CN220382079U - Pressing plate of semiconductor packaging die bonder - Google Patents
Pressing plate of semiconductor packaging die bonder Download PDFInfo
- Publication number
- CN220382079U CN220382079U CN202322057376.3U CN202322057376U CN220382079U CN 220382079 U CN220382079 U CN 220382079U CN 202322057376 U CN202322057376 U CN 202322057376U CN 220382079 U CN220382079 U CN 220382079U
- Authority
- CN
- China
- Prior art keywords
- pressing plate
- frame
- pad
- rubber frame
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003825 pressing Methods 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 210000001503 joint Anatomy 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 4
- 210000000078 claw Anatomy 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004861 thermometry Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of semiconductor packaging and discloses a pressing plate of a semiconductor packaging die bonder, which comprises a butt joint plate, wherein mounting holes are formed in two sides of the surface of the butt joint plate, one side of the surface of the butt joint plate is fixedly connected with the pressing plate, a rubber frame is fixedly arranged on the surface of the pressing plate, a scanning groove is formed in the surface of the rubber frame, and a butt joint block is arranged on the bottom surface of the rubber frame. According to the utility model, the length of the pressing plate is increased, the side frames on the left side and the right side are removed, so that only the upper side and the lower side of the rubber frame on the pad are pressed by the pressing plate, the problem that the rubber frame of the Lead Frame (LF) is damaged by pressing is effectively solved, meanwhile, when the Lead Frame (LF) is not pulled in place (offset) by index finger pliers, the PR of the pad can still be searched due to the fact that the side frames on the left side and the right side are not blocked by the pad, and meanwhile, the width of the upper side frame of the pressing plate is properly reduced (namely, the upper side frame of the uppermost pad is close to the claw) so as to avoid touching the upper edge of the pressing plate in the claw moving process.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a pressing plate of a semiconductor packaging die bonder.
Background
A semiconductor refers to a material having conductivity between that of a conductor and an insulator at normal temperature. Semiconductors have wide applications in radios, televisions, and thermometry. Such as diodes, are devices fabricated using semiconductors. A semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is very great, both from a technological and an economic point of view. Most electronic products today, such as computers, mobile phones or digital recorders, have very close association with semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is one of the most influential in commercial applications among various semiconductor materials.
In the production process, if the Lead Frame (LF) is deformed, the pad at the deformation position is tilted to be separated from the track, so that the deformation area is caused to be adhesive-dispensed and the height of the upper sheet is changed, the production is abnormal, the material consumption is increased correspondingly because the deformation of the Lead Frame (LF) is difficult to avoid, the pressing plate is provided with four frames in the past, the size of the upper frame of the pressing plate is designed according to the size of the pad, the four edges of the pad adhesive frame are pressed by the pressing plate, the risk that the adhesive frame is crushed is increased, and improvement is needed.
Disclosure of Invention
The utility model aims to provide a pressing plate of a semiconductor packaging die bonder, which solves the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a semiconductor encapsulation glues brilliant machine clamp plate, includes the butt joint board, the mounting hole has been seted up to butt joint board surface both sides, and the mounting hole of seting up can install the clamp plate on external equipment, and the semiconductor encapsulates the operation, butt joint board surface one side fixedly connected with clamp plate, clamp plate surface fixed mounting has gluey frame, the scanning groove has been seted up on gluey frame surface, gluey frame bottom surface is provided with the butt joint piece.
Preferably, the two sides of the surface of the rubber frame are rotatably sleeved with bearings, and the outer surfaces of the bearings are fixedly sleeved with rollers.
Preferably, the plastic frame is provided with five groups, the five groups of plastic frames are uniformly distributed on two sides of the surface of the pressing plate, the plastic frame is in a cuboid shape, the size of the frame of the pressing plate is designed according to the size of the pad, the deformed Lead Frame (LF) can be effectively flattened after the pressing plate is arranged, each pad is ensured to be capable of being attached to a track in the production process, and therefore, the height of dispensing and feeding cannot be greatly changed, and abnormal occurrence is avoided.
Preferably, a through hole is formed in one side of the surface of the rubber frame, the inside of the through hole is correspondingly sleeved with the position of the bearing, the length of the pressing plate is increased, meanwhile, the side frames on the left side and the right side are removed, the rubber frame on the pad is pressed by the pressing plate, the problem that the rubber frame of the Lead Frame (LF) is damaged by pressing is effectively solved, meanwhile, when the Lead Frame (LF) is not pulled in place (offset) by the index finger pliers, the PR of the pad can still be searched due to the fact that the PR of the pad is not blocked by the side frames on the left side and the right side, meanwhile, the width of the upper side frame of the pressing plate is properly reduced (namely, the upper side frame of the uppermost pad is close to the direction of the claw), and the upper edge of the pressing plate is prevented from being touched in the moving process of the claw.
Preferably, the gyro wheel rotates in clamp plate surface both sides through the bearing that sets up, and the gyro wheel of setting can effectively let the clamp plate normally slide on lead frame surface, avoids appearing the phenomenon of jamming, also can carry out dismouting to the gyro wheel of equidimension not equidimension simultaneously and change, reply different grade lead frame, convenient operation is simple.
The utility model provides a pressing plate of a semiconductor packaging die bonder, which has the following beneficial effects:
(1) According to the utility model, through the design of the size of the frame of the pressing plate according to the size of the pad, the deformed Lead Frame (LF) can be effectively flattened after the pressing plate is arranged, each pad is ensured to be capable of being adhered to a track in the production process, so that the heights of the dispensing and the feeding cannot be greatly changed, and the occurrence of abnormality is avoided.
(2) According to the utility model, the length of the pressing plate is increased, the side frames on the left side and the right side are removed, so that only the upper side and the lower side of the rubber frame on the pad are pressed by the pressing plate, the problem that the rubber frame of the Lead Frame (LF) is damaged by pressing is effectively solved, meanwhile, when the Lead Frame (LF) is not pulled in place (offset) by index finger pliers, the left side and the right side are not provided with side frames, the pad cannot be blocked, so that PR of the pad can still be searched, meanwhile, the width of the upper side frame of the pressing plate is properly reduced (namely, the upper side frame of the uppermost pad is close to the claw) so as to avoid touching the upper edge of the pressing plate in the claw moving process, the risk of the pressing plate on the side frame of the Lead Frame (LF) is effectively reduced, and the PR searching rate of the pad by the system is improved.
(3) The roller wheels can effectively enable the pressing plate to normally slide on the surface of the lead frame, so that the phenomenon of shell clamping is avoided, meanwhile, the rollers with different sizes can be disassembled, assembled and replaced, and the lead frame is convenient and simple to operate.
Drawings
FIG. 1 is a schematic surface view of a front overall structure of the present utility model;
FIG. 2 is a schematic surface view of a connection structure of a rubber frame and a butt joint block on the side face of the utility model;
FIG. 3 is a schematic surface view of a side bearing and roller connection structure according to the present utility model.
In the figure: 1. an abutting plate; 2. a mounting hole; 3. a pressing plate; 4. a rubber frame; 5. a scanning groove; 6. a butt joint block; 7. a bearing; 8. and a roller.
Detailed Description
The utility model provides the following technical scheme:
as shown in fig. 1-3, the pressing plate of the semiconductor packaging die bonder comprises a butt plate 1, mounting holes 2 are formed in two sides of the surface of the butt plate 1, the formed mounting holes 2 can mount the pressing plate 3 on external equipment to perform packaging operation on semiconductors, one side of the surface of the butt plate 1 is fixedly connected with the pressing plate 3, a rubber frame 4 is fixedly mounted on the surface of the pressing plate 3, five groups of the rubber frames 4 are uniformly distributed on two sides of the surface of the pressing plate 3, the five groups of the rubber frames 4 are cuboid, scanning grooves 5 are formed in the surface of the rubber frame 4, through holes are formed in one side of the surface of the rubber frame 4, the positions of the through holes correspond to those of bearings 7 in a sleeved mode, butt blocks 6 are arranged on the bottom surface of the rubber frame 4, and the butt blocks 6 can correspond to the positions of the surfaces of lead frames.
The two sides of the surface of the rubber frame 4 are rotatably sleeved with bearings 7, the outer surface of each bearing 7 is fixedly sleeved with a roller 8, and the rollers 8 rotate on the two sides of the surface of the pressing plate 3 through the arranged bearings 7.
According to the utility model, when the pressure plate 3 is used, the size of the frame of the pressure plate 3 is designed according to the size of the pad, the deformed Lead Frame (LF) can be effectively flattened after the pressure plate 3 is arranged, each pad can be ensured to be still searched in the production process, so that the upper frame width of the pressure plate 3 is properly reduced (namely, the upper frame of the uppermost pad is close to the direction of a claw) to avoid the occurrence of abnormal changes, the length of the pressure plate 3 is increased, the frames on the left side and the right side are removed, the rubber frame 4 on the pad is only pressed by the pressure plate 3, the problem that the Lead Frame (LF) is damaged by pressure is effectively solved, meanwhile, when the Lead Frame (LF) is not pulled in place (offset) by index finger pliers, the PR of the lead frame can be still searched by the left side and the right side, the PR of the upper frame of the pressure plate 3 is properly reduced (namely, the upper frame of the uppermost pad is close to the direction of the claw) to avoid the upper edge of the pressure plate 3 in the moving process, the roller 8 is arranged to effectively enable the pressure plate 3 to slide on the surface of the lead frame, the lead frame is prevented from being damaged by the roller 8, the different sizes of the lead frame can be easily replaced, the pressure plate is easy to replace the Lead Frame (LF), and the risk of the pressure plate is reduced.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Claims (5)
1. The pressing plate of the semiconductor packaging die bonder comprises an abutting plate (1), and is characterized in that: mounting holes (2) are formed in two sides of the surface of the butt joint plate (1), a pressing plate (3) is fixedly connected to one side of the surface of the butt joint plate (1), a rubber frame (4) is fixedly mounted on the surface of the pressing plate (3), a scanning groove (5) is formed in the surface of the rubber frame (4), and a butt joint block (6) is arranged on the bottom surface of the rubber frame (4).
2. The semiconductor package die bonder platen of claim 1, wherein: the two sides of the surface of the rubber frame (4) are rotatably sleeved with bearings (7), and the outer surfaces of the bearings (7) are fixedly sleeved with rollers (8).
3. The semiconductor package die bonder platen of claim 1, wherein: the glue frame (4) is provided with five groups in total, the five groups of glue frames (4) are uniformly distributed on two sides of the surface of the pressing plate (3), and the five groups of glue frames (4) are cuboid.
4. The semiconductor package die bonder platen of claim 1, wherein: and a through hole is formed in one side of the surface of the rubber frame (4), and the inside of the through hole is correspondingly sleeved with the position of the bearing (7).
5. The semiconductor package die bonder platen as recited in claim 2, wherein: the roller (8) rotates on two sides of the surface of the pressing plate (3) through the arranged bearings (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322057376.3U CN220382079U (en) | 2023-08-02 | 2023-08-02 | Pressing plate of semiconductor packaging die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322057376.3U CN220382079U (en) | 2023-08-02 | 2023-08-02 | Pressing plate of semiconductor packaging die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220382079U true CN220382079U (en) | 2024-01-23 |
Family
ID=89567039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322057376.3U Active CN220382079U (en) | 2023-08-02 | 2023-08-02 | Pressing plate of semiconductor packaging die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220382079U (en) |
-
2023
- 2023-08-02 CN CN202322057376.3U patent/CN220382079U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |