CN220367895U - Array type multi-cavity chip production tray - Google Patents

Abstract

The utility model relates to the technical field of chip processing auxiliary devices and discloses an array type multi-cavity chip production tray which comprises a supporting plate, wherein two sides of the upper bottom of the supporting plate are fixedly connected with a support, two screws are rotatably connected to the support, the same sides of the two screws are fixedly connected with belt wheels, a synchronous belt is connected between the two belt wheels, two sides of the screws are in threaded connection with a moving strip, the top of the moving strip is rotatably connected with a push rod, one end of the push rod is rotatably connected with a lifting plate, the top surface of the lifting plate is fixedly connected with a plurality of chip positioning baffles, an operator can lower the chip positioning baffles to a position flush with the top surface of the supporting plate, the chip can be conveniently taken out by the operator, meanwhile, the flat surface of the supporting plate has no chip residual dead angle, and chips are convenient and rapid to clean the chips milled.

Description

Array type multi-cavity chip production tray

Technical Field

The utility model belongs to the technical field of chip processing auxiliary devices, and particularly relates to an array type multi-cavity chip production tray.

Background

In the existing chip milling process, in order to ensure accurate position during chip milling, a special processing tray is generally required to be arranged for positioning and milling the chip.

The multi-cavity tray for chip production and processing and the chip production and processing method disclosed by publication number CN116259565A are mainly characterized in that: the processing device comprises a plurality of processing areas which are arranged in an array manner, wherein the processing areas comprise a cavity for fixing a chip, the cavity comprises an upper cavity positioned at the upper half part and a lower cavity positioned at the lower half part, the cross section of the upper cavity is in an inverted trapezoid shape, and the cross section of the lower cavity is in a rectangle shape; the tray is extruded by a press after milling the chips fixed in the cavity by a cutter.

The multi-cavity chip production tray has dead angles for residual scraps due to the concave structure, is very troublesome to clean, and aims to solve the problem.

Disclosure of Invention

The utility model aims at: in order to solve the above-mentioned problem, an array type multi-cavity chip production tray is provided.

The technical scheme adopted by the utility model is as follows: the utility model provides an array type multi-cavity chip production tray, includes the layer board, bottom both sides fixed connection support on the layer board, rotate on the support and be connected with two screws, two equal fixedly connected with band pulley in one side of screw rod, two be connected with the hold-in range between the band pulley, the both sides threaded connection of screw rod has the strip that moves, the top both sides that move the strip all rotate and are connected with the push rod, the one end rotation of push rod is connected with the lifter plate, the top surface fixedly connected with a plurality of chip positioning baffle of lifter plate.

In a preferred embodiment, a chip positioning cavity is formed between four of the chip positioning baffles.

In a preferred embodiment, the screw is provided with external threads on both sides in opposite directions.

In a preferred embodiment, two sides of the moving strip are connected with transverse guide rods in a sliding manner, and two ends of the transverse guide rods are fixedly arranged on the support.

In a preferred embodiment, the top surface of the supporting plate is provided with a plurality of through holes with the sizes matched with those of the chip positioning baffle plates, and the chip positioning baffle plates penetrate through the through holes.

In a preferred embodiment, the bottom four end corners of the supporting plate are fixedly connected with vertical guide rods, and the lifting plate is connected to the vertical guide rods in a sliding manner.

In a preferred embodiment, a limiting plate is fixedly connected to the bottom of the vertical guide rod.

In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:

1. according to the utility model, after the chip milling is finished, an operator can lower the chip positioning baffle to a position flush with the top surface of the supporting plate, and the flat surface of the supporting plate has no dead angle for chip residue, so that chips during the chip milling can be cleaned conveniently and rapidly.

2. According to the utility model, when an operator descends the chip positioning baffle, no baffle is arranged around the chip, so that the chip can be conveniently taken down from the supporting plate, and the chip is conveniently discharged.

Drawings

FIG. 1 is a schematic diagram of a three-dimensional structure of the present utility model;

FIG. 2 is a schematic diagram of the front view of the present utility model;

FIG. 3 is a schematic diagram of a pallet in a perspective view according to the present utility model;

FIG. 4 is a schematic and schematic diagram of a three-dimensional structure of a lifting and chip positioning baffle plate in the utility model;

fig. 5 is a schematic and schematic perspective view of a screw lifting assembly according to the present utility model.

The marks in the figure: 1-supporting plate, 2-bracket, 3-screw, 4-belt wheel, 5-synchronous belt, 6-moving bar, 7-push rod, 8-lifting plate, 9-chip positioning baffle, 10-chip positioning cavity, 11-through hole, 12-vertical guide rod, 13-limiting plate and 14-horizontal guide rod.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described in the following in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

An array-type multi-cavity chip production tray according to an embodiment of the present utility model will be described in detail with reference to fig. 1 to 5.

Examples:

the embodiment of the utility model provides an array type multi-cavity chip production tray, which is shown by referring to fig. 1 and 4, and comprises a supporting plate 1, wherein a plurality of chip positioning baffles 9 are arranged on the supporting plate 1, a chip positioning cavity 10 is formed among the four chip positioning baffles 9, the supporting plate 1 and the chip positioning baffles 9 form a multi-cavity chip tray, and the chip positioning baffles 9 are utilized for positioning and milling chips.

Referring to fig. 1, fig. 2 and fig. 5, the bottom both sides fixedly connected with support 2 on layer board 1, rotate on the support 2 and be connected with two screw rods 3, the same side of two screw rods 3 is equal fixedly connected with band pulley 4, be connected with hold-in range 5 between two band pulleys 4, the both sides threaded connection of screw rods 3 has moves strip 6, move the top both sides of strip 6 and all rotate and be connected with push rod 7, the one end rotation of push rod 7 is connected with lifter plate 8, chip location baffle 9 fixed mounting is on lifter plate 8, this structure is when the chip milling is finished, operating personnel can rotate one of them screw rods 3, drive hold-in range 5 through band pulley 4 and rotate this moment, thereby drive band pulley 4 on another screw rod 3 and rotate, thereby make two screw rods 3 rotate simultaneously, screw rod 3 utilizes the external screw thread to drive move strip pulley 6, thereby drive push rod 7 pulling lifter plate 8 and move down, thereby with chip location baffle 9 to flush with layer board 1 surface, then operating personnel alright take out the chip location baffle 9 easily, the chip is milled to the chip is convenient quick, when using, only need reverse rotation baffle 3 to drive chip location, thereby position the chip is located and is stretched out to the chip.

Referring to fig. 2 and 5, two sides of the screw 3 are provided with external threads with opposite directions, and the external threads with opposite directions can move two moving bars 6 in opposite directions at the same time.

Referring to fig. 5, two sides of the moving bar 6 are slidably connected with a transverse guide rod 14, two ends of the transverse guide rod 14 are fixedly mounted on the bracket 2, and the transverse guide rod 14 plays a guiding role in moving the moving bar 6.

Referring to fig. 3 and 4, a plurality of through holes 11 matched with the chip positioning baffle 9 in size are formed in the top surface of the supporting plate 1, the chip positioning baffle 9 penetrates through the through holes 11, the chip positioning baffle 9 penetrates through the supporting plate 1 conveniently through the through holes 11, meanwhile, the gap between the chip positioning baffle 9 and the supporting plate 1 is small due to the size design matched with the chip positioning baffle, and milling scraps are prevented from entering the connecting joint.

Referring to fig. 2, the bottom four end corners of the pallet 1 are fixedly connected with vertical guide rods 12, and the lifting plate 8 is slidably connected to the vertical guide rods 12, and the structure utilizes the vertical guide rods 12 to guide lifting movement of the lifting plate 8.

Referring to fig. 2, a limiting plate 13 is fixedly connected to the bottom of the vertical guide rod 12, and the limiting plate 13 is used to limit the lowest descending position of the lifting plate 8.

It should be noted that: the structure is mainly applied to milling of chips.

The implementation principle of the array type multi-cavity chip production tray in the embodiment of the application is as follows: when the chip milling is finished, one screw rod 3 can be rotated at the moment, the synchronous belt 5 is driven to rotate through the belt pulley 4, the belt pulley 4 on the other screw rod 3 is driven to rotate, the two screw rods 3 are driven to move by external threads, the push rod 7 is driven to move by the moving bar 6, the push rod 7 is driven to pull the lifting plate 8 to move downwards, the chip positioning baffle 9 is lowered to be flush with the surface of the supporting plate 1, then an operator can easily take out the molded chip, meanwhile, the flat surface of the supporting plate 1 is convenient and quick to clean chips milled, and when the chip milling device is used, the chip positioning baffle 9 can be stretched out only by reversely rotating the screw rod 3, so that the chip positioning milling is convenient to position and mill the next batch of chips.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (7)

1. The utility model provides an array type multi-cavity chip production tray, includes layer board (1), its characterized in that: bottom both sides fixedly connected with support (2) on layer board (1), rotate on support (2) and be connected with two screw rods (3), two equal fixedly connected with band pulley (4) in same one side of screw rod (3), two be connected with hold-in range (5) between band pulley (4), the both sides threaded connection of screw rod (3) has moves strip (6), the top both sides that move strip (6) all rotate and be connected with push rod (7), the one end rotation of push rod (7) is connected with lifter plate (8), the top surface fixedly connected with a plurality of chip positioning baffle (9) of lifter plate (8).

2. An array-type multi-cavity chip production tray as claimed in claim 1, wherein: and a chip positioning cavity (10) is formed among the four chip positioning baffles (9).

3. An array-type multi-cavity chip production tray as claimed in claim 1, wherein: external threads with opposite directions are arranged on two sides of the screw rod (3).

4. An array-type multi-cavity chip production tray as claimed in claim 1, wherein: the two sides of the moving strip (6) are connected with transverse guide rods (14) in a sliding manner, and two ends of each transverse guide rod (14) are fixedly arranged on the corresponding support (2).

5. An array-type multi-cavity chip production tray as claimed in claim 1, wherein: the top surface of layer board (1) is offered a plurality of with through-hole (11) of chip positioning baffle (9) size looks adaptation, chip positioning baffle (9) positioning baffle runs through-hole (11).

6. An array-type multi-cavity chip production tray as claimed in claim 1, wherein: the four end corners of the bottom of the supporting plate (1) are fixedly connected with vertical guide rods (12), and the lifting plate (8) is connected to the vertical guide rods (12) in a sliding mode.

7. An array-type multi-cavity chip production tray as defined in claim 6, wherein: the bottom of the vertical guide rod (12) is fixedly connected with a limiting plate (13).