CN220418639U - Resonant vibration sensor structure - Google Patents

Abstract

The utility model relates to a resonant vibration sensor structure, which comprises an upper cover, a main body and a lower cover, wherein the lower end of the upper cover is screwed with the lower cover, the upper cover is provided with an inner cavity, a cylindrical main body is arranged in the inner cavity, the upper end of the main body extends out of the top of the upper cover, at least one mounting groove is formed in the side wall of the main body, and a resonant sensitive unit is embedded and arranged in each mounting groove. The utility model uses the resonance type sensitive unit as the sensing core of the sensor, and the resonance type sensing unit generates certain oscillation frequency between tens of Hz and hundreds of MHz by using the inverse piezoelectric principle, thereby meeting the requirement of quick response.

Description

Resonant vibration sensor structure

Technical Field

The utility model relates to the technical field of resonant vibration sensors, in particular to a resonant vibration sensor structure.

Background

Along with the development of science and technology, the sensing technology is advanced rapidly, the sensing capability in the aspects of temperature, flow and mechanics is improved, more than 50% of the whole sensor market is occupied in the field of mechanics, such as tension, pressure, torque force, inertia force, vibration force sensor and the like, the force sensor can be divided into three main parts including a sensing unit, an elastomer and a signal interface, in the aspect of the sensing unit, the traditional strain gauge mode is used as a main sensing principle, when a metal or a composite material thereof deforms an object, the resistance value is changed, the stress size is calculated through the change of the resistance value, and the requirements of precision, sensitivity and response time are gradually unsatisfied.

For vibration sensors, when the vibration frequency is higher than 400Hz, the traditional strain gauge sensor cannot timely detect the vibration signal, so that monitoring is ineffective, and therefore, the novel vibration sensor is in urgent need of improvement considering the technical principles of rapider and shorter response time as the sensor basis.

Disclosure of Invention

The utility model aims to solve the technical problem of providing a resonant vibration sensor structure, which uses a resonant sensitive unit as a sensor sensing core, and the resonant mode of the resonant vibration sensor structure uses an inverse piezoelectric principle to generate certain oscillation frequency which is between tens of Hz and hundreds of MHz, so that the requirement of quick response can be met.

The technical scheme adopted for solving the technical problems is as follows: the utility model provides a resonant vibration sensor structure, including upper cover, main part and lower cover, the upper cover lower extreme connect soon and have the lower cover, this upper cover has an inner chamber, inner chamber internally mounted have and be cylindric main part, the upper end of this main part stretches out outside the upper cover top, the lateral wall of main part seted up at least one mounting groove, all imbeds in every mounting groove and install resonant mode sensitive unit.

As a supplement to the technical scheme of the utility model, the mounting groove is a square groove, and the depth of the groove is between 0.1 and 2.0 mm.

As a supplement to the technical scheme of the utility model, the middle part of the main body is provided with a central round hole along the axial direction, and the central round hole is used for connecting a screw.

As a supplement to the technical scheme of the utility model, the resonant type sensing units are divided into three sensing units in the X direction, a sensing unit in the Y direction and a sensing unit in the Z direction, and the side wall of the main body is sequentially provided with the sensing units in the X direction, the sensing units in the Y direction and the sensing units in the Z direction around the circumference.

As a supplement to the technical scheme of the utility model, the connecting line between the center of the X-direction sensitive unit and the main body axle is a first axis, the connecting line between the center of the Y-direction sensitive unit and the main body axle is a second axis, the connecting line between the center of the Z-direction sensitive unit and the main body axle is a third axis, the included angle between the first axis and the second axis is 90 degrees, the included angle between the first axis and the third axis is 135 degrees, and the included angle between the second axis and the third axis is 135 degrees.

As a supplement to the technical scheme of the utility model, the resonance type sensitive unit comprises a quartz crystal chip and two bearing bodies stacked up and down, wherein the bearing bodies comprise an upper force bearing edge, a lower force bearing edge, an inner hexagonal frame and a quartz crystal chip platform, two sides of the inner wall of the inner hexagonal frame are respectively provided with a placing groove, the two placing grooves form the quartz crystal chip platform, and the upper force bearing edge and the lower force bearing edge are respectively arranged on the upper side and the lower side of the inner hexagonal frame; the quartz crystal chip is fixedly arranged on the quartz crystal chip platform, and the two bearing bodies are fixedly connected by adopting the sealing part.

As a supplement to the technical scheme of the utility model, stress concentration structures are arranged between the upper force bearing edge and the inner hexagon frame and between the lower force bearing edge and the inner hexagon frame, and the structures of the stress concentration structures are round edges, square edges or polygons.

As a supplement to the technical scheme of the utility model, the quartz crystal chip is made of piezoelectric material, and the piezoelectric material is made of quartz, ceramic or ceramic composite material.

As a supplement to the technical scheme of the utility model, the quartz crystal chip comprises an upper electrode, a lower electrode and a chip flat plate, wherein the upper electrode and the lower electrode are respectively plated on the upper side and the lower side of the chip flat plate 204.

As a supplement to the technical scheme of the utility model, the outer side of the upper cover is provided with a wire connector connected with the resonance type sensitive unit.

The beneficial effects are that: the utility model relates to a resonant vibration sensor structure, which uses a resonant sensitive unit as a sensor sensing core, and the resonant mode of the resonant vibration sensor structure uses a reverse piezoelectric principle to generate certain oscillation frequency which is between tens of Hz and hundreds of MHz, so that the quick response requirement can be met; the three directions of the X-direction sensitive unit, the Y-direction sensitive unit and the Z-direction sensitive unit are placed in the mounting groove of the main body, the three-dimensional vibration directions in the space can be detected respectively, when the sensor is not stressed, the resonant sensitive unit maintains a fixed resonant frequency, after being stressed, the three direction sensitive units respectively generate the change of the resonant frequency, the change of the resonant frequency generates a difference value with the original fixed resonant frequency, and the difference value is calculated to obtain the stressed magnitude and the stressed vibration frequency, so that the sensor can be used as a force and vibration sensor.

Drawings

FIG. 1 is a schematic illustration of the open state of the present utility model;

FIG. 2 is a schematic illustration of the present utility model in a closed position;

FIG. 3 is a schematic diagram of a resonant sensor unit according to the present utility model;

FIG. 4 is an exploded view of the present utility model;

FIG. 5 is a graph of the distribution of resonant sensitive units according to the present utility model;

FIG. 6 is a schematic diagram of a quartz crystal chip according to the present utility model;

FIG. 7 is a schematic diagram of a resonant sensor unit according to the present utility model.

The diagram is: 101. the device comprises a supporting body, 102, an upper force bearing edge, 103, a lower force bearing edge, 104, an inner hexagon frame, 105, a quartz crystal chip platform, 106, a stress concentration structure, 107, a sealing part, 21, an upper cover, 22, a main body, 23, a lower cover, 24, a resonance type sensing unit, 25, a wire connector, 26, an inner cavity, 27, a central round hole, 28, a mounting groove, 29, an X direction sensing unit, 30, a Y direction sensing unit, 31, a Z direction sensing unit, 201, a quartz crystal chip, 202, an upper electrode, 203, a lower electrode, 204 and a chip flat plate.

Detailed Description

The utility model will be further illustrated with reference to specific examples. It is to be understood that these examples are illustrative of the present utility model and are not intended to limit the scope of the present utility model. Further, it is understood that various changes and modifications may be made by those skilled in the art after reading the teachings of the present utility model, and such equivalents are intended to fall within the scope of the claims appended hereto.

The embodiment of the utility model relates to a resonant vibration sensor structure, as shown in fig. 1-7, which comprises an upper cover 21, a main body 22 and a lower cover 23, wherein the lower end of the upper cover 21 is screwed with the lower cover 23, the upper cover 21 is provided with an inner cavity 26, the inner cavity 26 is internally provided with a cylindrical main body 22, the upper end of the main body 22 extends out of the top of the upper cover 21, the side wall of the main body 22 is provided with at least one mounting groove 28, and a resonant sensitive unit 24 is embedded and arranged in each mounting groove 28.

The utility model uses the resonance type sensing unit 24 as a sensor sensing core, the resonance type uses the inverse piezoelectric principle to generate a certain oscillation frequency which is between tens of Hz and hundreds of MHz, the quick response requirement can be met, the technical blank is filled in the automation and industry field, the micro and high frequency vibration of the sensor cannot be detected by using the existing sensor, and the sensor with more excellent sensitivity, precision and response speed is needed to solve and correct the vibration phenomenon of the robot in the working process, thereby improving the machining precision and accuracy of the robot.

The mounting groove 28 is a square groove with a groove depth of 0.1-2.0 mm.

The middle part of the main body 22 is provided with a central round hole 27 along the axial direction, and the central round hole 27 is used for connecting a screw.

The resonant type sensing units 24 are divided into an X-direction sensing unit 29, a Y-direction sensing unit 30 and a Z-direction sensing unit 31, and the side wall of the main body 22 is sequentially provided with the X-direction sensing unit 29, the Y-direction sensing unit 30 and the Z-direction sensing unit 31 around the circumference.

The connecting line between the center of the X-direction sensitive unit 29 and the axis of the main body 22 is a first axis, the connecting line between the center of the Y-direction sensitive unit 30 and the axis of the main body 22 is a second axis, the connecting line between the center of the Z-direction sensitive unit 31 and the axis of the main body 22 is a third axis, the included angle between the first axis and the second axis is 90 degrees, the included angle between the first axis and the third axis is 135 degrees, and the included angle between the second axis and the third axis is 135 degrees; the sensor arranged in the three directions has the following advantages: x, Y is a directivity test, and Z is used for reducing interference to XY directions, so that accuracy improvement and data decoupling calculation are facilitated, and in the aspect of data improvement, the most important parameter hysteresis can be improved to be less than 1.0% FS.

The vibration sensor is fixed on the object to be measured by using a fixing device such as a screw passing through the central round hole 42, the object to be measured is directly contacted with the vibration sensor, the vibration mechanical energy of the object to be measured is transmitted into the local vibration sensor, three directions of the X-direction sensitive unit 29, the Y-direction sensitive unit 30 and the Z-direction sensitive unit 31 are utilized to be placed in the mounting groove 28 of the main body 22, the three-dimensional vibration directions in the space can be respectively detected, when the sensor is not stressed, the resonant sensitive unit 24 maintains a fixed resonance frequency, after being stressed, the three direction sensitive units respectively generate the change of the resonance frequency, the change of the resonance frequency generates a difference value with the original fixed resonance frequency, and the difference value is calculated to obtain the stressed magnitude and the stressed vibration frequency, so that the vibration sensor can be used as a force and vibration sensor.

The resonance type sensing unit 24 comprises a quartz crystal chip 201 and two bearing bodies 101 stacked up and down, wherein the bearing bodies 101 comprise an upper force bearing edge 102, a lower force bearing edge 103, an inner hexagonal frame 104 and a quartz crystal chip platform 105, two sides of the inner wall of the inner hexagonal frame 104 are respectively provided with a placing groove, the two placing grooves form the quartz crystal chip platform 105, and the upper force bearing edge 102 and the lower force bearing edge 103 are respectively arranged on the upper side and the lower side of the inner hexagonal frame 104; the quartz crystal chip 201 is installed and fixed on the quartz crystal chip platform 105, and the two bearing bodies 101 are connected and fixed by adopting a sealing part 107; the material of the sealing part 107 is adhesive glue or solderable metal.

As shown in fig. 3 and 7, stress concentration structures 106 are disposed between the upper force bearing edge 102 and the inner hexagonal frame 104 and between the lower force bearing edge 103 and the inner hexagonal frame 104, and the stress concentration structures 106 are round edges, square edges, polygons or the like; after the external force enters the carrier 101, the external force is concentrated and amplified by the stress concentrating structure 106, so that the detection capability and sensitivity of the quartz crystal chip 201 are increased.

The quartz crystal chip 201 is made of piezoelectric material, and the piezoelectric material is quartz, ceramic or ceramic composite material.

As shown in fig. 6, the quartz crystal chip 201 includes an upper electrode 202, a lower electrode 203 and a chip flat plate 204, wherein the upper electrode 202 and the lower electrode 203 are respectively plated on the upper side and the lower side of the chip flat plate 204; the upper electrode 202 and the lower electrode 203 are made of conductive materials, and the conductive materials are selected from one of gold, silver and aluminum.

The outer side of the upper cover 21 is provided with a wire connector 25 connected with the resonance type sensitive unit 24.

The piezoelectric quartz crystal has piezoelectric and inverse piezoelectric principles, after the quartz crystal is plated with conductive electrodes, the quartz crystal can be electrified to generate resonant mechanical energy through inverse piezoelectric effect, stable oscillation frequency is maintained in an oscillation frequency range, when the crystal is acted by external force, the oscillation frequency is changed, the change degree is monitored, the stress can be converted, and meanwhile, the external oscillation frequency can be monitored and used as a vibration sensor.

The oscillation displacement is between a few micrometers, the error is quite small, the high rigidity characteristic and the high frequency characteristic are applicable to the field of high load bearing sensors, the quartz crystal is suitable for monitoring dynamic and transient static force, the quartz crystal can be square, round and abnormal, different physical and piezoelectric characteristics can be generated according to different crystal cutting types, meanwhile, the sensitivity to external temperature is also different, an AT cutting type crystal can be used, the temperature influence to which is the lowest, and the quartz crystal is the best choice in the aspects of stability and reliability.

The quartz crystal chip 201 is adhered to the quartz crystal chip stage 105, and external force is transmitted to the quartz crystal chip 201 via the stress concentrating structure 106.

The quartz crystal chip 201 is vibrated by the upper electrode 202 and the lower electrode 203 to generate a fundamental frequency, an external force acts on the quartz crystal chip flat plate 204 to cause a resonance frequency, and then a frequency signal is transmitted to the signal processing unit.

The upper force bearing edge 102, the lower force bearing edge 103, the inner hexagonal frame 104, the quartz crystal chip platform 105 and the stress concentration structure 106 are integrated, and the integrated structure can ensure the connection strength and the structural stability between all the components; the material of the carrier 101 is kovar alloy, aluminum alloy or steel. The carrier 101 is a metal structure, has high rigidity, can mount the quartz crystal chip 201 in the carrier 101, and concentrate external acting force on the quartz crystal chip 201, so that the quartz crystal chip 201 senses force energy, and changes the oscillation frequency of the quartz resonant crystal, thereby achieving the function of the sensor.

The carrier 101 has a stress concentration structure 106, which can effectively transfer the external force to be measured to the quartz crystal chip 201, and improve the sensitivity of the sensor. The upper force-bearing side 102 and lower force-bearing side 103 of the carrier 101 are configured to be operatively connected to an object to be tested.

In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model.

The foregoing has outlined a detailed description of a resonant vibration sensor structure provided herein, wherein specific embodiments are provided to illustrate the principles and embodiments of the present application, the above examples being provided only to assist in understanding the method and core concepts of the present application; meanwhile, as those skilled in the art will have modifications in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims (10)

1. The utility model provides a resonant vibration sensor structure, includes upper cover (21), main part (22) and lower cover (23), its characterized in that: the upper cover (21) lower extreme connect soon and have lower cover (23), this upper cover (21) have an inner chamber (26), inner chamber (26) internally mounted have be cylindric main part (22), outside the upper end of this main part (22) stretches out upper cover (21) top, the lateral wall of main part (22) seted up at least one mounting groove (28), all imbeds in every mounting groove (28) and install resonance type sensitive unit (24).

2. A resonant vibration sensor structure according to claim 1, wherein: the mounting groove (28) is a square groove, and the depth of the groove is between 0.1 and 2.0 mm.

3. A resonant vibration sensor structure according to claim 1, wherein: the middle part of the main body (22) is provided with a central round hole (27) along the axial direction, and the central round hole (27) is used for connecting a screw.

4. A resonant vibration sensor structure according to claim 1, wherein: the resonant type sensing units (24) are divided into an X-direction sensing unit (29), a Y-direction sensing unit (30) and a Z-direction sensing unit (31), and the side wall of the main body (22) is sequentially provided with the X-direction sensing unit (29), the Y-direction sensing unit (30) and the Z-direction sensing unit (31) around the circumference.

5. A resonant vibration sensor structure according to claim 4, wherein: the X-direction sensing unit (29) is characterized in that a connecting line between the center of the X-direction sensing unit (29) and the axis of the main body (22) is a first axis, a connecting line between the center of the Y-direction sensing unit (30) and the axis of the main body (22) is a second axis, a connecting line between the center of the Z-direction sensing unit (31) and the axis of the main body (22) is a third axis, an included angle between the first axis and the second axis is 90 degrees, an included angle between the first axis and the third axis is 135 degrees, and an included angle between the second axis and the third axis is 135 degrees.

6. A resonant vibration sensor structure according to claim 1, wherein: the resonance type sensing unit (24) comprises a quartz crystal chip (201) and two bearing bodies (101) which are stacked up and down, wherein each bearing body (101) comprises an upper force bearing edge (102), a lower force bearing edge (103), an inner hexagonal frame (104) and a quartz crystal chip platform (105), two sides of the inner wall of the inner hexagonal frame (104) are respectively provided with a placement groove, the two placement grooves form the quartz crystal chip platform (105), and the upper force bearing edge (102) and the lower force bearing edge (103) are respectively arranged on the upper side and the lower side of the inner hexagonal frame (104); the quartz crystal chip (201) is fixedly arranged on the quartz crystal chip platform (105), and the two supporting bodies (101) are fixedly connected by adopting the sealing part (107).

7. A resonant vibration sensor structure according to claim 6, wherein: stress concentration structures (106) are arranged between the upper force bearing edge (102) and the inner hexagon frame (104) and between the lower force bearing edge (103) and the inner hexagon frame (104), and the structures of the stress concentration structures (106) are round edges, square edges or polygons.

8. A resonant vibration sensor structure according to claim 6, wherein: the quartz crystal chip (201) is made of piezoelectric materials, and the piezoelectric materials are quartz, ceramic or ceramic composite materials.

9. A resonant vibration sensor structure according to claim 6, wherein: the quartz crystal chip (201) comprises an upper electrode (202), a lower electrode (203) and a chip flat plate (204), wherein the upper electrode (202) and the lower electrode (203) are respectively plated on the upper side and the lower side of the chip flat plate (204).

10. A resonant vibration sensor structure according to claim 1, wherein: the outside of the upper cover (21) is provided with a wire connector (25) connected with the resonance type sensitive unit (24).