CN220399690U - Photonic integrated circuit chip package - Google Patents
Photonic integrated circuit chip package Download PDFInfo
- Publication number
- CN220399690U CN220399690U CN202323093440.XU CN202323093440U CN220399690U CN 220399690 U CN220399690 U CN 220399690U CN 202323093440 U CN202323093440 U CN 202323093440U CN 220399690 U CN220399690 U CN 220399690U
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- Prior art keywords
- integrated circuit
- circuit chip
- photonic integrated
- chip package
- function board
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- 239000013307 optical fiber Substances 0.000 claims description 27
- 230000003287 optical effect Effects 0.000 claims description 15
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
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Abstract
The utility model relates to the field of chips, and provides a photonic integrated circuit chip package, which comprises: a circuit function board; the photon integrated circuit chip is arranged on the circuit function board; the resistor is arranged on the circuit function board and is electrically connected with the circuit function board; and the distance measuring sensor is arranged on the circuit function board and is configured to measure at least one parameter of the height and the distance of the resistor. The distance measuring sensor can detect whether the resistor is shifted or changed in height or the like, and accordingly whether the resistor is in cold joint or loose is reflected.
Description
Technical Field
The present utility model relates to the field of chips, and more particularly, to a photonic integrated circuit chip package.
Background
In the packaging of photonic integrated circuit chips, the circuit function board sometimes includes resistive elements, which may not be soldered well, such as by cold soldering, resulting in the circuit function board not functioning properly, thereby affecting the overall chip package.
Disclosure of Invention
In the utility model, the ranging sensor can detect whether the resistor is shifted or changed in height, etc., so as to reflect whether the resistor is in cold joint or loose state.
In one exemplary embodiment, a chip package is provided that includes a circuit function board; the photon integrated circuit chip is arranged on the circuit function board; the resistor is arranged on the circuit function board and is electrically connected with the circuit function board; and the distance measuring sensor is arranged on the circuit function board and is configured to measure at least one parameter of the height and the distance of the resistor.
In some embodiments, the ranging sensor is an infrared ranging sensor.
In some embodiments, the photonic integrated circuit chip package includes an optical fiber; the photonic integrated circuit chip includes an optical coupling port to which the optical fiber is coupled.
In some embodiments, the photonic integrated circuit chip package includes a PCB board disposed in the circuit function board, and the photonic integrated circuit chip is disposed in the PCB board.
In some embodiments, a photonic integrated circuit chip package includes a fiber carrier disposed on the photonic integrated circuit chip for carrying the optical fiber.
In some embodiments, the fiber optic carrier comprises: and the optical fibers are arranged on the V-shaped groove in the optical fiber carrier.
In some embodiments, the photonic integrated circuit chip includes a modulator.
In some embodiments, the photonic integrated circuit chip includes a photodetector.
In some embodiments, the photonic integrated circuit chip package includes a laser, wherein a first end of the optical fiber is coupled to the laser and a second end of the optical fiber is coupled to the photonic integrated circuit chip to transmit an output of the laser to the photonic integrated circuit chip.
In some embodiments, the optical coupling port comprises a grating coupler or an end-face coupler.
In the present utility model, the distance measuring sensor may detect a possible malfunction, for example, a tilting or shifting may occur when the resistance is cold-welded (or loose), and the height itself or the distance from the infrared sensor may be changed once it exceeds a set value, thereby being detected and further analyzed by the distance measuring sensor.
Various aspects, features, advantages, etc. of embodiments of the utility model will be described in detail below with reference to the accompanying drawings. The above aspects, features, advantages and the like of the present utility model will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a top view of a photonic integrated circuit chip package.
Fig. 2 is a side view of a photonic integrated circuit chip package.
Detailed Description
In order to facilitate understanding of the various aspects, features and advantages of the technical solution of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the various embodiments described below are for illustration only and are not intended to limit the scope of the present utility model.
In the description of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
As shown in fig. 1, in one exemplary embodiment, a photonic integrated circuit chip package 100 is provided, the photonic integrated circuit chip package 100 comprising:
a circuit function board 130;
a photonic integrated circuit chip 110 disposed on the circuit function board 130;
the resistor 101 is arranged on the circuit function board and is electrically connected with the circuit function board;
a distance measuring sensor 102 is disposed on the circuit board, and is configured to measure at least one parameter of the height and distance of the resistor.
With further reference to fig. 2, in fig. 2, a side view of photonic integrated circuit chip package 100 is shown (where the photonic integrated circuit chip is not shown), wherein a schematic diagram of circuit function board 130, resistor 101, ranging sensor 102 is shown.
The resistor 101 is disposed on the circuit functional board 130, and the resistor 101 may be mounted on the circuit functional board 130 by soldering, so that the electrical characteristics are not turned on or are turned off poorly when the resistance cold joint phenomenon occurs, thereby affecting the circuit characteristics. By means of the distance measuring sensor 102 on the circuit board 130, it is possible to find out at a first time whether there is a cold joint in the resistor. If the resistor 101 is cold soldered, it may be inclined or offset, and the distance from itself or the infrared sensor may be changed by an amount exceeding a set value, the distance sensor 102 may detect a possible failure thereof. The distance measuring sensor is always in an operating state, so that long-time monitoring can be realized.
In some embodiments, the ranging sensor is an infrared ranging sensor.
In some embodiments, the photonic integrated circuit chip package includes an optical fiber; the photonic integrated circuit chip includes an optical coupling port to which the optical fiber is coupled.
In some embodiments, the photonic integrated circuit chip package includes a PCB board disposed in the circuit function board, and the photonic integrated circuit chip is disposed in the PCB board.
In some embodiments, a photonic integrated circuit chip package includes a fiber carrier disposed on the photonic integrated circuit chip for carrying the optical fiber.
In some embodiments, the fiber optic carrier comprises: and the optical fibers are arranged on the V-shaped groove in the optical fiber carrier.
In some embodiments, the photonic integrated circuit chip includes a modulator.
In some embodiments, the photonic integrated circuit chip includes a photodetector.
In some embodiments, the photonic integrated circuit chip package includes a laser, wherein a first end of the optical fiber is coupled to the laser and a second end of the optical fiber is coupled to the photonic integrated circuit chip to transmit an output of the laser to the photonic integrated circuit chip.
In some embodiments, the optical coupling port comprises a grating coupler or an end-face coupler.
Photonic integrated circuit chip 110 may include photonic devices such as optical coupling ports, waveguides, photoelectric conversion units, electro-optical conversion units, light sources, etc., and the number of the various photonic devices may be one or more as desired. The electro-optical conversion unit may include a modulator to convert an electrical signal into an optical signal, for example. Illustratively, the optical coupling port may be used to optically couple with a laser or an optical fiber to input an optical signal to photonic integrated circuit chip 110 or output an optical signal from photonic integrated circuit chip 110, e.g., input and output an optical signal using an optical fiber; the optical coupling port may include a grating coupler, an end-face coupler, or the like. Illustratively, a waveguide may be used to propagate an optical signal, serving as a channel for information propagation. The photoelectric conversion unit may include a photodetector for converting an optical signal into an electrical signal, and the photodetector may include a photodiode, for example.
Illustratively, a method of fabricating a photonic integrated circuit chip may include:
in one embodiment, the wafer may be a semiconductor-on-insulator wafer, for example: SOI (Silicon-On-Insulator) wafer.
The step of forming a plurality of photonic integrated circuit chips based on the wafer may be, for example, by patterning, deposition, doping, etc. the photonic integrated circuit chips may be formed by a process.
Illustratively, in some embodiments, the wavelength of the input optical fiber may be selected as desired, a laser may be used as an external light source, light provided to the optical fiber, and further input to the photonic integrated circuit chip via the optical fiber. Illustratively, the wavelength band of light may be 1260nm-1360nm, 1530nm-1565nm. The 1260nm-1360nm band and 1530nm-1565nm band refer to laser beams having any wavelength within the 1260nm-1360nm and 1530nm-1565nm range. Such as laser light of any wavelength of 1260nm, 1270nm, 1280 nm, 1290 nm, 1300 nm, 1310 nm, 1320 nm, 1330 nm, 1340 nm, 1350 nm, 1360nm, and 1530nm, 1513 nm, 1540nm, 1545 nm, 1550 nm, 1560 nm, 1565nm. It is noted that the specific values of the wavelengths are given by way of example only, as long as any value of the wavelengths in the 1260nm-1360nm band and 1530nm-1565nm band ranges are within the scope of the present application.
It will be appreciated by those skilled in the art that the foregoing disclosure is merely illustrative of the present utility model and that no limitation on the scope of the claimed utility model is intended, as defined by the appended claims and equivalents thereof.
Claims (10)
1. A photonic integrated circuit chip package comprising:
a circuit function board;
the photon integrated circuit chip is arranged on the circuit function board;
the resistor is arranged on the circuit function board and is electrically connected with the circuit function board;
the resistor is characterized by further comprising a ranging sensor which is arranged on the circuit function board and is configured to measure at least one parameter of the height and the distance of the resistor.
2. The photonic integrated circuit chip package of claim 1, wherein the ranging sensor comprises an infrared ranging sensor.
3. The photonic integrated circuit chip package of claim 1 wherein,
the photonic integrated circuit chip package includes an optical fiber;
the photonic integrated circuit chip includes an optical coupling port to which the optical fiber is coupled.
4. The photonic integrated circuit chip package of claim 1, wherein the photonic integrated circuit chip package comprises a PCB board disposed on the circuit function board, the photonic integrated circuit chip disposed on the PCB board.
5. The photonic integrated circuit chip package of claim 3, comprising:
the optical fiber carrier is arranged on the photonic integrated circuit chip and is used for bearing the optical fiber.
6. The photonic integrated circuit chip package of claim 5, wherein the fiber carrier comprises: and the optical fibers are arranged on the V-shaped groove in the optical fiber carrier.
7. The photonic integrated circuit chip package of claim 1, wherein the photonic integrated circuit chip comprises a modulator.
8. The photonic integrated circuit chip package of claim 1, wherein the photonic integrated circuit chip comprises a photodetector.
9. The photonic integrated circuit chip package of claim 3, comprising a laser, wherein,
a first end of the optical fiber is coupled to the laser and a second end of the optical fiber is coupled to the photonic integrated circuit chip to transmit an output of the laser to the photonic integrated circuit chip.
10. The photonic integrated circuit chip package of claim 3, wherein the optical coupling port comprises a grating coupler or an end-face coupler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323093440.XU CN220399690U (en) | 2023-11-16 | 2023-11-16 | Photonic integrated circuit chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323093440.XU CN220399690U (en) | 2023-11-16 | 2023-11-16 | Photonic integrated circuit chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220399690U true CN220399690U (en) | 2024-01-26 |
Family
ID=89604948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323093440.XU Active CN220399690U (en) | 2023-11-16 | 2023-11-16 | Photonic integrated circuit chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220399690U (en) |
-
2023
- 2023-11-16 CN CN202323093440.XU patent/CN220399690U/en active Active
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