CN220382001U - Temperature switch and wide-range temperature automatic compensation device - Google Patents
Temperature switch and wide-range temperature automatic compensation device Download PDFInfo
- Publication number
- CN220382001U CN220382001U CN202322032327.4U CN202322032327U CN220382001U CN 220382001 U CN220382001 U CN 220382001U CN 202322032327 U CN202322032327 U CN 202322032327U CN 220382001 U CN220382001 U CN 220382001U
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- temperature switch
- switch
- wiring terminal
- moving contact
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- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 238000005057 refrigeration Methods 0.000 abstract description 22
- 238000010276 construction Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 14
- 230000003993 interaction Effects 0.000 description 8
- 230000007613 environmental effect Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Control Of Temperature (AREA)
Abstract
The utility model provides a temperature switch and a wide-range temperature automatic compensation device, wherein the wide-range temperature automatic compensation device comprises at least 2 temperature switches, a semiconductor refrigeration device and a power supply, wherein the temperature switches are respectively a first temperature switch and a second temperature switch, a first wiring terminal of the first temperature switch is connected with a negative electrode of the power supply, a second wiring terminal of the first temperature switch is connected with a positive electrode of the power supply, and a third wiring terminal of the first temperature switch is connected with a power line at one end of the semiconductor refrigeration device; the first binding post of second temperature switch is connected with the positive pole of power, and the second binding post of second temperature switch is connected with the negative pole of power, and the third binding post of second temperature switch is connected with the power cord of semiconductor refrigerating plant other end. The utility model has single external energy demand type, no need of various connection construction, no vibration, no noise, long service life and easy installation during working.
Description
Technical Field
The utility model relates to the technical field of electrical design, in particular to a temperature switch and a wide-range temperature automatic compensation device.
Background
The mobility of the ship causes wider requirements on the normal working temperature of equipment arranged in the open space of the ship, for example, the working temperature range of outdoor equipment is definitely required to be between-28 ℃ and 65 ℃ in the design of a ship of a certain model, the normal working range of electronic equipment is typically between-10 ℃ and 45 ℃, and if related electronic equipment works outdoors, a temperature compensation device is additionally arranged for the electronic equipment working outdoors, so that the electronic equipment can work normally between-28 ℃ and 65 ℃.
The temperature compensation mode is many, but for the man-machine interaction all-in-one machine arranged in the open air environment, the compensation device cannot occupy excessive space and cannot have excessive connection construction in the installation process of the compensation device because the compensation device needs to be installed in a wall-mounted mode. In addition, the temperature compensation device should have two working modes of refrigeration and heating, and work in a heating mode (increasing the ambient temperature) when the working ambient temperature is too low, and work in a refrigerating mode (reducing the ambient temperature) when the working ambient temperature is too high, and the volume and the weight of the temperature compensation device cannot be too large, and higher reliability is also required.
Disclosure of Invention
The utility model aims to solve the technical problems that when the environmental temperature of electronic equipment working outdoors is too low, the working environment is heated, and the environmental temperature is increased; and simultaneously, the temperature switch and the wide-range temperature automatic compensation device are provided for solving the problems.
The object of the utility model is achieved in the following way:
the temperature switch comprises a first wiring terminal 1, a second wiring terminal 2 and a third wiring terminal 3, wherein one end of the first wiring terminal 1 is connected with a first moving contact 4, one end of the second wiring terminal 2 is connected with a second moving contact 5, and the third wiring terminal 3 is respectively connected with a fixed contact 6 which is respectively connected with the first moving contact 4 and the second moving contact 5; the first moving contact 4 and the second moving contact 5 are respectively provided with a metal sheet, the thermal expansion coefficients of the two metal sheets are different, and the first moving contact 4 and the second moving contact 5 are contacted with or separated from the fixed contact 6 under the triggering of the deformation stress of the bimetallic strip.
The jump temperature range of the metal sheet on the first movable contact is not overlapped with the jump temperature range of the metal sheet on the second movable contact.
The wide-range automatic temperature compensation device comprises at least 2 temperature switches, a semiconductor refrigeration device and a power supply, wherein the temperature switches are respectively a first temperature switch and a second temperature switch, a first wiring terminal of the first temperature switch is connected with a negative electrode of the power supply, a second wiring terminal of the first temperature switch is connected with a positive electrode of the power supply, and a third wiring terminal of the first temperature switch is connected with a power line at one end of the semiconductor refrigeration device; the first binding post of second temperature switch is connected with the positive pole of power, and the second binding post of second temperature switch is connected with the negative pole of power, and the third binding post of second temperature switch is connected with the power cord of semiconductor refrigerating plant other end.
The utility model has the beneficial effects that: compared with the prior art, the external energy input is electric energy, and the external energy input is consistent with the energy requirement of the man-machine interaction integrated machine (both are electric energy), so that the type of the external energy requirement is single, and various construction is not needed (for example, a compressor is added or a refrigerant water pipeline is added). By adopting the semiconductor refrigeration technology, the semiconductor refrigeration sheet can realize refrigeration or heating on the same refrigeration sheet by changing the polarity of the input direct current, so that the number of devices of the temperature compensation device is reduced (the heating component and the refrigeration component are integrated). The device can continuously work, has no vibration, noise and long service life during working, is easy to install, can be processed into various shapes, and can be even installed on the surface of compensation equipment. The semiconductor refrigerating sheet has a large temperature difference range from +90 ℃ to-130 ℃ and is suitable for the operation requirement of ships in multi-latitude areas. The utility model avoids the traditional control mode of adopting a temperature sensor, a singlechip and a relay, adopts the traditional mechanical temperature switch, and improves the action reliability while reducing the cost.
Drawings
Fig. 1 is a schematic diagram of a temperature switch according to the present utility model.
Fig. 2 is an electrical schematic diagram of the automatic temperature compensating apparatus of the present utility model.
Fig. 3 is a schematic diagram 1 (high temperature operation type switch operation, refrigeration) of the temperature compensation device of the present utility model.
Fig. 4 is a schematic diagram of a temperature compensation device according to the present utility model 2 (low temperature operation type switch operation, heating).
Detailed Description
The utility model will be described in further detail with reference to the drawings and the detailed description.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
As shown in fig. 1, the temperature switch comprises a first wiring terminal 1, a second wiring terminal 2 and a third wiring terminal 3, wherein one end of the first wiring terminal 1 is connected with a first moving contact 4, one end of the second wiring terminal 2 is connected with a second moving contact 5, and the third wiring terminal 3 is respectively connected with a fixed contact 6 respectively connected with the first moving contact and the second moving contact; the first moving contact 4 and the second moving contact 5 are respectively provided with a metal sheet, the thermal expansion coefficients of the two metal sheets are different, and the first moving contact 4 and the second moving contact 5 are contacted with or separated from the fixed contact 6 under the triggering of stress generated by the deformation of the bimetallic strip.
The jump temperature range of the metal sheet on the first movable contact 4 is the temperature range of the beginning and ending of the expected refrigeration, and the jump temperature range of the metal sheet on the second movable contact is as follows: a temperature range in which heating starts and ends is desired. Since the device should not be cooled or heated simultaneously in the working scene, the temperature at which the cooling is expected to end should be less than the temperature at which the heating is expected to start.
The first moving contact 4 and the second moving contact 5 are realized in principle: in addition to the above-mentioned temperature switch implemented using the principle of different thermal expansion rates based on different metals at the same temperature, it may also be implemented using a pressure change or a phase change based on gas at different temperatures, or two moving contacts are implemented using different principles, respectively.
The wide-range automatic temperature compensation device comprises 2 temperature switches, a semiconductor refrigeration device and a power supply, wherein the number of the temperature switches is 2, the first temperature switches and the second temperature switches are respectively, a first wiring terminal 1 of the first temperature switch is connected with the negative electrode of the power supply, a second wiring terminal 2 of the first temperature switch is connected with the positive electrode of the power supply, and a third wiring terminal 3 of the first temperature switch is connected with a power line at one end of the semiconductor refrigeration device; the first wiring terminal 1 of the second temperature switch is connected with the positive electrode of the power supply, the second wiring terminal 2 of the second temperature switch is connected with the negative electrode of the power supply, and the third wiring terminal 3 of the second temperature switch is connected with the power line at the other end of the semiconductor refrigerating device.
The working principle of the utility model is as follows: the semiconductor refrigeration device is arranged on the surface of the electronic equipment needing temperature compensation, and when the environmental temperature is too low, the working environment is heated, so that the environmental temperature is increased; and simultaneously, the refrigerator is used for refrigerating when the ambient temperature is too high, so that the ambient temperature is reduced. The first temperature switch and the second temperature switch are connected between the power supply and the semiconductor refrigerating device to realize the inversion of the current polarity of the semiconductor refrigerating sheet flowing into the semiconductor refrigerating device, and the first temperature switch and the second temperature switch have the same structure; the second moving contacts of the first temperature switch and the second temperature switch are provided with metal sheets which act at low temperature, so that the second moving contacts of the first temperature switch and the second temperature switch are respectively contacted with the fixed contacts at low temperature, the semiconductor refrigerating sheet is in a heating state, and the temperature compensation of the electronic equipment needing temperature compensation is finally completed through heat transfer.
Referring to fig. 2, the implementation process of the present utility model will be described by taking the design of an outdoor temperature automatic compensation device of a man-machine interaction integrated machine as an example.
The first moving contact is used for realizing the circuit on operation in the automatic temperature compensation device when the temperature is higher than a specific temperature, and is used for disconnecting and resetting when the temperature is lower than a specific value, and finally setting the circuit on operation according to the normal working temperature and the environmental temperature of the integrated machine in combination with related environmental adaptability experiments: the semiconductor cold piece is in a refrigerating state when the temperature is conducted at 46 ℃ or higher and the temperature is disconnected at 40 ℃ or lower, as shown in figure 3; the second moving contact is used for realizing the circuit on operation in the automatic temperature compensation device when the temperature is lower than a specific value, and is disconnected and reset when the temperature is higher than the specific value, and finally set as follows according to the normal working temperature and the environmental temperature requirement of the integrated machine in combination with related experiments: the semiconductor cold sheet is in a heating state when the temperature is conducted at the temperature of less than or equal to-12 ℃ and the temperature is disconnected at the temperature of more than or equal to-6 ℃, as shown in figure 4.
To sum up, the working temperature interval of the two contacts is defined as: the temperature is lower than-12 ℃, the second moving contacts of the first temperature switch and the second temperature switch are conducted, the first moving contact is disconnected, and the circuit is in a heating state; at the temperature of minus 12 ℃ to minus 6 ℃, the second moving contacts of the first temperature switch and the second temperature switch are conducted, and the circuit is in a heating state; at the temperature of minus 6 ℃ to 40 ℃, the first temperature switch and the second temperature switch are disconnected, the first moving contact is disconnected, and the circuit is in a breaking failure state; at 40-46 ℃, the second moving contacts of the first temperature switch and the second temperature switch are disconnected, the first moving contacts of the first temperature switch and the second temperature switch are conducted, and the circuit is in a refrigerating state; the second contact is opened at the temperature of more than 46 ℃, the first moving contact of the first temperature switch and the second temperature switch is conducted, and the circuit is in a refrigerating state.
In the process of temperature switch parameter selection and tuning, the following points need to be noted:
firstly, verifying the reset and action temperature of a temperature switch according to the thermal load of the environment to be compensated, and if the temperature difference between the reset and action is too small, frequent action of the temperature switch can be caused to influence the service life of the switch;
secondly, considering possible condensation phenomenon, the trigger and reset temperatures of the low-temperature switch should be lower than 0 ℃;
finally, the working temperature range of the first moving contact and the working temperature range of the second moving contact cannot be overlapped, otherwise, connection errors of the two temperature switches occur, at the moment, the power supply part of the power supply is in an open circuit state, and the semiconductor refrigeration device is in a short circuit state, so that the function of the device is invalid.
The utility model utilizes the semiconductor refrigeration technology to refrigerate or heat the environment through the Peltier effect. Because the semiconductor refrigerating sheet (hereinafter referred to as a refrigerating sheet) utilizing the Peltier effect can realize the refrigerating or heating function on the refrigerating sheet by changing the polarity of direct current flowing through the refrigerating sheet, the man-machine interaction integrated machine needing to be protected can be placed in a closed protecting device, the refrigerating sheet is installed in the protecting device or fixed on a heat conducting shell of the man-machine interaction integrated machine, and the temperature compensation of the man-machine interaction integrated machine is finally completed through the heat transfer between the semiconductor refrigerating sheet and the heat conducting shell of the man-machine interaction integrated machine.
The utility model has the following advantages:
1. in the control mode, the external energy input is electric energy, and the energy requirements of the control mode are consistent with those of the human-computer interaction integrated machine (the electric energy is the same), so that the type of the external energy requirements is single, and various construction is not needed (for example, a compressor is added or a refrigerant water pipeline is added);
2. the semiconductor refrigeration technology is sampled, the semiconductor refrigeration sheet can realize refrigeration or heating on the same refrigeration sheet by changing the polarity of the input direct current, and the number of devices of the temperature compensation device is reduced (the heating component and the refrigeration component are integrated);
3. the device can continuously work, has no vibration, noise and long service life during working, is easy to install, can be processed into various shapes, and can be even installed on the surface of compensation equipment;
4. the temperature difference range of the semiconductor refrigerating sheet is large, and the semiconductor refrigerating sheet can be realized from +90 ℃ to-130 ℃, so that the semiconductor refrigerating sheet is suitable for the operation requirement of ships in multi-latitude areas;
5. the scheme avoids the control mode of adopting a temperature sensor, a singlechip and a relay in the prior art, adopts a traditional mechanical temperature switch, and improves the action reliability while reducing the cost.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that it will be apparent to those skilled in the art that several changes and modifications can be made without departing from the general inventive concept, and these should also be regarded as the scope of the utility model.
Claims (3)
1. A temperature switch, characterized in that: the temperature switch comprises a first wiring terminal (1), a second wiring terminal (2) and a third wiring terminal (3), wherein one end of the first wiring terminal (1) is connected with a first moving contact (4), one end of the second wiring terminal (2) is connected with a second moving contact (5), and the third wiring terminal (3) is respectively connected with a fixed contact (6) which is respectively connected with the first moving contact (4) and the second moving contact (5); the first moving contact (4) and the second moving contact (5) are respectively provided with a metal sheet, the thermal expansion coefficients of the two metal sheets are different, and the first moving contact (4) and the second moving contact (5) are contacted with or separated from the fixed contact (6) under the triggering of the deformation stress of the bimetallic strip.
2. A temperature switch as claimed in claim 1, wherein: the jump temperature range of the metal sheet on the first movable contact is not overlapped with the jump temperature range of the metal sheet on the second movable contact.
3. An automatic wide-range temperature compensation device is characterized in that: the semiconductor refrigerator comprises at least 2 temperature switches, a semiconductor refrigerator and a power supply, wherein the temperature switches are respectively a first temperature switch and a second temperature switch, a first connecting terminal of the first temperature switch is connected with a negative electrode of the power supply, a second connecting terminal of the first temperature switch is connected with a positive electrode of the power supply, and a third connecting terminal of the first temperature switch is connected with a power line at one end of the semiconductor refrigerator; the first binding post of second temperature switch is connected with the positive pole of power, and the second binding post of second temperature switch is connected with the negative pole of power, and the third binding post of second temperature switch is connected with the power cord of semiconductor refrigerating plant other end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322032327.4U CN220382001U (en) | 2023-07-31 | 2023-07-31 | Temperature switch and wide-range temperature automatic compensation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322032327.4U CN220382001U (en) | 2023-07-31 | 2023-07-31 | Temperature switch and wide-range temperature automatic compensation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220382001U true CN220382001U (en) | 2024-01-23 |
Family
ID=89573078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322032327.4U Active CN220382001U (en) | 2023-07-31 | 2023-07-31 | Temperature switch and wide-range temperature automatic compensation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220382001U (en) |
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2023
- 2023-07-31 CN CN202322032327.4U patent/CN220382001U/en active Active
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