CN220420305U - High-conductivity oxygen-free copper wire - Google Patents

High-conductivity oxygen-free copper wire Download PDF

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Publication number
CN220420305U
CN220420305U CN202321248520.5U CN202321248520U CN220420305U CN 220420305 U CN220420305 U CN 220420305U CN 202321248520 U CN202321248520 U CN 202321248520U CN 220420305 U CN220420305 U CN 220420305U
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China
Prior art keywords
wire
wire core
wall
plating layer
layer
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Active
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CN202321248520.5U
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Chinese (zh)
Inventor
徐真洪
常亮
刘健
邱镜钦
施志祥
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Lu'an Hongtai New Copper Technology Yixing Co ltd
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Lu'an Hongtai New Copper Technology Yixing Co ltd
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Abstract

The utility model discloses a high-conductivity oxygen-free copper wire, which comprises a wire core, wherein the wire core is of a linear type, a reinforcing wire is wound on the outer wall of the wire core, a tinning layer is electroplated in a gap of the outer wall of the reinforcing wire, an outer protective layer is wrapped on the outer wall of the tinning layer, the technical field of copper wires is related, the tinning layer is electroplated and connected in the outer wall of the reinforcing wire and the gap of the reinforcing wire, so that gaps on the surface of the reinforcing wire are conveniently filled, the phenomenon of virtual connection between the wire core and the reinforcing wire is avoided when the wire core is conductive, meanwhile, a silver film layer is wrapped on the outer wall of the tinning layer, the conductivity of the wire core is improved, the heating degree of the wire core is reduced, the wire core and the reinforcing wire are isolated from air, the oxidized speed is reduced, and the conductivity of the copper wire is improved.

Description

High-conductivity oxygen-free copper wire
Technical Field
The utility model relates to the technical field of copper wires, in particular to a high-conductivity oxygen-free copper wire.
Background
Copper wire is generally made of metal copper, the metal copper has good electric conduction and heat conduction properties, the most noble property of pure copper is that the electric conduction property is very good, and in all metals, copper is inferior to silver but is cheaper than silver, so that the copper wire forms a main angle of the electric industry, the use of the pure copper is wider than that of pure iron, 50% of copper is electrolytically purified into pure copper every year, and the pure copper is used in the electric industry, and the metal copper is usually processed into metal alloy copper wires to be used as wires.
The prior art has the following defects: when the existing copper wire is used as a wire, the copper wire is usually made of single material metal copper, and is wrapped by an insulating leather to form the wire for conducting electricity, and the copper wire is in contact with air for a long time due to the lack of a protective structure for the outer wall of the copper wire, meanwhile, the wire generates certain heat when being electrified, so that oxidation reaction between the copper wire and oxygen in the air is accelerated, the conductivity of the copper wire is reduced, electric energy is not saved, and energy conservation and environmental protection are not facilitated.
Therefore, it is necessary to invent a high conductivity oxygen-free copper wire.
Disclosure of Invention
Therefore, the high-conductivity oxygen-free copper wire is provided by the utility model, the tin plating layer is electroplated and connected in the outer wall of the reinforcing wire and the gaps of the reinforcing wire, so that the gaps on the surface of the reinforcing wire are conveniently filled, the phenomenon of virtual connection between the wire core and the reinforcing wire when conduction occurs is avoided, meanwhile, the silver film layer is wrapped on the outer wall of the tin plating layer, the conductivity of the core wire is improved, the resistance of the wire core is reduced, the heat generation degree of the wire core is reduced, the wire core and the reinforcing wire are isolated from air, the oxidization speed is reduced, and the conductivity of the copper wire is improved, so that the problem in the background technology is solved.
In order to achieve the above object, the present utility model provides the following technical solutions: the utility model provides a high conductivity oxygen-free copper wire, includes the sinle silk, the sinle silk is the linear type, the sinle silk outer wall is around rolling up there is the enhancement line, the inside tin-plating that has electroplated in enhancement line outer wall gap, the parcel of tin-plating outer wall has the outer sheath.
Preferably, the reinforcing wires are provided with five reinforcing wires, the reinforcing wires are made of metal copper, the reinforcing wires are arranged in a spring shape, and the five reinforcing wires are distributed in an array at the center of a uniformly wound wire core.
Preferably, the outer protective layer comprises a silver film layer and a nickel plating layer, the outer walls of the reinforcing wires and the tin plating layer are uniformly plated and connected with the silver film layer, and the silver film layer is used for sealing and isolating the surfaces of the reinforcing wires and the tin plating layer from air.
Preferably, the outer wall of the silver film layer is electroplated with a nickel plating layer, and the outer wall of the nickel plating layer is wrapped with an insulating layer.
The beneficial effects of the utility model are as follows:
1. the reinforcing wire is arranged for uniformly winding the outer wall of the wire core, so that the mechanical property of the outer wall of the wire core is conveniently enhanced, the tensile and dragging properties of the wire core are improved, and the breakage resistance of the wire core is improved;
2. through electroplating connection tin-plating layer in reinforcement line outer wall and gap thereof to conveniently fill reinforcement line surface gap, thereby appear the virtual phenomenon of connecing between sinle silk and the reinforcement line when avoiding taking place to electrically conductive, simultaneously at tinning layer outer wall parcel silver rete, improved the electric conductivity of heart yearn, reduced the resistance of sinle silk, reduced sinle silk heat generation degree, keep apart the air to sinle silk, reinforcement line, reduce by oxidation rate, improved the conductivity of copper wire.
Drawings
FIG. 1 is a schematic diagram of a front view structure provided by the present utility model;
fig. 2 is a schematic diagram of a wire core structure provided by the utility model;
FIG. 3 is a schematic view of a reinforcement wire structure according to the present utility model;
fig. 4 is a schematic view of the structure of the outer passivation layer according to the present utility model.
In the figure: the cable comprises a cable core 100, a reinforcing wire 200, a tinning layer 210, an outer protective layer 300, a silver film layer 310 and a nickel plating layer 320.
Detailed Description
The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.
Referring to fig. 1-4, the utility model provides a high-conductivity oxygen-free copper wire, and in order to achieve the above purpose, the utility model provides the following technical scheme: the utility model provides a high conductivity oxygen-free copper wire, including sinle silk 100, be used for electrically conductive through setting up sinle silk 100, sinle silk 100 material is metallic copper, sinle silk 100 is the linear type, sinle silk 100 outer wall is around rolling up there is stiffening wire 200, be used for strengthening sinle silk 100 outer wall mechanical strength's effect through setting up stiffening wire 200, have conductive properties through setting up stiffening wire 200, stiffening wire 200 material is metallic copper, the inside electroplating of stiffening wire 200 outer wall gap has tinning layer 210, be used for filling sinle silk 100 through setting up tinning layer 210, gap between stiffening wire 200, avoid the virtual joint to strike sparks, improve the life of electrical safety and wire, tinning layer 210 outer wall parcel has outer sheath 300, be used for sealing up the effect of insulating air to sinle silk 100 through setting up outer sheath 300, stiffening wire 200, tinning layer 210 outer wall, thereby conveniently improve oxidation resistance, reduce copper wire oxygen content.
The reinforcing wires 200 are arranged in five, the reinforcing wires 200 are made of metal copper, the reinforcing wires 200 are arranged in a spring shape, the five reinforcing wires 200 are uniformly distributed around the center of the wire core 100 in an array manner, and the stress uniformity is conveniently improved by arranging the five reinforcing wires 200 to be uniformly distributed, so that the tensile dragging performance and the fracture resistance of the reinforcing wires 200 are improved.
The outer protective layer 300 comprises a silver film layer 310 and a nickel plating layer 320, wherein the silver film layer 310 is uniformly electroplated and connected to the outer walls of the reinforcing wire 200 and the tin plating layer 210, the silver film layer 310 is used for sealing and isolating air from the surfaces of the reinforcing wire 200 and the tin plating layer 210, the nickel plating layer 320 is electroplated on the outer wall of the silver film layer 310, the insulating layer is wrapped on the outer wall of the nickel plating layer 320, the silver film layer 310 is made of metallic silver and has conductivity superior to that of metallic copper, conductivity of the copper wire is improved, the metallic silver has an isolating effect on the air, oxidation resistance to the wire core 100, the reinforcing wire 200 and the tin plating layer 210 is conveniently improved, and the nickel plating layer 320 is used for protecting the surfaces of the silver film layer 310 to reduce abrasion of the silver film layer 310.
The application process of the utility model is as follows: when the novel reinforced wire is used, five reinforced wires 200 are uniformly and tightly wound on the outer wall of the wire core 100, the inner gaps of the reinforced wires 200 and the tin-plated layers 210 are uniformly filled by electroplating and connecting the tin-plated layers 210 on the outer wall of the reinforced wires 200, then the silver film layer 310 is connected by electroplating and electroplating on the outer wall of the tin-plated layers 210, the nickel-plated layers 320 are connected by electroplating on the outer wall of the silver film layer 310, the surface of the silver film layer 310 is sealed and protected, and the surface of the nickel-plated layers 320 is smoothened.
The above description is only of the preferred embodiments of the present utility model, and any person skilled in the art may modify the present utility model or make modifications to the present utility model equivalent thereto using the technical solutions described above. Therefore, any simple modification or equivalent made according to the technical solution of the present utility model falls within the scope of the protection claimed by the present utility model.

Claims (2)

1. The utility model provides a high conductivity oxygen-free copper wire, includes sinle silk (100), sinle silk (100) are the linear type, its characterized in that: the utility model discloses a wire core, including wire core (100), wire core (100) outer wall is around having a reinforcing wire (200), the inside tin-plating layer (210) that has electroplated of wire core (200) outer wall gap, tin-plating layer (210) outer wall parcel has outer sheath (300), wire core (200) are provided with five, wire core (200) material is metallic copper, wire core (200) set up to the spring form, five wire core (100) centre of a circle department array distribution is evenly wound to wire core (200), outer sheath (300) include silver rete (310), nickel-plating layer (320), wire core (200), tin-plating layer (210) outer wall even electroplate and be connected with silver rete (310), silver rete (310) are used for sealing up air to wire core (200), tin-plating layer (210) surface.
2. The oxygen-free copper wire with high conductivity according to claim 1, wherein the outer wall of the silver film layer (310) is electroplated with a nickel plating layer (320), and the outer wall of the nickel plating layer (320) is wrapped with an insulating layer.
CN202321248520.5U 2023-05-23 2023-05-23 High-conductivity oxygen-free copper wire Active CN220420305U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321248520.5U CN220420305U (en) 2023-05-23 2023-05-23 High-conductivity oxygen-free copper wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321248520.5U CN220420305U (en) 2023-05-23 2023-05-23 High-conductivity oxygen-free copper wire

Publications (1)

Publication Number Publication Date
CN220420305U true CN220420305U (en) 2024-01-30

Family

ID=89647883

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321248520.5U Active CN220420305U (en) 2023-05-23 2023-05-23 High-conductivity oxygen-free copper wire

Country Status (1)

Country Link
CN (1) CN220420305U (en)

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