CN220390613U - Water-oxygen barrier conductive film - Google Patents
Water-oxygen barrier conductive film Download PDFInfo
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- CN220390613U CN220390613U CN202321802985.0U CN202321802985U CN220390613U CN 220390613 U CN220390613 U CN 220390613U CN 202321802985 U CN202321802985 U CN 202321802985U CN 220390613 U CN220390613 U CN 220390613U
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- layer
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- oxygen
- conductive film
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- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 64
- 239000001301 oxygen Substances 0.000 title claims abstract description 64
- 230000004888 barrier function Effects 0.000 title claims abstract description 41
- 239000010410 layer Substances 0.000 claims abstract description 226
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000002346 layers by function Substances 0.000 claims abstract description 13
- 239000011247 coating layer Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 2
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229910052682 stishovite Inorganic materials 0.000 claims description 2
- 229910052905 tridymite Inorganic materials 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 18
- 230000000903 blocking effect Effects 0.000 abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920002284 Cellulose triacetate Polymers 0.000 description 5
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
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- Electroluminescent Light Sources (AREA)
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Abstract
The utility model discloses a water-oxygen barrier conductive film, which comprises: the device comprises a substrate layer, a first water-blocking and oxygen-blocking layer, an IM layer, a conductive functional layer and a second water-blocking and oxygen-blocking layer. The first water-blocking and oxygen-blocking layer is arranged on one surface of the substrate layer; the IM layer is arranged on one surface of the first water-blocking and oxygen-blocking layer, which is far away from the substrate layer; the conductive functional layer is arranged on one surface of the IM layer, which is far away from the first water-blocking and oxygen-blocking layer; the second water-blocking and oxygen-blocking layer is arranged on the other surface of the substrate layer. The water-oxygen barrier conductive film is provided with the first water-oxygen blocking layer and the second water-oxygen blocking layer at two sides of the substrate layer, and the thickness of the first water-oxygen blocking layer and the thickness of the second water-oxygen blocking layer are controlled, so that the water-oxygen barrier conductive film has better water-oxygen blocking property, and therefore, the devices sensitive to water and oxygen of the OLED are effectively protected. Secondly, the arrangement of the ITO layer can improve the conductivity of the water-oxygen barrier conductive film and increase the applicability of the water-oxygen barrier conductive film. In addition, the arrangement of the IM layer can improve the refractive index matching of the water-oxygen barrier conductive film.
Description
Technical Field
The utility model relates to the field of films, in particular to a water-oxygen barrier conductive film.
Background
The application fields of flexible OLED screens, flexible photovoltaic cells, flexible OLED lighting lamps and the like are expanding due to good flexibility and along with the continuous progress of flexible electronic technology. Since it is very sensitive to moisture and oxygen, organic materials used in OLED devices are easily oxidized or crystallized if exposed to the external environment, thereby severely affecting the performance of the OLED device. Therefore, it is necessary to effectively encapsulate the OLED device so that the functional layers of the OLED do not contact moisture, oxygen, and other components in the atmosphere. In the prior art, a flexible protective film is generally used to cover the OLED device so as to avoid the OLED device from being affected by moisture and oxygen. The existing flexible protective film has the problem of poor water and oxygen blocking effect, or the problem that the oxygen and water blocking effect reaches but the flexibility degree does not reach the requirement.
The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The utility model aims to provide a water-oxygen barrier conductive film which can prevent oxidation and corrosion of oxygen and water vapor to electronic devices and protect electronic elements.
In order to achieve the above object, the present utility model provides a water-oxygen barrier conductive film comprising: the device comprises a substrate layer, a first water-blocking and oxygen-blocking layer, an IM layer, a conductive functional layer and a second water-blocking and oxygen-blocking layer. The first water-blocking and oxygen-blocking layer is arranged on one surface of the substrate layer; the IM layer is arranged on one surface of the first water-blocking and oxygen-blocking layer, which is far away from the substrate layer; the conductive functional layer is arranged on one surface of the IM layer, which is far away from the first water-blocking and oxygen-blocking layer; the second water-blocking and oxygen-blocking layer is arranged on the other surface of the substrate layer.
In one or more embodiments, the conductive functional layer includes: a coating layer and an ITO layer. The coating layer is arranged on one surface of the IM layer, which is far away from the first water-blocking and oxygen-blocking layer; the ITO layer is arranged on one surface of the coating layer, which is far away from the IM layer, wherein the thickness of the ITO layer is between 18nm and 75 nm.
In one or more embodiments, the coating layer is a SiO2 layer; and/or the thickness of the coating layer is between 10nm and 25 nm.
In one or more embodiments, the substrate layer is a PET layer, a PC layer, a TAC layer, or a COP layer.
In one or more embodiments, the substrate layer has a thickness between 23 μm and 125 μm.
In one or more embodiments, the first water and oxygen blocking layer is a Si layer, a SiO layer 2 Layer or Si 3 N 4 A layer.
In one or more embodiments, the first water-and oxygen-blocking layer has a thickness between 200nm and 300 nm.
In one or more embodiments, the IM layer is an acrylic layer; and/or the thickness of the IM layer is between 100nm and 250 nm.
In one or more embodiments, the second water and oxygen blocking layer is a Si layer, a SiO layer 2 Layer or Si 3 N 4 A layer.
In one or more embodiments, the second water-and oxygen-blocking layer has a thickness between 200nm and 300 nm.
Compared with the prior art, the water-oxygen barrier conductive film is provided with the first water-oxygen blocking layer and the second water-oxygen blocking layer respectively at the two sides of the substrate layer, and the thickness of the first water-oxygen blocking layer and the thickness of the second water-oxygen blocking layer are controlled, so that the water-oxygen barrier conductive film has better water-oxygen blocking property, and therefore, devices sensitive to water vapor and oxygen of an OLED (organic light emitting diode) can be effectively protected. Secondly, the arrangement of the ITO layer can improve the conductivity of the water-oxygen barrier conductive film and increase the applicability of the water-oxygen barrier conductive film. In addition, the arrangement of the IM layer can improve the refractive index matching of the water-oxygen barrier conductive film.
Drawings
Fig. 1 is a schematic structural view of a water-oxygen barrier conductive film according to an embodiment of the present utility model.
Fig. 2 is a schematic structural view of a preferred embodiment of a water-oxygen barrier conductive film according to an embodiment of the present utility model.
The main reference numerals illustrate:
1-substrate layer, 2-first water-blocking and oxygen-blocking layer, 3-IM layer, 4-conductive functional layer, 41-coating layer, 42-ITO layer, 5-second water-blocking and oxygen-blocking layer.
Detailed Description
The following detailed description of embodiments of the utility model is, therefore, to be taken in conjunction with the accompanying drawings, and it is to be understood that the scope of the utility model is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.
As shown in fig. 1 to 2, a water-oxygen barrier conductive film according to an embodiment of the present utility model includes: a substrate layer 1, a first water-and oxygen-blocking layer 2, an IM layer 3, a conductive functional layer 4 and a second water-and oxygen-blocking layer 5. The first water-blocking oxygen-blocking layer 2 is arranged on one surface of the substrate layer 1. The IM layer 3 is disposed on a surface of the first water-blocking and oxygen-blocking layer 2 away from the substrate layer 1. The conductive functional layer 4 is disposed on a surface of the IM layer 3 away from the first water-blocking and oxygen-blocking layer 2. The second water-blocking oxygen-blocking layer 5 is arranged on the other side of the substrate layer 1.
In the above embodiment, the first water-blocking and oxygen-blocking layer 2 and the second water-blocking and oxygen-blocking layer 5 are respectively disposed on two sides of the substrate layer 1, so that the water-blocking and oxygen-blocking conductive film has better water-blocking and oxygen-blocking properties, and thus, OLED devices sensitive to water vapor and oxygen and the like can be effectively protected.
As shown in fig. 2, in an embodiment, the conductive functional layer 4 includes: a coating layer 41 and an ITO layer 42. The coating layer 41 is disposed on a surface of the IM layer 3 away from the first water-blocking and oxygen-blocking layer 2. The ITO layer 42 is disposed on a surface of the coating layer 41 away from the IM layer 3. Wherein the thickness of the ITO layer 42 is between 18nm and 75 nm. The ITO layer 42 is an indium tin oxide layer comprising a mixture of indium oxide and tin oxide, wherein the indium oxide accounts for 90-95%. The ITO layer 42 is disposed to enable the water-oxygen barrier conductive film to have conductivity, so that the water-oxygen barrier conductive film can protect a device and simultaneously perform a conductive function, and is particularly applicable to a device requiring conductivity.
The IM layer 3, also called the shadow eliminating layer, can be used for matching the refractive index between the conductive functional layer 4 and other layer structures, and further adjusts the refractive index of the water-oxygen barrier layer according to the actual production and use requirements. In one embodiment, the IM layer 3 may be an acrylic layer, and the thickness of the IM layer 3 is between 100nm and 250 nm.
The plating layer 41 is provided between the IM layer 3 and the ITO layer 42. Because IM layer 3 and ITO layer 42 are directly bonded, the bonding is not firm. The coating layer 41 is added between the IM layer 3 and the ITO layer 42, so that the bonding degree of the IM layer 3 and the ITO layer 42 can be improved. In one embodiment, the coating 41 is SiO 2 The thickness of the coating layer 41 is between 10nm and 25 nm.
In an embodiment, the substrate layer 1 may be a PET (polyethylene terephthalate) layer, a PC (polycarbonate) layer, a TAC (triacetyl cellulose) layer or a COP (cyclic olefin polymer) layer, and the thickness of the substrate layer 1 may be between 23 μm and 125 μm. The thickness of the base material layer 1 is not preferably too thick or too thin. Too thick may result in insufficient softness of the water-oxygen barrier conductive film, and too thin results in insufficient strength of the water-vapor barrier film.
In one embodiment, the first water-blocking and oxygen-blocking layer 2 may be a Si layer, siO layer 2 Layer or Si 3 N 4 A layer. The thickness of the first water-blocking oxygen-blocking layer 2 is between 200nm and 300 nm. In addition, the second water-and oxygen-blocking layer 5 can be a Si layer, a SiO layer 2 Layer or Si 3 N 4 A layer. The thickness of the second water-blocking oxygen-blocking layer 5 is between 200nm and 300 nm. A first water-blocking oxygen-blocking layer 2 and a second water-blocking oxygen-blocking layerThe thickness of the oxygen barrier layer 5 needs to be kept to be a proper thickness, so that the effect of blocking water and oxygen of the first water and oxygen barrier layer 2 and the second water and oxygen barrier layer 5 is poor due to the fact that the excessive thickness can affect the softness of the water and oxygen barrier conductive film.
Example 1
Substrate layer 1:25 μm, PET layer; first water-blocking oxygen-blocking layer 2:200nm, siO 2 A layer; IM layer 3:100nm; coating layer 41:10nm; ITO layer 42:18nm; second water-and oxygen-blocking layer 5:200nm, si layer.
Example 2
Substrate layer 1:125 μm, TAC layer; first water-blocking oxygen-blocking layer 2:300nm, si layer; IM layer 3:250nm; coating layer 41:25nm; ITO layer 42:75nm; second water-and oxygen-blocking layer 5:300nm, si 3 N 4 A layer.
Comparative example 1
Substrate layer 1:25 μm, PET layer; no first water-blocking oxygen-blocking layer 2; IM layer 3:120nm; coating layer 41:10nm; ITO layer 42:18nm; second water-and oxygen-blocking layer 5:200nm, si layer.
Comparative example 2
Substrate layer 1:25 μm, PC layer; first water-blocking oxygen-blocking layer 2:200nm, siO 2 A layer; IM layer 3:100nm; coating layer 41:25nm; ITO layer 42:18nm; there is no second water-and oxygen-blocking layer 5.
Comparative example 3
Substrate layer 1:125 μm, PET layer; first water-blocking oxygen-blocking layer 2:100nm, si layer; IM layer 3:100nm; coating layer 41:10nm; ITO layer 42:75nm, second water-and oxygen-blocking layer 5:100nm, siO 2 A layer.
Comparative example 4
Substrate layer 1:125 μm, TAC layer; first water-blocking oxygen-blocking layer 2:100nm, si 3 N 4 A layer; IM layer 3:250nm; coating layer 41:25nm; ITO layer 42:75nm, second water-and oxygen-blocking layer 5:300nm, siO 2 A layer.
Table 1 test parameters for the water and oxygen blocking properties of examples 1-2 and comparative examples 1-4
In summary, the first water-blocking and oxygen-blocking layer 2 and the second water-blocking and oxygen-blocking layer 5 are respectively disposed on two sides of the substrate layer 1, and the thickness of the first water-blocking and oxygen-blocking layer 2 and the thickness of the second water-blocking and oxygen-blocking layer 5 are controlled, so that the water-blocking and oxygen-blocking conductive film has better water-blocking and oxygen-blocking properties, and therefore, devices sensitive to water vapor and oxygen of the OLED can be effectively protected. Second, the provision of the ITO layer 42 can improve the conductivity of the water-oxygen barrier conductive film, increasing its applicability. In addition, the provision of the IM layer 3 can improve the refractive index matching of the water-oxygen barrier conductive film.
The foregoing descriptions of specific exemplary embodiments of the present utility model are presented for purposes of illustration and description. It is not intended to limit the utility model to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the utility model and its practical application to thereby enable one skilled in the art to make and utilize the utility model in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the utility model be defined by the claims and their equivalents.
Claims (10)
1. A water-oxygen barrier conductive film, comprising:
a substrate layer;
the first water-blocking and oxygen-blocking layer is arranged on one surface of the substrate layer;
the IM layer is arranged on one surface of the first water-blocking oxygen-blocking layer, which is far away from the substrate layer;
the conductive functional layer is arranged on one surface of the IM layer, which is far away from the first water-blocking and oxygen-blocking layer; and
the second water-blocking and oxygen-blocking layer is arranged on the other surface of the substrate layer.
2. The water-oxygen barrier conductive film according to claim 1, wherein the conductive functional layer comprises:
the coating layer is arranged on one surface of the IM layer, which is far away from the first water-blocking and oxygen-blocking layer; and
the ITO layer is arranged on one surface of the coating layer, which is far away from the IM layer, wherein the thickness of the ITO layer is between 18nm and 75 nm.
3. The water-oxygen barrier conductive film according to claim 2, wherein the plating layer is a SiO2 layer; and/or the thickness of the coating layer is between 10nm and 25 nm.
4. The water-oxygen barrier conductive film according to claim 1, wherein the base material layer is a PET layer, a PC layer, a TAC layer, or a COP layer.
5. The water-oxygen-barrier conductive film according to claim 1, wherein the thickness of the base material layer is between 23 μm and 125 μm.
6. The water-oxygen barrier conductive film according to claim 1, wherein the first water-oxygen barrier layer is a Si layer, siO 2 Layer or Si 3 N 4 A layer.
7. The water-oxygen barrier conductive film of claim 1, wherein the first water-blocking oxygen-blocking layer has a thickness between 200nm and 300 nm.
8. The water-oxygen barrier conductive film according to claim 1, wherein the IM layer is an acrylic resin layer; and/or the thickness of the IM layer is between 100nm and 250 nm.
9. The water-oxygen barrier conductive film according to claim 1, wherein the second water-oxygen barrier layer is a Si layer, siO 2 Layer or Si 3 N 4 A layer.
10. The water-oxygen barrier conductive film of claim 1, wherein the second water-blocking oxygen-blocking layer has a thickness between 200nm and 300 nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321802985.0U CN220390613U (en) | 2023-07-10 | 2023-07-10 | Water-oxygen barrier conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321802985.0U CN220390613U (en) | 2023-07-10 | 2023-07-10 | Water-oxygen barrier conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220390613U true CN220390613U (en) | 2024-01-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321802985.0U Active CN220390613U (en) | 2023-07-10 | 2023-07-10 | Water-oxygen barrier conductive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220390613U (en) |
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2023
- 2023-07-10 CN CN202321802985.0U patent/CN220390613U/en active Active
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