CN220367321U - Carrier and detection system - Google Patents

Abstract

The utility model relates to a carrier and a detection system, wherein the carrier comprises a substrate, the upper surface of the substrate is provided with at least two grooves which are matched with wafers, the bottoms of the grooves are respectively provided with a negative pressure adsorption hole, the substrate is also provided with an interface for communicating a negative pressure pipeline, and the interface is communicated with the negative pressure adsorption holes; this microscope carrier, compact structure not only can place a plurality of wafers simultaneously to improve detection efficiency, and be favorable to increasing the productivity, can fix a position and spacing wafer moreover, prevent that the wafer from placing the in-process and taking place the drift, make the position of wafer confirm, thereby effectively prevent the wafer because of placing the position unfixed and the problem that takes place the damage easily.

Description

Carrier and detection system

Technical Field

The utility model relates to the technical field of wafer carriers, in particular to a carrier and a detection system.

Background

An Atomic Force Microscope (AFM) is a novel instrument with atomic level resolution, which is invented after a scanning tunnel microscope (Scanning Tunnel microscope), makes up the shortages of the scanning tunnel microscope, and can detect physical properties of nano areas including morphology of various materials and samples under the atmosphere and liquid environment or directly perform nano manipulation. The nanometer material is widely applied to the fields of research experiments of various nanometer related subjects in semiconductors, nanometer functional materials, biology, chemical industry, food, medical research and scientific research institutes, and the like, and becomes a basic tool for nanometer science research.

Existing wafers are typically of a circular plate-shaped configuration, as shown in fig. 1, and are typically configured with at least one flat edge for facilitating subsequent processing, which may be used to orient the wafer during subsequent processing. When the atomic force microscope is applied to AFM inspection of a wafer (or referred to as a crystal or a wafer), the wafer is usually required to be placed on a carrier, the existing carrier is generally configured into a disc-shaped structure, as shown in fig. 2, and the upper surface of the carrier is smooth and flat, and can be used for placing 2-8 inch wafers, meanwhile, the upper surface of the carrier is also configured with a negative pressure adsorption hole, and the negative pressure adsorption hole is communicated with a negative pressure device so as to adsorb the wafer placed on the carrier by using negative pressure. Although the existing carrier can be suitable for wafers with various sizes, the existing carrier can only be used for placing wafers with one size at a time, so that an atomic force microscope can only measure one wafer at a time, and the next wafer can be placed for measurement after one wafer is measured and taken away, and the problems of multiple actions and low efficiency exist, which are unfavorable for increasing the productivity. In addition, because the upper surface of the existing carrier is smooth and flat, after the wafer is placed, the wafer is easy to drift, so that the position of the wafer is not fixed and is uncertain, AFM detection operation is not facilitated, the wafer is easy to damage, and the problem needs to be solved.

Disclosure of Invention

The first aspect of the present utility model provides a carrier which is beneficial to increasing productivity and protecting wafers, and the carrier is mainly designed as follows:

the carrier comprises a substrate, at least two grooves for adapting to a wafer are formed on the upper surface of the substrate, negative pressure adsorption holes are respectively formed at the bottoms of the grooves,

the base body is also provided with an interface for communicating a negative pressure pipeline, and the interface is communicated with the negative pressure adsorption hole. In the scheme, at least two grooves for adapting to the wafers are formed in the upper surface of the substrate, so that on one hand, at least two wafers can be placed on the carrier each time, after the wafers are placed, each wafer on the carrier can be continuously and sequentially detected by using an atomic force microscope, the detection efficiency can be improved, and the improvement of productivity is facilitated; on the other hand, the grooves are configured to be matched with the wafer and are inwards recessed in the upper surface of the substrate, so that the grooves can play a role in positioning and limiting the wafer, drift in the wafer placement process can be prevented, the position of the wafer is determined, and damage to the wafer due to unfixed positions can be effectively prevented; the interface is configured so as to be connected with a negative pressure pipeline; the interface is communicated with the negative pressure adsorption holes so as to form negative pressure at the bottom of each groove, so that the wafer can be stably adsorbed on the carrier by utilizing the negative pressure, and high-precision detection can be conveniently carried out.

In order to further improve efficiency and productivity, at least 3 grooves are formed in the substrate, and the grooves are arranged in an array. In this scheme, through configuration at least 3 recesses to make each recess arrange according to the array, not only can once only place and detect more wafers, make each wafer arrange orderly and regular moreover, thereby be convenient for high-efficient, accurate detection wafer more.

Preferably, 9 grooves are formed in the substrate, and the 9 grooves are arranged in a 3×3 array.

In order to facilitate the correct placement of the wafer positioning problem, it is preferable that the grooves are configured in a square structure. The grooves of the directional structure are provided with straight edges so as to be matched with the flat edges in the wafers, and the wafers can be positioned and placed rapidly and accurately by taking the straight edges of the grooves as references when the grooves are placed.

Preferably, the grooves adopt square structures. The wafer is more convenient to put.

Preferably, the thickness of the groove is equal to the thickness of the wafer. The grooves can be utilized to play a better limiting role on the wafer.

In order to achieve better adsorption effect, further, the negative pressure adsorption hole is arranged at the middle position of the groove. The negative pressure adsorption force acting on the wafer can be uniformly distributed along the wafer, so that better adsorption effect can be realized.

In order to simplify the structure, further, an internal air passage is formed in the substrate, and each negative pressure adsorption hole is communicated with the interface through the internal air passage.

Preferably, the interface is disposed on the back surface of the substrate. So as not to influence the placement of the wafer and the detection of the wafer on the front surface of the substrate, thereby being more convenient for operation.

The second aspect of the present utility model is to solve the problem of facilitating the removal of the wafer from the groove, further, the upper surface of the substrate is further configured with a sinking groove adapted to the groove, the depth of the sinking groove is greater than the depth of the groove, a partial area of the sinking groove is located in the groove, and a partial area of the sinking groove is located outside the groove. In the scheme, the sinking groove of the adaptive groove is constructed, and the depth of the sinking groove is larger than that of the groove, so that a hand or a tool can be extended below the wafer, and the wafer can be conveniently taken out upwards; by constructing the partial region of the sinking groove in the groove and the partial region of the sinking groove outside the groove, when the wafer is taken out, the hand or the tool can be extended into the sinking groove region in the groove through the sinking groove region outside the groove, so that the wafer in the groove can be taken out smoothly.

Preferably, the sinking groove is constructed at the corner of the groove. So as to fully utilize the gap between the adjacent grooves, not only can make the structure of the carrier more compact and improve the utilization rate, but also can obtain the sinking groove with larger area, thereby being more convenient for taking out the wafer.

Preferably, the sink groove is configured in a square structure.

In order to solve the problem of being convenient for distinguishing each wafer during the detection operation, the substrate is further provided with distinguishing marks for distinguishing each groove. So that the distinguishing mark can effectively distinguish each wafer during the detection operation.

Preferably, the distinguishing mark is configured as a numerical mark. Facilitating differentiation and ordering.

Preferably, the distinguishing mark is constructed at the bottom of the sink groove. To prevent the distinguishing mark from being blocked by the placed wafer and ensure that the distinguishing mark is visible.

The third aspect of the present utility model is to solve the problem that the wafer with the negative pressure adsorbed on the carrier cannot be removed, further, the side surface of the substrate is configured with a communication hole, the communication hole is communicated with the negative pressure adsorption hole through a flow channel configured in the substrate, and the communication hole is provided with a sealing mechanism, and the sealing mechanism is used for sealing and opening the communication hole. By disposing the communication hole and making the communication hole communicate with the negative pressure adsorption hole, a sealing mechanism is provided at the communication hole so as to close and open the communication hole by the sealing mechanism. When the sealing mechanism is in a state of closing the communication hole, the negative pressure adsorption hole and the runner can be in the same negative pressure environment so as to realize a negative pressure adsorption function by using the negative pressure adsorption hole; when the sealing mechanism is in a state of opening the communication hole, the negative pressure adsorption hole can be communicated with the outside through the flow channel, so that the negative pressure environment at the negative pressure adsorption hole can be effectively destroyed, the negative pressure adsorption function is lost at the negative pressure adsorption hole, the wafer in the groove can be easily taken down, and the problem that the wafer adsorbed on the carrier by the negative pressure cannot be taken down can be effectively solved.

In order to solve the problem of being convenient for destroy the negative pressure absorption, further, sealing mechanism includes the internal thread that constructs in the intercommunicating pore and the sealing screw of adaptation intercommunicating pore, sealing screw threaded connection is in the intercommunicating pore. So as to realize the sealing of the communication hole by screwing the sealing screw, and realize the communication of the negative pressure adsorption hole and the outside by loosening the sealing screw, thereby achieving the purpose of destroying the negative pressure adsorption.

In order to achieve a better sealing effect, further, an annular sealing ring is further arranged in the communication hole, and the annular sealing ring is contacted and extruded in the screwing process of the sealing screw. So as to realize better sealing effect by using the annular sealing ring, thereby effectively preventing air leakage and being beneficial to realizing better negative pressure adsorption effect.

Furthermore, the back of the base body is also provided with a yielding groove. To avoid collisions and interference with the backside circuitry.

Furthermore, the back of the base body is also provided with a plurality of threaded holes. So as to mount a limiting member, etc.

The detection system comprises a detection module, a vacuum pump and a carrying platform, wherein the carrying platform is arranged at the position of the adaptive detection module, and the vacuum pump is communicated with the interface through a negative pressure pipeline.

Preferably, the detection module adopts an atomic force microscope.

Compared with the prior art, the carrier and the detection system provided by the utility model are compact in structure, can be used for simultaneously placing a plurality of wafers so as to improve the detection efficiency, are beneficial to increasing the productivity, can be used for positioning and limiting the wafers, and can be used for preventing the wafers from drifting in the placing process, so that the positions of the wafers are determined, and the problem that the wafers are easy to damage due to unfixed placing positions is effectively prevented.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a top view of a conventional wafer.

Fig. 2 is a top view of a conventional carrier.

Fig. 3 is a schematic structural diagram of a carrier according to embodiment 1 of the present utility model.

Fig. 4 is a second schematic structural diagram of a carrier according to embodiment 1 of the present utility model.

Fig. 5 is a top view of fig. 3.

Fig. 6 is a perspective view of fig. 5.

Fig. 7 is a schematic structural diagram of a carrier according to embodiment 2 of the present utility model.

Fig. 8 is a schematic structural diagram of a carrier according to embodiment 3 of the present utility model.

Fig. 9 is a second schematic structural diagram of a carrier according to embodiment 3 of the present utility model.

Fig. 10 is a top view of fig. 8.

Fig. 11 is a cross-sectional view at A-A in fig. 11.

Fig. 12 is a partial sectional view of a stage according to embodiment 3 of the present utility model, in which the communication hole is in a closed state.

Fig. 13 is a partial sectional view of a stage provided in embodiment 3 of the present utility model, in which the communication hole is in an opened state.

Description of the drawings

Wafer 1, flat edge 11

Carrier 2

Base body 3, upper surface 31, groove 32, negative pressure adsorption hole 33, internal air passage 34, back surface 35, interface 36, relief groove 37, threaded hole 38

Sink 41 and distinguishing mark 42

Communication hole 51, flow passage 52

A seal screw 61, and an annular seal ring 62.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present utility model.

Example 1

In this embodiment, a carrier for a wafer is provided, which includes a substrate 3, where at least two grooves 32 adapted to the wafer 1 are configured on an upper surface 31 (or referred to as a front surface) of the substrate 3, and the shape of the grooves 32 may be determined according to actual requirements, and only the wafer 1 needs to be adapted. Since the wafer 1 has a circular plate-shaped structure, the grooves 32 may have a circular structure in practice. In the preferred embodiment provided in this embodiment, the groove 32 may be configured as a square structure, as shown in fig. 3, where the groove 32 with a square structure has a straight edge so as to adapt to the flat edge 11 in the wafer 1, so that when the groove 32 is placed, the wafer 1 may be quickly and accurately positioned and placed with reference to the straight edge of the groove 32. Preferably, as shown in fig. 3, the recess 32 has a square structure, which is more convenient for placing the wafer 1, and the corners of the recess 32 may be configured as a circular arc structure, as shown in fig. 3 and 5.

In practice, the depth of the groove 32 may be smaller than the thickness of the wafer 1 or larger than the thickness of the wafer 1, and in the preferred embodiment provided in this embodiment, the thickness of the groove 32 may be equal to the thickness of the wafer 1, and the groove 32 may be used to perform a better limiting function on the wafer 1.

In practice, the size of the grooves 32 may be adapted to the size of the wafer 1, for example, the grooves 32 may be sized to fit 2-8 inches of the wafer 1 as desired. In practice, the dimensions of the wafers 1 may be the same so as to accommodate wafers 1 of the same size, e.g., as shown in fig. 3, the dimensions of the grooves 32 are the same and accommodate wafers 1 of 2 inches.

In practice, the number of the grooves 32 may be two, three, four, etc., according to practical requirements. In implementation, at least 3 grooves 32 can be formed in the substrate 3, and the grooves 32 are arranged in an array, so that more wafers 1 can be placed and detected at one time, and the wafers 1 are orderly and orderly arranged, thereby being more convenient for detecting the wafers 1 efficiently and accurately. As an example, the substrate 3 may include three grooves 32, the three grooves 32 being arranged in a 1×3 array. As another example, the substrate 3 may include four grooves 32, and three grooves 32 are arranged in a 2×2 array. As yet another example, as shown in fig. 3 and 5, 9 grooves 32,9 grooves 32 are configured on the substrate 3 in a 3×3 array so that 9 wafers 1 are simultaneously placed and 9 wafers 1 can be sequentially inspected.

In this embodiment, the bottom of each groove 32 is respectively configured with a negative pressure adsorption hole 33, and the negative pressure adsorption holes 33 may preferably be round holes, as shown in fig. 3 and 5, so as to be shaped. Meanwhile, in the present embodiment, the base body 3 is further configured with a port 36 for communicating with a negative pressure line, and the port 36 communicates with the negative pressure adsorption hole 33. In practice, the interface 36 may be configured on the side of the substrate 3, or may be configured on the back surface 35 of the substrate 3 preferentially, as shown in fig. 4, so as not to affect the placement of the wafer 1 and the inspection of the wafer 1 on the front surface of the substrate 3, thereby facilitating the operation. In implementation, the negative pressure adsorption hole 33 may be disposed at any position at the bottom of the groove 32, as shown in fig. 5, in this embodiment, the negative pressure adsorption hole 33 is preferentially disposed at a middle position of the groove 32, so as to adsorb the wafer 1 from the middle position of the wafer 1, so that the negative pressure adsorption force acting on the wafer 1 may be uniformly distributed along the wafer 1, thereby being beneficial to realizing a better adsorption effect. In implementation, the number of the interfaces 36 may be one or more, for example, one interface 36 may be configured for each negative pressure adsorption hole 33, and for example, one interface 36 may be configured for each negative pressure adsorption hole 33 in a unified manner.

In implementation, the interface 36 may be a threaded hole 38 formed in the base 3, or may be a connector protruding out of the back surface 35 of the base 3, as shown in fig. 4, where the structure of the connector may be implemented by using the prior art, and will not be described herein.

In order to realize the communication between the negative pressure adsorption holes 33 and the connectors 36, in practice, internal air passages 34 may be machined into the interior of the base body 3, so that each negative pressure adsorption hole 33 may be respectively communicated with the connectors 36 through the internal air passages 34. For example, as shown in fig. 6, when 9 grooves 32 arranged in a 3×3 array are formed on the base 3, the ports 36 may be provided on the back surface 35 of the suction hole 33 in the middle and communicate with the suction hole 33, and the remaining suction holes 33 may communicate with each other through the inner air passages 34 formed in the base 3 and staggered in the lateral and longitudinal directions, as shown by the broken line in fig. 6.

According to the carrier 2 provided by the embodiment, by constructing the grooves 32 of at least two adaptive wafers 1 on the upper surface 31 of the substrate 3, on one hand, at least two wafers 1 can be placed on the carrier 2 each time, and after the wafers 1 are placed, each wafer 1 on the carrier 2 can be continuously and sequentially detected by using an atomic force microscope, so that the detection efficiency can be improved, and the productivity can be increased; on the other hand, the groove 32 is configured to be matched with the wafer 1 and is recessed inwards on the upper surface 31 of the substrate 3, so that the groove 32 can play a role in positioning and limiting the wafer 1, not only can prevent drifting in the placing process of the wafer 1, ensure the position of the wafer 1, but also can effectively prevent the wafer 1 from being damaged due to unfixed position; by configuring the interface 36 to connect to a negative pressure line; by communicating the interface 36 with the negative pressure suction holes 33 so as to form a negative pressure at the bottom of each groove 32, the wafer 1 can be stably sucked to the stage 2 by the negative pressure so as to perform high-precision detection.

Example 2

To solve the problem of facilitating the removal of the wafer 1 from the recess 32, the main difference between the present embodiment 2 and the above-mentioned embodiment 1 is that, in the carrier 2 provided in this embodiment, the upper surface 31 of the base 3 is further configured with a sinking groove 41 adapted to the recess 32, as shown in fig. 7, and the sinking grooves 41 are respectively provided in the vicinity of each recess 32, and the depth of the sinking groove 41 is greater than the depth of the recess 32, as shown in fig. 7, so as to extend a hand or tool (such as tweezers) to the lower side of the wafer 1, thereby facilitating the upward removal of the wafer 1. In the present embodiment, a partial region of the sink trench 41 is located inside the recess 32, and a partial region of the sink trench 41 is located outside the recess 32. In practice, a partial region of the countersink 41 is located in a recess 32, while the remaining partial region of the countersink 41 is located outside the recess 32, so that, during the removal of the wafer 1, a hand or tool can be extended into the region of the countersink 41 in the recess 32 via the region of the countersink 41 located outside the recess 32, in order to remove the wafer 1 in the recess 32 smoothly.

The shape of the sink 41 may be determined according to practical requirements, and in practice, the sink 41 may be constructed in a circular structure, a square structure, or the like, as shown in fig. 7. In implementation, the sinking groove 41 may be preferentially configured at the corner of the groove 32, as shown in fig. 7, so as to make full use of the gap between adjacent grooves 32, so that the structure of the carrier 2 is more compact, the utilization rate of the substrate 3 is improved, and the sinking groove 41 with a larger area can be obtained, thereby being more convenient for taking out the wafer 1.

Because the carrier 2 can simultaneously place a plurality of wafers 1, the problem that the wafers 1 are easy to be confused and error is solved, in order to solve the problem that the wafers 1 are convenient to be distinguished during the inspection operation, in a further embodiment, the substrate 3 is further configured with distinguishing marks 42 for distinguishing the grooves 32, so that the grooves 32 are effectively distinguished during the inspection operation by using the distinguishing marks 42, and the purpose of distinguishing the wafers 1 is achieved. In practice, the distinguishing mark 42 may be various embodiments, and for example, the distinguishing mark 42 may be a character, letter, pattern, or the like, which constructs the base body 3, and the distinguishing mark 42 may be formed by machining a groove in the base body 3, or may be formed by machining a boss in the base body 3. In practice, the distinguishing mark 42 may be preferentially constructed as a numerical mark, as shown in fig. 7, to facilitate distinguishing and ordering. In practice, the distinguishing mark 42 may be disposed near the groove 32 or within the groove 32, and in a preferred embodiment, the distinguishing mark 42 may be preferentially configured at the bottom of the sink 41, so as to prevent the distinguishing mark 42 from being blocked by the placed wafer 1, ensure that the distinguishing mark 42 is visible, and can play a role in distinguishing.

Example 3

In order to solve the problem that the negative pressure is still applied to the negative pressure suction hole 33 after the negative pressure is turned off, and the wafer 1 attached to the carrier 2 cannot be removed, the main difference between the embodiment 3 and the embodiment 1 or the embodiment 2 is that in the carrier 2 provided in this embodiment, the side surface of the substrate 3 is further configured with a communication hole 51, as shown in fig. 8 and 9, and the communication hole 51 may be communicated with the negative pressure suction hole 33 through a flow channel 52 configured in the substrate 3, as shown in fig. 10. Meanwhile, a sealing mechanism is further arranged at the communication hole 51 and is used for closing and opening the communication hole 51. In the actual use process, when the sealing mechanism is in a state of closing the communication hole 51, the negative pressure adsorption hole 33 and the flow channel 52 can be in the same negative pressure environment, so that the negative pressure adsorption function is realized by using the negative pressure adsorption hole 33; when the sealing mechanism is in a state of opening the communication hole 51, the negative pressure adsorption hole 33 can be communicated with the outside through the flow channel 52, so that the negative pressure environment at the negative pressure adsorption hole 33 can be effectively destroyed, the negative pressure adsorption function is lost at the negative pressure adsorption hole 33, the wafer 1 in the groove 32 can be easily taken down, and the problem that the wafer 1 adsorbed on the carrier 2 by the negative pressure cannot be taken down can be effectively solved.

The sealing mechanism has various embodiments, for example, the sealing mechanism may include a plug provided in the communication hole 51, and the plug may employ a rubber plug so as to effectively seal the communication hole 51. As another example, the sealing mechanism may include an internal thread formed on the communication hole 51 and a sealing screw 61 adapted to the communication hole 51, as shown in fig. 10 and 11, the sealing screw 61 is screwed to the communication hole 51, so as to seal the communication hole 51 by tightening the sealing screw 61, and the communication between the negative pressure suction hole 33 and the outside may be achieved by loosening the sealing screw 61, thereby achieving the purpose of breaking the negative pressure suction.

In a further embodiment, the annular sealing ring 62 is further disposed in the communication hole 51, so that the sealing screw 61 can contact and press the annular sealing ring 62 in the screwing process, and the annular sealing ring 62 is elastically deformed, so that a better sealing effect is achieved by using the annular sealing ring 62, air leakage can be effectively prevented, and a better negative pressure adsorption effect is facilitated. In a preferred embodiment, as shown in fig. 12 and 13, the inner diameter of the communication hole 51 may be larger than the inner diameter of the flow passage 52, so that a step may be formed between the communication hole 51 and the flow passage 52, the annular seal ring 62 may be disposed at the step and correspond to the end of the seal screw 61, and when the seal screw 61 is tightened, the end of the seal screw 61 may press the annular seal ring 62 against the step, as shown in fig. 12, thereby achieving the sealing effect.

In a more sophisticated version, the back face 35 of the base body 3 is also configured with relief grooves 37, as shown in fig. 9, to avoid collisions and interference with the lines of the back face 35. The back surface 35 of the base body 3 is also configured with a plurality of screw holes 38 as shown in fig. 9, so that a stopper member or the like is mounted with the screw holes 38.

Example 4

The embodiment provides a detection system, including detection module, vacuum pump, above-mentioned carrier 2, wherein, carrier 2 sets up in the position department of adaptation detection module, and carrier 2 is used for bearing wafer 1 to make the wafer 1 of bearing cooperate with detection module, in order to utilize detection module to detect wafer 1. Meanwhile, the vacuum pump may be in communication with the interface 36 through a negative pressure line so as to provide negative pressure to the wafer 1 using the vacuum pump.

In implementation, the detection module may use an existing detection device, for example, the detection module may preferentially use an atomic force microscope, and the carrier 2 may be disposed directly under a lens of the atomic force microscope; of course, other microscopes may be used for the detection module, and are not illustrated here.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model.

Claims (10)

1. The carrier is characterized by comprising a base body, wherein the upper surface of the base body is provided with at least two grooves which are matched with wafers, the bottoms of the grooves are respectively provided with a negative pressure adsorption hole,

the base body is also provided with an interface for communicating a negative pressure pipeline, and the interface is communicated with the negative pressure adsorption hole.

2. The carrier of claim 1, wherein the substrate is configured with at least 3 grooves, and each groove is arranged in an array;

and/or the grooves are configured in a square structure.

3. The carrier of claim 2, wherein the recess is square in configuration;

and/or the thickness of the groove is equal to the thickness of the wafer;

and/or the negative pressure adsorption hole is arranged at the middle position of the groove;

and/or 9 grooves are formed in the substrate, and the 9 grooves are arranged in a 3×3 array.

4. The carrier of claim 1, wherein an internal air passage is formed in the base body, and each negative pressure adsorption hole is respectively communicated with the interface through the internal air passage.

5. The carrier of claim 1, wherein the upper surface of the base is further configured with a sink channel adapted to the recess, the depth of the sink channel being greater than the depth of the recess, a portion of the sink channel being located within the recess and a portion of the sink channel being located outside the recess.

6. The carrier of claim 5, wherein the base is further configured with a distinguishing mark for distinguishing between the grooves.

7. The carrier of claim 6, wherein the sink is configured at a corner of the recess;

and/or the sinking groove is configured into a square structure;

and/or, the distinguishing mark is configured as a digital mark;

and/or the distinguishing mark is constructed at the bottom of the sinking groove.

8. The carrier according to any one of claims 1 to 7, wherein the side face of the base body is constructed with a communication hole which communicates with the negative pressure adsorption hole through a flow passage constructed in the base body, and the communication hole is provided with a sealing mechanism for closing and opening the communication hole.

9. The carrier of claim 8, wherein the sealing mechanism comprises an internal thread formed at the communication hole and a sealing screw adapted to the communication hole, the sealing screw being screwed to the communication hole, the sealing screw being for closing and opening the communication hole.

10. A detection system comprising a detection module and a vacuum pump, characterized in that the detection system further comprises a carrier according to any one of claims 1-9, wherein the carrier is arranged at a position adapted to the detection module, and the vacuum pump is communicated with the interface through a negative pressure pipeline.