CN220419902U - Domain control host - Google Patents
Domain control host Download PDFInfo
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- CN220419902U CN220419902U CN202322075442.XU CN202322075442U CN220419902U CN 220419902 U CN220419902 U CN 220419902U CN 202322075442 U CN202322075442 U CN 202322075442U CN 220419902 U CN220419902 U CN 220419902U
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- heat dissipation
- domain master
- main body
- radiating
- air outlet
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 143
- 238000009434 installation Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model provides a domain control host, relates to the technical field of intelligent cabins, and aims to optimize a heat dissipation structure in the domain control host to a certain extent and improve heat dissipation efficiency and heat dissipation effect of the domain control host. The domain control host provided by the utility model comprises a shell component, a heat dissipation component and a main board; the heat dissipation assembly and the main board are arranged in the shell assembly, the heat dissipation assembly comprises a heat dissipation piece, the heat dissipation piece corresponds to the main board, a plurality of first heat dissipation parts are formed on the heat dissipation piece, the plurality of first heat dissipation parts are all of a Y-shaped structure, and the plurality of first heat dissipation parts are arranged at intervals along the width direction of the heat dissipation piece.
Description
Technical Field
The utility model relates to the technical field of intelligent cabins, in particular to a domain control host.
Background
Along with the market development of intelligent cabins, the functions of domain control hosts are more and more complex, and the requirements on space are more severe. However, the increase of the functions means the increase of the power consumption, and the increase of the power consumption releases more heat, thereby affecting the operation stability and the service life of the domain control host.
Because the space for setting the domain control host is limited, the heat dissipation effect of the conventional heat dissipation structure is limited along with the continuous increase of power consumption.
Therefore, there is an urgent need to provide a domain master in order to solve the problems in the prior art to some extent.
Disclosure of Invention
The utility model aims to provide a domain control host machine so as to optimize the heat dissipation structure in the domain control host machine to a certain extent and improve the heat dissipation efficiency and the heat dissipation effect of the domain control host machine.
The utility model provides a domain control host, which comprises a shell component, a heat dissipation component and a main board; the heat dissipation assembly and the mainboard all set up in the casing subassembly, just the heat dissipation assembly includes the radiating piece, the radiating piece corresponds the mainboard sets up, be formed with a plurality of first radiating parts on the radiating piece, a plurality of first radiating parts all are Y shape structure, and a plurality of first radiating parts is followed the width direction interval setting of radiating piece.
The heat dissipation part is also provided with a plurality of second heat dissipation parts, the second heat dissipation parts are in a straight line structure, and the second heat dissipation parts and the first heat dissipation parts are alternately arranged at intervals along the width direction of the heat dissipation part.
Specifically, an air inlet is formed at one end of the shell assembly, an air outlet is formed at the other end of the shell assembly, and the heat dissipation piece is arranged between the air inlet and the air outlet.
Further, the first heat dissipation part and the second heat dissipation part extend along a connecting line between the air inlet and the air outlet to form a heat dissipation flow channel.
Further, the first heat dissipation part comprises a first heat dissipation section and a second heat dissipation section; the first heat dissipation section is of a linear structure, the second heat dissipation section is of a V-shaped structure so as to form a Y-shaped first heat dissipation part, and the second heat dissipation section is close to the air outlet.
The domain control host provided by the utility model further comprises a fan, wherein the fan is arranged corresponding to the air inlet, and the air outlet end of the fan faces the heat dissipation flow channel.
Specifically, the housing assembly comprises a main body member and an air duct cover, wherein an opening is formed in the position, corresponding to the heat dissipation piece, of the main body member, the air duct cover is covered on the opening, and the air duct cover is detachably connected with the main body member.
Further, the body member includes a shell body, a bottom cover, and an end cap; the shell main body is of a -shaped structure, the air inlet and the air outlet are oppositely arranged at two ends of the shell main body, the opening is formed in the top of the shell main body, the bottom cover is connected with the shell main body to form a rectangular cylindrical structure, and the end cover is connected with the shell main body and the bottom cover to form a closed rectangular installation space.
Still further, the casing assembly further comprises a baffle plate, the baffle plate is arranged in the installation space, the installation space is separated into a heat dissipation cavity, and the main board and the heat dissipation piece are both arranged in the heat dissipation cavity.
Further, the end cover is provided with a mounting groove, the mounting groove is arranged corresponding to the air inlet, and the fan is arranged in the mounting groove; the main board is connected with the end cover.
Compared with the prior art, the domain control host provided by the utility model has the following advantages:
the domain control host provided by the utility model comprises a shell component, a heat dissipation component and a main board; the heat dissipation assembly and the main board are arranged in the shell assembly, the heat dissipation assembly comprises a heat dissipation piece, the heat dissipation piece corresponds to the main board, a plurality of first heat dissipation parts are formed on the heat dissipation piece, the plurality of first heat dissipation parts are all of a Y-shaped structure, and the plurality of first heat dissipation parts are arranged at intervals along the width direction of the heat dissipation piece.
From this analysis shows that can provide stable mounted position for radiating member and mainboard through the casing subassembly, and through setting up radiating member correspondence mainboard, can make radiating member be close the mainboard more to can improve the heat dispersion to the mainboard.
And, because the radiating piece in this application includes a plurality of first radiating portions, and a plurality of first radiating portions all are Y shape structure, consequently, can increase the radiating area of radiating piece in limited space to improve the radiating effect, guarantee the stability of whole domain accuse host computer.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of an internal structure of a domain master provided in an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a first view angle of a domain control host according to an embodiment of the present utility model.
In the figure: 1-a shell body; 101-an air outlet; 2-an air duct cover; 3-end caps; 4-a bottom cover; 5-a heat sink; 501-a first heat sink; 5011-a first heat dissipation segment; 5012-a second heat-dissipating section; 502-a second heat sink; 6-a main board; 7-fans.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to be within the scope of the present application.
In the description of the embodiments of the present application, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," "coupled" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As used herein, the term "and/or" includes any one of the listed items of interest and any combination of any two or more.
For ease of description, spatially relative terms such as "above … …," "upper," "below … …," and "lower" may be used herein to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. Singular forms also are intended to include plural forms unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are intended to specify the presence of stated features, integers, operations, elements, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, operations, elements, and/or groups thereof.
Variations from the shapes of the illustrations as a result, of manufacturing techniques and/or tolerances, are to be expected. Accordingly, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shapes that occur during manufacture.
The features of the examples described herein may be combined in various ways that will be apparent after an understanding of the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible as will be apparent after an understanding of the present disclosure. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
As shown in fig. 1 and fig. 2, the present utility model provides a domain control host, which includes a housing assembly, a heat dissipation assembly, and a motherboard 6; the heat dissipation assembly and the main board 6 are arranged in the shell assembly, the heat dissipation assembly comprises a heat dissipation piece 5, the heat dissipation piece 5 corresponds to the main board 6, a plurality of first heat dissipation parts 501 are formed on the heat dissipation piece 5, the plurality of first heat dissipation parts 501 are of Y-shaped structures, and the plurality of first heat dissipation parts 501 are arranged at intervals along the width direction of the heat dissipation piece 5.
Compared with the prior art, the domain control host provided by the utility model has the following advantages:
according to the domain control host provided by the utility model, a stable installation position can be provided for the heat dissipation part 5 and the main board 6 through the shell assembly, and the heat dissipation part 5 can be more close to the main board 6 through arranging the heat dissipation part 5 corresponding to the main board 6, so that the heat dissipation capacity of the main board 6 can be improved.
Moreover, since the heat dissipation element 5 in the present application includes the plurality of first heat dissipation portions 501, and the plurality of first heat dissipation portions 501 are all in a Y-shaped structure, therefore, the heat dissipation area of the heat dissipation element 5 can be increased in a limited space, thereby improving the heat dissipation effect and ensuring the stability of the whole domain control host.
Because the one end of the housing assembly in this application is formed with the air intake, and the other end is formed with air outlet 101, and radiating member 5 sets up between air intake and air outlet 101, consequently, outside gas can get into in the housing assembly by the air intake to take the heat out by air outlet 101 after radiating member 5, realize the heat dissipation to mainboard 6.
Accordingly, the present application can form the heat dissipation gap by arranging the plurality of first heat dissipation portions 501 at intervals in the width direction of the heat dissipation member 5, so as to ensure the heat dissipation effect. It can be understood that, since the number of the first heat dissipation portions 501 formed on the heat dissipation member 5 cannot be infinitely increased, if the number of the first heat dissipation portions 501 is too large, the heat dissipation gap is too small, which not only cannot enhance the heat dissipation effect, but also prevents the airflow from flowing, so that the heat dissipation effect is reduced.
Therefore, this application is through making first radiating portion 501 be Y shape, and as shown in fig. 1 combines fig. 2, first radiating section 5011 of first radiating portion 501 is the font structure, second radiating section 5012 is V-arrangement structure, and make second radiating section 5012 be close to air outlet 101, first radiating section 5011 is close to the air intake, thereby make the clearance between adjacent first radiating section 5011 be greater than the clearance between adjacent second radiating section 5012, namely through the bigger first radiating section 5011 in clearance as the air inlet, thereby can reduce the hindrance to the air current to a certain extent, and through the second radiating section 5012 that is V-arrangement structure, can enough guide the air current, can increase the radiating area of first radiating portion 501 again, promote the radiating effect.
Preferably, as shown in fig. 1 and fig. 2, the heat dissipation member 5 is further formed with a plurality of second heat dissipation portions 502, the plurality of second heat dissipation portions 502 are each in a linear structure, and the plurality of second heat dissipation portions 502 and the plurality of first heat dissipation portions 501 are alternately arranged at intervals along the width direction of the heat dissipation member 5.
It can be appreciated that, because the first heat dissipation portion 501 is in a Y-shaped structure, a heat dissipation gap formed between the first heat dissipation segments 5011 of the first heat dissipation portion 501 is relatively large, and the application further forms a plurality of second heat dissipation portions 502 on the heat dissipation member 5, and the plurality of second heat dissipation portions 502 and the plurality of first heat dissipation portions 501 are alternately arranged, so that a larger gap of the first heat dissipation segments 5011 can be filled, a heat dissipation area of a heat dissipation surface is increased, and a heat dissipation effect on the motherboard 6 is improved.
It can be understood that, in the present application, the first heat dissipation portion 501 and the second heat dissipation portion 502 extend along the connection line between the air inlet and the air outlet 101 to form a heat dissipation flow channel, and air entering from the air inlet can flow in the heat dissipation flow channel through the heat dissipation flow channel, so that heat of the first heat dissipation portion 501 and the second heat dissipation portion 502 of the heat dissipation member 5 can be absorbed, and the heat is carried out through the air outlet 101 to realize heat dissipation to the motherboard 6.
Preferably, as shown in fig. 1 and fig. 2, the domain control host provided by the utility model further includes a fan 7, wherein the fan 7 is arranged corresponding to the air inlet, and the air outlet end of the fan 7 faces the heat dissipation flow channel.
Through the fan 7 that sets up at the air intake, can make the outside air get into in the casing subassembly fast to, because the air-out end of fan 7 sets up towards the heat dissipation runner, consequently, can further promote the gas velocity of flow, improve the radiating effect.
It should be noted that, when the domain control host adopting the heat dissipation element 5 provided by the application is in a low-power running state, the fan 7 is not required to be started, heat dissipation to the main board 6 can be realized only through the heat dissipation element 5, and when the host is in a high-power state, the fan 7 is started to improve the heat dissipation effect.
Optionally, as shown in fig. 1 and fig. 2 in combination, the housing assembly in the present application includes a main body member and an air duct cover 2, an opening is formed at a position of the main body member corresponding to the heat dissipation element 5, the air duct cover 2 is covered on the opening, and the air duct cover 2 is detachably connected with the main body member.
The air duct cover 2 detachably connected with the main body member is arranged on the opening part through the opening part formed at the position of the main body member corresponding to the heat dissipation part 5, so that the air duct cover 2 can be opened to realize quick inspection and maintenance of the internal structure.
Accordingly, as shown in fig. 1, the body member in the present application includes a case body 1, a bottom cover 4, and an end cover 3; the shell main body 1 is -shaped structure, the air inlet and the air outlet 101 are oppositely arranged at two ends of the shell main body 1, the opening is formed at the top of the shell main body 1, the bottom cover 4 is connected with the shell main body 1 to form a rectangular cylindrical structure, and the end cover 3 is connected with the shell main body 1 and the bottom cover 4 to form a closed rectangular installation space.
By assembling the main body member from the case main body 1, the bottom cover 4, and the end cover 3, the assembly and maintenance can be facilitated, and the overhaul flexibility of the main body member can be improved.
Preferably, as shown in fig. 1 and fig. 2, the housing assembly in the present application further includes a baffle plate, the baffle plate is disposed in the installation space, and separates the installation space from the heat dissipation cavity, and the motherboard 6 and the heat dissipation member 5 are disposed in the heat dissipation cavity.
Because main heat source in the domain control host is the mainboard 6, consequently, through setting up the baffle in the installation space, can separate the mainboard 6 that produces the heat source with other components and parts of domain control host to, the heat dissipation chamber that forms through the baffle also can make the air current concentrate more, thereby better dispel the heat.
Preferably, the end cover 3 in the present application is formed with a mounting groove, and the mounting groove is arranged corresponding to the air inlet, and the fan 7 is arranged in the mounting groove; the main board 6 is connected with the end cover 3.
The fan 7 in this application sets up in the installation space that above-mentioned, and through the mounting groove that forms on the end cover 3, can make the setting of fan 7 more stable.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (10)
1. The domain control host is characterized by comprising a shell component, a heat dissipation component and a main board;
the heat dissipation assembly and the mainboard all set up in the casing subassembly, just the heat dissipation assembly includes the radiating piece, the radiating piece corresponds the mainboard sets up, be formed with a plurality of first radiating parts on the radiating piece, a plurality of first radiating parts all are Y shape structure, and a plurality of first radiating parts is followed the width direction interval setting of radiating piece.
2. The domain master of claim 1, wherein the heat dissipation member further comprises a plurality of second heat dissipation portions, the plurality of second heat dissipation portions each have a linear structure, and the plurality of second heat dissipation portions and the plurality of first heat dissipation portions are alternately arranged at intervals along a width direction of the heat dissipation member.
3. The domain master of claim 2, wherein an air inlet is formed at one end of the housing assembly, an air outlet is formed at the other end of the housing assembly, and the heat sink is disposed between the air inlet and the air outlet.
4. The domain master of claim 3, wherein the first heat dissipation portion and the second heat dissipation portion each extend along a connection line between the air inlet and the air outlet to form a heat dissipation flow channel.
5. The domain master of claim 3, wherein the first heat sink portion comprises a first heat sink segment and a second heat sink segment;
the first heat dissipation section is of a linear structure, the second heat dissipation section is of a V-shaped structure so as to form a Y-shaped first heat dissipation part, and the second heat dissipation section is close to the air outlet.
6. The domain master of claim 4, further comprising a fan disposed in correspondence to the air inlet, and an air outlet of the fan is oriented toward the heat dissipation flow channel.
7. The domain master of claim 6, wherein the housing assembly includes a body member and an air duct cover, an opening is formed in the body member at a position corresponding to the heat sink, the air duct cover covers the opening, and the air duct cover is detachably connected to the body member.
8. The domain master of claim 7, wherein the body member comprises a shell body, a bottom cover, and an end cap;
the shell main body is of a -shaped structure, the air inlet and the air outlet are oppositely arranged at two ends of the shell main body, the opening is formed in the top of the shell main body, the bottom cover is connected with the shell main body to form a rectangular cylindrical structure, and the end cover is connected with the shell main body and the bottom cover to form a closed rectangular installation space.
9. The domain master of claim 8, wherein the housing assembly further comprises a baffle disposed within the mounting space and separating the mounting space from a heat dissipation cavity, the motherboard and the heat sink each disposed within the heat dissipation cavity.
10. The domain master of claim 8, wherein the end cap is formed with a mounting groove, the mounting groove is disposed corresponding to the air inlet, and the fan is disposed in the mounting groove;
the main board is connected with the end cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322075442.XU CN220419902U (en) | 2023-08-02 | 2023-08-02 | Domain control host |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322075442.XU CN220419902U (en) | 2023-08-02 | 2023-08-02 | Domain control host |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220419902U true CN220419902U (en) | 2024-01-30 |
Family
ID=89654825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322075442.XU Active CN220419902U (en) | 2023-08-02 | 2023-08-02 | Domain control host |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220419902U (en) |
-
2023
- 2023-08-02 CN CN202322075442.XU patent/CN220419902U/en active Active
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