CN220432955U - Magnetron sputtering coating device - Google Patents

Abstract

The application provides a magnetron sputtering coating device, which comprises a target unit, a magnetic field generating unit and a vacuum generating unit; the number of the target units is multiple, the target units comprise first connecting parts, and the first ends of the first connecting parts are communicated with the hollow cavity of the plated workpiece; the magnetic field generating unit is sleeved outside the target units; the vacuum generating unit comprises a vacuum cavity and a plurality of second connecting parts, wherein the second connecting parts are communicated with the vacuum cavity, the second connecting parts are arranged in a matched mode with the second ends of the first connecting parts, and the first connecting parts are communicated with the second connecting parts. The magnetron sputtering coating device provided by the application provides a plurality of coating stations for the coated workpiece, and the vacuum cavity is communicated with the second connecting part, the first connecting part and the hollow cavity of the coated workpiece, so that a plurality of vacuum boxes can be formed inside the magnetic field generating unit, a plurality of coated workpieces can be coated simultaneously, and the coating production efficiency of the coated workpiece is greatly improved.

Description

Magnetron sputtering coating device

Technical Field

The application belongs to the technical field of magnetron sputtering, and particularly relates to a magnetron sputtering coating device.

Background

The coating film is applied to pipelines in the special fields of vacuum equipment, medical equipment, chemical industry and the like, and in order to change the physical characteristics of the inner surface of a pipeline material, such as improving the corrosion resistance and the wear resistance of the inner surface of the pipeline, reducing the secondary electron yield of the surface of the material, reducing the material air release rate, improving the air suction characteristic and the like, the inner wall of the pipeline needs to be coated.

The inner wall of the pipeline is coated by a magnetron sputtering coating device, before coating, a target material is required to be installed in the pipeline to be coated, and then the target material and the pipeline to be coated are installed in the magnetron sputtering coating device, so that the installation process is complicated; in addition, most of the existing magnetron sputtering coating equipment is single-station coating equipment, so that the production efficiency is low when the inner wall of the pipeline is coated, and the production requirement of the pipeline coating can not be met.

Disclosure of Invention

An object of the embodiment of the application is to provide a magnetron sputtering coating device, so as to solve the technical problem of lower production efficiency of coating on the inner wall of a workpiece in the prior art.

In order to achieve the above object, an embodiment of the present application provides a magnetron sputtering coating device, including:

a target unit; the number of the target units is multiple, the target units comprise first connecting parts, and the first ends of the first connecting parts are communicated with the hollow cavity of the plated workpiece;

a magnetic field generation unit; the magnetic field generating unit is sleeved outside the target units;

a vacuum generating unit; the vacuum generating unit comprises a vacuum cavity and a plurality of second connecting parts, wherein the second connecting parts are communicated with the vacuum cavity, the second connecting parts are arranged in a matched mode with the second ends of the first connecting parts, and the first connecting parts are communicated with the second connecting parts.

Optionally, the magnetic field generating unit includes a solenoid body and a coil layer wound on the solenoid body;

the coil layer includes first coil layer and second coil layer, and two first coil layers are located the both ends of solenoid body, and the second coil layer is located the middle part of solenoid body, along the radial direction of solenoid body, and the thickness of first coil layer is greater than the thickness of second coil layer.

Optionally, the magnetron sputtering coating device further comprises a cooling unit, and the cooling unit is connected with the magnetic field generating unit.

Optionally, the cooling unit includes a cooling fan, and the cooling fan is disposed opposite to the magnetic field generating unit;

the number of the cooling fans is plural, and the plural cooling fans are sequentially arranged along the axial direction and/or the circumferential direction of the solenoid body.

Optionally, the target unit further includes a third connecting portion and a target, the first end of the third connecting portion is communicated with the hollow cavity of the workpiece to be plated, the second end of the third connecting portion is provided with a target fixing assembly, the first end of the target is connected with the target fixing assembly, and the second end of the target sequentially penetrates through the third connecting portion, the workpiece to be plated and the first connecting portion.

Optionally, the target unit further comprises a weight member and an insulating member; the target is arranged in the vertical direction, the insulating parts are arranged at two ends of the target, and the counterweight part is connected with the second end of the target;

the vacuum cavity of the vacuum generating unit is internally provided with a limiting seat, and the counterweight is inserted into the limiting seat.

Optionally, the length of the solenoid body is greater than the length of the workpiece to be plated, and the first end of the first connecting portion and the first end of the third connecting portion are located inside the tube body of the solenoid body.

Optionally, the vacuum generating unit further comprises a plurality of quick-release flanges, and the first connecting part and the second connecting part are detachably connected through the quick-release flanges;

the axes of the plurality of second connecting parts are arranged in parallel; projections of the quick release flanges in the radial direction of the second connecting part are not overlapped with each other.

Optionally, the vacuum generating unit further comprises a vacuum pump set, a vacuum gauge and a valve; the vacuum pump group and the vacuum gauge are communicated with the vacuum cavity through a pipeline, and the valve is arranged on the pipeline.

The magnetron sputtering coating device has the beneficial effects that: compared with the prior art, the magnetron sputtering coating device is provided with a plurality of second connecting parts communicated with the vacuum cavities, the second connecting parts can be used for setting the first connecting parts in the target units, a plurality of coating stations are provided for the coated workpiece, the vacuum cavities are communicated with the second connecting parts, the first connecting parts and the hollow cavities of the coated workpiece, a plurality of vacuum boxes can be formed in the magnetic field generating unit, a plurality of coated workpieces can be coated simultaneously, and the coating production efficiency of the coated workpiece is greatly improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a front view of a magnetron sputtering coating device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a magnetron sputtering coating device according to an embodiment of the present application;

FIG. 3 is a top view of a magnetron sputtering coating device according to an embodiment of the present application;

FIG. 4 is a cross-sectional view of the structure of line A-A in FIG. 3;

FIG. 5 is a schematic diagram of a magnetron sputtering coating device according to an embodiment of the present application, wherein the magnetron sputtering coating device includes a magnetic field generating unit and a cooling unit;

FIG. 6 is a schematic diagram of the structure of a target unit and a workpiece to be plated according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a target unit and a third connection portion according to an embodiment of the present disclosure;

FIG. 8 is a cross-sectional view I of a target unit and plated workpiece connection structure provided in an embodiment of the present application;

fig. 9 is a schematic structural diagram of a target unit and a second connection portion according to an embodiment of the present disclosure;

FIG. 10 is a second cross-sectional view of a connection structure between a target unit and a workpiece to be plated according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a vacuum generating unit according to an embodiment of the present application.

Wherein, each reference sign in the figure:

1-a first connection; 101-a first connection plate; 102-a second connection plate; 103-a first extension pipe;

2-a workpiece to be plated; 201, a workpiece tube body to be plated; 202-a third connecting plate; 203-a fourth connection plate;

3-a vacuum cavity;

4-a second connection;

a 5-solenoid body;

6-coil layers; 601-a first coil layer; 602-a second coil layer;

7-a cooling unit; 701-a cooling fan; 702-a fan mount;

8-a third connection; 801-a second extension duct; 802-a fifth connection board; 803-sixth connection plates;

9-target material;

10-a target fixing assembly;

11-a weight;

12-an insulator; 12 A-A first insulating member; 12 b-a second insulator; 12 c-a third insulator;

13, a limiting seat;

14-quick-release flange;

15-a vacuum pump set;

16-vacuum gauge;

17-a valve member; 1701-a trim valve; 1702-a first angle valve; 1703-second angle valve;

18-a power electrode;

19-a mounting base; 1901-a solenoid mount; 1902-mounting brackets; 1903-universal wheels; 1904-ground feet.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, a magnetron sputtering coating device according to an embodiment of the application will be described. The magnetron sputtering coating device comprises a target unit, a magnetic field generating unit and a vacuum generating unit; the number of the target units is multiple, the target units comprise first connecting parts 1, and the first ends of the first connecting parts 1 are communicated with the hollow cavity of the plated workpiece 2; the magnetic field generating unit is sleeved outside the target units; the vacuum generating unit comprises a vacuum cavity 3 and a plurality of second connecting parts 4, the second connecting parts 4 are communicated with the vacuum cavity 3, the second connecting parts 4 are matched with the second ends of the first connecting parts 1, and the first connecting parts 1 are communicated with the second connecting parts 4.

Compared with the prior art, the magnetron sputtering coating device provided by the application is provided with a plurality of second connecting parts 4 communicated with the vacuum cavity 3, the second connecting parts 4 can be used for setting the first connecting parts 1 in the target units, a plurality of coating stations are provided for the coated workpiece 2, the vacuum cavity 3 is communicated with the second connecting parts 4, the first connecting parts 1 and the hollow cavity of the coated workpiece 2, a plurality of vacuum boxes can be formed inside the magnetic field generating unit, a plurality of coated workpieces 2 can be coated simultaneously, and the coating production efficiency of the coated workpiece 2 is greatly improved.

In another embodiment of the present application, referring to fig. 1, 9 and 11, the vacuum generating unit further includes a plurality of quick-release flanges 14, and the first connection portion 1 and the second connection portion 4 are detachably connected through the quick-release flanges 14; the dismounting efficiency between the first connecting part 1 and the second connecting part 4 can be improved, so that the mounting and replacing efficiency of the plated workpiece 2 can be improved, and the production efficiency of magnetron sputtering coating can be improved.

In another embodiment of the present application, referring to fig. 11, the axes of the plurality of second connecting portions 4 are arranged in parallel; the projections of the plurality of quick release flanges 14 in the radial direction of the second connecting portion 4 do not overlap each other. The second connecting parts 4 are compact in structure, and interference among the quick-release flanges 14 is avoided.

As a preferred embodiment of the present application, referring to fig. 11, the axes of the three second connection parts 4 are arranged in parallel, and the axes of the three second connection parts 4 are uniformly arranged along the circumferential direction of the magnetic field generating unit.

As a preferred embodiment of the present application, referring to fig. 11, the axes of the plurality of second connecting portions 4 are vertically disposed, and the positions of the plurality of second connecting portions 4 in the height direction are different, so as to avoid interference between adjacent second connecting portions 4 and between adjacent quick-release flanges 14 during disassembly.

In another embodiment of the present application, referring to fig. 9 and 10, a first connecting plate 101 is disposed at a second end of the first connecting portion 1, and the first connecting plate 101 is configured to match with the quick release flange 14, so as to achieve tight connection between the first connecting portion 1 and the quick release flange 14.

In another embodiment of the present application, referring to fig. 2, 3 and 4, the magnetic field generating unit includes a solenoid body 5 and a coil layer 6 wound on the solenoid body 5; after the coil layer 6 is electrified, a magnetic field is generated, so that the target unit performs sputtering coating on the inner wall of the workpiece 2 to be coated under the action of the magnetic field.

In another embodiment of the present application, referring to fig. 1 and 4, the coil layer 6 includes a first coil layer 601 and a second coil layer 602, the two first coil layers 601 are located at two ends of the solenoid body 5, the second coil layer 602 is located in the middle of the solenoid body 5, adjacent first coil layers 601 and second coil layers 602 are electrically connected, and the thickness of the first coil layer 601 is greater than the thickness of the second coil layer 602 along the radial direction of the solenoid body 5. Coil compensation can be performed on two ends of the solenoid body 5, the axial length of an effective magnetic field in the solenoid body 5 is prolonged, and the solenoid can be suitable for plating films of plated workpieces 2 with longer lengths.

As a preferred embodiment of the present application, the thickness of the first coil layer 601 is 1.5 to 2 times the thickness of the second coil layer 602.

In another embodiment of the present application, referring to fig. 1 and 2, the magnetron sputtering coating device further includes a cooling unit 7, where the cooling unit 7 is connected to the magnetic field generating unit, and is used for cooling the solenoid body 5 and the coil layer 6.

In another embodiment of the present application, a plurality of cooling medium channels are provided in the side wall of the solenoid body 5, and when the cooling medium is introduced into the cooling medium channels, heat in the solenoid body 5 and the coil layer 6 can be taken away through heat exchange, so that burning out caused by overhigh solenoid temperature is avoided, and the magnetic field is destroyed.

Because the cooling medium channel provided in the solenoid body 5 has a complex cooling structure, the solenoid body 5 has a problem of high manufacturing difficulty and high manufacturing cost, in another embodiment of the present application, referring to fig. 1 and 2, the cooling unit 7 includes a cooling fan 701, and the cooling fan 701 is disposed opposite to the magnetic field generating unit; the heat on the coil layer 6 and the solenoid body 5 is taken away by air cooling. By adopting the cooling mode, a cooling medium channel is not required to be arranged in the side wall of the solenoid body 5, so that the cooling structure is greatly simplified, and the manufacturing cost of the solenoid body 5 is reduced.

In another embodiment of the present application, referring to fig. 1 and 2, the number of cooling fans 701 is plural, and the plural cooling fans 701 are sequentially arranged along the axial direction and/or the circumferential direction of the solenoid body 5.

As a preferred embodiment of the present application, referring to fig. 2, the cooling unit 7 includes a fan mounting frame 702 and five cooling fans 701, wherein the fan mounting frame 702 is vertically mounted on one side of the solenoid body 5, and the five cooling fans 701 are sequentially disposed along the axial direction of the solenoid body 5, for air-cooling the solenoid body 5 and the coil layer 6.

As another preferred embodiment of the present application, two fan mounting frames 702 are symmetrically disposed on both sides of the solenoid body 5, and a plurality of cooling fans 701 are sequentially disposed on each fan mounting frame 702 along the axial direction of the solenoid body 5, so as to uniformly cool the coil layer 6 and the solenoid body 5.

As another preferred embodiment of the present application, a plurality of fan mounting frames 702 are sequentially provided in the circumferential direction of the solenoid body 5, and a plurality of cooling fans 701 are provided on each fan mounting frame 702 sequentially provided in the axial direction of the solenoid body 5, so that the coil layer 6 and the solenoid body 5 can be uniformly cooled.

In another embodiment of the present application, referring to fig. 1, 4, 5 and 8, the target unit further includes a third connecting portion 8 and a target 9, a first end of the third connecting portion 8 is communicated with the hollow cavity of the workpiece 2 to be plated, a second end of the third connecting portion 8 is provided with a target fixing assembly 10, a first end of the target 9 is connected with the target fixing assembly 10, and a second end of the target 9 sequentially penetrates through the third connecting portion 8, the workpiece 2 to be plated and the first connecting portion 1. Because the vacuum cavity 3, the second connecting part 4, the first connecting part 1, the hollow cavity of the plated workpiece 2 and the third connecting part 8 are communicated, a plurality of vacuum boxes are formed in the magnetic field generating unit, and when the target 9 is connected with the power electrode 18, atoms on the surface of the target 9 overflow and are sputtered to the inner wall of the plated workpiece 2, so that internal plating of the plated workpiece 2 is realized.

In order to ensure that the inner wall of the workpiece 2 to be plated is uniformly coated, the length of the target 9 is greater than that of the workpiece 2 to be plated, and two ends of the target 9 extend out of two ends of the workpiece 2 to be plated, as a preferred embodiment of the application, the target 9 is coaxially arranged in a hollow cavity of the workpiece 2 to be plated, the difference between the length of the target 9 and the length of the workpiece 2 to be plated is at least 100mm, so that effective coating can be ensured at two ends of the workpiece 2 to be plated, and the specific allowance can be freely adjusted according to the size of a specific device.

In another embodiment of the present application, referring to fig. 4, the length of the solenoid body 5 is greater than the length of the workpiece 2 to be plated, and the first end of the first connecting portion 1 and the first end of the third connecting portion 8 are located inside the tube body of the solenoid body 5. So that the magnetic field generated by the magnetic field generating unit can cover the whole surface of the workpiece 2 to be plated.

The workpiece 2 to be plated is an elongated pipe with a hollow cavity, the length of which can be freely decided according to the specific requirement, and in order to ensure that the workpiece 2 to be plated can be within a uniform good field area range and ensure the uniformity of plating, the good field area length of the solenoid body 5 is greater than or equal to the effective length of the workpiece 2 to be plated. As a preferred embodiment of the present application, the length of the elongated pipe is 50-4000mm, the length of the solenoid body 5 is 200-300mm more than the length of the elongated pipe, and by using the magnetic control generating unit in the present application, uniform coating of the inner wall of the elongated pipe can be achieved.

As a preferred embodiment of the present application, the first connection part 1 includes a first connection plate 101, a second connection plate 102, and a first extension pipe 103, wherein the first connection plate 101 and the second connection plate 102 are disposed at both ends of the first extension pipe 103, respectively. The plated workpiece 2 comprises a plated workpiece pipe 201, a third connecting plate 202 and a fourth connecting plate 203, wherein the third connecting plate 202 and the fourth connecting plate 203 are respectively arranged at two ends of the plated workpiece pipe 201. The third connection part 8 includes a second extension pipe 801, a fifth connection plate 802, and a sixth connection plate 803, wherein the fifth connection plate 802 and the sixth connection plate 803 are disposed at both ends of the second extension pipe 801, respectively.

As a preferred embodiment of the present application, the second connection plate 102, the third connection plate 202, the fourth connection plate 203, the fifth connection plate 802 and the sixth connection plate 803 are flanges, and the connection plates are all in sealing connection with each other, so as to form a vacuum box inside the workpiece 2 to be plated. In order to improve the batch coating efficiency, the solenoid body 5 of the device can be used for accommodating a plurality of coated workpieces 2 to be coated simultaneously, the inner diameter of the solenoid body 5 is usually 2-8 times of the outer diameter of the flange, and the inner diameter of the solenoid body 5 can be flexibly adjusted according to the space and process requirements of multi-station batch coating.

As a preferred embodiment of the present application, the magnetron sputtering coating device has three coating stations, three coated workpieces 2 can be disposed on the three second connection portions 4, each coated workpiece 2 is correspondingly provided with a target material 9, the number of power electrodes 18 is the same as that of the target materials 9, and each target material 9 is correspondingly connected with a power electrode 18.

As another preferred embodiment of the present application, the material of the target 9 is one of titanium (Ti), vanadium (V), zirconium (Zr), silver (Ag), palladium (Pd) or an alloy, the material of the workpiece 2 to be plated is one of oxygen-free copper, alloy copper or stainless steel, and the power electrode 18 to which the target 9 is connected is a cathode.

In another embodiment of the present application, referring to fig. 4, 6 and 10, the target unit further includes a weight 11 and an insulator 12; the target 9 is arranged in the vertical direction, the insulating pieces 12 are arranged at the two ends of the target 9, the target 9 is prevented from being contacted with other metal pieces, the counterweight piece 11 is connected to the second end of the target 9, the target 9 is in the vertical state through the gravity of the counterweight piece 11, and therefore the target 9 and the axis of the plated workpiece 2 are collinear, and the film plating effect of the inner wall of the plated workpiece 2 is guaranteed.

In a preferred embodiment of the present application, referring to fig. 7, 8 and 10, the insulating member 12 is an insulating ceramic sleeve, and a first insulating member 12a is disposed at the connection between the power electrode 18 and the target fixing assembly 10, so as to avoid contact between the power electrode 18 and the target fixing assembly 10; a third insulating piece 12c is arranged at the joint of the target material 9 and the power electrode 18 and is used for realizing reliable connection between the power electrode 18 and the target material 9; a second insulating part 12b is arranged at the joint of the bottom end of the target 9 and the weight 11, so that the contact between the target 9 and the second weight 11 is avoided.

In another embodiment of the present application, referring to fig. 4 and 11, a limiting seat 13 is disposed inside a vacuum chamber 3 of a vacuum generating unit, and a counterweight 11 is inserted into the limiting seat 13, so as to avoid the counterweight 11 from shaking and colliding inside the vacuum chamber 3 during the movement of the magnetron sputtering coating device.

As a preferred embodiment of the present application, weight 11 is a weight.

In another embodiment of the present application, referring to fig. 1, 5 and 11, the vacuum generating unit further comprises a vacuum pump group 15, a vacuum gauge 16 and a valve member 17; the vacuum pump group 15 and the vacuum gauge 16 are communicated with the vacuum cavity 3 through pipelines, and the valve 17 is arranged on the pipelines. The hollow cavity of the plated workpiece 2 can be in a vacuum state by the work of the vacuum pump group 15; the vacuum gauge 16 may be used to measure the vacuum level inside the vacuum chamber 3; the valve 17 is arranged on each pipeline, and can control the on-off and flow of each pipeline.

As a preferred embodiment of the present application, the valve member 17 includes a fine tuning valve 1701, a first angle valve 1702 and a second angle valve 1703, where the fine tuning valve 1701 is disposed on an air inlet pipe connected to the vacuum chamber 3, and can charge air into the vacuum chamber 3 and precisely adjust an air inlet flow rate, so as to control and adjust a vacuum degree inside the vacuum chamber 3. The first angle valve 1702 is arranged on a connecting pipeline between the vacuum cavity 3 and the vacuum gauge pipe 16, the second angle valve 1703 is arranged on an external connecting pipeline of the vacuum cavity 3, and the on-off of the corresponding pipeline is realized through the angle valve.

In another embodiment of the present application, referring to fig. 1, 2 and 4, the magnetron sputtering coating device further includes a mounting base 19, where the mounting base 19 includes a solenoid mounting base 1901, a mounting bracket 1902, a universal wheel 1903 and a foot 1904, the mounting bracket 1902 is a frame structure, and the vacuum generating unit is disposed inside the frame structure formed by the mounting bracket 1902; a solenoid mounting base 1901 is arranged at the top of the mounting bracket 1902 and is used for being connected with the solenoid body 5; the bottom of installing support 1902 is equipped with universal wheel 1903, is convenient for carry out the whole removal with magnetron sputtering coating device, and the bottom of installing support 1902 still is equipped with ground foot 1904, is convenient for realize the leveling and the fixed setting of magnetron sputtering coating device.

Referring to fig. 1 and 4, the embodiment of the present application further provides a magnetron sputtering coating method, which includes the following steps:

mounting a plated workpiece 2: coaxially arranging a target 9 in a target unit in a hollow cavity of a plated workpiece 2, wherein the target 9 is made of one of titanium, vanadium, zirconium, silver, palladium or alloy, and the plated workpiece 2 is made of one of oxygen-free copper, alloy copper, stainless steel, aluminum alloy or ceramic; the cross section of the plated workpiece 2 is one of a circle, a runway shape or a polygon;

setting a target unit: placing a plurality of target units and the plated workpiece 2 into the magnetic field generating unit, and communicating the first connecting part 1 of the target units with the second connecting part 4 of the vacuum generating unit;

coating: starting a vacuum generating unit to enable the air pressure in the vacuum cavity 3 and the hollow cavity of the plated workpiece 2 to reach a preset condition; the magnetic field generating unit is started, the targets 9 in the target units are connected with the power electrode 18, and magnetron sputtering coating is performed on the inner walls of the workpieces 2 to be coated.

In another embodiment of the present application, when the length of the workpiece 2 to be plated is 50-4000mm, two ends of the workpiece 2 to be plated are respectively connected with the first connecting portion 1 and the third connecting portion 8 when the length of the workpiece 2 to be plated is long, the target 9 is disposed inside the workpiece 2 to be plated, one end of the target 9 is connected with the power electrode 18 and the target fixing component 10, the target fixing component 10 is connected with the third connecting portion, the insulating piece 12 and the counterweight 11 are disposed at one end of the target 9 extending out of the first connecting portion 1, finally, the target unit and the workpiece 2 to be plated are integrally lifted to the upper portion of the solenoid body 5 through the lifting device, the target unit and the workpiece 2 to be plated are integrally placed in the solenoid body 5 along the vertical direction until the counterweight 11 enters the limiting seat 13 in the vacuum cavity 3, the first connecting portion 1 is placed on the second connecting portion 4, and the relative position fixing of the first connecting portion 1 and the second connecting portion 4 is realized through the quick-release flange 14.

In another preferred embodiment of the present application, referring to fig. 2 and 3, the workpiece 2 to be plated is an elongated circular tube with an inner diameter of 5-100mm, and the solenoid body 5 has an inner diameter 5-20 times the inner diameter of the workpiece 2 to be plated, so as to accommodate a plurality of workpieces 2 to be plated with a film simultaneously.

As a preferred embodiment of the present application, referring to fig. 3, three workpieces 2 to be plated are sequentially arranged along the circumferential direction of the solenoid body 5, and each target 9 in each workpiece 2 to be plated is correspondingly connected to one power electrode 18, so that the inner walls of the three workpieces 2 to be plated can be plated simultaneously.

In the magnetron sputtering coating device, a plurality of coating stations are arranged, so that synchronous coating work of a plurality of coated workpieces 2 can be realized, and the coating efficiency is improved; the vacuum cavity 3 is connected with the plated workpiece 2 and the whole structure of the target unit through the quick-release flange 14, so that the dismounting efficiency of the device is improved; coil compensation is performed at two ends of the solenoid body 5 in a mode of increasing the thickness of the coil layer 6, so that the axial length of the magnetic field is prolonged, the application range of the magnetron sputtering coating device can be increased, and the device is applicable to coating of longer coated workpieces 2; the cooling fan 701 is used for cooling the solenoid body 5 and the coil layer 6, so that the cooling coefficients of the solenoid body 5 and the coil layer 6 can be improved, the magnetic field range can be enlarged, the cooling structure can be simplified, and the manufacturing cost of the solenoid body 5 can be reduced.

The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims (9)

1. A magnetron sputtering coating device, comprising:

a target unit; the number of the target units is multiple, the target units comprise first connecting parts (1), and the first ends of the first connecting parts are communicated with the hollow cavity of the plated workpiece (2);

a magnetic field generation unit; the magnetic field generating units are sleeved outside the target units;

a vacuum generating unit; the vacuum generating unit comprises a vacuum cavity (3) and a plurality of second connecting portions (4), wherein the second connecting portions are communicated with the vacuum cavity, the second connecting portions are matched with the second ends of the first connecting portions, and the first connecting portions are communicated with the second connecting portions.

2. The magnetron sputtering coating apparatus as claimed in claim 1 wherein: the magnetic field generating unit comprises a solenoid body (5) and a coil layer (6) wound on the solenoid body;

the coil layers comprise a first coil layer (601) and a second coil layer (602), the two first coil layers are located at two ends of the solenoid body, the second coil layer is located in the middle of the solenoid body, and the thickness of the first coil layer is larger than that of the second coil layer along the radial direction of the solenoid body.

3. The magnetron sputtering coating apparatus as claimed in claim 2 wherein: the magnetron sputtering coating device further comprises a cooling unit (7), and the cooling unit is connected with the magnetic field generating unit.

4. The magnetron sputtering coating apparatus as claimed in claim 3 wherein: the cooling unit comprises a cooling fan (701) which is arranged opposite to the magnetic field generating unit;

the number of the cooling fans is multiple, and the multiple cooling fans are sequentially arranged along the axial direction and/or the circumferential direction of the solenoid body.

5. The magnetron sputtering coating apparatus as claimed in claim 2 wherein: the target unit further comprises a third connecting portion (8) and a target (9), wherein the first end of the third connecting portion is communicated with the hollow cavity of the plated workpiece, a target fixing assembly (10) is arranged at the second end of the third connecting portion, the first end of the target is connected with the target fixing assembly, and the second end of the target sequentially penetrates through the third connecting portion, the plated workpiece and the first connecting portion.

6. The magnetron sputtering coating apparatus as claimed in claim 5 wherein: the target unit also comprises a weight piece (11) and an insulating piece (12); the target is arranged in the vertical direction, the insulating pieces are arranged at two ends of the target, and the counterweight piece is connected to the second end of the target;

and a limiting seat (13) is arranged in the vacuum cavity of the vacuum generating unit, and the counterweight is inserted into the limiting seat.

7. The magnetron sputtering coating apparatus as claimed in claim 5 wherein the length of the solenoid body is greater than the length of the workpiece to be coated, and the first end of the first connecting portion and the first end of the third connecting portion are located inside the tube body of the solenoid body.

8. The magnetron sputtering coating apparatus as claimed in claim 1 wherein: the vacuum generating unit further comprises a plurality of quick-release flanges (14), and the first connecting part and the second connecting part are detachably connected through the quick-release flanges;

the axes of the plurality of second connecting parts are arranged in parallel; projections of the quick release flanges in the radial direction of the second connecting part are not overlapped with each other.

9. The magnetron sputtering coating apparatus as claimed in claim 1 wherein: the vacuum generating unit further comprises a vacuum pump set (15), a vacuum gauge pipe (16) and a valve (17); the vacuum pump set and the vacuum gauge pipe are communicated with the vacuum cavity through a pipeline, and the valve is arranged on the pipeline.