CN220340512U - Local heat dissipation type LCM structure - Google Patents
Local heat dissipation type LCM structure Download PDFInfo
- Publication number
- CN220340512U CN220340512U CN202321464052.5U CN202321464052U CN220340512U CN 220340512 U CN220340512 U CN 220340512U CN 202321464052 U CN202321464052 U CN 202321464052U CN 220340512 U CN220340512 U CN 220340512U
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- module
- led module
- frame
- heat dissipation
- metal frame
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 239000012080 ambient air Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 10
- 230000002411 adverse Effects 0.000 abstract description 6
- 239000011324 bead Substances 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 description 10
- 238000002474 experimental method Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 210000003128 head Anatomy 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Abstract
The utility model relates to the technical field of display panels, in particular to a local heat dissipation type LCM structure, which comprises a rubber frame, a light guide plate, a reflecting sheet, a metal frame, an LED module and an FPC module, wherein the LED module and the rubber frame are arranged at intervals, the LED module is welded on a contact of the FPC module, and the back surface of the FPC module is adhered to the metal frame, so that the LED module is lightened in the environment air with heat generated by the metal frame and dissipated by the metal frame. The LCM structure can improve the heat dissipation effect of the LED lamp beads in the LED module, and can not cause adverse phenomena such as lamp eyes and the like due to structural deformation after long-time use.
Description
Technical Field
The utility model relates to the technical field of display panels, in particular to a local heat dissipation type LCM structure.
Background
The existing LCM product assembling structure uses a rubber frame as a reference and the back assembling sequence is that the LED module is installed into the rubber frame, and the light guide plate and the reflecting sheet are placed in the LED module. The front assembly sequence is placed in the lower diffusion layer, lower brightness enhancement layer, upper brightness enhancement layer and FOG module of the membrane, as shown in figure 3. The disadvantage of this assembly is as follows.
The defect 1 is that the LED module has poor heat dissipation performance, the LED module is contacted with the rubber frame, the rubber frame is a plastic product, the heat conduction performance is poor, the position of the LED module of the rubber frame is in the same position with the vertical direction of the position of the bonding IC module at the head of the FOG module, and after the product is lightened for a long time, the heat energy of the LED module can be conducted onto the FOG through the rubber frame, so that the bonded IC module has a certain influence.
The LED module is connected with the rubber frame assembly through the double faced adhesive tape of the intermediate material, and the overall thickness of the structure of the rubber frame at the front position of the lamp is thinner, and the product can deform after the rubber frame experiment when the product is subjected to the reliability experiment, so that the rubber frame is separated from the double faced adhesive tape of the LED module, and adverse phenomena such as lamp eyes and the like can be caused indirectly.
The defect 3 is that when the LED module is assembled with the rubber frame, the structure of the rubber frame at the front part of the lamp is thinner and is an injection molding product, the overall flatness is poorer, the LED module is a flexible product, the deformation of plastic can be followed during assembly, when the light guide plate is fixed on the LED module, the light guide plate is of a rigid structure, the deformation degree can be corrected through the assembly strength at the beginning of assembly, the deformation can rebound after the standing time, and the deformation after rebound can possibly bring about the change of the effect before the lamp, such as the bad phenomenon of a lamp eye and the like.
Disclosure of Invention
In order to solve the above problems, the present utility model provides a local heat dissipation type LCM structure, which can improve the heat dissipation effect of LED lamp beads in an LED module, and can not cause adverse phenomena such as lamp eyes due to structural deformation when used for a long time.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a local heat dissipation type LCM structure, includes gluey frame, light guide plate, reflector plate, metal frame, LED module and FPC module, the LED module with glue the frame interval setting, the LED module welds on the contact of FPC module, the back bonding of FPC module is on metal frame, so that the LED module lights and is in the radiating ambient air of heat by metal frame that produces.
Preferably, the FPC module is adhered to the metal frame by a double sided tape having heat conductive capability.
Preferably, the metal frame is an iron frame.
Preferably, the end face of the LED module facing the light guide plate is in full contact with the light guide plate.
Preferably, the front side of the plastic frame is further provided with an IC module, and the IC module and the projection of the LED module in the thickness direction do not overlap.
Preferably, a part of the surface of the LED module is in contact with the iron frame.
The beneficial effects of using the utility model are as follows:
the utility model provides a LCM structure has changed the position of FPC module, makes FPC module and chase bond to the heat that the LED module produced can directly distribute outside ambient air through the chase, and the back of chase exposes outside, and the heat of chase directly passes through the air and dispels, improves the heat dispersion of LED module, has solved the problem that the heat energy can't be derived after the LED module lights for a long time, and the heat of LED module is gone out from the back heat dissipation through the chase, and is irrelevant with positive FOG module, does not have the influence to the IC module of bonding.
The LED module contacts with the iron frame, and the iron frame is metal product, and the iron frame can not take place the experiment under the experimental condition of current product and warp the problem, ensures that the structure of experimental back LED module department can not change, has stopped the experimental back lamp effect and has changed before the lamp. The lamp LED module is fixed on the iron frame, the iron frame is a metal product, the deformation and flatness of the iron frame are superior to those of the rubber frame, the rebound problem of the assembled LED module light guide plate is avoided, and the adverse phenomena such as lamp eyes and the like are avoided.
Drawings
Fig. 1 is a schematic cross-sectional view of a local heat dissipation LCM structure according to the present utility model.
Fig. 2 is a rear partial perspective view of the local heat dissipation LCM structure of the present utility model.
FIG. 3 is a schematic cross-sectional view of a LCM structure according to the prior art.
The reference numerals include:
the LED light source comprises a lower diffusion layer 11-a lower light enhancement layer 12-a upper light enhancement layer 13-a 14-FOG module, a 15-IC module, a 21-light guide plate, a 22-reflecting sheet, a 23-metal frame, a 24-LED module and a 25-FPC module.
Detailed Description
In order to make the objects, technical solutions and advantages of the present technical solution more apparent, the present technical solution is further described in detail below in conjunction with the specific embodiments. It should be understood that the description is only illustrative and is not intended to limit the scope of the present technical solution.
The conventional LCM product assembling structure uses a plastic frame as a reference and the back assembling sequence is that the LED module 24 is mounted in the plastic frame, and the light guide plate 21 and the reflective sheet 22 are placed. The front assembly is sequentially put into the lower diffusion layer 11, the lower brightness enhancement layer 12, the upper brightness enhancement layer 13 and the FOG module 14, as shown in fig. 3, and the disadvantage of this assembly is as follows.
The LED module 24 heat dispersion is poor, and the LED module 24 contacts with gluing the frame, glues the frame and is the plastic goods, and heat conductivility is poor, and glues frame LED module 24 position and FOG module 14 head bonding IC module 15 position vertical direction in same position, and the product is after the long-time illumination, and the heat energy of LED module 24 can be conducted to FOG module 14 through gluing the frame, has certain influence to bonding the IC module 15 on the FOG module 14. The LED module 24 is connected with the glue frame assembly through the double faced adhesive tape of intermediate materials, and the overall thickness of the structure of the glue frame in the front of the lamp is thinner, and the product can be deformed after the glue frame experiment when the product is subjected to the reliability experiment, so that the glue frame is separated from the double faced adhesive tape of the LED module 24, and adverse phenomena such as lamp eyes and the like can be caused indirectly due to the front effect of the lamp. When the LED module 24 is assembled with the rubber frame, the structure of the rubber frame at the front part of the lamp is thinner and is an injection molding product, the overall flatness can be poorer, the LED module 24 is a flexible product, the deformation of plastic can be followed during assembly, when the light guide plate 21 is fixed on the LED module 24, the light guide plate 21 is of a hard structure, the deformation degree can be corrected through the assembly force at the beginning of assembly, the deformation can rebound after long standing time, and the deformation after rebound can possibly bring about the change of the effect before the lamp, such as bad phenomena of a lamp eye and the like.
For this reason, as shown in fig. 1 and 2, the present utility model proposes a local heat dissipation LCM structure, which includes a plastic frame, a light guide plate 21, a reflective sheet 22, a metal frame 23, an LED module 24 and an FPC module 25, wherein the LED module 24 is disposed at intervals from the plastic frame, the LED module 24 is soldered on a contact of the FPC module 25, and a back surface of the FPC module 25 is bonded on the metal frame 23, so that the LED module 24 is lighted in the ambient air where the generated heat is dissipated by the metal frame 23.
The LCM structure of this application has changed the position of FPC module 25, makes FPC module 25 bond with metal frame 23, and the heat that LED module 24 produced can directly distribute outside ambient air through metal frame 23, metal frame 23's the back exposes outside, metal frame 23's heat directly passes through the air and dispels, LED module 24's heat dissipation has been improved, the problem that heat energy can't derive after having solved LED module 24 and lighting for a long time, LED module 24's heat is gone out from the back heat dissipation through metal frame 23, with positive FOG module 14 unassociated, there is not the influence to the IC module 15 of bonding.
Preferably, the FPC module 25 is adhered to the metal frame 23 by a double sided tape having heat conducting capability, so as to accelerate the heat conduction effect between the FPC module 25 and the metal frame 23. The metal frame 23 is a metal frame, and in other embodiments, an aluminum alloy frame or the like may be used.
The end surface of the LED module 24 facing the light guide plate 21 is in full contact with the light guide plate 21. The front side of the plastic frame is also provided with an IC module 15, the projection of the IC module 15 and the LED module 24 in the thickness direction is not overlapped, and a part of the surface of the LED module 24 is in contact with the metal frame 23. The LED module 24 contacts with the metal frame 23, and the metal frame 23 is a metal product, so that the problem of deformation of the metal frame 23 after the experiment can not occur under the experimental conditions of the existing product, the structure of the LED module 24 after the experiment can not be changed, and the effect change before the lamp after the experiment is stopped. The LED module 24 is fixed on the metal frame 23, the metal frame 23 is a metal product, the deformation and flatness of the metal frame are superior to those of the rubber frame, the rebound problem of the LED module 24 after the light guide plate 21 is assembled is avoided, and the adverse phenomena such as lamp eyes and the like are avoided.
In the technical scheme of this application, because the structure of optimizing does not change former display panel's overall structure frame, carries out some adjustments in structural frame, can realize optimizing radiating effect, simultaneously because LED module 24 position changes to use the display panel of this technique, ageing resistance reinforcing, optical index after the ageing test, including luminance, homogeneity, lamp front effect's index are superior to traditional display panel.
The foregoing is merely exemplary of the present utility model, and those skilled in the art can make many variations in the specific embodiments and application scope according to the spirit of the present utility model, as long as the variations do not depart from the spirit of the utility model.
Claims (6)
1. The utility model provides a local heat dissipation type LCM structure, includes gluey frame, light guide plate, reflector plate, metal frame, LED module and FPC module, its characterized in that: the LED module is arranged at intervals with the rubber frame, the LED module is welded on a contact of the FPC module, and the back of the FPC module is adhered to the metal frame, so that heat generated when the LED module is lightened is dissipated into ambient air through the metal frame.
2. The local heat dissipation LCM structure of claim 1, wherein: the FPC module is adhered to the metal frame through double faced adhesive tape with good heat conduction capability.
3. The local heat dissipation LCM structure of claim 1, wherein: the metal frame is an iron frame.
4. The local heat dissipation LCM structure of claim 1, wherein: the end face of the LED module, which faces one side of the light guide plate, is in full contact with the light guide plate.
5. The local heat dissipation LCM structure of claim 1, wherein: and the front side of the rubber frame is also provided with an IC module, and the projection of the IC module and the LED module in the thickness direction is not overlapped.
6. The local heat dissipation LCM structure of claim 3, wherein: and part of the surface of the LED module is contacted with the iron frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321464052.5U CN220340512U (en) | 2023-06-09 | 2023-06-09 | Local heat dissipation type LCM structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321464052.5U CN220340512U (en) | 2023-06-09 | 2023-06-09 | Local heat dissipation type LCM structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220340512U true CN220340512U (en) | 2024-01-12 |
Family
ID=89461203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321464052.5U Active CN220340512U (en) | 2023-06-09 | 2023-06-09 | Local heat dissipation type LCM structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220340512U (en) |
-
2023
- 2023-06-09 CN CN202321464052.5U patent/CN220340512U/en active Active
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