CN220352027U

CN220352027U - Die-cutting is with bed hedgehopping sticky tape

Info

Publication number: CN220352027U
Application number: CN202320674008.0U
Authority: CN
Inventors: 顾斌; 吴庆; 胡荣; 孔德峰
Original assignee: Suzhou Linghui Material Technology Co ltd
Current assignee: Suzhou Linghui Material Technology Co ltd
Priority date: 2023-03-30
Filing date: 2023-03-30
Publication date: 2024-01-16
Anticipated expiration: 2033-03-30

Abstract

The utility model provides a die-cutting heightening adhesive tape, which is characterized by comprising a high-modulus film material layer; the two low-modulus film material layers are respectively covered on the upper surface and the lower surface of the high-modulus film material layer; and the two layers of pressure sensitive adhesive layers are coated on the surface of the low-modulus film material layer. The high-strength adhesive tape has the basic characteristics of more simplified structure, easier operation, lower cost, high thickness and high hardness, and easy die cutting.

Description

Die-cutting is with bed hedgehopping sticky tape

Technical Field

The utility model relates to the field of die cutting of electronic elements, in particular to a heightening adhesive tape for die cutting.

Background

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

Based on the current design of electronic products, especially consumer electronic products, gradually develop in the light, small and light directions, the internal structure of the electronic products and various related parts also face increasingly complex processing demands, and the adhesive tape products are also the same. The adhesive tape is mostly used for fixing parts such as FPC, PCB, screen, outer frame, back shell, etc., because the adhesive tape product is easy to die-cut in addition to the advantages of convenient use and stable dosage. Die cutting can refer generally to a way of processing a material by using a die to cut the material into a specific pattern shape, which is very common and important in electronic parts processing, and for adhesive tape materials, it is usually die-cut into a specific shape requiring an adhesive part, and adhered by a manual or mechanical hand. Along with the increasing fineness and the complexity of electronic product structures, the processing requirement of adhesive tape die-cutting pieces is also increasingly improved, the die-cutting size needs to be strictly controlled, meanwhile, due to the fact that the mechanical arm is used for gradually replacing manual operation, the design and the processing of the adhesive tape die-cutting pieces also need to be accurately controlled, and the camera recognition is facilitated, and the mechanical arm can grasp the adhesive tape die-cutting pieces correctly. However, due to the self-material and application requirements, the adhesive tape generally uses softer substrate, especially foam adhesive tapes such as acrylic foam, PE foam, PU foam adhesive tape, etc., and has higher thickness, so that the adhesive tape is more prone to use softer and more elastic substrate rather than hard and brittle substrate, which brings certain difficulty to die cutting of the adhesive tapes, maintaining the original die cutting shape during transportation and precisely controlling the die cutting assembly, and the adhesive tape is a common solution for applications such as screen bonding, etc. which requires extremely precise control of die cutting size and position, thus creating a certain contradiction.

To solve this problem, it is currently common to use a bedding tape as a bedding before die cutting such foam tapes, together. The elevating adhesive tape is a composite adhesive tape, is actually a composite structure formed by accumulating double-sided adhesive tapes of a plurality of layers of PET (polyethylene terephthalate) base materials, has a thickness far greater than that of a common double-sided adhesive tape, is generally 400-450um or more, has certain hardness and supporting performance, and additionally uses a plurality of layers of PET films, and has excellent die-cutting performance, so that when the elevating adhesive tape is used for being attached to an adhesive tape to be die-cut (the middle of the elevating adhesive tape is provided with a protective film structure, see a rear picture) and is jointly subjected to die-cutting treatment, the elevating adhesive tape can be used as a support for maintaining the shape of a die-cut part in the die-cutting part transportation process and the assembly process, and the accuracy of die-cutting and the working efficiency of the die-cutting part attaching transportation are effectively improved.

As shown in fig. 1, the conventional lifting adhesive tape structure and the complete structure of the die-cut piece in the actual assembly at present, but the conventional lifting adhesive tape still has a part of defects to be solved, firstly, the lifting adhesive tape requires high thickness and hardness, so that the multilayer PET double-sided adhesive composite structure is used, the process is very complicated in production, multiple coating and attaching operations are required, and the cost is high. In view of this problem, one idea is to simplify the structure of the raised tape, discard the multilayer PET laminate, use a single layer of high thickness PET as the substrate, but this approach causes two problems: 1, because PET is too thick, the whole cross cutting that is difficult to carry out, 2, high thickness PET also probably can cause the stiffness too high in rewinding, rolling etc. when the coating, the problem of difficult operation, and problem 1 is especially important in these two, consequently how to simplify the structure of the backing adhesive tape, simplify the backing adhesive tape manufacturing process, remain simultaneously again and backing adhesive tape high thickness, high hardness, the cross cutting performance is outstanding simultaneously, the advantage of easy operation handling becomes the key of solving the problem.

It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present utility model and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the utility model section.

Disclosure of Invention

The utility model aims to solve the technical problem of providing the heightening adhesive tape for die cutting, which can enable the heightening adhesive tape to have a more simplified structure, a production process which is easier to operate and lower cost, and simultaneously keep the basic characteristics of high thickness, high hardness and easy die cutting of the heightening adhesive tape.

In order to solve the technical problems, the heightening adhesive tape for die cutting comprises a high-modulus film layer; the two low-modulus film material layers are respectively covered on the upper surface and the lower surface of the high-modulus film material layer; and the two layers of pressure sensitive adhesive layers are coated on the surface of the low-modulus film material layer.

Preferably, the Young modulus of the high-modulus film layer is 2-4GPA, and the thickness is 75-200 um.

Preferably, the high modulus film layer is made of PET material.

Preferably, the Young modulus of the low-modulus film material layer is 0.2-1.3GPA, and the thickness is 10-100 um.

Preferably, the low-modulus film layer is made of PP or PE materials.

Preferably, the thickness of the pressure-sensitive adhesive layer is 15 um-50 um.

Preferably, the low-modulus film material layer is attached to the surface of the high-modulus film material layer in a film coating or curtain coating mode.

By the technical scheme, the utility model has the following beneficial effects:

according to the heightening adhesive tape for die cutting, through improvement of the prior art, firstly, the substrate layer is simplified, and the whole substrate can be bonded by only one-time film coating or curtain coating operation on two sides of a high-modulus core substrate, so that repeated coating and bonding necessary for conventional design are not needed. Similarly, the outer layer adhesive of the original structure is assembled without repeated coating and lamination, and the existing design is improved, so that the coating treatment similar to double-sided adhesive can be directly carried out on the surface of the composite substrate, the process is effectively simplified, and the cost is saved. In addition, as the low modulus layer in the substrate layer is softer, and the design of the core high modulus layer is reserved, after the low modulus layer and the design of the core high modulus layer are combined, even if the overall thickness is higher, the corresponding stiffness and the overall hardness are reserved, and the die-cutting performance is still realized, and therefore the problems of how to reserve the die-cutting performance of the most core in the structural improvement of the cushion adhesive tape and simplifying the structure and the production process are directly solved.

In summary, the improvement of the structure of the bedding adhesive tape for die cutting improves and simplifies the old structure, simplifies the production process and saves the cost when meeting the hardness, stiffness and die cutting performance required by the bedding adhesive tape as an auxiliary piece for die cutting.

Drawings

Fig. 1 is a block diagram of a conventional raised tape construction and die cut pieces in assembly in accordance with the prior art.

Fig. 2 is a structural view of the die-cutting cushion tape of the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, in the description of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

As shown in FIG. 2, the utility model provides a die-cutting backing adhesive tape, which comprises a high-modulus film material layer; the two low-modulus film material layers are respectively covered on the upper surface and the lower surface of the high-modulus film material layer; and the two layers of pressure sensitive adhesive layers are coated on the surface of the low-modulus film material layer.

The manufacturing process of the cushion adhesive tape for die cutting comprises the steps of taking a high-modulus film layer as a substrate core, directly attaching a low-modulus film on the surface of the substrate core, and thus obtaining a high-modulus and low-modulus composite substrate layer, wherein the low-modulus film layer can be attached by using a film coating or curtain coating process. And coating pressure-sensitive adhesive layers on the two sides of the high-modulus and low-modulus composite substrate layer.

In a preferred embodiment, the high modulus film layer has a Young's modulus in the range of 2-4GPA and a center substrate layer thickness in the range of 75-200 um, optionally made of PET material. The Young modulus of the low-modulus film layer is in the range of 0.2-1.3GPA, the thickness of the low-modulus film layer is 10-100 um, and the low-modulus film layer can be made of PP or PE materials. The thickness of the pressure-sensitive adhesive layer is 15 um-50 um, and the 180 DEG surface stripping force at normal temperature reaches 600-1200gf/in range

The above-described embodiments are merely preferred embodiments for fully explaining the present utility model, and the scope of the present utility model is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present utility model, and are intended to be within the scope of the present utility model. The protection scope of the utility model is subject to the claims.

Claims

1. A heightening adhesive tape for die cutting is characterized in that the heightening adhesive tape comprises,

a high modulus film layer;

the two low-modulus film material layers are respectively covered on the upper surface and the lower surface of the high-modulus film material layer;

and the two layers of pressure sensitive adhesive layers are coated on the surface of the low-modulus film material layer.

2. The die-cut cushion adhesive tape according to claim 1, wherein the high modulus film layer has a young's modulus of 2-4GPA and a thickness of 75-200 um.

3. The elevating die-cut adhesive tape according to claim 2, wherein the high modulus film layer is made of PET material.

4. The die-cut cushion tape according to claim 1, wherein the young's modulus of the low-modulus film layer is 0.2-1.3GPA and the thickness is 10-100 um.

5. The elevating die-cut adhesive tape according to claim 4, wherein the low modulus film layer is made of PP or PE material.

6. The elevating die-cutting adhesive tape according to claim 1, wherein the thickness of the pressure-sensitive adhesive layer is 15um to 50um.

7. The elevating die-cutting adhesive tape according to claim 4, wherein the low modulus film layer is adhered to the surface of the high modulus film layer by film coating or curtain coating.