CN220325648U - Anti-radiation and shockproof mobile phone motherboard - Google Patents
Anti-radiation and shockproof mobile phone motherboard Download PDFInfo
- Publication number
- CN220325648U CN220325648U CN202322055134.0U CN202322055134U CN220325648U CN 220325648 U CN220325648 U CN 220325648U CN 202322055134 U CN202322055134 U CN 202322055134U CN 220325648 U CN220325648 U CN 220325648U
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- mobile phone
- main board
- protection mechanism
- board body
- shockproof
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- 230000003471 anti-radiation Effects 0.000 title description 3
- 230000007246 mechanism Effects 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 17
- 230000005855 radiation Effects 0.000 claims abstract description 17
- 230000035939 shock Effects 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 230000001681 protective effect Effects 0.000 claims description 18
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 238000013016 damping Methods 0.000 claims description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
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- Telephone Set Structure (AREA)
Abstract
The utility model discloses a radiation-resistant and vibration-proof mobile phone motherboard, which comprises a mobile phone motherboard body, a vibration-proof protection mechanism I and a vibration-proof protection mechanism II, wherein a metal cover plate is arranged on the top surface of the mobile phone motherboard body; the metal cover plate is fixedly connected with the main board body; the shockproof protection mechanism I is transversely arranged on the side face of the mobile phone main board body; the mobile phone main board body can be protected and shockproof work through the arrangement of the shockproof protection mechanism I and the shockproof protection mechanism II, when the mobile phone main board body receives shock impact, the side face of the mobile phone main board body is subjected to shockproof protection through the shockproof protection mechanism I, the upper end and the lower end of the mobile phone main board body are subjected to shockproof protection through the shockproof protection mechanism II, the external impact of the mobile phone main board body can be effectively reduced through reduction of the shock, and the service life of the mobile phone is prolonged; the utility model has simple structure and convenient operation, and is worth popularizing.
Description
Technical Field
The utility model relates to the technical field of mobile phone mainboards, in particular to a radiation-resistant and vibration-proof mobile phone mainboard.
Background
Along with the rapid development of communication technology, the position of a mobile phone in the life of people is more and more important, the mobile phone becomes an indispensable communication tool slowly, and along with the increase of the use frequency, the mobile phone is vibrated after being dropped to cause impact to the mainboard of the mobile phone after vibrating, so that the service life is shortened, and the requirement on the vibration prevention of the mobile phone is higher.
Original mobile phone motherboard body is generally through screw direct fixation on the cell-phone casing for the cell-phone is when receiving too strong vibration and striking, and the cell-phone casing is direct to the vibration transfer for on the mainboard above, makes the cell-phone mainboard body receive the damage easily, shortens the life of cell-phone, for this, we propose a radiation-resistant shockproof cell-phone mainboard.
Disclosure of Invention
The utility model aims to provide a radiation-resistant and vibration-proof mobile phone motherboard so as to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the anti-radiation and shockproof mobile phone motherboard comprises a mobile phone motherboard body, a shockproof protection mechanism I and a shockproof protection mechanism II, wherein a metal cover plate is arranged on the top surface of the mobile phone motherboard body; the metal cover plate is fixedly connected with the main board body; the shockproof protection mechanism I is transversely arranged on the side face of the mobile phone main board body; the second shockproof protection mechanism is longitudinally arranged at the upper end and the lower end of the mobile phone body; the first shockproof protection mechanism and the second shockproof protection mechanism are matched with each other; the first shockproof protection mechanism and the second shockproof protection mechanism are distributed at four corners of the mobile phone main board body; a heat dissipation plate is arranged right in front of the mobile phone main board body; and a plurality of heat dissipation holes are distributed on the heat dissipation plate in an array manner.
Preferably, a cylindrical buffer disc is arranged at the middle part of the top end of the metal cover plate; a plurality of heat dissipation holes are distributed on the heat dissipation plate in an array manner; the buffer disk is a rubber member.
Preferably, the first shockproof protection mechanism comprises a connecting frame, wherein the connecting frame adopts , and a cross rod is arranged in the middle of the right side of the connecting frame; the cross rod is transversely inserted into the side surface of the mobile phone main board; cylindrical grooves are formed in the upper end and the lower end of the tail of the cross rod; a magnet is fixedly arranged between the two grooves; the left side of the connecting frame is provided with a protective ball through a first spring; the protective ball is of a semicircular structure; the inside of the protective ball is of a hollow structure; the spring is arranged at the right center of the protective ball; the periphery of the protective ball is connected with the connecting frame through a second spring; the outer wall of the protective ball is provided with a first anti-slip layer.
Preferably, the shockproof protection mechanism II comprises a telescopic rod, one end of the telescopic rod is longitudinally inserted into the mobile phone main board body, and tail ends of the two telescopic rods are respectively embedded into the grooves correspondingly; the tail end of the telescopic rod is attracted with the magnet; the head end of the telescopic rod is fixedly provided with a damping ball; an anti-slip layer II is arranged on the outer wall surface of the shock absorption ball; the damping ball is of a hollow semicircular spherical structure; one end of the shock absorption ball is connected with the mobile phone main board body through a spring IV; the outer part of the telescopic rod is sleeved with a spring III; the spring is arranged between the shock-absorbing ball and the mobile phone main board body.
Preferably, the first anti-slip layer and the second anti-slip layer are rubber members; and a plurality of anti-slip protrusions are arranged on the outer walls of the first anti-slip layer and the second anti-slip layer.
Preferably, the heat dissipation plate is made of metal; the heat dissipation plate is provided with a plurality of.
The beneficial effects are that: compared with the prior art, the utility model has the beneficial effects that: through the first shockproof protection mechanism, the second shockproof protection mechanism, the mobile phone main board body can be protected and shockproof work, when the mobile phone main board body receives vibration impact, the side face of the mobile phone main board body is protected in a shockproof manner through the shockproof protection mechanism, the upper end and the lower end of the mobile phone main board body are protected in a shockproof manner through the second shockproof protection mechanism, and the external impact force of the mobile phone main board body can be effectively reduced through the reduction of vibration, so that the service life of the mobile phone is prolonged.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a mobile phone motherboard with radiation resistance and vibration resistance.
Fig. 2 is a schematic diagram of a front view structure of a mobile phone motherboard with radiation resistance and vibration resistance.
Fig. 3 is a schematic structural diagram of a vibration-proof protection mechanism one and a vibration-proof protection mechanism two of a mobile phone motherboard with radiation resistance and vibration resistance.
In the accompanying drawings: the mobile phone comprises a 1-mobile phone main board body, a 2-metal cover board, a 3-buffer disc, a 4-through hole, a 5-heat dissipation plate, a 6-heat dissipation hole, a 7-shockproof protection mechanism I, a 71-connecting frame, a 72-cross rod, a 73-groove, a 74-magnet, a 75-protective ball, a 76-antiskid layer I, a 77-spring I, a 78-spring II, an 8-shockproof protection mechanism II, a 81-telescopic rod, a 82-spring III, a 83-shock absorption ball, a 84-antiskid layer II and a 85-spring IV.
Detailed Description
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
Examples
Referring to the drawings of the specification, in the embodiment of the utility model, a radiation-resistant and shockproof mobile phone motherboard comprises a mobile phone motherboard body 1, a shockproof protection mechanism I7 and a shockproof protection mechanism II 8, wherein a metal cover plate 2 is arranged on the top surface of the mobile phone motherboard body 1; the metal cover plate 2 is fixedly connected with the main board body 1; the shockproof protection mechanism I7 is transversely arranged on the side face of the mobile phone main board body 1; the second shockproof protection mechanism 8 is longitudinally arranged at the upper end and the lower end of the mobile phone body 1; the first shockproof protection mechanism 7 and the second shockproof protection mechanism 8 are matched with each other; the first shockproof protection mechanism 7 and the second shockproof protection mechanism 8 are distributed at four corners of the mobile phone main board body 1; a heat dissipation plate 5 is arranged right in front of the mobile phone main board body 1; a plurality of heat dissipation holes 6 are distributed on the heat dissipation plate 5 in an array manner; a cylindrical buffer disc 3 is arranged at the middle part of the top end of the metal cover plate 2; a plurality of heat dissipation holes 4 are distributed on the heat dissipation plate 3 in an array manner; the buffer disc 3 is a rubber member; the first shockproof protection mechanism 7 comprises a connecting frame 71, wherein the connecting frame 71 adopts , and a cross rod 72 is arranged in the middle of the right side of the connecting frame 71; the cross rod 72 is transversely inserted into the side surface of the mobile phone main board 1; cylindrical grooves 73 are formed in the upper end and the lower end of the tail of the cross rod 72; a magnet 74 is fixedly arranged between the two grooves 73; the left side of the connecting frame 71 is provided with a protective ball 75 through a first spring 77; the protective ball 75 is of a semicircular structure; the inside of the protective ball 75 is a hollow structure; the spring 77 is arranged at the center of the protective ball 75; the periphery of the protective ball 75 is connected with the connecting frame 71 through a second spring 78; the outer wall of the protective ball 75 is provided with a first anti-slip layer 76; the second shockproof protection mechanism 8 comprises a telescopic rod 81, one end of the telescopic rod 81 is longitudinally inserted into the mobile phone main board body 1, and tail ends of the two telescopic rods 81 are respectively embedded into the grooves 73 correspondingly; the tail end of the telescopic rod 81 is attracted with the magnet 74; the head end of the telescopic rod 82 is fixedly provided with a damping ball 83; an anti-slip layer II 84 is arranged on the outer wall surface of the shock absorbing ball 83; the shock-absorbing ball 83 has a hollow semicircle-spherical structure; one end of the shock absorbing ball 83 is connected with the mobile phone main board body 1 through a spring IV 85; the outer part of the telescopic rod 82 is sleeved with a spring III 82; the spring 82 is arranged between the shock-absorbing ball 83 and the mobile phone motherboard body 1; the first anti-slip layer 76 and the second anti-slip layer 84 are rubber members; a plurality of anti-slip protrusions are arranged on the outer walls of the first anti-slip layer 76 and the second anti-slip layer 84; the heat dissipation plate 5 is made of metal; the heat dissipation plate 5 is provided in plurality.
The using process comprises the following steps:
during use, the first shockproof protection mechanism 7 and the second shockproof protection mechanism 8 are firstly installed, during installation, the transverse rod 72 is transversely inserted into the mobile phone main board body 1, the connecting frame 71 is clamped on the outer side wall of the side face of the mobile phone main board body 1, the connecting frame 71 is clamped on the side face of the mobile phone main board body 1, then the two telescopic rods 81 are correspondingly inserted into the grooves 73, the two telescopic rods 81 are attracted and fixed with the magnet 74 through metal materials of the telescopic rods 81, and the first shockproof protection mechanism 7 and the second shockproof protection mechanism 8 are integrally installed through the arrangement of the transverse rod 72, the grooves 73 and the magnet 74 and the telescopic rods 81, so that the installation and the disassembly are convenient, and the maintenance cost is reduced; when the mobile phone main board body 1 receives vibration impact, the side surface of the mobile phone main board body 1 is subjected to vibration protection through the first vibration-proof protection mechanism 7, the upper end and the lower end of the mobile phone main board body 1 are subjected to vibration protection through the second vibration-proof protection mechanism 8, external impact force of the mobile phone main board body 1 can be effectively reduced, particularly when the mobile phone main board is in vibration protection, the first spring 77, the second spring 78, the third spring 82 and the fourth spring 85 are extruded after the first spring 77, the second spring 78, the third spring 82 and the fourth spring 85 are absorbed, so that the mobile phone main board body 1 is protected by supporting and protecting through the first spring 77, the second spring 78, the third spring 82 and the fourth spring 85, vibration of the mobile phone main board body 1 is reduced, the mobile phone main board 1 is prevented from being damaged, and the metal cover plate is directly fixed on the main board through screws, and the main board has strong radiation resistance through elements on the metal cover plate cladding main board; the surface of the heat radiation plate 5 is provided with a penetrating heat radiation hole 6, so that the surface of the mobile phone main board body 1 can normally radiate heat.
In the process, the mobile phone main board body can be protected and shockproof through the arrangement of the shockproof protection mechanism I and the shockproof protection mechanism II, when the mobile phone main board body receives shock impact, the shockproof protection is carried out on the side face of the mobile phone main board body through the shockproof protection mechanism I, the shockproof protection is carried out on the upper end and the lower end of the mobile phone main board body through the shockproof protection mechanism II, the external impact of the mobile phone main board body can be effectively reduced through reducing the shock, and the service life of the mobile phone is prolonged; through the arrangement of the cross rod, the groove, the magnet and the telescopic rod, the first shockproof protection mechanism and the second shockproof protection mechanism can be integrally installed, the installation and the disassembly are convenient, and the maintenance cost is reduced; the utility model has the advantages of this application simple structure, the practicality is strong, and easy operation is worth promoting.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the present utility model, and these should also be considered as the scope of the present utility model, which does not affect the effect of the implementation of the present utility model and the utility of the patent.
Claims (6)
1. A radiation-resistant and shockproof mobile phone motherboard is characterized in that: the mobile phone main board comprises a mobile phone main board body, a first shockproof protection mechanism and a second shockproof protection mechanism, wherein a metal cover plate is arranged on the top surface of the mobile phone main board body; the metal cover plate is fixedly connected with the main board body; the shockproof protection mechanism I is transversely arranged on the side face of the mobile phone main board body; the second shockproof protection mechanism is longitudinally arranged at the upper end and the lower end of the mobile phone body; the first shockproof protection mechanism and the second shockproof protection mechanism are matched with each other; the first shockproof protection mechanism and the second shockproof protection mechanism are distributed at four corners of the mobile phone main board body; a heat dissipation plate is arranged right in front of the mobile phone main board body; and a plurality of heat dissipation holes are distributed on the heat dissipation plate in an array manner.
2. The radiation-resistant and vibration-resistant mobile phone motherboard according to claim 1, wherein: a cylindrical buffer disc is arranged at the middle part of the top end of the metal cover plate; a plurality of heat dissipation holes are distributed on the heat dissipation plate in an array manner; the buffer disk is a rubber member.
3. The radiation-resistant and vibration-resistant mobile phone motherboard according to claim 1, wherein: the first shockproof protection mechanism comprises a connecting frame, wherein the connecting frame adopts , and a cross rod is arranged in the middle of the right side of the connecting frame; the cross rod is transversely inserted into the side surface of the mobile phone main board; cylindrical grooves are formed in the upper end and the lower end of the tail of the cross rod; a magnet is fixedly arranged between the two grooves; the left side of the connecting frame is provided with a protective ball through a first spring; the protective ball is of a semicircular structure; the inside of the protective ball is of a hollow structure; the spring is arranged at the right center of the protective ball; the periphery of the protective ball is connected with the connecting frame through a second spring; the outer wall of the protective ball is provided with a first anti-slip layer.
4. The radiation-resistant and vibration-resistant mobile phone motherboard according to claim 1, wherein: the shockproof protection mechanism II comprises telescopic rods, one ends of the telescopic rods are longitudinally inserted into the mobile phone main board body, and tail ends of the two telescopic rods are respectively embedded into the grooves correspondingly; the tail end of the telescopic rod is attracted with the magnet; the head end of the telescopic rod is fixedly provided with a damping ball; an anti-slip layer II is arranged on the outer wall surface of the shock absorption ball; the damping ball is of a hollow semicircular spherical structure; one end of the shock absorption ball is connected with the mobile phone main board body through a spring IV; the outer part of the telescopic rod is sleeved with a spring III; the spring is arranged between the shock-absorbing ball and the mobile phone main board body.
5. The radiation-resistant and vibration-resistant mobile phone motherboard according to claim 3 or 4, wherein: the first anti-slip layer and the second anti-slip layer are rubber components; and a plurality of anti-slip protrusions are arranged on the outer walls of the first anti-slip layer and the second anti-slip layer.
6. The radiation-resistant and vibration-resistant mobile phone motherboard according to claim 1, wherein: the heat dissipation plate is made of metal; the heat dissipation plate is provided with a plurality of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322055134.0U CN220325648U (en) | 2023-08-02 | 2023-08-02 | Anti-radiation and shockproof mobile phone motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322055134.0U CN220325648U (en) | 2023-08-02 | 2023-08-02 | Anti-radiation and shockproof mobile phone motherboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220325648U true CN220325648U (en) | 2024-01-09 |
Family
ID=89410020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322055134.0U Active CN220325648U (en) | 2023-08-02 | 2023-08-02 | Anti-radiation and shockproof mobile phone motherboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220325648U (en) |
-
2023
- 2023-08-02 CN CN202322055134.0U patent/CN220325648U/en active Active
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