CN220340566U

CN220340566U - Quick docking controller suitable for maximum 8Bit input and output sensor

Info

Publication number: CN220340566U
Application number: CN202321675209.9U
Authority: CN
Inventors: 祁文; 刘常伦; 孙成祥
Original assignee: Zhejiang Sineva Intelligent Technology Co ltd
Current assignee: Zhejiang Sineva Intelligent Technology Co ltd
Priority date: 2023-06-28
Filing date: 2023-06-28
Publication date: 2024-01-12
Anticipated expiration: 2033-06-28

Abstract

The utility model discloses a fast docking controller suitable for maximum 8Bit input and output sensors, which can realize fast docking of the sensors and transmit read data in various communication protocols. The device comprises an input isolation module, an output isolation module, a microcontroller, a communication module and a DB25 connector; the input isolation module is used for isolating signals input to the DB25 connector and transmitting the signals to the microcontroller; the output isolation module is used for isolating the microcontroller signal and then transmitting the isolated signal to the DB25 connector for output; the microcontroller is used for sending the sensor data to the upper computer through the communication module when receiving the data; when data is transmitted, the data to be transmitted is read from the external equipment through the communication module, and the data is transmitted to the sensor; the communication module is used for communication between the microcontroller and external equipment.

Description

Quick docking controller suitable for maximum 8Bit input and output sensor

Technical Field

The utility model relates to the butt joint of sensor input and output, in particular to a quick butt joint controller suitable for maximum 8Bit input and output sensors.

Background

The controller is a machine which can receive other equipment information and send out corresponding instructions to control equipment and communicate with the upper computer. In the semiconductor field, the existing controller is an integrated controller, which is based on a butt joint controller, transmits signals to OHV and AGV equipment, compares the signals with the previous data in a database, and alarms if abnormality occurs.

The existing controller is only suitable for the semiconductor application scene of the E84 interface, the number of the interfaces is small, the communication protocol is single, and the adaptation scene of the controller is small. Particularly, the sensor for 8 paths of digital quantity input and 8 paths of digital quantity output has the problems of complicated wiring in the assembly process, and the problems of small application range, low reaction speed and the like caused by mismatching of communication protocols.

Disclosure of Invention

The utility model aims to: in order to overcome the defects in the prior art, the utility model provides a quick docking controller suitable for maximum 8Bit input and output sensors. The sensor can be quickly docked, and the read data can be transmitted out in various communication protocols.

The technical scheme is as follows: in order to achieve the above purpose, the utility model comprises an input isolation module, an output isolation module, a microcontroller, a communication module and a DB25 connector; the input isolation module is used for isolating signals input to the DB25 connector and transmitting the signals to the microcontroller; the output isolation module is used for isolating the microcontroller signal and then transmitting the isolated signal to the DB25 connector for output; the microcontroller is used for sending the sensor data to the upper computer through the communication module when receiving the data; when data is transmitted, the data to be transmitted is read from the external equipment through the communication module, and the data is transmitted to the sensor; the communication module is used for communication between the microcontroller and external equipment.

Further, the power supply module is used for supplying power to the microcontroller and the communication module.

Furthermore, the power module comprises a 24V direct current power supply, a triode Q1 and a PMOS tube Q2, wherein the power anode of the 24V direct current power supply is grounded through a series circuit consisting of a resistor R1 and a zener diode D1.

The common point of the resistor R1 and the voltage stabilizing diode D1 is connected with the base electrode of the triode Q1 through a resistor R2, the emitter electrode of the triode Q1 is connected with the positive electrode of a power supply of a 24V direct current power supply, and the collector electrode of the triode Q1 is grounded through a resistor R4; a zener diode D2 is connected between the base electrode and the emitter electrode of the triode Q1, and a resistor R3 and a capacitor C2 are connected between the collector electrode and the emitter electrode of the triode Q1 in parallel; the emitter of transistor Q1 is also grounded via capacitor C1.

The source electrode of the PMOS tube Q2 is connected with the power supply anode of the 24V direct current power supply, the grid electrode of the PMOS tube Q2 is grounded through a resistor R4, and the drain electrode of the PMOS tube Q2 serving as the output of the power supply module is grounded through two parallel capacitors C3 and C4.

Further, the microcontroller is respectively connected with the input isolation module, the output isolation module and the communication module, and the input isolation module and the output isolation module are connected with the DB25 connector.

Further, the input isolation module comprises a chip 74HC14D, 7 pins of the chip 74HC14D are grounded, and 14 pins of the chip 74HC14D are connected with a 3.3V power supply anode; the input ends of the 1, 3, 5, 9, 11 and 13 pins of the chip 74HC14D serving as input isolation modules are respectively connected with the output pins of the sensor through respective optocouplers, and the output ends of the 2, 4, 6, 8, 10 and 12 pins of the chip 74HC14D serving as input isolation modules are connected with the microcontroller.

Further, the optocoupler adopts a chip PS2801C, a 1 pin of the chip PS2801C is connected to a 5V power supply positive electrode, a sensor output pin is connected to a 2 pin of the chip PS2801C through a serial circuit formed by a first diode (D1) and a first resistor (R2), a second resistor (R1) is connected between the 1 pin and the 2 pin of the chip PS2801C, a 4 pin of the chip PS2801C is connected to a 3.3V power supply positive electrode, and a 3 pin of the chip PS2801C is connected to a corresponding input end of the chip 74HC14D through a third resistor (R3); the 3 pin of the chip PS2801C is grounded through a fourth resistor (R4), and the fourth resistor (R4) is connected in parallel with the first capacitor (C2).

Further, the output isolation module comprises a plurality of groups of output isolation units, wherein the input end of each group of output isolation units is connected to the output pin of the microcontroller, and the output end of each group of output isolation units is connected to the input pin of the sensor; (each input pin of the sensor corresponds to a set of output isolation cells).

Each group of output isolation units have the same structure and comprise an optocoupler IS281-4, an NMOS tube WST4040 and a TVS tube D1, wherein a 1 pin of the optocoupler IS281-4 IS connected with the positive electrode of a 3.3V power supply, and a 2 pin of the optocoupler IS281-4 IS connected with an output pin of the microcontroller through a fifth resistor (R1); the 4 pin of the optocoupler IS281-4 IS connected with the positive electrode of the 5V power supply, the 3 pin of the optocoupler IS281-4 IS connected with the grid electrode of the NMOS tube WST4040 through a sixth resistor (R2), and a seventh resistor (R3) IS connected in parallel between the grid electrode and the source electrode; the source electrode of the NMOS tube WST4040 is connected with GND, and the drain electrode of the NMOS tube WST4040 is connected with the input end of the sensor; the drain electrode and the source electrode of the NMOS tube WST4040 are connected with a TVS tube D1 in parallel to realize ESD protection.

Further, in the DB25 connector, pin1-Pin8 and Pin10-Pin11 are used as output pins, pin12 and Pin14-Pin21 are used as input pins, pin22 and Pin23 are used as 24V power outputs, and Pin24 is used as GND.

Further, the external device comprises an upper computer.

Further, the communication module comprises an Ethernet module, a CAN module, an RS485 module and an RS232 module, wherein the Ethernet module, the CAN module, the RS485 module and the RS232 module are respectively connected with the microcontroller.

The beneficial effects are that: the utility model can quickly dock the 8-path digital quantity input and 8-path digital quantity output sensors, convert the read sensor data into various communication protocols and transmit the communication protocols to external equipment such as an upper computer and the like.

Drawings

Fig. 1 is a functional block diagram of a quick docking controller of the sensor of the present utility model.

Fig. 2 is a circuit diagram of an output isolation module of the present utility model.

Fig. 3 is a circuit diagram of an input isolation module of the present utility model.

Fig. 4 is a circuit diagram of a power module of the present utility model.

Fig. 5 is a schematic diagram of a DB25 connector of embodiment 1.

Fig. 6 is a controller interface schematic diagram of embodiment 2.

In the figure, 1 is an RJ45 interface, 2 is a communication and power interface, and 3 is a buckle.

Detailed Description

The utility model will be further described with reference to the accompanying drawings.

As shown in fig. 1, the utility model comprises an input isolation module, an output isolation module, a microcontroller, a communication module and a DB25 connector; the input isolation module is used for isolating signals input to the DB25 connector and transmitting the signals to the microcontroller. The output isolation module is used for isolating the microcontroller signal and transmitting the signal to the DB25 connector for output. The microcontroller is used for sending the sensor data to the upper computer through the communication module when receiving the data; when data is transmitted, the data to be transmitted is read from the external equipment through the communication module, and the data is transmitted to the sensor. The communication module is used for communication between the microcontroller and external equipment. The external equipment comprises an upper computer.

Specifically, the microcontroller is respectively connected with the input isolation module, the output isolation module and the communication module, and the input isolation module and the output isolation module are connected with the DB25 connector. The communication module comprises an Ethernet module, a CAN module, an RS485 module and an RS232 module, wherein the Ethernet module, the CAN module, the RS485 module and the RS232 module are respectively connected with the microcontroller.

In a first preferred embodiment, as shown in fig. 4, the portable electronic device further comprises a power module, wherein the power module is used for supplying power to the microcontroller and the communication module. The power module comprises a 24V direct current power supply, a triode Q1 and a PMOS tube Q2, wherein the power anode of the 24V direct current power supply is grounded through a series circuit consisting of a resistor R1 and a zener diode D1. The common point of the resistor R1 and the voltage stabilizing diode D1 is connected with the base electrode of the triode Q1 through a resistor R2, the emitter electrode of the triode Q1 is connected with the positive electrode of a power supply of a 24V direct current power supply, and the collector electrode of the triode Q1 is grounded through a resistor R4; a zener diode D2 is connected between the base electrode and the emitter electrode of the triode Q1, and a resistor R3 and a capacitor C2 are connected between the collector electrode and the emitter electrode of the triode Q1 in parallel; the emitter of transistor Q1 is also grounded via capacitor C1. The source electrode of the PMOS tube Q2 is connected with the power supply anode of the 24V direct current power supply, the grid electrode of the PMOS tube Q2 is grounded through a resistor R4, and the drain electrode of the PMOS tube Q2 serving as the output of the power supply module is grounded through two parallel capacitors C3 and C4.

Specifically, the overload protection and reverse connection prevention of the power supply input are realized by diodes D1 and D2, a triode Q1 and a PMOS tube Q2; d1 is a zener diode, which has a nominal value of 28V. When the input voltage is greater than 28V, D1 is turned on, the base voltage of transistor Q1 becomes 28V, and Q1 is turned on. The grid electrode and the source electrode of the PMOS tube Q2 have the same voltage, the Q2 is turned off, and the VDD_DCIN has no voltage. When the power supply is reversely connected, the voltage difference between the Q2 grid electrode and the source electrode is 24V, the PMOS tube is turned off, and the VDD_DCIN has no voltage.

In a second preferred embodiment, as shown in fig. 3, the input isolation module includes a chip 74HC14D, the 7 pin of the chip 74HC14D is grounded, and the 14 pin of the chip 74HC14D is connected to the 3.3V power supply anode; the input ends of the 1, 3, 5, 9, 11 and 13 pins of the chip 74HC14D serving as input isolation modules are respectively connected with the output pins of the sensor through respective optocouplers, and the output ends of the 2, 4, 6, 8, 10 and 12 pins of the chip 74HC14D serving as input isolation modules are connected with the microcontroller.

The optocoupler adopts a chip PS2801C, a 1 pin of the chip PS2801C is connected with a 5V power supply anode, a sensor output pin is connected to a 2 pin of the chip PS2801C through a serial circuit consisting of a first diode D1 and a first resistor R2, a second resistor R1 is connected between the 1 pin and the 2 pin of the chip PS2801C, a 4 pin of the chip PS2801C is connected with a 3.3V power supply anode, and a 3 pin of the chip PS2801C is connected to a corresponding input end of a chip 74HC14D through a third resistor R3; the 3 pin of the chip PS2801C is grounded through a fourth resistor R4, and the fourth resistor R4 is connected in parallel to a first capacitor C2.

Specifically, the input isolation circuit is composed of a diode D1, an optocoupler U1 and an inverter U2. The anode of the optocoupler is connected with a 5V power supply. The cathode is connected to the anode of the diode D1 through a resistor R2 and pulled up to 5V using R1, and connected to the output pin of the sensor after passing through the diode. The collector is connected to a 3.3V power supply. The emitter is connected to the inverter via resistor R3 while resistors R4 and C1 are connected in parallel. The output of the inverter is connected to the input pin of the microcontroller through a resistor R5. When the sensor output signal is low, diode D1 and optocoupler U1 are on. The input end of the inverter U2 is at a high level, and the output end of the inverter U2 is connected to the input pin of the microcontroller and is at a low level. When the output signal of the sensor is in a high level or high resistance state, the diode is cut off, the cathode of the optocoupler is pulled up to 5V through the resistor, and the optocoupler is turned off. Inverter U2 is pulled down to GND through resistor R4, with the input low and the output high. C1 and C2 are used for decoupling.

In a third preferred embodiment, as shown in fig. 2, the output isolation module includes multiple groups of output isolation units, wherein, the input end of each group of output isolation units is connected to the output pin of the microcontroller, and the output end of each group of output isolation units is connected to the input pin of the sensor; (each input pin of the sensor corresponds to a set of output isolation cells); each group of output isolation units have the same structure and comprise an optocoupler IS281-4, an NMOS tube WST4040 and a TVS tube D1, wherein the 1 pin of the optocoupler IS281-4 IS connected with the positive electrode of a 3.3V power supply, and the 2 pin of the optocoupler IS281-4 IS connected with the output pin of the microcontroller through a fifth resistor R1; the 4 pin of the optocoupler IS281-4 IS connected with the positive electrode of the 5V power supply, the 3 pin of the optocoupler IS281-4 IS connected with the grid electrode of the NMOS tube WST4040 through a sixth resistor R2, and a seventh resistor R3 IS connected in parallel between the grid electrode and the source electrode; the source electrode of the NMOS tube WST4040 is connected with GND, and the drain electrode of the NMOS tube WST4040 is connected with the input end of the sensor; the drain electrode and the source electrode of the NMOS tube WST4040 are connected with a TVS tube D1 in parallel to realize ESD protection.

Specifically, the output isolation circuit IS281-4 optocouplers U1, WT4040 NMOS transistor Q1 and BV24V TVS transistor D1. The anode of the optocoupler is connected with a 3.3V power supply. The cathode is connected with the output pin of the microcontroller through a resistor R1. The collector is connected to a 5V power supply. The emitter is connected with the grid electrode of the NMOS tube Q1 through a resistor R2, and a resistor R3 is connected in parallel between the grid electrode and the source electrode. The source of Q1 is connected to GND. The drain electrode is connected with the input end of the sensor, and the TVS tube D1 is connected in parallel to realize ESD protection. When the output of the microcontroller is at a low level, the optocoupler is conducted, the grid electrode of the NMOS tube is communicated with 5V, the NMOS tube is conducted, and the drain electrode outputs a low level. When the output pin of the microcontroller is in a high level or high resistance state, the optocoupler is turned off, the grid electrode of the NMOS tube is pulled down to GND through a resistor R3, and the NMOS tube is not conducted. When the resistor R4 is welded, the input pin of the sensor is 24V, and when the resistor R4 is not welded, the input pin of the sensor is in a high-resistance state.

In the DB25 connector of embodiment 1, pin1-Pin8, pin10-Pin11 are the output pins, pin12, pin14-Pin21 are the input pins, pin22 and Pin23 are the 24V power outputs, and Pin24 is the GND ground. As shown in fig. 5, the sensor end of the controller may be connected by two dual DB25 connectors, with Pin1-Pin8 and Pin10-Pin11 of each connector being provided as output pins. Pin12, pin14-Pin21 are provided as input pins. Pin22 and Pin23 are 24V power outputs, and Pin24 is GND. All input and output points are isolated through an optical coupler, and the input is effective at low level and maximally supports 100V voltage. The output is 0V or 24V selectable.

Embodiment 2, the controller provides an 18Pin connector for power supply and external communication of the controller. The device comprises a 24V power input, an RS232 interface, an RS-485 interface and a CAN interface. In addition, 2 SPI output interfaces and 2 5V output interfaces are provided, and 2 low-level effective IO outputs are used for connecting the relay. The 24V power supply provides reverse connection prevention and overvoltage protection. As shown in fig. 6, the controller also has an RJ45 interface supporting 10Mbps (10 BASE-T) and 100Mbps (100 BASE-TX) operation. The RJ45 is provided with a yellow-green LED lamp, the yellow LED is used for indicating the connection state, and the green LED is used for indicating the speed. The controller is provided with a metal buckle for being fixed on a metal guide rail of the using equipment, and the installation is convenient.

In summary, the working process of the controller is as follows: the input/output isolation module is realized by an optocoupler. When the sensor outputs data, the optocoupler is conducted, the input pin of the inverter is changed from low level to high level, the output of the inverter is changed from high level to low level, and the output of the inverter is input to the microcontroller. When the microcontroller inputs data to the sensor, the optocoupler is turned on, the grid electrode of the output control NMOS tube is turned from low level to high level, the NMOS tube is turned on, and the low level is transmitted to the sensor. The RS232 chip is connected to the microcontroller through the serial port 3, and the RS-485 chip is connected to the microcontroller through the serial port 1. The CAN chip is connected to the micro-controlled CAN1 TX and CAN1 RX, and the data interfaces converted by the CAN chip are all connected to the CODE terminal female base on the board. The Ethernet chip is connected to the microcontroller through the RMII and externally connected to the RJ45 interface.

In operation, the sensor is connected to the pin of the microcontroller through the DB25 connector. When the data is required to be received, the microcontroller reads the state of the register of the corresponding pin to obtain the data of the sensor. And then converting the sensor data into a required format and transmitting the sensor data to an upper computer. When data is required to be sent, the microcontroller reads the data required to be sent from the upper computer, changes the state of a register of a corresponding pin and sends the data to the sensor.

The utility model has the advantages that:

1. the assembly difficulty between the sensor and the controller is reduced, and the possibility of wiring errors is effectively avoided.

2. The maximum support is to use 8 digital quantity input and 8 digital quantity output sensors. At present, the method is applied to the field of semiconductors and the field of digital displays. The controller has wide application range, is not only suitable for the semiconductor field, but also can be applied to other digital display industries.

3. And a plurality of communication modes are provided, and the application range is wide.

4. The singlechip is used as a controller, so that the reaction speed is high.

5. The overvoltage protection and reverse connection prevention functions of the power supply are supported.

6. The utility model uses a microcontroller with 2 DB25 interfaces to the sensor side. All sensors using 8 digital inputs and 8 digital outputs can be connected and can be used as an IO controller that maximally supports 20 outputs and 18 inputs when no sensor is connected. The application range is increased. In addition, the controller supports various communication protocols, meets various communication requirements, including CAN-BUS, RS232, RS-485 and Ethernet, and CAN be suitable for a multi-purpose application scene.

The foregoing is only a preferred embodiment of the utility model, it being noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present utility model, and such modifications and adaptations are intended to be comprehended within the scope of the utility model.

Claims

1. A fast docking controller suitable for maximum 8Bit input and output sensors comprises an input isolation module, an output isolation module, a microcontroller, a communication module and a DB25 connector; the method is characterized in that: the input isolation module is used for isolating signals input to the DB25 connector and transmitting the signals to the microcontroller;

the output isolation module is used for isolating the microcontroller signal and then transmitting the isolated signal to the DB25 connector for output;

the microcontroller is used for sending the sensor data to the upper computer through the communication module when receiving the data; when data is transmitted, the data to be transmitted is read from the external equipment through the communication module, and the data is transmitted to the sensor;

the communication module is used for communication between the microcontroller and external equipment.

2. The docking controller of claim 1, wherein: the power supply module is used for supplying power to the microcontroller and the communication module.

3. The docking controller of claim 2, wherein: the power supply module comprises a 24V direct current power supply, a triode Q1 and a PMOS tube Q2, wherein the power supply anode of the 24V direct current power supply is grounded through a series circuit consisting of a resistor R1 and a zener diode D1;

the common point of the resistor R1 and the voltage stabilizing diode D1 is connected with the base electrode of the triode Q1 through a resistor R2, the emitter electrode of the triode Q1 is connected with the positive electrode of a power supply of a 24V direct current power supply, and the collector electrode of the triode Q1 is grounded through a resistor R4; a zener diode D2 is connected between the base electrode and the emitter electrode of the triode Q1, and a resistor R3 and a capacitor C2 are connected between the collector electrode and the emitter electrode of the triode Q1 in parallel; the emitter of the triode Q1 is grounded through a capacitor C1;

4. A docking controller according to any one of claims 1-3, characterized in that: the microcontroller is respectively connected with the input isolation module, the output isolation module and the communication module, and the input isolation module and the output isolation module are connected with the DB25 connector.

5. A docking controller according to any one of claims 1-3, characterized in that: the input isolation module comprises a chip 74HC14D, 7 pins of the chip 74HC14D are grounded, and 14 pins of the chip 74HC14D are connected with a 3.3V power supply anode;

the input ends of the 1, 3, 5, 9, 11 and 13 pins of the chip 74HC14D serving as input isolation modules are respectively connected with the output pins of the sensor through respective optocouplers, and the output ends of the 2, 4, 6, 8, 10 and 12 pins of the chip 74HC14D serving as input isolation modules are connected with the microcontroller.

6. The docking controller of claim 5, wherein: the optocoupler adopts a chip PS2801C, wherein a 1 pin of the chip PS2801C is connected with a 5V power supply anode, a sensor output pin is connected to a 2 pin of the chip PS2801C through a serial circuit consisting of a first diode and a first resistor, a second resistor is connected between the 1 pin and the 2 pin of the chip PS2801C, a 4 pin of the chip PS2801C is connected with a 3.3V power supply anode, and a 3 pin of the chip PS2801C is connected to a corresponding input end of a chip 74HC14D through a third resistor; the 3 pin of the chip PS2801C is grounded through a fourth resistor, which is connected in parallel with the first capacitor.

7. A docking controller according to any one of claims 1-3, characterized in that: the output isolation module comprises a plurality of groups of output isolation units, the input end of each group of output isolation units is connected to the output pin of the microcontroller, and the output end of each group of output isolation units is connected to the input pin of the sensor;

each group of output isolation units have the same structure and comprise an optocoupler IS281-4, an NMOS tube WST4040 and a TVS tube D1, wherein the 1 pin of the optocoupler IS281-4 IS connected with the positive electrode of a 3.3V power supply, and the 2 pin of the optocoupler IS281-4 IS connected with the output pin of the microcontroller through a fifth resistor; the 4 pin of the optocoupler IS281-4 IS connected with the positive electrode of the 5V power supply, the 3 pin of the optocoupler IS281-4 IS connected with the grid electrode of the NMOS tube WST4040 through a sixth resistor, and a seventh resistor IS connected in parallel between the grid electrode and the source electrode; the source electrode of the NMOS tube WST4040 is connected with GND, and the drain electrode of the NMOS tube WST4040 is connected with the input end of the sensor; the drain electrode and the source electrode of the NMOS tube WST4040 are connected with a TVS tube D1 in parallel to realize ESD protection.

8. A docking controller according to any one of claims 1-3, characterized in that: in the DB25 connector, pin1-Pin8 and Pin10-Pin11 are used as output pins, pin12 and Pin14-Pin21 are used as input pins, pin22 and Pin23 are used as 24V power supply output, and Pin24 is used as GND ground.

9. A docking controller according to any one of claims 1-3, characterized in that: the external equipment comprises an upper computer.

10. A docking controller according to any one of claims 1-3, characterized in that: the communication module comprises an Ethernet module, a CAN module, an RS485 module and an RS232 module, wherein the Ethernet module, the CAN module, the RS485 module and the RS232 module are respectively connected with the microcontroller.