CN220341199U

CN220341199U - Wafer lifting mechanism

Info

Publication number: CN220341199U
Application number: CN202321201554.9U
Authority: CN
Inventors: 韩一波; 沈杰; 朱林奎
Original assignee: Hangzhou Xieto Machinery Manufacturing Co ltd
Current assignee: Hangzhou Xieto Machinery Manufacturing Co ltd
Priority date: 2023-05-15
Filing date: 2023-05-15
Publication date: 2024-01-12
Anticipated expiration: 2033-05-15

Abstract

The utility model discloses a wafer lifting mechanism which comprises a lifting rod and a supporting circular plate, wherein the top end of the lifting rod is fixedly provided with the supporting circular plate, the inside of the supporting circular plate is provided with a size adjusting groove, the inner wall of the supporting circular plate is provided with a positioning hole, the top surface of the supporting circular plate is provided with a limit sliding groove, the inside of the size adjusting groove is provided with a supporting straight plate, the supporting straight plate penetrates through the frame of the lifting rod, the top surface of the outer end of the supporting straight plate is fixedly provided with the lifting circular plate, the top surface of the lifting circular plate is provided with a protection circular gasket, the inside of the inner end of the supporting straight plate is provided with a storage hole, and the inside of the storage hole is provided with a spring and a positioning column. According to the wafer lifting mechanism, after the straight rod is pressed manually, the straight rod is pulled, so that the supporting straight plate can be subjected to positioning release and sliding adjustment, the operation steps are simple and quick, and after the straight rod is released subsequently, the elastic force of the spring to the positioning column can be used for pushing the automatic clamping alignment.

Description

Wafer lifting mechanism

Technical Field

The utility model relates to the technical field of CVD equipment components, in particular to a wafer lifting mechanism.

Background

CVD apparatus are used for semiconductor processing, wherein the overall apparatus includes various mechanisms and components, wherein the mechanisms are available for lifting wafer workpieces, but the wafer lifting mechanisms currently on the market still have the following problems:

because of the in-process that the wafer processed, through putting behind the firm wafer, follow-up going up and down, holistic support area of putting can lead to the support area of putting to take place to rock when the too big back of wafer whole diameter, influences the stability of putting.

Aiming at the problems, innovative design is carried out on the basis of the original wafer lifting mechanism.

Disclosure of Invention

The utility model aims to provide a wafer lifting mechanism, which solves the problem that in the conventional wafer lifting mechanism on the market, the problem that the stability of placement is affected because the placement support area is rocked after the whole placement support area is too large in diameter after the wafer is stably placed and lifted later in the process of processing the wafer.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a wafer lifting mechanism, includes lifter and support plectane, the top fixed mounting of lifter has the support plectane, and the inside of supporting the plectane is provided with the size adjustment groove, the locating hole has been seted up to the inner wall of support plectane, and the spacing spout has been seted up to the top surface of supporting the plectane, the internally mounted in size adjustment groove has the support straight board, and supports the frame that the straight board passed the lifter, the outer end top surface fixed mounting of support straight board has the lift plectane, and the top surface of lifting the plectane is provided with the protection round gasket, the inner inside of support straight board is provided with the storage hole, and the internally mounted in storage hole has spring and reference column, and the spring is located the below of reference column to the reference column passes support straight board and locating hole interconnect, the straight-bar is installed at the top surface center of reference column, and the straight-bar passes spacing spout.

Preferably, the size adjusting groove is communicated with the positioning hole and the limiting chute, and the size adjusting groove and the limiting chute are distributed on the supporting circular plate at equal angles.

Preferably, the support straight plate is connected with the size adjustment groove in a sliding manner, and the length of the support straight plate is greater than that of the size adjustment groove.

Preferably, the lifting circular plate and the protection circular gasket are connected in an adhesive mode, and the protection circular gasket is distributed on the lifting circular plate at equal angles.

Preferably, the positioning column and the support straight plate form a telescopic structure through the spring and the storage hole.

Preferably, the connection mode of the positioning column and the positioning hole is clamping connection.

Preferably, the straight rod and the positioning column are connected in a threaded manner, and the diameter of the straight rod is smaller than that of the positioning column.

Preferably, the straight rod is connected with the limiting chute in a sliding manner.

Compared with the prior art, the utility model has the beneficial effects that: the wafer lifting mechanism comprises a wafer lifting mechanism and a wafer lifting mechanism,

1. after the wafers are stably placed, the lifting operation is performed through the lifting rods through the lifting circular plate and the protection wafer gaskets arranged on the supporting straight plate, the position of the supporting straight plate can be adjusted on the supporting circular plate through the size adjusting grooves, the whole wafer placing machine can be properly adjusted according to the diameter of the wafers, and the placing stability is kept;

2. after the straight rod is manually pressed, the straight rod is pulled, the supporting straight plate can be subjected to positioning release and sliding adjustment, the operation steps are simple and quick, and after the straight rod is subsequently loosened, the elastic force of the spring to the positioning column can be used for pushing the automatic clamping alignment.

Drawings

FIG. 1 is a schematic view of the overall three-dimensional structure of the present utility model;

FIG. 2 is a schematic view of a three-dimensional structure of a supporting circular plate according to the present utility model;

FIG. 3 is a schematic view of a cross-sectional perspective structure of a supporting circular plate according to the present utility model;

FIG. 4 is a schematic view of the inner end of the support plate of the present utility model.

In the figure: 1. a lifting rod; 2. supporting a circular plate; 3. a size adjustment groove; 4. positioning holes; 5. limiting sliding grooves; 6. supporting the straight plate; 7. lifting the circular plate; 8. a protective round gasket; 9. a receiving hole; 10. a spring; 11. positioning columns; 12. a straight rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a wafer lifting mechanism, including lifter 1 and support plectane 2, the top fixed mounting of lifter 1 has support plectane 2, and the inside of support plectane 2 is provided with size adjustment groove 3, locating hole 4 has been seted up to the inner wall of support plectane 2, and spacing spout 5 has been seted up to the top surface of support plectane 2, the internally mounted in size adjustment groove 3 has support straight board 6, and support straight board 6 passes the frame of lifter 1, the outer end top surface fixed mounting of support straight board 6 has lift plectane 7, and the top surface of lift plectane 7 is provided with protection circular gasket 8, the inner inside of support straight board 6 is provided with accomodates hole 9, and accomodate hole 9's internally mounted has spring 10 and reference column 11, and spring 10 is located the below of reference column 11, and reference column 11 passes support straight board 6 and locating hole 4 interconnect, straight-bar 12 is installed at the top surface center of reference column 11, and straight-bar 12 passes spacing spout 5.

The size adjusting groove 3 is communicated with the positioning hole 4 and the limiting chute 5, and the size adjusting groove 3 and the limiting chute 5 are distributed on the supporting circular plate 2 at equal angles, so that follow-up integral adjustment and fixed operation butt joint work are facilitated.

The support straight plate 6 and the size adjustment groove 3 are connected in a sliding mode, the length of the support straight plate 6 is larger than that of the size adjustment groove 3, the support straight plate 6 can slide and shift, and proper pairing work is carried out according to the diameter of a wafer.

The lifting circular plate 7 and the protection circular gasket 8 are connected in an adhesive mode, the protection circular gaskets 8 are distributed on the lifting circular plate 7 at equal angles, and the protection circular gaskets 8 are arranged on the lifting circular plate 7 in pairs, so that the stability of placing wafers is improved.

The positioning column 11 and the supporting straight plate 6 form a telescopic structure through the spring 10 and the containing hole 9, and the positioning column 11 can be pushed by the elastic force of the spring 10 to keep upward thrust, so that the automatic sliding and the docking are convenient.

The positioning column 11 is connected with the positioning hole 4 in a clamping way, and the adjusted position of the support straight plate 6 can be fixed through the clamping butt joint of the positioning column 11 and the positioning hole 4.

The straight rod 12 is in threaded fixation with the positioning column 11, and the diameter of the straight rod 12 is smaller than that of the positioning column 11, so that the straight rod 12 and the positioning column 11 can be assembled and fixed conveniently, and meanwhile, the clamping and butt joint stability of the positioning column 11 is kept.

The straight rod 12 is connected with the limiting chute 5 in a sliding manner, and the straight rod 12 can drive the supporting straight plate 6 to carry out sliding adjustment through the positioning column 11 by poking the straight rod 12.

Working principle: according to fig. 1-4, can put the wafer and steadily put on the protection round gasket 8 of lifting the plectane 7 top surface, protection round gasket 8 improves the frictional force of putting, follow-up start lifter 1 drives and supports plectane 2 and go up and down, thereby can drive the wafer of putting and go up and down, when the operation is put to the wafer of different diameters to the needs, can manual press down straight-bar 12, straight-bar 12 drives reference column 11 and contracts, reference column 11 slides completely into accomodate hole 9, reference column 11 promotes spring 10 and contracts, simultaneously reference column 11 carries out sliding separation with locating hole 4, the location of supporting straight-bar 6 is removed, follow-up stirring straight-bar 12, straight-bar 12 carries out sliding displacement through spacing spout 5, simultaneously straight-bar 12 drives through reference column 11 and supports straight-bar 6 and carries out sliding displacement through size adjustment groove 3, support straight-bar 6 drives and lifts plectane 7 and go on moving, the circular diameter adjustment that the plectane 7 constitutes, follow-up loosen 12, make reference column 11 slide into the locating hole 4 through spring force automatic snap-in through the spring 10 and fix, the convenience is firm, the work process that just is whole device, and the straight-bar 12 is not all well known in the technical specification in the prior art.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer lifting mechanism, includes lifter (1) and supports plectane (2), its characterized in that: the top fixed mounting of lifter (1) has support plectane (2), and the inside of supporting plectane (2) is provided with size adjustment groove (3), locating hole (4) have been seted up to the inner wall of supporting plectane (2), and limit chute (5) have been seted up to the top surface of supporting plectane (2), the internally mounted of size adjustment groove (3) has support straight bar (6), and supports straight bar (6) and pass the frame of lifter (1), the outer end top surface fixed mounting of support straight bar (6) has lifts plectane (7), and lifts the top surface of plectane (7) and be provided with protection circular gasket (8), the inner inside of support straight bar (6) is provided with accomodates hole (9), and accomodates the internally mounted of hole (9) has spring (10) and reference column (11), and spring (10) are located the below of reference column (11), and reference column (11) pass support straight bar (6) and locating hole (4) interconnect, the top surface center of reference column (11) installs straight bar (12), and straight bar (12) pass limit chute (5).

2. A wafer lift mechanism as recited in claim 1 wherein: the size adjusting groove (3) is communicated with the positioning hole (4) and the limiting chute (5), and the size adjusting groove (3) and the limiting chute (5) are distributed on the supporting circular plate (2) at equal angles.

3. A wafer lift mechanism as recited in claim 1 wherein: the support straight plate (6) is connected with the size adjusting groove (3) in a sliding mode, and the length of the support straight plate (6) is larger than that of the size adjusting groove (3).

4. A wafer lift mechanism as recited in claim 1 wherein: the lifting circular plate (7) is connected with the protection circular gasket (8) in an adhesive mode, and the protection circular gasket (8) is distributed on the lifting circular plate (7) at equal angles.

5. A wafer lift mechanism as recited in claim 1 wherein: the positioning column (11) and the supporting straight plate (6) form a telescopic structure through the spring (10) and the containing hole (9).

6. A wafer lift mechanism as recited in claim 1 wherein: the positioning column (11) is connected with the positioning hole (4) in a clamping connection mode.

7. A wafer lift mechanism as recited in claim 1 wherein: the straight rod (12) and the positioning column (11) are connected in a threaded mode, and the diameter of the straight rod (12) is smaller than that of the positioning column (11).

8. A wafer lift mechanism as recited in claim 1 wherein: the straight rod (12) is connected with the limiting chute (5) in a sliding manner.