CN220367901U - Wafer leveling device with worm transmission structure - Google Patents
Wafer leveling device with worm transmission structure Download PDFInfo
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- CN220367901U CN220367901U CN202322035687.XU CN202322035687U CN220367901U CN 220367901 U CN220367901 U CN 220367901U CN 202322035687 U CN202322035687 U CN 202322035687U CN 220367901 U CN220367901 U CN 220367901U
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 34
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 20
- 239000010959 steel Substances 0.000 claims abstract description 20
- 238000001179 sorption measurement Methods 0.000 claims description 34
- 238000003825 pressing Methods 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 42
- 238000004519 manufacturing process Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Abstract
The utility model provides a wafer leveling device, which adopts a fixed upright post and a fixed tension spring to form a fixed support component, wherein the top of the fixed upright post is abutted with an adapting wing plate through a steel ball, the bottom of the fixed upright post is abutted with a supporting base through a steel ball, so that a positioning base can be subjected to position fine adjustment in a deflection manner on the supporting base, a movable support component is formed by a movable prying plate, a movable upright post and a movable tension spring, the movable prying plate can be deflected on the supporting base through a lever jacking post, the top of the movable upright post is abutted with the adapting wing plate through the steel ball, the bottom of the movable upright post is abutted with the outer end of the movable prying plate through the steel ball, and meanwhile, a worm wheel end post driven by a transmission worm is arranged, the top of the worm wheel end post is abutted with the inner end of the movable prying plate, and can drive the movable prying plate to deflect when the worm wheel end post rotates, so that the positioning base and a positioning sucker can be subjected to leveling operation, and the positioning base can be matched with corresponding position sensors to carry out closed-loop control in a leveling process, thereby being beneficial to improving the precision of the wafer detection and the processing process, and improving the performance of an integrated circuit product.
Description
Technical Field
The utility model relates to semiconductor production equipment, in particular to a wafer leveling device with a worm drive structure.
Background
Patent document CN217239425U discloses a wafer centering levelling device, it includes supporting platform, rotating assembly and multiunit centering push rod, supporting platform is including the carrier that is connected and deflector, the carrier is used for bearing the wafer, the interval is equipped with a plurality of long waist holes on the deflector, long waist hole extends towards being close to or keeping away from the direction of carrier centre of a circle, and a plurality of long waist holes are arranged circumferentially around the carrier, the interval is provided with multiunit centering push rod on rotating assembly's the output, multiunit centering push rod is the circumference interval with the centre of a circle of carrier, every group centering push rod corresponds to wear to establish in a long waist hole, rotating assembly can synchronous drive multiunit centering push rod remove along the long waist hole that corresponds, in order to promote wafer and carrier concentricity, wafer processing equipment is through using above-mentioned wafer centering levelling device, can guarantee that centering location to the wafer is more stable accurate, and simple structure, be convenient for adjust. However, the leveling device adopts a plurality of groups of centering push rods to move along the long waist holes so as to push the wafer and the carrier to be concentric, and the leveling device can only adjust and position in the radial direction and can not perform fine adjustment in the axial direction, so that the detection and processing precision of the wafer are difficult to improve. Therefore, there is a need for structural optimization of such leveling devices to overcome the above-mentioned drawbacks.
Disclosure of Invention
The utility model aims to provide a wafer leveling device with a worm transmission structure, so as to improve leveling precision and efficiency.
The utility model adopts the technical proposal for solving the technical problems that:
a wafer leveling device with worm drive structure, comprising:
a support assembly having an installation space thereon;
the adsorption positioning assembly is arranged on the supporting assembly and is matched with the wafer to be processed, so that the wafer can be adsorbed and positioned;
the axial positioning assembly is arranged on the supporting assembly and matched with the adsorption positioning assembly, and the adsorption positioning assembly and the wafer on the adsorption positioning assembly are axially positioned by the axial positioning assembly;
the radial positioning assembly is arranged on the supporting assembly and the adsorption positioning assembly, and the radial positioning assembly radially positions the wafer on the adsorption positioning assembly;
further comprises:
the fixed support component is arranged on the supporting assembly component and matched with the adsorption positioning component, and the fixed support component carries out axial support on the adsorption positioning component;
the movable supporting component is arranged on the supporting assembly component and matched with the adsorption positioning component, and the movable supporting component axially supports the adsorption positioning component;
the worm driving assembly is arranged on the supporting assembly and matched with the movable supporting assembly, and the worm driving assembly drives the movable supporting assembly to adjust the position, so that the movable supporting assembly performs leveling operation on the wafer adsorbed on the positioning assembly.
Specifically, the support assembly includes:
and the top of the supporting base is provided with an assembling notch.
The adsorption positioning assembly comprises:
the positioning shoe is arranged in the assembling notch, the position of the positioning shoe can be adjusted in the assembling notch, a group of matching wing pieces are arranged at the edge of the positioning shoe, and each matching wing piece extends outwards in the radial direction;
the positioning sucker is arranged on the positioning collet and connected with the vacuum generator through a pipeline, and the vacuum generator is used for vacuumizing the positioning sucker, so that the positioning sucker is adsorbed on the positioning collet, the position of the positioning sucker can be adjusted along with the positioning collet, and the positioning sucker can adsorb wafers.
The axial positioning assembly includes:
the positioning seat plate is isosceles triangle and is positioned below the supporting base, and the top of the positioning seat plate is connected with the positioning bottom support through the switching support rod;
the guide seat frames are provided with a pair of guide seat frames, each guide seat frame is respectively installed in the supporting base, and the waist line parts of the positioning seat plates are respectively installed on the guide seat frames through guide sliding rails which are axially arranged, so that the positioning seat plates can carry the positioning bottom support and the positioning suction disc to axially move;
the transmission seat block is fixed at the bottom edge of the positioning seat plate, and a strip-shaped transmission chute is formed in the transmission seat block, and the extending direction of the transmission chute is parallel to the plane where the positioning seat plate is positioned;
and the positioning motor is fixed at the bottom of the supporting base and corresponds to the bottom edge of the positioning seat plate, an eccentric wheel is arranged on the power output shaft of the positioning motor, the eccentric wheel is matched with the transmission chute, and the positioning seat plate can be driven to move along the axial direction through the eccentric wheel when the positioning motor operates.
The radial positioning assembly includes:
the positioning seat block is fixed on the edge of the supporting base;
the guide struts are provided with a pair of guide struts, and each guide strut is respectively arranged in the positioning seat block through a linear bearing and extends along the radial direction of the supporting base to move in the positioning seat block;
the positioning top plate is arranged at the positioning end of the guide supporting rod and extends towards the positioning sucker, a pair of movable rollers are arranged at the tail end of the positioning top plate, and the movable rollers can be matched with the edge of a wafer on the positioning sucker;
the pressing springs are provided with a pair, one end of each pressing spring is connected with the positioning seat block, the other end of each pressing spring is connected with the pressing end of the guide supporting rod, and the pressing springs apply elasticity to the guide supporting rod and the positioning top plate to drive the movable roller to press the edge of the wafer;
the fixed rollers are provided with a pair, each fixed roller is respectively arranged at the edge of the positioning sucker and is respectively arranged at two ends of the positioning sucker with the movable roller, the fixed rollers can be matched with the edge of the wafer on the positioning sucker, and the fixed rollers and the movable rollers are used for radially positioning the wafer together;
and the traction cylinder is arranged in the positioning seat block, the tail end of a piston rod of the traction cylinder is connected with the guide supporting rod through the switching cross beam, and the traction cylinder drives the guide supporting rod to move so as to separate the movable roller from the wafer.
The fixed bracket assembly includes:
the fixed upright post is positioned between the supporting base and the positioning base and corresponds to the position of the matching wing piece, the top of the fixed upright post is propped against the matching wing piece through steel balls, and the bottom of the fixed upright post is propped against the supporting base through steel balls, so that the positioning base can be adjusted on the supporting base;
the fixed tension spring is positioned between the supporting base and the positioning collet and positioned on the same radial line with the fixed upright post, the top end of the fixed tension spring is connected with the matching wing piece, the bottom end of the fixed tension spring is connected with the supporting base, and the fixed tension spring applies axial tension to the supporting base and the matching wing piece so as to prevent the fixed upright post from falling off.
The movable bracket assembly comprises:
the movable prying plates are provided with at least one pair, each movable prying plate is respectively positioned between the supporting base and the positioning collet and corresponds to the position of the matching wing piece, the length direction of each movable prying plate extends along the radial direction, the middle part of each movable prying plate is arranged on the supporting base through a lever jacking column, and the movable prying plates can deflect on the supporting base through the lever jacking column;
the movable upright post is positioned between the movable pry plate and the positioning collet and corresponds to the position of the matching wing piece, the top of the movable upright post is propped against the matching wing piece through a steel ball, and the bottom of the movable upright post is propped against the outer end of the movable pry plate through the steel ball, so that the positioning collet can be adjusted in position on the movable pry plate;
the movable tension spring is positioned between the movable prying plate and the positioning collet and is positioned on the same radial line with the movable upright post, the top end of the movable tension spring is connected with the matching wing piece, the bottom end of the movable tension spring is connected with the outer end of the movable prying plate, and the movable tension spring applies axial tension to the movable prying plate and the matching wing piece to prevent the movable upright post from falling off.
The worm drive assembly includes:
the worm wheel end posts are provided with at least one pair, each worm wheel end post is respectively arranged on the supporting base through a rotating structure and corresponds to the position of the movable prying plate, and the top end of each worm wheel end post is propped against the inner end of the movable prying plate;
the transmission worm is provided with at least one pair, and each transmission worm is meshed with the end post of the worm wheel respectively;
the driving motors are provided with at least one pair, and each driving motor is respectively arranged on the supporting base and connected with the transmission worm, and the transmission worm can drive the worm wheel end post to move so as to drive the movable prying plate to deflect, thereby carrying out leveling operation on the positioning collet and the positioning sucker.
The utility model has the advantages that:
the wafer leveling device adopts a fixed upright post and a fixed tension spring to form a fixed support component, the top of the fixed upright post is abutted against the matched wing piece through a steel ball, the bottom of the fixed upright post is abutted against the supporting base through the steel ball, so that the positioning base can be subjected to position fine adjustment in a deflection mode on the supporting base, a movable support component is formed by adopting a movable prying plate, a movable upright post and a movable tension spring, the movable prying plate can deflect on the supporting base through a lever jacking post, the top of the movable upright post is abutted against the matched wing piece through the steel ball, the bottom of the movable upright post is abutted against the outer end of the movable prying plate through the steel ball, a worm wheel end post driven by a transmission worm is arranged, the top of the worm wheel end post is abutted against the inner end of the movable prying plate, the movable prying plate can be driven to deflect during rotation of the worm wheel end post, and further perform leveling operation on the positioning base and the positioning sucker, the positioning base can be matched with corresponding position sensors to perform closed-loop control on the leveling process, the wafer leveling process is more accurate, the precision of the wafer detection and the finished product of an integrated circuit is improved.
Drawings
FIG. 1 is a schematic view of the bottom surface structure of a wafer leveling device with a worm drive structure according to the present utility model;
FIG. 2 is a schematic top plan view of the leveling device;
FIG. 3 is a schematic view of the structure of the support assembly;
FIG. 4 is a schematic structural view of an adsorption positioning assembly;
FIG. 5 is an exploded view of the axial positioning assembly;
FIG. 6 is an exploded view of the radial positioning assembly;
FIG. 7 is one of the cross-sectional views of the device;
fig. 8 is a second cross-sectional view of the device.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 8, the wafer leveling device with the worm transmission structure provided by the utility model comprises a supporting assembly component, an adsorption positioning component, an axial positioning component, a radial positioning component, a fixed supporting component, a movable supporting component and a worm driving component, wherein the supporting assembly component is provided with an installation space, the adsorption positioning component is installed on the supporting assembly component and is matched with a wafer to be processed, the wafer can be adsorbed and positioned, the axial positioning component is installed on the supporting assembly component and is matched with the adsorption positioning component, the axial positioning component is used for axially positioning the wafer on the adsorption positioning component and the adsorption positioning component, the radial positioning component is installed on the supporting assembly component and the adsorption positioning component, the radial positioning component is used for radially positioning the wafer on the adsorption positioning component, the fixed supporting component is installed on the supporting assembly component and is matched with the adsorption positioning component, the fixed supporting assembly is used for axially supporting the adsorption positioning component, the movable supporting component is installed on the supporting assembly component and is matched with the adsorption positioning component, the axial supporting assembly is used for supporting the adsorption positioning component, the worm driving component is installed on the supporting assembly component and is matched with the movable supporting assembly, and the movable supporting assembly is used for driving the position of the wafer to be adjusted and positioned by the movable supporting assembly.
In this embodiment, the support assembly includes a support base 100 with an assembly slot 110 formed in the top of the support base.
The adsorption positioning assembly comprises a positioning collet 210 and a positioning sucker 220, wherein the positioning collet is arranged in an assembly notch, the position of the positioning collet can be adjusted in the assembly notch, a group of matching fins 211 are arranged at the edge of the positioning collet, each matching fin extends out radially outwards, the positioning sucker is arranged on the positioning collet and is connected with a vacuum generator through a pipeline, the vacuum generator is used for vacuumizing the positioning sucker, so that the positioning sucker is adsorbed on the positioning collet, the position of the positioning sucker can be adjusted along with the positioning collet, and the positioning sucker can adsorb wafers.
The axial positioning assembly comprises a positioning seat plate 310, a guide seat frame 320, a transmission seat block 330 and a positioning motor 340, wherein the positioning seat plate is in an isosceles triangle shape and is positioned below a supporting base, the top of the positioning seat plate is connected with the positioning base through a switching support rod 311, the guide seat frame is provided with a pair of guide seat frames, each guide seat frame is respectively installed in the supporting base, a waist line part of the positioning seat plate is respectively installed on the guide seat frame through a guide sliding rail which is axially arranged, the positioning seat plate can carry the positioning base and the positioning suction cup to axially move, the transmission seat block is fixed at the bottom edge of the positioning seat plate, a strip-shaped transmission sliding chute 331 is formed in the transmission seat plate, the extending direction of the transmission sliding chute is parallel to the plane where the positioning seat plate is located, the positioning motor is fixed at the bottom of the supporting base and corresponds to the bottom edge position of the positioning seat plate, an eccentric wheel 341 is installed on a power output shaft of the positioning motor, and the eccentric wheel is matched with the transmission sliding chute, and the positioning motor can drive the positioning seat plate to axially move through the eccentric wheel.
The radial positioning assembly comprises a positioning seat block 410, a guide supporting rod 420, a positioning top plate 430, pressing springs 440, fixed rollers 450 and a traction cylinder 460, wherein the positioning seat block is fixed on the edge of a supporting base, the guide supporting rod is provided with a pair of guide supporting rods, each guide supporting rod is installed in the positioning seat block through a linear bearing and extends along the radial direction of the supporting base, the guide supporting rods can move in the positioning seat block, the positioning top plate is installed at the positioning end of the guide supporting rod and extends towards the direction of a positioning sucker, a pair of movable rollers 431 are arranged at the tail end of the guide supporting rod, the movable rollers can be matched with the edge of a wafer on the positioning sucker, the pressing springs are provided with a pair of pressing springs, one end of each pressing spring is connected with the positioning seat block, the other end of each pressing spring is connected with the pressing end of the guide supporting rod, elastic force is applied to the guide supporting rod and the positioning top plate by the pressing springs to drive the movable rollers to press the edge of the wafer, the fixed rollers are provided with a pair of fixed rollers are installed at the edge of the positioning sucker, the movable rollers are matched with the edge of the wafer on the positioning sucker, the movable rollers can be matched with the edge of the wafer on the positioning sucker, the wafer is positioned at the two ends of the wafer, the wafer is positioned by the fixed rollers and the movable rollers are jointly, and the wafer is positioned by the fixed.
The fixed support assembly comprises a fixed upright column 510 and a fixed tension spring 520, wherein the fixed upright column is positioned between the supporting base and the positioning support and corresponds to the position of the matching wing piece, the top of the fixed upright column is propped against the matching wing piece through a steel ball, the bottom of the fixed upright column is propped against the supporting base through a steel ball, the positioning support can be adjusted on the supporting base, the fixed tension spring is positioned between the supporting base and the positioning support and is positioned on the same radial line with the fixed upright column, the top end of the fixed tension spring is connected with the matching wing piece, the bottom end of the fixed tension spring is connected with the supporting base, and the fixed tension spring applies axial tension to the supporting base and the matching wing piece to prevent the fixed upright column from falling off.
The movable support assembly comprises a movable support plate 610, a movable upright 620 and a movable tension spring 630, wherein the movable support plate is provided with at least one pair, each movable support plate is respectively positioned between a supporting base and a positioning bottom support and corresponds to the position of the matching wing piece, the length direction of each movable support plate extends along the radial direction, the middle part of the movable support plate is arranged on the supporting base through a lever jack post, the movable support plate can deflect on the supporting base through the lever jack post, the movable upright is positioned between the movable support plate and the positioning bottom support and corresponds to the position of the matching wing piece, the top of the movable support plate is abutted with the matching wing piece through a steel ball, the bottom of the movable support plate is abutted with the outer end of the movable support plate through the steel ball, the positioning bottom of the movable support plate can be adjusted on the movable support plate, the movable tension spring is positioned between the movable support plate and the positioning bottom support and is positioned on the same radial line with the movable upright, the top of the movable support plate is connected with the matching wing piece, the bottom of the movable support plate is connected with the outer end of the movable support plate, and the movable tension spring exerts axial tension on the movable support plate and the matching wing piece to prevent the movable upright from falling off.
The worm driving assembly comprises a worm wheel end post 710, a transmission worm 720 and a driving motor 730, wherein the worm wheel end post is provided with at least one pair, each worm wheel end post is respectively installed on the supporting base through a rotating structure and corresponds to the position of the movable prying plate, the top end of the worm wheel end post is propped against the inner end of the movable prying plate, the transmission worm is provided with at least one pair, each transmission worm is respectively meshed with the worm wheel end post, the driving motor is provided with at least one pair, each driving motor is respectively installed on the supporting base and connected with the transmission worm, and the transmission worm can drive the worm wheel end post to move so as to drive the movable prying plate to deflect, and then leveling operation is carried out on the positioning collet and the positioning sucker.
In the description of the present utility model, it should be noted that, when terms such as "upper", "lower", "inner", "outer", "left", "right", and the like indicate orientations or positional relationships, are to be understood as being based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships conventionally put in use of the inventive product, or the orientations or positional relationships conventionally understood by those skilled in the art, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, when used herein, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance. In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, terms such as "mounted," "configured," and "connected" are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Claims (8)
1. A wafer leveling device with worm drive structure, comprising:
a support assembly having an installation space thereon;
the adsorption positioning assembly is arranged on the supporting assembly and is matched with the wafer to be processed, so that the wafer can be adsorbed and positioned;
the axial positioning assembly is arranged on the supporting assembly and matched with the adsorption positioning assembly, and the adsorption positioning assembly and the wafer on the adsorption positioning assembly are axially positioned by the axial positioning assembly;
the radial positioning assembly is arranged on the supporting assembly and the adsorption positioning assembly, and the radial positioning assembly radially positions the wafer on the adsorption positioning assembly;
characterized by further comprising:
the fixed support component is arranged on the supporting assembly component and matched with the adsorption positioning component, and the fixed support component carries out axial support on the adsorption positioning component;
the movable supporting component is arranged on the supporting assembly component and matched with the adsorption positioning component, and the movable supporting component axially supports the adsorption positioning component;
the worm driving assembly is arranged on the supporting assembly and matched with the movable supporting assembly, and the worm driving assembly drives the movable supporting assembly to adjust the position, so that the movable supporting assembly performs leveling operation on the wafer adsorbed on the positioning assembly.
2. The wafer leveling device with worm drive of claim 1, wherein the support assembly comprises:
and the top of the supporting base is provided with an assembling notch.
3. The wafer leveling device with worm drive of claim 2, wherein the suction positioning assembly comprises:
the positioning shoe is arranged in the assembling notch, the position of the positioning shoe can be adjusted in the assembling notch, a group of matching wing pieces are arranged at the edge of the positioning shoe, and each matching wing piece extends outwards in the radial direction;
the positioning sucker is arranged on the positioning collet and connected with the vacuum generator through a pipeline, so that the positioning sucker is adsorbed on the positioning collet, the position of the positioning sucker can be adjusted along with the positioning collet, and the wafer can be adsorbed by the positioning sucker.
4. A wafer leveling apparatus having a worm drive arrangement as set forth in claim 3 wherein the axial positioning assembly comprises:
the positioning seat plate is isosceles triangle and is positioned below the supporting base, and the top of the positioning seat plate is connected with the positioning bottom support through the switching support rod;
the guide seat frames are provided with a pair of guide seat frames, each guide seat frame is respectively arranged in the supporting base, and the waist line parts of the positioning seat plates are respectively arranged on the guide seat frames through guide sliding rails arranged along the axial direction;
the transmission seat block is fixed at the bottom edge of the positioning seat plate, and a strip-shaped transmission chute is formed in the transmission seat block, and the extending direction of the transmission chute is parallel to the plane where the positioning seat plate is positioned;
and the positioning motor is fixed at the bottom of the supporting base and corresponds to the bottom edge of the positioning seat plate, and an eccentric wheel is arranged on the power output shaft and is matched with the transmission chute.
5. A wafer leveling apparatus with worm drive arrangement as set forth in claim 3 wherein the radial positioning assembly comprises:
the positioning seat block is fixed on the edge of the supporting base;
the guide struts are provided with a pair of guide struts, and each guide strut is respectively arranged in the positioning seat block through a linear bearing and extends along the radial direction of the supporting base;
the positioning top plate is arranged at the positioning end of the guide strut and extends towards the positioning sucker, and the tail end of the positioning top plate is provided with a pair of movable rollers;
the pressing springs are provided with a pair of pressing springs, one end of each pressing spring is connected with the positioning seat block, and the other end of each pressing spring is connected with the pressing end of the guide strut;
the fixed rollers are provided with a pair, and each fixed roller is respectively arranged at the edge of the positioning sucker and is respectively arranged at the two ends of the positioning sucker with the movable roller, and can be matched with the edge of the wafer on the positioning sucker;
the traction cylinder is arranged in the positioning seat block, and the tail end of a piston rod of the traction cylinder is connected with the guide strut through the switching cross beam.
6. A wafer leveling apparatus having a worm drive arrangement as set forth in claim 3 wherein the fixed bracket assembly comprises:
the fixed upright post is positioned between the supporting base and the positioning base, corresponds to the position of the matching wing piece, is propped against the matching wing piece through a steel ball at the top and is propped against the supporting base through the steel ball at the bottom;
and the fixed tension spring is positioned between the supporting base and the positioning collet, is positioned on the same radial line with the fixed upright post, is connected with the matching wing piece at the top end and is connected with the supporting base at the bottom end.
7. The wafer leveling device with worm drive of claim 6, wherein the movable bracket assembly comprises:
the movable prying plates are provided with at least one pair, each movable prying plate is respectively positioned between the supporting base and the positioning bottom bracket and corresponds to the position of the matching wing piece, the length direction of each movable prying plate extends along the radial direction, and the middle part of each movable prying plate is arranged on the supporting base through a lever jacking column;
the movable upright post is positioned between the movable prying plate and the positioning collet and corresponds to the position of the matching wing piece, the top of the movable upright post is propped against the matching wing piece through a steel ball, and the bottom of the movable upright post is propped against the outer end of the movable prying plate through the steel ball;
the movable tension spring is positioned between the movable prying plate and the positioning collet, is positioned on the same radial line with the movable upright post, the top end of the movable tension spring is connected with the matching wing piece, and the bottom end of the movable tension spring is connected with the outer end of the movable prying plate.
8. The wafer leveling device with worm drive of claim 7, wherein the worm drive assembly comprises:
the worm wheel end posts are provided with at least one pair, each worm wheel end post is respectively arranged on the supporting base through a rotating structure and corresponds to the position of the movable prying plate, and the top end of each worm wheel end post is propped against the inner end of the movable prying plate;
the transmission worm is provided with at least one pair, and each transmission worm is meshed with the end post of the worm wheel respectively;
and the driving motors are provided with at least one pair, and each driving motor is respectively arranged on the supporting base and connected with the transmission worm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322035687.XU CN220367901U (en) | 2023-07-31 | 2023-07-31 | Wafer leveling device with worm transmission structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322035687.XU CN220367901U (en) | 2023-07-31 | 2023-07-31 | Wafer leveling device with worm transmission structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220367901U true CN220367901U (en) | 2024-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322035687.XU Active CN220367901U (en) | 2023-07-31 | 2023-07-31 | Wafer leveling device with worm transmission structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN220367901U (en) |
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2023
- 2023-07-31 CN CN202322035687.XU patent/CN220367901U/en active Active
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