PDFInfo
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- CN220438874U CN220438874U CN202322129891.8U CN202322129891U CN220438874U CN 220438874 U CN220438874 U CN 220438874U CN 202322129891 U CN202322129891 U CN 202322129891U CN 220438874 U CN220438874 U CN 220438874U
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- edge computing
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- 238000007789 sealing Methods 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an edge computing board-mounted device, which belongs to the technical field of edge computing equipment and particularly relates to an edge computing board-mounted device.
Description
Technical Field
The utility model relates to the technical field of edge computing equipment, in particular to an edge computing board-mounted device.
Background
The internet of things is an important component of a new generation of information technology and is also an important development stage of the information age. The internet of things is a network which utilizes local network or internet and other communication technologies to connect sensors, controllers, machines, personnel, objects and the like together in a new way to form connection between the personnel and the objects and between the objects and realize informatization, remote management control and intellectualization. In the current mainstream internet of things technology, the basic operation thought is that the edge equipment sends collected data to the data center; then the data center performs operation processing analysis to obtain an operation instruction, and the operation instruction is issued to the edge equipment; and finally, the edge equipment executes the operation instruction to obtain a result required by the user. In the mode, the intelligent degree of the whole Internet of things completely depends on a data center, and the edge equipment only has the functions of simple data acquisition, transmission, final instruction execution and the like. Once the network communication between the edge device and the data center is interrupted, the whole internet of things system may be in an unusable state. To solve this problem, intelligent edge computation is proposed. Intelligent edge computing proposes a new model: every edge device of the Internet of things has the functions of data acquisition, analysis and calculation, communication and most important intelligence. The intelligent edge computing also utilizes the capability of cloud computing, utilizes the cloud computing to perform large-scale security configuration, deployment and management of edge devices, and can distribute computing capability according to device types and scenes, so that the computing capability flows between the cloud and the edge, and a two-best result is obtained.
The existing edge calculation board-mounted circuit main board works for a long time, heat is generated through current and needs to be cooled, a heat conducting plate is arranged on the main board and used for increasing the contact area with air, meanwhile, the heat conducting plate is blown through a fan, the air flow rate is increased, the blown air is shielded through the top end of the heat conducting plate, the flow rate passing through the inner walls of the heat conducting plate is reduced, and the heat radiating efficiency is affected;
meanwhile, the circuit main board is directly fixed through screws during installation, and no protection is adopted, so that no buffer is generated during vibration, and the damage of materials is caused.
For this purpose, we invent an edge computing on-board device.
Disclosure of Invention
The present utility model has been made in view of the above and/or problems occurring in prior art edge computing on-board devices.
Therefore, an object of the present utility model is to provide an edge computing board-mounted device, which can solve the problems that the prior art is provided with a heat conducting plate on a main board, so as to increase the contact area with air, and meanwhile, the heat conducting plate is blown by a fan, so that the flow velocity of the blown air is increased, and the flow velocity between the inner walls of the heat conducting plate is reduced due to shielding of the top end of the heat conducting plate, so that the heat dissipation efficiency is affected.
In order to solve the technical problems, according to one aspect of the present utility model, the following technical solutions are provided:
an edge computing on-board device, comprising: the computer circuit board is mounted on the computer circuit board, the four corners of the computer circuit board are provided with first mounting positioning holes, and the upper part of the computer circuit board is provided with a heat conducting fin.
As a preferred embodiment of the edge computing on-board device according to the present utility model, the following applies: rubber pads are fixedly arranged below the positioning holes formed in the four corners of the computer circuit main board, second mounting positioning holes are formed in the rubber pads, and the second mounting positioning holes correspond to the first mounting positioning holes.
As a preferred embodiment of the edge computing on-board device according to the present utility model, the following applies: the fixing frame is arranged above the computer circuit main board, and the fixing frame is positioned on the outer side of the heat conducting fin.
As a preferred embodiment of the edge computing on-board device according to the present utility model, the following applies: the top end of the fixed frame is fixedly provided with a sealing cover, a closed space is formed between the inner side of the sealing cover and the inner side of the fixed frame, and one side of the closed space is provided with an opening structure and is used for being communicated with the outside.
As a preferred embodiment of the edge computing on-board device according to the present utility model, the following applies: the top end of the sealing cover is provided with a through groove, and the bottom end of the through groove is communicated with the sealed space.
As a preferred embodiment of the edge computing on-board device according to the present utility model, the following applies: the top of the heat conducting fin is provided with a groove, and the top of the groove corresponds to the through groove.
As a preferred embodiment of the edge computing on-board device according to the present utility model, the following applies: the inner wall of the groove is provided with a fixed mounting frame, and the top end of the fixed mounting frame is fixedly provided with an exhaust fan.
As a preferred embodiment of the edge computing on-board device according to the present utility model, the following applies: rectangular vertical grooves are formed in two sides of the fixed mounting frame, and the outer sides of the rectangular vertical grooves are communicated with gaps between two adjacent groups of heat conducting fins.
Compared with the prior art:
when the computer circuit main board is mounted, the protection is carried out through the rubber pad and the connecting part, and meanwhile, a buffer interval is formed, so that the damage efficiency is reduced;
the heat that computer circuit mainboard board carried produced is conducted to the conducting strip through the body, increases heat radiating area, opens the exhaust fan and makes its inside formation negative pressure with the gas discharge in the fixed frame after, with outer wall gas suction and each conducting strip rather than carrying out the heat transfer after, again by the exhaust fan discharge for the air velocity of flow improves radiating efficiency.
Drawings
FIG. 1 is a front view of the present utility model;
FIG. 2 is a bottom view of the present utility model;
FIG. 3 is a front view of a heat conductive sheet according to the present utility model;
FIG. 4 is a front view of a mounting frame of the present utility model;
fig. 5 is a front view of the mounting frame of the present utility model.
In the figure: 1 of a computer circuit main board, a wiring port 2, a first mounting and positioning hole 3, a rubber pad 4, a second mounting and positioning hole 5, a heat dissipation structure, a fixed frame 6, a heat conducting fin 7, a sealing cover 8, a through groove 9, a groove 10, a fixed mounting frame 11, a rectangular vertical groove 12 and an exhaust fan 13.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings.
Embodiment one:
the utility model provides an edge computing board device, which has the advantages of convenient use and improved heat dissipation efficiency, referring to fig. 1-5, and comprises a computer circuit board 1, wherein four corners of the computer circuit board 1 are respectively provided with a mounting positioning hole 3, and a heat conducting fin 7 is arranged above the computer circuit board 1.
Rubber pads 4 are fixedly arranged below the first positioning holes 3 formed in the four corners of the computer circuit main board 1, second mounting positioning holes 5 are formed in the rubber pads 4, and the second mounting positioning holes 5 correspond to the first mounting positioning holes 3;
a fixed frame 6 is arranged above the computer circuit main board 1, and the fixed frame 6 is positioned outside the heat conducting fin 7;
a sealing cover 8 is fixedly arranged at the top end of the fixed frame 6, a closed space is formed between the inner side of the sealing cover 8 and the inner side of the fixed frame 6, and one side of the closed space is provided with an opening structure for communicating with the outside;
the top end of the sealing cover 8 is provided with a through groove 9, the bottom end of the through groove 9 is communicated with the upper sealed space, the top end of the heat conducting fin 7 is provided with a groove 10, the top end of the groove 10 corresponds to the through groove 9, the inner wall of the groove 10 is provided with a fixed mounting frame 11, and the top end of the fixed mounting frame 11 is fixedly provided with an exhaust fan 13
When specifically using, when installing computer circuit mainboard board 1, protect with the junction through rubber pad 4, form buffer interval simultaneously, reduce damage efficiency, the heat that computer circuit mainboard board 1 produced is conducted to conducting strip 7 through the body, increase radiating area, open exhaust fan 13, make its inside negative pressure that forms with the gaseous discharge in the fixed frame 6, inhale outer wall gas in the fixed frame through the opening structure, after each conducting strip 7 exchanges heat with it, gather in fixed frame 6 in, again by exhaust fan 13 discharge, accelerate the air velocity, improve radiating efficiency.
Embodiment two:
the utility model provides an edge computing board-mounted device, referring to fig. 1-5, rectangular vertical grooves 12 are formed on two sides of a fixed mounting frame 11, and the outer sides of the rectangular vertical grooves 12 are communicated with gaps between two adjacent groups of heat conducting fins 7.
When specifically using, when installing computer circuit mainboard board 1, protect with the junction through rubber pad 4, form buffer interval simultaneously, reduce damage efficiency, the heat that computer circuit mainboard board 1 produced is conducted to conducting strip 7 through the body, increase radiating area, open exhaust fan 13, make its inside negative pressure that forms with the gaseous discharge in the fixed frame 6, inhale outer wall gas in the fixed frame through the opening structure, after each conducting strip 7 exchanges heat with it, gather in fixed frame 6 in, again by exhaust fan 13 discharge, accelerate the air velocity, improve radiating efficiency.
Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner as long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of omitting the descriptions and saving resources. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (3)
1. The edge computing board-mounted device comprises a computer circuit main board (1), and is characterized in that: four corners of the computer circuit main board carrier (1) are provided with mounting positioning holes I (3), and a heat conducting sheet (7) is arranged above the computer circuit main board carrier (1);
a fixed frame (6) is arranged above the computer circuit main board (1), and the fixed frame (6) is positioned at the outer side of the heat conducting fin (7);
a sealing cover (8) is fixedly arranged at the top end of the fixed frame (6), a closed space is formed between the inner side of the sealing cover (8) and the inner side of the fixed frame (6), and one side of the closed space is provided with an opening structure and is used for being communicated with the outside; a through groove (9) is formed in the top end of the sealing cover (8), and the bottom end of the through groove (9) is communicated with the sealed space; a groove (10) is formed in the top end of the heat conducting fin (7), and the top end of the groove (10) corresponds to the through groove (9);
the inner wall of the groove (10) is provided with a fixed installation frame (11), and the top end of the fixed installation frame (11) is fixedly provided with an exhaust fan (13).
2. The edge computing board-mounted device according to claim 1, wherein rubber pads (4) are fixedly installed below positioning holes I (3) formed in four corners of the computer circuit board-mounted device (1), mounting positioning holes II (5) are formed in the rubber pads (4), and the mounting positioning holes II (5) correspond to the mounting positioning holes I (3).
3. The edge computing board device according to claim 1, wherein rectangular vertical grooves (12) are formed in two sides of the fixed mounting frame (11), and the outer sides of the rectangular vertical grooves (12) are communicated with gaps between two adjacent groups of heat conducting fins (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322129891.8U CN220438874U (en) | 2023-08-09 | 2023-08-09 | Edge computing board-mounted device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322129891.8U CN220438874U (en) | 2023-08-09 | 2023-08-09 | Edge computing board-mounted device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220438874U true CN220438874U (en) | 2024-02-02 |
Family
ID=89698965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322129891.8U Active CN220438874U (en) | 2023-08-09 | 2023-08-09 | Edge computing board-mounted device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220438874U (en) |
-
2023
- 2023-08-09 CN CN202322129891.8U patent/CN220438874U/en active Active
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