CN220376232U - Lifting device for be used for SiC high temperature equipment - Google Patents
Lifting device for be used for SiC high temperature equipment Download PDFInfo
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- CN220376232U CN220376232U CN202321954472.1U CN202321954472U CN220376232U CN 220376232 U CN220376232 U CN 220376232U CN 202321954472 U CN202321954472 U CN 202321954472U CN 220376232 U CN220376232 U CN 220376232U
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- 230000007246 mechanism Effects 0.000 claims abstract description 106
- 230000005540 biological transmission Effects 0.000 claims abstract description 57
- 235000012431 wafers Nutrition 0.000 claims abstract description 16
- 238000006073 displacement reaction Methods 0.000 claims abstract description 12
- 239000003638 chemical reducing agent Substances 0.000 claims description 19
- 230000001360 synchronised effect Effects 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 8
- 229910018540 Si C Inorganic materials 0.000 description 17
- 230000006872 improvement Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a lifting device for SiC high-temperature equipment, which comprises: the device comprises a driving mechanism, a supporting flat plate, a transmission mechanism, a horizontal adjusting mechanism, a limiting mechanism, a lifting assembly and a bearing plate for loading wafers; the driving mechanism and the transmission mechanism are both arranged on the supporting flat plate, the driving mechanism is connected with the transmission mechanism, two sides of the bearing plate are connected with the supporting flat plate through the lifting assembly, and the transmission mechanism drives the lifting assembly to lift reciprocally under the driving of the driving mechanism, so that the bearing plate can lift reciprocally; the horizontal adjusting mechanisms are positioned at two sides of the supporting flat plate and are used for adjusting the levelness of the supporting flat plate; and the limiting mechanism is respectively arranged on the supporting flat plate and the lifting assembly and used for limiting the lifting displacement of the bearing plate. The utility model has the advantages of compact structure, stable operation and high repeated positioning precision, solves the problems of low wafer transmission efficiency and pollution caused by friction in a hearth in the operation process due to low positioning precision of the lifting device, and realizes high-quality wafer transmission.
Description
Technical Field
The utility model belongs to the technical field of semiconductor process equipment, and particularly relates to a lifting device for SiC high-temperature equipment.
Background
At present, the SiC high-temperature equipment mainly comprises a SiC high-temperature annealing furnace and a SiC high-temperature oxidation furnace, and the process implementation mode mainly adopts a lifting device to send a bearing table carrying wafers into a hearth for high-temperature treatment, a flange is arranged at the bottom of the lifting device to seal a furnace mouth, and the process treatment mode for realizing wafer feeding and discharging through vertical lifting motion is generally called as a vertical structure. In order to meet the requirements of the sealing performance and the temperature uniformity of the hearth, the size design of the hearth and the bearing table is compact, so that the positioning precision and the repeated positioning precision of the lifting device are required to be high. Meanwhile, in order to ensure that the wafer stably ascends and descends in the hearth, the running speed and the buffering performance of the elevating device are particularly required.
Compared with SiC high-temperature equipment, the existing vertical semiconductor equipment is generally low in process treatment temperature, low in equipment sealing requirement, and low in repeated positioning accuracy, and is not compact in structure, and easy to produce friction in the operation process to cause pollution. It can be seen that the existing lifting device is difficult to meet the production requirements of Si C high-temperature equipment.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the lifting device for the SiC high-temperature equipment, which has the advantages of compact structure, simple operation, high positioning precision and stable operation.
In order to solve the technical problems, the utility model adopts the following technical scheme:
a lifting device for SiC high temperature equipment, comprising: the device comprises a driving mechanism, a supporting flat plate, a transmission mechanism, a horizontal adjusting mechanism, a limiting mechanism, a lifting assembly and a bearing plate for loading wafers; the driving mechanism and the transmission mechanism are both arranged on the supporting flat plate, the output end of the driving mechanism is connected with the transmission mechanism, two sides of the bearing plate are respectively connected with the supporting flat plate through the lifting assembly, and the transmission mechanism drives the lifting assembly to lift reciprocally under the driving of the driving mechanism so as to realize the lifting reciprocally of the bearing plate; the horizontal adjusting mechanisms are positioned at two sides of the supporting flat plate and used for adjusting the levelness of the supporting flat plate, and are connected with Si C high-temperature equipment; and the limiting mechanisms are respectively arranged on the supporting flat plate and the lifting assembly and are used for limiting the lifting displacement of the bearing plate.
As a further improvement of the utility model, the lifting assembly comprises a ball screw and a guide rail; one end of the ball screw is connected with the transmission mechanism, the other end of the ball screw is connected with the guide rail, and the guide rail is connected with the bearing plate; the driving mechanism drives the transmission mechanism, so that the ball screw operates to realize lifting of the bearing plate.
As a further improvement of the utility model, the guide rail is provided with a linear bearing, and the limiting mechanism is arranged at the side part of the linear bearing.
As a further improvement of the present utility model, the driving mechanism includes: the motor, speed reducer and motor mounting panel, the output and the speed reducer of motor are connected, and the speed reducer passes to support dull and stereotyped and drive mechanism to be connected, and the motor mounting panel sets up in supporting dull and stereotyped bottom for realize motor and speed reducer installation and fix in supporting dull and stereotyped bottom.
As a further improvement of the utility model, the driving mechanism further comprises an adjusting plate, wherein the adjusting plate is arranged at the bottom of the supporting flat plate, and a bolt component for adjusting the position of the motor mounting plate is arranged on the adjusting plate.
As a further improvement of the present utility model, the transmission mechanism includes: the device comprises a driving belt wheel, a first driving belt wheel, a second driving belt wheel, a synchronous belt, a first tensioning wheel and a second tensioning wheel; the driving belt wheel is in transmission connection with an output shaft of the speed reducer, and the first driving belt wheel and the second driving belt wheel are respectively connected with the ball screw; the driving belt wheel, the second tensioning wheel, the first driving belt wheel, the second driving belt wheel and the first tensioning wheel are in transmission connection through a synchronous belt.
As a further improvement of the utility model, the inner side of the synchronous belt is fixedly provided with belt teeth, and the excircles of the driving belt wheel, the first driving belt wheel and the second driving belt wheel are meshed with the belt teeth.
As a further improvement of the present utility model, the level adjustment mechanism includes: the fixed bottom plate is arranged on the Si C high-temperature equipment to realize that the lifting device is connected with the Si C high-temperature equipment, the adjusting cushion block is arranged on the fixed bottom plate, and the supporting flat plate is arranged on the adjusting cushion block.
As a further improvement of the utility model, the horizontal adjusting mechanism further comprises a first adjusting block and a second adjusting block; the first adjusting block is arranged on the fixed bottom plate and is used for adjusting the position of the adjusting cushion block through thread transmission; the second adjusting block is connected with the supporting flat plate, and the position of the adjusting cushion block is adjusted through threaded transmission.
As a further improvement of the utility model, the limiting mechanism comprises a limiting base, a limiting block and a limiting sensor; the limiting base is respectively arranged at the bottom of the supporting flat plate and the linear bearing; the limiting block is arranged at the top of the guide rail and is close to the nut seat of the ball screw and used for limiting the descending displacement of the ball screw; and the limiting base is provided with a limiting sensor for detecting the lifting displacement of the bearing plate.
Compared with the prior art, the utility model has the advantages that:
according to the lifting device for the Si C high-temperature equipment, the driving mechanism and the transmission mechanism are arranged on the supporting flat plate, one end of the lifting assembly is connected with the supporting flat plate and is in transmission connection with the transmission mechanism, the other end of the lifting assembly is connected with the bearing plate for loading the wafer, the two sides of the bearing plate are connected with the lifting assembly so as to uniformly support the gravity of the bearing plate, and the transmission mechanism transmits the driving force to the lifting assembly under the driving of the driving mechanism, so that the bearing plate is driven to lift in a reciprocating manner, and the stable transmission of the wafer is realized; meanwhile, the horizontal adjusting mechanisms are arranged on the two sides of the supporting flat plate and are connected with the Si C high-temperature equipment, and the relative positions between the supporting flat plate and the Si C high-temperature equipment are adjusted by the horizontal adjusting mechanisms, so that the supporting flat plate and the Si C high-temperature equipment are highly aligned, the repeated positioning accuracy of the bearing plate is improved, and the requirement on the machining precision of parts is reduced; further, through setting up stop gear respectively on supporting dull and stereotyped and lifting unit, utilize stop gear to carry out accurate accuse to the lift displacement of loading board, improved the stability that the loading board removed, avoided the loading board to appear the phenomenon of slope in the lift in-process, solved because elevating gear lacks stability and lead to the wafer to convey the problem that gets into Si C high temperature equipment's position emergence skew.
Drawings
Fig. 1 is a schematic structural diagram of a lifting device for a Si C high temperature apparatus according to the present utility model.
Fig. 2 is a schematic structural diagram of a driving mechanism in the present utility model.
Fig. 3 is a schematic diagram of the structural principle of the transmission mechanism in the utility model.
Fig. 4 is a schematic structural diagram of a horizontal adjusting mechanism in the present utility model.
Fig. 5 is a schematic structural diagram of a limiting mechanism in the present utility model.
Legend description: 1. a driving mechanism; 2. a support plate; 3. a transmission mechanism; 4. a ball screw; 5. a horizontal adjustment mechanism; 6. a linear bearing; 7. a limiting mechanism; 8. a carrying plate; 9. a guide rail; 101. a motor; 102. a speed reducer; 103. a motor mounting plate; 104. an adjusting plate; 301. a driving belt wheel; 302. a first drive pulley; 303. a second transmission pulley; 304. a synchronous belt; 305. a first tensioning wheel; 306. a second tensioning wheel; 501. a fixed bottom plate; 502. adjusting the cushion block; 503. a first adjustment block; 504. a second adjustment block; 701. a limit base; 702. a limiting block; 703. and a limit sensor.
Detailed Description
The utility model is further described below in connection with the drawings and the specific preferred embodiments, but the scope of protection of the utility model is not limited thereby.
Examples
As shown in fig. 1 to 5, the lifting device for the S i C high temperature apparatus of the present utility model includes: the wafer loading device comprises a driving mechanism 1, a supporting flat plate 2, a transmission mechanism 3, a horizontal adjusting mechanism 5, a limiting mechanism 7, a lifting assembly and a bearing plate 8 for loading wafers. The driving mechanism 1 and the transmission mechanism 3 are both arranged on the support flat plate 2, the output end of the driving mechanism 1 is connected with the transmission mechanism 3, and two sides of the bearing plate 8 are respectively connected with the support flat plate 2 through lifting components so as to stably support the gravity of the bearing plate 8. Under the drive of the driving mechanism 1, the transmission mechanism 3 drives the lifting assembly to linearly reciprocate so as to realize the reciprocating lifting of the bearing plate 8. The horizontal adjusting mechanisms 5 are positioned at two sides of the support flat plate 2 and are used for adjusting the levelness of the support flat plate 2; and the horizontal adjusting mechanism 5 is connected with Si C high-temperature equipment to realize the connection of the lifting device and the Si C high-temperature equipment. The limiting mechanism 7 is respectively arranged on the supporting flat plate 2 and the lifting assembly and is used for limiting the lifting displacement of the bearing plate 8.
In this embodiment, the lifting assembly comprises a ball screw 4 and a guide rail 9. One end of the ball screw 4 is connected with the transmission mechanism 3, the other end of the ball screw 4 is connected with the guide rail 9 through a screw nut, and the guide rail 9 is connected with the bearing plate 8. The driving mechanism 1 drives the transmission mechanism 3, so that the ball screw 4 runs, the guide rail 9 correspondingly stretches and contracts, and the bearing plate 8 is lifted.
As shown in fig. 1, in this embodiment, the guide rail 9 is provided with a linear bearing 6, and the limit mechanism 7 is mounted on the side of the linear bearing 6. The linear bearing 6 is used for assisting, so that the stability of the telescopic movement of the guide rail 9 is improved.
As shown in fig. 2, in the present embodiment, the driving mechanism 1 includes: a motor 101, a speed reducer 102, and a motor mounting plate 103. The output end of the motor 101 is connected with a speed reducer 102, the speed reducer 102 penetrates through the supporting flat plate 2 to be connected with the transmission mechanism 3, and a motor mounting plate 103 is arranged at the bottom of the supporting flat plate 2 and used for realizing that the motor 101 and the speed reducer 102 are fixedly mounted at the bottom of the supporting flat plate 2. Specifically, the motor 101 may employ a servo motor to stably output the driving force.
Further, the driving mechanism 1 further comprises an adjusting plate 104 arranged at the bottom of the supporting flat plate 2, and a bolt assembly for adjusting the position of the motor mounting plate 103 is arranged on the adjusting plate 104. By adjusting the position of the motor mounting plate 103, the connection position of the speed reducer 102 and the transmission mechanism 3 is adjusted to improve the efficiency of driving force transmission.
As shown in fig. 3, in the present embodiment, the transmission mechanism 3 includes: a drive pulley 301, a first drive pulley 302, a second drive pulley 303, a timing belt 304, a first tension pulley 305 and a second tension pulley 306. The drive pulley 301 is in transmission connection with the output shaft of the speed reducer 102, and the first drive pulley 302 and the second drive pulley 303 are respectively connected with the ball screw 4. The driving pulley 301, the second tensioning pulley 306, the first driving pulley 302, the second driving pulley 303 and the first tensioning pulley 305 are in transmission connection through a synchronous belt 304; the first tensioning wheel 305 and the second tensioning wheel 306 can be freely fixed in the adjusting groove on the supporting flat plate 2, so that the synchronous belt 304 is tensioned, and the synchronous belt 304 is prevented from slipping. The driving force output by the motor 101 is transmitted to the driving pulley 301 through the speed reducer 102, and the driving pulley 301 drives the first driving pulley 302 and the second driving pulley 303 to rotate through the synchronous belt 304, so that the ball screw 4 is driven to rotate. It can be appreciated that the driving pulley 301, the second tensioning pulley 306, the first driving pulley 302, the second driving pulley 303 and the first tensioning pulley 305 can also be driven by hinges, so that the belt driving is prevented from elastic sliding and slipping, and the driving accuracy is improved.
Further, the inner side of the synchronous belt 304 is fixedly provided with belt teeth, and the outer circles of the driving belt pulley 301, the first driving belt pulley 302 and the second driving belt pulley 303 are meshed with the belt teeth, so that the problem of belt slipping is further avoided.
As shown in fig. 4, in the present embodiment, the horizontal adjustment mechanism 5 includes: a fixed base plate 501 and an adjustment block 502. The fixed bottom plate 501 is installed on Si C high temperature equipment to realize that elevating gear is connected with Si C high temperature equipment, and adjusting cushion block 502 passes through waist hole and bolt assembly and installs on fixed bottom plate 501, and the dull and stereotyped 2 of support is installed on adjusting cushion block 502.
Further, the horizontal adjustment mechanism 5 further includes a first adjustment block 503 and a second adjustment block 504. The first adjusting block 503 is arranged on the fixed bottom plate 501, and adjusts the position of the adjusting cushion block 502 through screw transmission, so as to realize the adjustment of the supporting flat plate 2 in the left-right direction. The second adjusting block 504 is connected with the supporting flat plate 2, and adjusts the position of the adjusting cushion block 502 through screw transmission, so that the supporting flat plate 2 is adjusted in the front-rear direction.
As shown in fig. 5, in the present embodiment, the limit mechanism 7 includes a limit base 701, a limit block 702, and a limit sensor 703. The limiting base 701 is respectively arranged at the bottom of the supporting flat plate 2 and on the linear bearing 6; the limiting block 702 is arranged at the top of the guide rail 9 and is close to the nut seat of the ball screw 4, and is used for limiting the descending displacement of the ball screw 4. The limit base 701 is provided with a limit sensor 703 for detecting the lifting displacement of the bearing plate 8.
The working process of the lifting device of this embodiment is as follows:
when the motor 101 is started, the output shaft of the speed reducer 102 drives the driving belt pulley 301 to rotate, and the driving belt pulley 301, the second tensioning wheel 306, the first driving belt pulley 302, the second driving belt pulley 303 and the first tensioning wheel 305 are in transmission connection through the synchronous belt 304, so that the first driving belt pulley 302 and the second driving belt pulley 303 rotate in the same direction. The first tensioning wheel 305 and the second tensioning wheel 306 can be fixed freely in the adjustment on the support plate 2, so that the belt is tensioned, and the problem of belt slipping is avoided. Meanwhile, the first driving belt pulley 302 and the second driving belt pulley 303 drive the screw 4 to rotate, a screw nut seat is sleeved at the top of the guide rod 9, and internal threads are arranged in the screw nut seat, so that a thread pair is formed between the screw nut seat and the screw 4. Driven by the two lead screws 4, the two guide rails 9 drive the bearing plate 8 to move vertically, so that the lifting device can move stably.
In this embodiment, the driving mechanism 1 and the transmission mechanism 3 are installed on the supporting plate 2, one end of the lifting assembly is connected with the supporting plate 2 and is in transmission connection with the transmission mechanism 3, the other end of the lifting assembly is connected with the carrying plate 8 for carrying the wafer, the two sides of the carrying plate 8 are connected with the lifting assembly, so as to uniformly support the gravity of the carrying plate 8, and under the driving of the driving mechanism 1, the transmission mechanism 3 transmits the driving force to the lifting assembly, and then drives the carrying plate 8 to lift reciprocally, thereby realizing the stable transmission of the wafer. Meanwhile, through setting up horizontal adjustment mechanism 5 in the dull and stereotyped 2 both sides of support, and horizontal adjustment mechanism 5 is connected with the S i C high temperature equipment, utilizes horizontal adjustment mechanism 5 to adjust the relative position between dull and stereotyped 2 of support and the Si C high temperature equipment, has realized supporting dull and stereotyped 2 and Si C high temperature equipment highly aligned, has improved the accuracy of loading board 8 repeated location, has reduced the requirement to spare part machining precision. Further, through setting up stop gear 7 respectively on supporting dull and stereotyped 2 and lifting unit, utilize stop gear 7 to carry out accurate accuse to the lift displacement of loading board 8, improved the stability that loading board 8 removed, avoided loading board 8 to appear the phenomenon of slope in the lift process, solved because elevating gear lacks stability and lead to the wafer conveying to get into the problem that the position of Si C high temperature equipment takes place the skew.
While the utility model has been described with reference to preferred embodiments, it is not intended to be limiting. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present utility model or equivalent embodiments using the method and technical solution disclosed above without departing from the spirit and technical solution of the present utility model. Therefore, any simple modification, equivalent substitution, equivalent variation and modification of the above embodiments according to the technical substance of the present utility model, which do not depart from the technical solution of the present utility model, still fall within the scope of the technical solution of the present utility model.
Claims (10)
1. A lifting device for SiC high temperature equipment, characterized by comprising: the device comprises a driving mechanism (1), a supporting flat plate (2), a transmission mechanism (3), a horizontal adjusting mechanism (5), a limiting mechanism (7), a lifting assembly and a bearing plate (8) for loading wafers; the driving mechanism (1) and the transmission mechanism (3) are both arranged on the support flat plate (2), the output end of the driving mechanism (1) is connected with the transmission mechanism (3), two sides of the bearing plate (8) are respectively connected with the support flat plate (2) through lifting components, and the transmission mechanism (3) drives the lifting components to lift reciprocally under the driving of the driving mechanism (1) so as to realize the reciprocating lifting of the bearing plate (8); the horizontal adjusting mechanisms (5) are positioned at two sides of the supporting flat plate (2) and are used for adjusting the levelness of the supporting flat plate (2), and the horizontal adjusting mechanisms (5) are connected with SiC high-temperature equipment; and the limiting mechanism (7) is respectively arranged on the supporting flat plate (2) and the lifting assembly and is used for limiting the lifting displacement of the bearing plate (8).
2. Lifting device for SiC high temperature equipment according to claim 1, characterized in that the lifting assembly comprises a ball screw (4) and a guide rail (9); one end of the ball screw (4) is connected with the transmission mechanism (3), the other end of the ball screw (4) is connected with the guide rail (9), and the guide rail (9) is connected with the bearing plate (8); the driving mechanism (1) drives the transmission mechanism (3) to enable the ball screw (4) to operate, so that the bearing plate (8) is lifted.
3. Lifting device for SiC high temperature equipment according to claim 2, characterized in that the guide rail (9) is provided with a linear bearing (6), and the limit mechanism (7) is mounted on the side of the linear bearing (6).
4. Lifting device for SiC high temperature equipment according to claim 2, characterized in that the drive mechanism (1) comprises: the motor is characterized by comprising a motor (101), a speed reducer (102) and a motor mounting plate (103), wherein the output end of the motor (101) is connected with the speed reducer (102), the speed reducer (102) penetrates through a supporting flat plate (2) to be connected with a transmission mechanism (3), and the motor mounting plate (103) is arranged at the bottom of the supporting flat plate (2) and used for realizing that the motor (101) and the speed reducer (102) are fixedly arranged at the bottom of the supporting flat plate (2).
5. Lifting device for SiC high temperature equipment according to claim 4, characterized in that the driving mechanism (1) further comprises an adjusting plate (104), which is arranged at the bottom of the supporting plate (2), and the adjusting plate (104) is provided with a bolt assembly for adjusting the position of the motor mounting plate (103).
6. Lifting device for SiC high temperature equipment according to claim 4, characterized in that the transmission (3) comprises: a drive pulley (301), a first drive pulley (302), a second drive pulley (303), a timing belt (304), a first tensioning pulley (305) and a second tensioning pulley (306); the driving belt wheel (301) is in transmission connection with an output shaft of the speed reducer (102), and the first driving belt wheel (302) and the second driving belt wheel (303) are respectively connected with the ball screw (4); the driving belt wheel (301), the second tensioning wheel (306), the first driving belt wheel (302), the second driving belt wheel (303) and the first tensioning wheel (305) are in transmission connection through a synchronous belt (304).
7. The lifting device for SiC high temperature equipment according to claim 6, wherein the inner side of the synchronous belt (304) is fixedly provided with belt teeth, and the outer circles of the driving pulley (301), the first driving pulley (302) and the second driving pulley (303) are meshed with the belt teeth.
8. Lifting device for SiC high temperature equipment according to claim 6, characterized in that the level adjustment mechanism (5) comprises: fixed bottom plate (501) and regulation cushion (502), fixed bottom plate (501) are installed on SiC high temperature equipment to realize elevating gear and SiC high temperature equipment and be connected, regulation cushion (502) are installed on fixed bottom plate (501), support dull and stereotyped (2) are installed on regulation cushion (502).
9. Lifting device for SiC high temperature equipment according to claim 8, characterized in that the horizontal adjustment mechanism (5) further comprises a first adjustment block (503) and a second adjustment block (504); the first adjusting block (503) is arranged on the fixed bottom plate (501), and the position of the adjusting cushion block (502) is adjusted through screw transmission; the second adjusting block (504) is connected with the supporting flat plate (2), and the position of the adjusting cushion block (502) is adjusted through threaded transmission.
10. Lifting device for SiC high temperature equipment according to claim 8, characterized in that the limit mechanism (7) comprises a limit base (701), a limit block (702) and a limit sensor (703); the limiting base (701) is respectively arranged at the bottom of the supporting flat plate (2) and on the linear bearing (6); the limiting block (702) is arranged at the top of the guide rail (9) and is close to a nut seat of the ball screw (4) and used for limiting descending displacement of the ball screw (4); and the limiting base (701) is provided with a limiting sensor (703) for detecting the lifting displacement of the bearing plate (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321954472.1U CN220376232U (en) | 2023-07-24 | 2023-07-24 | Lifting device for be used for SiC high temperature equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321954472.1U CN220376232U (en) | 2023-07-24 | 2023-07-24 | Lifting device for be used for SiC high temperature equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220376232U true CN220376232U (en) | 2024-01-23 |
Family
ID=89566076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321954472.1U Active CN220376232U (en) | 2023-07-24 | 2023-07-24 | Lifting device for be used for SiC high temperature equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220376232U (en) |
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2023
- 2023-07-24 CN CN202321954472.1U patent/CN220376232U/en active Active
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