CN220433043U - Copper plating device for multilayer printed circuit board - Google Patents
Copper plating device for multilayer printed circuit board Download PDFInfo
- Publication number
- CN220433043U CN220433043U CN202322031526.3U CN202322031526U CN220433043U CN 220433043 U CN220433043 U CN 220433043U CN 202322031526 U CN202322031526 U CN 202322031526U CN 220433043 U CN220433043 U CN 220433043U
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- China
- Prior art keywords
- fixed
- copper plating
- frames
- electroplating
- circular
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 55
- 239000010949 copper Substances 0.000 title claims abstract description 55
- 238000007747 plating Methods 0.000 title claims abstract description 54
- 238000009713 electroplating Methods 0.000 claims abstract description 35
- 239000007788 liquid Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 20
- 230000002457 bidirectional effect Effects 0.000 abstract description 12
- 238000003825 pressing Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The utility model discloses a copper plating device for a multilayer printed circuit board, which belongs to the technical field of copper plating of circuit boards and aims at solving the problems of lower working efficiency of the copper plating device and insufficient use stability of the copper plating device, and the copper plating device comprises an electroplating box, wherein a box groove is formed in the electroplating box, two supporting frames are fixed at the upper end of the electroplating box, a bidirectional threaded rod is rotationally connected to the middle part of the two supporting frames, rotating handles are respectively fixed at two ends of the bidirectional threaded rod, two threaded frames are in threaded connection with the outer surface of the bidirectional threaded rod, connecting frames are rotationally connected to the lower ends of the two threaded frames, fixing frames are rotationally connected to the other ends of the two connecting frames, and a placing frame is fixed at the other ends of the two fixing frames; according to the copper plating device, the rotary handle is rotated by manpower to perform rotary operation, the effect of batch copper plating is achieved, the effect of improving the working efficiency of the copper plating device is achieved, the handle is pulled by manpower to perform moving operation, the effect of pressing and fixing is achieved, and the effect of improving the use stability of the copper plating device is achieved.
Description
Technical Field
The utility model belongs to the technical field of copper plating of circuit boards, and particularly relates to a copper plating device of a multilayer printed circuit board.
Background
The printed circuit board is used as a carrier of electronic components, and is widely applied to the field of electronic devices to realize connection between the electronic components, in the production process of the printed circuit board, a copper plating device is required to be used for carrying out copper plating treatment on the printed circuit board, and electroplating copper refers to electroplating copper in a layer with a specified thickness in a hole and on the surface of a copper plate in a direct current electroplating mode on the basis of a PTH or a via hole so as to ensure the performance requirement of a product.
Although current copper plating device can carry out daily printed wiring board copper plating operation, but in the in-service use, need carry out copper plating to the printed wiring board alone and handle, inconvenient simultaneously carry out copper plating operation to a plurality of printed wiring boards, more waste time for copper plating device's work efficiency is lower, and inconvenient carry out centre gripping operation to the printed wiring board, make the printed wiring board produce easily and rock when immersing in the plating bath, make copper plating device's stability in use not enough.
Therefore, there is a need for a copper plating apparatus for a multilayer printed wiring board, which solves the problems of the prior art that the working efficiency of the copper plating apparatus is low and the use stability of the copper plating apparatus is insufficient.
Disclosure of Invention
The utility model aims to provide a copper plating device for a multilayer printed wiring board, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a multilayer printed wiring board copper plating device, includes the electroplating tank, the inside case groove of having seted up of electroplating tank, electroplating tank upper end is fixed with two support frames, two support frame middle part rotates and is connected with two-way threaded rod, two-way threaded rod both ends all are fixed with the rotating handle, two-way threaded rod surface threaded connection has two screw thread framves, two the screw thread frame lower extreme all rotates and is connected with the link, two the link other end all rotates and is connected with the mount, two the mount other end is fixed with the rack, a plurality of runs through the groove has been seted up at the rack middle part, the rack upper end is fixed with a plurality of mounting bracket, every circular groove has all been seted up to mounting bracket one end, every equal sliding connection of circular groove inner wall has circular dish, every circular dish one end all is fixed with the spring, every circular dish middle part all is fixed with the movable contact rod, every movable contact rod one end all is fixed with the handle, every the mounting bracket other end all is fixed with the stationary contact.
In the scheme, the lower ends of the two supporting frames are fixed at the middle parts of the two ends of the electroplating box, the outer surfaces of the two-way threaded rods are rotationally connected to the middle parts of the two supporting frames, and the middle parts of the two rotating handles are fixed at the two ends of the two-way threaded rods.
It is further worth to say that two screw frame middle part threaded connection is at the both sides surface of two-way threaded rod, every screw frame one end rotates to be connected in every link one end, every mount one end rotates to be connected at every link other end, two the mount lower extreme is fixed in rack upper end middle part, rack surface sliding connection is at the case inslot wall, a plurality of run through the groove runs through in the rack middle part.
It should be further noted that each mounting frame vertical section is U-shaped, each circular disc outer surface sliding connection is in each circular groove inner wall, each circular disc vertical section is circular, each spring one end is fixed in each circular disc one end, each spring other end is fixed in each circular groove one end.
As a preferred embodiment, each movable contact rod penetrates through the middle part of each circular groove, each movable contact rod is fixed at the middle part of each circular disc, the outer surface of one end of each movable contact rod is contacted with the outer surface of each stationary contact, and each handle middle part is fixed at the other end of each movable contact rod.
As a preferred implementation mode, the lower end of the electroplating tank is provided with a liquid outlet pipe, and the middle part of the liquid outlet pipe is provided with a valve.
As a preferred implementation mode, handles are fixed at two ends of the electroplating tank, the handles are arranged oppositely, supporting legs are fixed at four corners of the lower end of the electroplating tank, and vertical sections of the supporting legs are all T-shaped.
Compared with the prior art, the copper plating device for the multilayer printed circuit board provided by the utility model at least comprises the following beneficial effects:
(1) Rotating operation is carried out by manually rotating the rotating handle, so that the rotating handle, the bidirectional threaded rod, the threaded rack, the connecting frame, the supporting frame, the fixing frame, the placing frame and the penetrating groove are mutually matched for operation, the effect of batch copper plating is achieved, copper plating treatment can be carried out on a plurality of printed circuit boards simultaneously, time is saved, and the effect of improving the working efficiency of the copper plating device is achieved.
(2) Through the manual force pulling handle operation of removing for handle, movable feeler lever, stationary contact, mounting bracket, circular slot, circular dish, spring mutually support the operation, realize pressing fixed effect, avoid printed wiring board to produce at the immersion fluid in-process and rock, and then reach the effect that improves copper plating device stability in use.
Drawings
FIG. 1 is a perspective view of the present utility model;
FIG. 2 is a cross-sectional view of the plating tank of the present utility model;
FIG. 3 is a schematic view of a rack structure according to the present utility model;
fig. 4 is a cross-sectional view of the mounting bracket of the present utility model.
In the figure: 1. an electroplating box; 2. a tank; 3. a support frame; 4. a two-way threaded rod; 5. a rotating handle; 6. a screw thread rack; 7. a connecting frame; 8. a fixing frame; 9. a placing rack; 10. a through groove; 11. a mounting frame; 12. a circular groove; 13. a circular disc; 14. a spring; 15. a movable feeler lever; 16. a handle; 17. a stationary contact; 18. a liquid outlet pipe; 19. a valve; 20. a handle; 21. and (5) supporting legs.
Detailed Description
The utility model is further described below with reference to examples.
Referring to fig. 1-4, the utility model provides a copper plating device for a multilayer printed circuit board, which comprises an electroplating box 1, wherein the electroplating box 1 is used for loading electroplating solution to perform copper plating treatment on the printed circuit board, a box groove 2 is formed in the electroplating box 1, two support frames 3 are fixed at the upper end of the electroplating box 1, the support frames 3 play a role in stabilizing a bidirectional threaded rod 4, the middle parts of the two support frames 3 are rotationally connected with the bidirectional threaded rod 4, the bidirectional threaded rod 4 drives two threaded frames 6 to perform reverse sliding, both ends of the bidirectional threaded rod 4 are fixedly provided with rotating handles 5, the rotating handles 5 facilitate the rotation of workers, the outer surface of the bidirectional threaded rod 4 is in threaded connection with two threaded frames 6, the threaded frames 6 drive a placing frame 9 to slide through connecting frames 7 and a fixing frame 8, the lower ends of the two threaded frames 6 are rotationally connected with connecting frames 7, the other ends of the two connecting frames 7 are rotationally connected with a fixing frame 8, the other ends of the two fixing frames 8 are fixedly provided with the placing frames 9, the placing frames 9 perform the function of placing printed circuit boards in batches, the function of batch production can be realized, a plurality of through grooves 10 are formed in the middle of the placing frames 9, a plurality of mounting frames 11 are fixedly arranged at the upper ends of the placing frames 9, the mounting frames 11 perform the mounting operation of the printed circuit boards, one end of each mounting frame 11 is provided with a circular groove 12, the circular groove 12 provides the place support function for the sliding of the circular disc 13, the inner wall of each circular groove 12 is fixedly connected with the circular disc 13 in a sliding manner, one end of each circular disc 13 is fixedly provided with a spring 14, the spring 14 provides the function of elastic support, the middle of each circular disc 13 is fixedly provided with a movable contact rod 15, the movable contact rod 15 is mutually matched with a fixed contact 17, the pressing and fixing function is performed on the printed circuit boards, one end of each movable contact rod 15 is fixedly provided with a handle 16, the handle 16 is convenient for the staff to rotate, and the other end of each mounting frame 11 is fixed with a fixed contact 17.
Further, as shown in fig. 1, fig. 2 and fig. 3, it is worth specifically explaining that the lower ends of the two supporting frames 3 are fixed at the middle parts of the two ends of the electroplating tank 1, the outer surfaces of the two-way threaded rods 4 are rotationally connected at the middle parts of the two supporting frames 3, the middle parts of the two rotating handles 5 are fixed at the two ends of the two-way threaded rods 4, the middle parts of the two threaded frames 6 are in threaded connection with the outer surfaces of the two sides of the two-way threaded rods 4, one end of each threaded frame 6 is rotationally connected at one end of each connecting frame 7, one end of each fixing frame 8 is rotationally connected at the other end of each connecting frame 7, the lower ends of the two fixing frames 8 are fixed at the middle parts of the upper ends of the placing frames 9, the outer surfaces of the placing frames 9 are slidingly connected at the inner walls of the tank 2, and a plurality of penetrating grooves 10 penetrate through the middle parts of the placing frames 9.
Further, as shown in fig. 1, fig. 2 and fig. 4, it is worth specifically describing that the vertical section of each mounting frame 11 is U-shaped, the outer surface of each circular disc 13 is slidably connected to the inner wall of each circular groove 12, the vertical section of each circular disc 13 is circular, one end of each spring 14 is fixed to one end of each circular disc 13, the other end of each spring 14 is fixed to one end of each circular groove 12, each movable contact rod 15 penetrates through the middle part of each circular groove 12, the middle part of each movable contact rod 15 is fixed to the middle part of each circular disc 13, the outer surface of one end of each movable contact rod 15 contacts with the outer surface of each stationary contact 17, and the middle part of each handle 16 is fixed to the other end of each movable contact rod 15.
The scheme comprises the following working processes: when the multilayer printed circuit board copper plating device is used, the rotating handle 5 is rotated by manpower at first, so that the bidirectional threaded rod 4 fixedly connected with the middle part of the rotating handle 5 rotates under the stability of the two supporting frames 3, and the two threaded frames 6 in threaded connection with the outer surfaces of the two sides of the bidirectional threaded rod 4 slide reversely under the stability of the connecting frame 7 and the fixing frame 8, so that the connecting frame 7 rotationally connected with the lower end of the threaded frame 6 drives the placing frame 9 to slide on the inner wall of the box 2 through the fixing frame 8, copper plating treatment is conveniently and simultaneously carried out on a plurality of printed circuit boards, the effect of batch copper plating is finished, copper plating treatment can be simultaneously carried out on a plurality of printed circuit boards, the time is saved, and the effect of improving the working efficiency of the copper plating device is achieved, then the handle 16 is pulled by manpower to carry out moving operation, so that the movable feeler lever 15 fixedly connected with the handle 16 carries out sliding operation under the stability of the mounting frame 11, the round disc 13 fixedly connected with the middle part of the movable feeler lever 15 carries out sliding operation under the stability of the inner wall of the round groove 12, the spring 14 fixedly connected with one end of the round disc 13 is compressed under the support of the round groove 12, the movable feeler lever 15 obtains a compression space, the movable feeler lever 15 can be far away from the fixed contact 17, then a printed circuit board is placed between the movable feeler lever 15 and the fixed contact 17, then the manpower is released, the elastic force generated by the compressed spring 14 pushes the round disc 13 and the movable feeler lever 15 to carry out resetting operation, so that the movable feeler lever 15 and the fixed contact 17 are mutually matched, the effect of pressing and fixing is finished, the shaking of the printed circuit board is avoided in the immersion process, thereby achieving the effect of improving the use stability of the copper plating device.
The working process can be as follows: rotating operation is carried out through manpower rotation rotating handle 5 for the bidirectional threaded rod 4 with rotating handle 5 middle part fixed connection drives rack 9 and carries out sliding operation, realizes copper plating's effect in batches, can carry out copper plating to a plurality of printed wiring boards simultaneously, and is more save time, and then reaches the effect that improves copper plating device work efficiency, moves the operation through manpower pulling handle 16 afterwards, makes the movable feeler lever 15 with handle 16 fixed connection carry out sliding operation, realizes pressing fixed effect, avoids printed wiring board to produce at the immersion in-process and rocks, and then reaches the effect that improves copper plating device stability in use.
Further, as shown in fig. 1 and fig. 2, it is worth specifically explaining that the lower end of the electroplating tank 1 is provided with a liquid outlet pipe 18, the middle part of the liquid outlet pipe 18 is provided with a valve 19, and the liquid outlet pipe 18 can conduct out the used electroplating liquid, thereby being convenient to use.
Further, as shown in fig. 1 and 2, it is worth specifically explaining that handles 20 are fixed at both ends of the electroplating tank 1, the two handles 20 are oppositely arranged, supporting legs 21 are fixed at four corners of the lower end of the electroplating tank 1, vertical sections of the supporting legs 21 are all in a T-shaped arrangement, the supporting legs 21 play a role in supporting the electroplating tank 1, and stability of the copper plating device is improved.
To sum up: the effect of leading out the used electroplating solution can be conducted through the liquid outlet pipe 18, the effect of using is convenient, the effect of supporting the electroplating tank 1 is played through the landing leg 21, and the effect of improving the stability of the copper plating device is achieved.
Claims (7)
1. The utility model provides a multilayer printed wiring board copper plating device, includes electroplating case (1), its characterized in that, box groove (2) has been seted up to inside electroplating case (1), electroplating case (1) upper end is fixed with two support frames (3), two support frame (3) middle part rotates and is connected with bi-directional threaded rod (4), bi-directional threaded rod (4) both ends all are fixed with rotating handle (5), bi-directional threaded rod (4) surface threaded connection has two screw frame (6), two screw frame (6) lower extreme all rotates and is connected with link (7), two link (7) other end all rotates and is connected with mount (8), two the mount (8) other end is fixed with rack (9), a plurality of run-through groove (10) have been seted up in rack (9) middle part, rack (9) upper end is fixed with a plurality of mounting bracket (11), every circular groove (12) all have been seted up at mounting bracket (11) one end, every circular groove (12) inner wall all sliding connection has circular dish (13), every link (15) all have one end (15) all fixed with circular dish (15), and a fixed contact (17) is fixed at the other end of each mounting frame (11).
2. The copper plating apparatus for a multilayer printed wiring board according to claim 1, wherein: the lower ends of the two supporting frames (3) are fixed at the middle parts of the two ends of the electroplating box (1), the outer surfaces of the two-way threaded rods (4) are rotationally connected to the middle parts of the two supporting frames (3), and the middle parts of the two rotating handles (5) are fixed at the two ends of the two-way threaded rods (4).
3. The copper plating apparatus for a multilayer printed wiring board according to claim 1, wherein: two screw frame (6) middle part threaded connection is in two-way threaded rod (4) both sides surface, every screw frame (6) one end rotates to be connected in every link (7) one end, every mount (8) one end rotates to be connected at every link (7) other end, two mount (8) lower extreme is fixed in rack (9) upper end middle part, rack (9) surface sliding connection is at case groove (2) inner wall, a plurality of run through groove (10) run through in rack (9) middle part.
4. The copper plating apparatus for a multilayer printed wiring board according to claim 1, wherein: every mounting bracket (11) erects the tangent plane and is the U type setting, every circular dish (13) surface sliding connection is at every circular groove (12) inner wall, every circular dish (13) erects the tangent plane and is circular setting, every spring (14) one end is fixed at every circular dish (13) one end, every spring (14) other end is fixed at every circular groove (12) one end.
5. The copper plating apparatus for a multilayer printed wiring board according to claim 1, wherein: each movable contact rod (15) penetrates through the middle of each circular groove (12), the middle of each movable contact rod (15) is fixed at the middle of each circular disc (13), the outer surface of one end of each movable contact rod (15) is contacted with the outer surface of each stationary contact (17), and the middle of each handle (16) is fixed at the other end of each movable contact rod (15).
6. The copper plating apparatus for a multilayer printed wiring board according to claim 1, wherein: the lower end of the electroplating tank (1) is provided with a liquid outlet pipe (18), and the middle part of the liquid outlet pipe (18) is provided with a valve (19).
7. The copper plating apparatus for a multilayer printed wiring board according to claim 1, wherein: the electroplating device is characterized in that handles (20) are fixed at two ends of the electroplating tank (1), the handles (20) are oppositely arranged, supporting legs (21) are fixed at four corners of the lower end of the electroplating tank (1), and vertical sections of the supporting legs (21) are T-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322031526.3U CN220433043U (en) | 2023-07-31 | 2023-07-31 | Copper plating device for multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322031526.3U CN220433043U (en) | 2023-07-31 | 2023-07-31 | Copper plating device for multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220433043U true CN220433043U (en) | 2024-02-02 |
Family
ID=89695993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322031526.3U Active CN220433043U (en) | 2023-07-31 | 2023-07-31 | Copper plating device for multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220433043U (en) |
-
2023
- 2023-07-31 CN CN202322031526.3U patent/CN220433043U/en active Active
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