CN220428008U

CN220428008U - Full-automatic wafer thinning machine

Info

Publication number: CN220428008U
Application number: CN202321891006.3U
Authority: CN
Inventors: 胡敬祥; 王选; 邱祥文
Original assignee: SHENZHEN FONDA GRINDING TECHNOLOGY CO LTD
Current assignee: SHENZHEN FONDA GRINDING TECHNOLOGY CO LTD
Priority date: 2023-07-18
Filing date: 2023-07-18
Publication date: 2024-02-02
Anticipated expiration: 2033-07-18

Abstract

The utility model belongs to the technical field of thinning machines, and particularly relates to a full-automatic wafer thinning machine which comprises a box body, a cleaning mechanism and a mounting mechanism, wherein the cleaning mechanism is arranged on the box body, a water permeable plate is fixedly connected in the box body, the mounting mechanism is arranged on the water permeable plate, a wafer is contacted with the upper end of the water permeable plate, and a cylinder is fixedly arranged in the box body.

Description

Full-automatic wafer thinning machine

Technical Field

The utility model relates to the technical field of thinning machines, in particular to a full-automatic wafer thinning machine.

Background

The utility model patent with patent grant publication number CN219053834U of a full-automatic wafer thinning machine provides a full-automatic single-shaft wafer thinning machine, which comprises a machine base, wherein a wafer box, a centering mechanism, a grinding table, a grinding mechanism and a cleaning mechanism are arranged on the machine base, the wafer box is detachably arranged at the front end of the machine base, the grinding table is movably connected on the longitudinal central axis of the machine base through a grinding table sliding rail longitudinally arranged at the bottom of the grinding table, the centering mechanism and the cleaning mechanism are respectively arranged at the left side and the right side of the grinding table, the grinding mechanism is arranged at the rear end of the machine base, and a material taking and discharging arm is arranged at the geometric center surrounded by the wafer box, the centering mechanism and the cleaning mechanism. According to the wafer conveying device, the centering mechanism, the grinding mechanism and the cleaning mechanism are integrally arranged on the machine base, and the wafer is driven to be conveyed between the mechanisms through the material taking and discharging arm, the first loading arm and the second loading arm, so that the reliability and the grinding quality of wafer adsorption are improved, the functional module structure of the device is compact, the integration level of the device is high, the occupied area is small, and the production efficiency and the quality are greatly improved. However, the above patent also suffers from the following disadvantages: the wafer is cleaned through the shower nozzle water spray, and the water flow is inconvenient to recycle after cleaning, and the wafer is installed through a conventional installation structure, so that the wafer can be damaged.

Disclosure of Invention

The utility model aims to provide a full-automatic wafer thinning machine, which solves the problems that a wafer is cleaned by spraying water through a spray head and is inconvenient to recycle after the water flow is cleaned, and also solves the problem that the wafer is possibly damaged when being installed through a conventional installation structure.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a full-automatic wafer attenuate machine, includes box, clearance mechanism, installation mechanism, be provided with clearance mechanism on the box, fixedly connected with water permeable plate in the box, be provided with installation mechanism on the water permeable plate, water permeable plate's upper end contact has the wafer, fixedly mounted with cylinder in the box, fixedly connected with mounting panel on the output of cylinder, the lower extreme fixed mounting of mounting panel has driving motor, fixedly connected with piece of polishing on driving motor's the output, the lower extreme fixedly connected with stabilizer blade of box.

Preferably, the cleaning mechanism comprises a filter screen, a water pump, a spray head, a clamping groove, a push rod, a movable rod, a guide rod and a spring, wherein the filter screen is contacted in the box body, the water pump is fixedly installed on the box body, the clamping groove is formed in the box body, the push rod is connected in a sliding manner in the clamping groove, the movable rod is fixedly connected on the push rod, the guide rod is fixedly connected in the filter screen, the spring is arranged on the outer side of the guide rod, and the cleaning mechanism is designed to clean the wafer.

Preferably, the input of water pump is fixed cup joint in the box, the output of water pump fixed connection is in the box, fixedly connected with shower nozzle on the output of water pump, through the design water pump, accessible water pump realizes the reuse to the water resource.

Preferably, the outside sliding connection of guide arm has the movable rod, movable rod sliding connection is in the filter screen, through the design guide arm, can give the spacing of movable rod certain degree.

Preferably, one end of the spring is fixedly connected to the movable rod, the other end of the spring is fixedly connected to the filter screen, and the movable rod can be moved under the elastic action of the spring through designing the spring.

Preferably, the mounting mechanism comprises a sucking disc, a sleeve, a piston, a thread bush, a forward and reverse rotating motor, a screw rod, a limit groove and a limit rod, wherein the sucking disc is contacted with the wafer, the sleeve is fixedly connected with the sucking disc, the sleeve is fixedly connected with the water permeable plate, the piston is connected with the sliding part in the sleeve in a sliding mode, the thread bush is fixedly connected with the piston, the lower end of the sleeve is fixedly provided with the forward and reverse rotating motor, the output end of the forward and reverse rotating motor is rotationally connected with the sleeve, the output end of the forward and reverse rotating motor is fixedly connected with the screw rod, the outer side of the screw rod is provided with the thread bush through threads, the limit groove is formed in the thread bush, the limit rod is connected with the limit rod in a sliding mode, and the limit rod is fixedly connected with the sleeve and can be mounted on the wafer through the mounting mechanism.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, through designing the components such as the filter screen, the water pump, the bayonet lock, the ejector rod, the nozzle and the like, the water pump pumps water from the box body and ejects the water through the nozzle to clean the wafer, the cleaned water passes through the water permeable plate and then enters the bottom of the box body through the filtering of the filter screen, and then the cleaned water can be conveyed to the nozzle again through the water pump, so that the recycling of water resources can be realized, when the filter screen is blocked and needs to be disassembled, the ejector rod can be pulled to enable the ejector rod to slide out of the clamping groove, the limit between the filter screen and the box body is released, and the filter screen can be disassembled and cleaned at the moment.

2. According to the utility model, through designing the parts such as the sucker, the piston, the thread bush, the forward and reverse rotating motor, the screw rod and the like, the wafer is placed on the piston, the forward and reverse rotating motor is started, so that the screw rod rotates, further, the screw rod and the thread bush are in threaded movement, the piston moves, further, negative pressure is generated in the sucker, the wafer can be installed, the sucker is an elastic product, and the wafer is not easy to damage.

Drawings

FIG. 1 is a perspective view of the overall structure of the present utility model;

FIG. 2 is a front cross-sectional view of FIG. 1 of the present utility model;

FIG. 3 is an enlarged view of the utility model at A in FIG. 2;

fig. 4 is an enlarged view of the present utility model at B in fig. 2.

In the figure: 1. a case; 2. a cleaning mechanism; 3. a water permeable plate; 4. a mounting mechanism; 5. a wafer; 6. a cylinder; 7. a mounting plate; 8. a driving motor; 9. polishing the sheet; 10. a support leg; 21. a filter screen; 22. a water pump; 23. a spray head; 24. a clamping groove; 25. a push rod; 26. a moving rod; 27. a guide rod; 28. a spring; 41. a suction cup; 42. a sleeve; 43. a piston; 44. a thread sleeve; 45. a forward and reverse rotation motor; 46. a screw rod; 47. a limit groove; 48. and a limit rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 and 2, a full-automatic wafer thinning machine comprises a box body 1, a cleaning mechanism 2 and a mounting mechanism 4, wherein the cleaning mechanism 2 is arranged on the box body 1, a water permeable plate 3 is fixedly connected in the box body 1, the mounting mechanism 4 is arranged on the water permeable plate 3, a wafer 5 is contacted with the upper end of the water permeable plate 3, a cylinder 6 is fixedly arranged in the box body 1, a mounting plate 7 is fixedly connected to the output end of the cylinder 6, a driving motor 8 is fixedly arranged at the lower end of the mounting plate 7, a polishing sheet 9 is fixedly connected to the output end of the driving motor 8, and a supporting leg 10 is fixedly connected to the lower end of the box body 1.

Referring to fig. 1, 2 and 3, the cleaning mechanism 2 includes a filter screen 21, a water pump 22, a spray head 23, a clamping groove 24, a push rod 25, a moving rod 26, a guide rod 27 and a spring 28, the filter screen 21 is contacted in the box 1, the water pump 22 is fixedly installed on the box 1, the clamping groove 24 is provided in the box 1, the push rod 25 is connected in the clamping groove 24 in a sliding manner, the moving rod 26 is fixedly connected on the push rod 25, the guide rod 27 is fixedly connected in the filter screen 21, the spring 28 is arranged on the outer side of the guide rod 27, the input end of the water pump 22 is fixedly sleeved in the box 1, the output end of the water pump 22 is fixedly connected in the box 1, the spray head 23 is fixedly connected on the output end of the water pump 22, the moving rod 26 is connected in the filter screen 21 in a sliding manner, one end of the spring 28 is fixedly connected on the moving rod 26, the other end of the spring 28 is fixedly connected in the filter screen 21, and the cleaning mechanism 2 is designed to clean the wafer 5.

Referring to fig. 1, 2 and 4, the mounting mechanism 4 includes a suction cup 41, a sleeve 42, a piston 43, a threaded sleeve 44, a forward and reverse rotation motor 45, a screw rod 46, a limit groove 47 and a limit rod 48, the suction cup 41 is contacted with the wafer 5, the sleeve 42 is fixedly connected with the suction cup 41, the sleeve 42 is fixedly connected with the water permeable plate 3, the piston 43 is slidably connected with the sleeve 42, the threaded sleeve 44 is fixedly connected with the piston 43, the lower end of the sleeve 42 is fixedly connected with the forward and reverse rotation motor 45, the output end of the forward and reverse rotation motor 45 is rotatably connected with the sleeve 42, the screw rod 46 is fixedly connected with the screw rod 46, the screw rod 46 is externally provided with the threaded sleeve 44 through threads, the limit groove 47 is arranged in the threaded sleeve 44, the limit rod 48 is slidably connected with the limit rod 48, and the limit rod 48 is fixedly connected with the sleeve 42.

Working principle: when thinning wafer 5, through placing wafer 5 on sucking disc 41, this moment can start positive and negative rotation motor 45, make lead screw 46 rotate under the drive of positive and negative rotation motor 45, take place the screw motion between lead screw 46 and the thread bush 44, and then make thread bush 44 remove, the removal of thread bush 44 drives piston 43 and removes, can make the sucking disc 41 in produce negative pressure, and then accomplish the installation to wafer 5, then start driving motor 8, make polishing piece 9 rotate, then start cylinder 6, and then make driving motor 8 remove, and then make polishing piece 9 and wafer 5 contact realization attenuate, at this moment can start water pump 22, can follow box 1 bottom under the effect of water pump 22 and draw water, then spout through shower nozzle 23, at this moment can clear up wafer 5, the design just needs place wafer 5 on sucking disc 41, afterwards, full-automatic installation has been realized, attenuate and clear up, after the rivers after the clearance pass through filter screen 21's filtration back reentrant box 1 bottom, and then realize the hydrologic cycle, and when 21 appears blocking, can start water pump 22, at this moment can be lifted off the filter screen 21 through 21, and then can be removed from the filter screen box 21 through 21, and can be removed from the filter screen box 24, and can be removed, and the filter screen 21 is moved, and the filter screen is set up in the filter screen 21 is removed.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims

1. The utility model provides a full-automatic wafer attenuate machine, includes box (1), clearance mechanism (2), installation mechanism (4), its characterized in that: be provided with clearance mechanism (2) on box (1), fixedly connected with water permeable plate (3) in box (1), be provided with installation mechanism (4) on water permeable plate (3), upper end contact of water permeable plate (3) has wafer (5), fixedly mounted has cylinder (6) in box (1), fixedly connected with mounting panel (7) on the output of cylinder (6), the lower extreme fixed mounting of mounting panel (7) has driving motor (8), fixedly connected with piece (9) of polishing on the output of driving motor (8), the lower extreme fixedly connected with stabilizer blade (10) of box (1).

2. The fully automatic wafer thinning machine according to claim 1, wherein: the cleaning mechanism (2) comprises a filter screen (21), a water pump (22), a spray head (23), a clamping groove (24), a push rod (25), a movable rod (26), a guide rod (27) and a spring (28), wherein the filter screen (21) is contacted with the inside of the box body (1), the water pump (22) is fixedly installed on the box body (1), the clamping groove (24) is formed in the box body (1), the push rod (25) is connected in the clamping groove (24) in a sliding manner, the movable rod (26) is fixedly connected to the push rod (25), the guide rod (27) is fixedly connected in the filter screen (21), and the spring (28) is arranged on the outer side of the guide rod (27).

3. The fully automatic wafer thinning machine according to claim 2, wherein: the input end of the water pump (22) is fixedly sleeved in the box body (1), the output end of the water pump (22) is fixedly connected in the box body (1), and the output end of the water pump (22) is fixedly connected with a spray head (23).

4. The fully automatic wafer thinning machine according to claim 2, wherein: the outside of guide arm (27) sliding connection has movable rod (26), movable rod (26) sliding connection is in filter screen (21).

5. The fully automatic wafer thinning machine according to claim 2, wherein: one end of the spring (28) is fixedly connected to the movable rod (26), and the other end of the spring (28) is fixedly connected to the filter screen (21).

6. The fully automatic wafer thinning machine according to claim 1, wherein: the mounting mechanism (4) comprises a sucker (41), a sleeve (42), a piston (43), a thread bush (44), a forward and backward rotating motor (45), a screw rod (46), a limiting groove (47) and a limiting rod (48), wherein the sucker (41) is contacted with the wafer (5), the sleeve (42) is fixedly connected to the sucker (41), the sleeve (42) is fixedly connected to the water permeable plate (3), the piston (43) is connected to the sleeve (42) in a sliding manner, the thread bush (44) is fixedly connected to the piston (43), the forward and backward rotating motor (45) is fixedly arranged at the lower end of the sleeve (42), the screw rod (46) is fixedly connected to the output end of the forward and backward rotating motor (45), the screw rod (46) is connected to the outer side of the screw rod (46) through the thread bush (44), the limiting groove (47) is formed in the thread bush (44), and the limiting rod (48) is connected to the inner side of the limiting groove (47) in a sliding manner.