CN220324460U - Photoelectric coupler and electronic device - Google Patents

Abstract

The utility model provides a photoelectric coupler and an electronic device, wherein the photoelectric coupler comprises a chip and a bonding wire, the bonding wire comprises a first connecting section, a second connecting section and a third connecting section, one end of the first connecting section is connected with the chip, the other end of the first connecting section is connected with one end of the second connecting section, and the second connecting section extends from one end of the first connecting section to one end of the third connecting section horizontally. According to the bonding wire, the second connecting section is horizontally connected with the first connecting section and the third connecting section, so that the second connecting section is always in a stable state, namely, the middle line section of the bonding wire is kept in a stable state, the bonding wire is prevented from collapsing due to the stress of different thermal expansion coefficients among materials, the phenomenon that the second connecting section collapses is avoided, normal use of a device is influenced due to collapsing of the bonding wire, and the reliability of the bonding wire is improved.

Description

Photoelectric coupler and electronic device

Technical Field

The present utility model relates to the field of optoelectronics technologies, and in particular, to an optocoupler and an electronic device.

Background

The photoelectric coupler is an indispensable semiconductor component in an integrated circuit, and is a device for converting an input electric signal into an optical signal and then converting the optical signal into an electric signal, and the input end of the photoelectric coupler is a light emitting diode which converts the input electric signal into the optical signal, is accepted by a photoelectric detector after passing through a transparent photoconductive medium, is converted into the electric signal, and amplifies the converted electric signal to finish the electric-optical-electric conversion. Through the conversion process, the input and output signals realize unidirectional transmission and isolation, i.e. the output signal has no interference to the input signal. The optocoupler has the advantages of stable operation, high transmission efficiency, long service life and the like. The relative positions of the input end chip and the output end chip in the optocoupler generally have two modes, namely a planar structure and an up-down stacking structure. At present, due to the structural characteristics and application characteristics of the upper and lower stacking structures of the optocoupler device, the phenomenon of wire collapse of bonding wires is very easy to occur, and the normal functions of the device are influenced.

Disclosure of Invention

The embodiment of the utility model provides a photoelectric coupler and an electronic device, which are used for reducing the phenomenon of wire collapse of a bonding wire and avoiding influencing the normal use of a device.

The present utility model provides an optoelectronic coupler comprising:

a chip;

the bonding wire comprises a first connecting section, a second connecting section and a third connecting section, one end of the first connecting section is connected with the chip, the other end of the first connecting section is connected with one end of the second connecting section, and the second connecting section extends from one end of the first connecting section to the direction of the third connecting section horizontally to be connected with one end of the third connecting section.

In the photoelectric coupler provided by the utility model, the photoelectric coupler further comprises a chip and a pin, one side of the chip is fixedly connected with the pin, and the first connecting section extends from one end connected with the chip to the direction away from one side of the chip fixedly connected with the pin to be connected with the second connecting section.

In the photoelectric coupler provided by the utility model, an included angle is formed between the first connecting section and the second connecting section, and the included angle is 90 degrees.

In the photoelectric coupler provided by the utility model, the pin comprises an installation part, the chip is arranged on the installation part, and the other end of the third connecting section is fixedly connected with the installation part.

In the photoelectric coupler provided by the utility model, the photoelectric coupler further comprises organic glue, and the organic glue is wrapped outside the chip and the bonding wire.

In the photoelectric coupler provided by the utility model, the photoelectric coupler comprises an input module and an output module, wherein the input module and the output module are correspondingly arranged, the input module and the output module comprise the chip, the pins and the bonding wires, the organic adhesive extends from the mounting part of the input module to the mounting part of the output module, and the chip and the bonding wires of the input module, the chip and the bonding wires of the output module are all positioned in the organic adhesive.

In the photoelectric coupler provided by the utility model, the photoelectric coupler further comprises an insulating layer, and the insulating layer and one end, close to the third connecting section, of the chip, which is connected with the pin are fixedly connected.

In the photoelectric coupler provided by the utility model, the photoelectric coupler further comprises a plastic sealing layer, a light guiding medium and a buffer layer, wherein the plastic sealing layer encloses to form a closed space, the light guiding medium is fully distributed in the closed space, the buffer layer is arranged between the light guiding medium and the plastic sealing layer along the circumferential direction of the plastic sealing layer, and the thermal expansion coefficient of the buffer layer is between the thermal expansion coefficient of the light guiding medium and the thermal expansion coefficient of the plastic sealing layer.

In the photoelectric coupler provided by the utility model, the buffer layer is made of ceramic materials.

The utility model provides an electronic device, which comprises:

the photoelectric coupler is any one of the photoelectric couplers.

The utility model provides a photoelectric coupler and an electronic device, wherein the photoelectric coupler comprises a chip and a bonding wire, the bonding wire comprises a first connecting section, a second connecting section and a third connecting section, one end of the first connecting section is connected with the chip, the other end of the first connecting section is connected with one end of the second connecting section, and the second connecting section extends from one end of the first connecting section to one end of the third connecting section horizontally. According to the method, the second connecting section is horizontally connected with the first connecting section and the third connecting section, so that the second connecting section is always in a stable state, namely, the middle line segment of the bonding line is kept in a stable state, the bonding line is prevented from collapsing due to the fact that the bonding line is stressed by different thermal expansion coefficients among materials, the phenomenon that the second connecting section collapses is avoided, normal use of a device is influenced due to the collapse of the bonding line, and therefore the reliability of the bonding line is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a sectional view of a conventional photocoupler;

FIG. 2 is a schematic diagram of a bond wire collapse of a conventional optocoupler;

FIG. 3 is a schematic diagram of a bond wire detachment chip of a conventional optocoupler;

fig. 4 is a sectional view of the photocoupler in the present embodiment;

FIG. 5 is an enlarged view of FIG. 4 at A;

the reference numerals in the drawings are as follows:

100. a bonding wire; 110. a first connection section; 120. a second connection section; 130. a third connecting section; 200. a chip; 300. pins; 310. a mounting part; 400. an organic adhesive; 510. an input module; 520. an output module; 600. an insulating layer; 710. a plastic sealing layer; 720. a photoconductive medium; 730. and a buffer layer.

Detailed Description

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings.

The optocoupler is an indispensable semiconductor component in an integrated circuit, and transmits an electrical signal with light as a medium. It has good isolation effect on input and output electric signals, so that it can be widely used in various circuits. It has become one of the most versatile photovoltaic devices. Optocouplers generally consist of three parts, light emission, light reception and signal amplification. The input electric signal drives a Light Emitting Diode (LED) to emit light with a certain wavelength, and the light is received by a light detector to generate photocurrent, and then the photocurrent is amplified and output. This completes the electro-optic-electrical conversion, thus functioning as input, output, isolation. Because the input and output of the optical coupler are mutually isolated, the electric signal transmission has the characteristics of unidirectionality and the like, and thus, the optical coupler has good electric insulation capability and anti-interference capability.

Referring to fig. 1 to 3, in the present stage, there are two general modes, a planar structure and a stacked structure, in which a chip 200 at an input end of a photo-coupler and a chip 200 at an output end are positioned opposite to each other. When the devices of the photoelectric coupler are in a vertically stacked structure, the bonding wires 100 on the photoelectric coupler are very easy to find out the wire collapse phenomenon according to the structural characteristics and application characteristics of the vertically stacked structure.

As shown in fig. 2, the bonding wire 100 is collapsed at this time, so that the middle line segment of the bonding wire 100 is collapsed and connected with the leads, so that the conventional photoelectric coupler is very easy to generate a short circuit phenomenon, and has low reliability, affects the normal use of the photoelectric coupler, and is easy to generate a product quality problem.

As shown in fig. 3, due to the difference of thermal expansion coefficients between the photoconductive medium 720 and the surrounding structures, the photoconductive medium 720 is very easy to generate colloid expansion when heated, so that the bonding point between the bonding wire 100 and the chip 200 is pulled out, and the bonding wire 100 is separated from the chip 200, so as to affect the normal use of the photocoupler.

Based on the existing problems of the conventional photocoupler at the present stage, the present application proposes the following solutions to solve the problem of product quality caused by low reliability of the photocoupler due to the collapse phenomenon of the bonding wire 100.

Referring to fig. 4 and 5, an embodiment of the optocoupler of the present utility model is shown. The photoelectric coupler comprises a chip 200 and a bonding wire 100, wherein the bonding wire 100 comprises a first connecting section 110, a second connecting section 120 and a third connecting section 130, one end of the first connecting section 110 is connected with the chip 200, the other end of the first connecting section 110 is connected with the second connecting section 120, and the second connecting section 120 horizontally extends from one end connected with the first connecting section 110 to one end of the third connecting section 130 to be connected with one end of the third connecting section 130.

Specifically, the bonding wire 100 is a part for connecting the pin 300 of the optocoupler and the chip 200 of the optocoupler to transmit an electrical signal, and is an essential core material in semiconductor production. The bonding wire 100 in this embodiment includes three connection sections, which are a first connection section 110, a second connection section 120 and a third connection section 130, where the second connection section 120 is located between the first connection section 110 and the third connection section 130, one end of the first connection section 110 is connected with one end of the second connection section 120, the other end of the first connection section 110 is fixedly connected with the chip 200 of the optoelectronic coupler, the other end of the second connection section 120 is connected with the third connection section 130, and the second connection section 120 extends horizontally from the end connected with the first connection section 110 toward the direction of the third connection section 130 until being fixedly connected with one end of the third connection section 130, and the other end of the third connection section 130 is fixedly connected with the pin 300 of the optoelectronic coupler.

The first connection section 110, the second connection section 120, and the third connection section 130 form a path between the chip 200 and the pin 300 of the optocoupler, so as to ensure transmission of electrical signals.

Meanwhile, the bonding wire 100 is in an integrated structure, before the bonding wire 100 is bonded with the chip 200, the bonding wire 100 is bent to a certain degree by a robot or a person, so that the first connecting section 110, the second connecting section 120 and the third connecting section 130 are formed, the structural strength of the bonding wire 100 is ensured, the bonding wire 100 can maintain a stable state after being bonded with the chip 200, the bonding wire 100 is not easy to damage, and meanwhile, the bonding wire 100 is more convenient and rapid to fixedly connect with the chip 200 and the pins 300 due to the integrated structure.

Therefore, in this embodiment, in the structure of connecting the chip 200 of the optocoupler and the lead 300 of the optocoupler, the second connection section 120 of the bonding wire 100 maintains a stable state, that is, the middle line section of the bonding wire 100 maintains a stable state, so that the bonding wire 100 is prevented from collapsing due to stress of different thermal expansion coefficients between materials, and normal use of the device is prevented from being affected due to collapsing of the bonding wire 100, thereby improving reliability of the bonding wire 100.

In an embodiment, referring to fig. 4 and 5, the optocoupler further includes a pin 300, one side of the chip 200 is fixedly connected to the pin 300, and the first connection section 110 extends from one end connected to the chip 200 to be connected to the second connection section 120 in a direction away from the side of the chip 200 fixedly connected to the pin 300.

Specifically, one end of the chip 200 is fixedly connected to the lead 300, the bonding wire 100 connects the chip 200 and the lead 300, so as to electrically connect the chip 200 and the lead 300, and the first connection section 110 is fixedly connected to an opposite end of the chip 200 and the lead 300, which is fixedly connected.

When the optocoupler is in a vertically stacked structure, the first connecting section 110 is fixedly connected with the upper end or the lower end of the chip 200, the first connecting section 110 extends in a direction away from one end of the chip 200, which is fixedly connected with the pin 300, and the other end is connected with the second connecting section 120, that is, the first connecting section 110 extends in a direction away from the chip 200, which is fixedly connected with the pin 300, so that other parts of the first connecting section 110 are not contacted with the chip 200 or the pin 300, thereby further ensuring that the bonding wire 100 does not collapse, improving the reliability of the device, and reducing the quality of the product.

Meanwhile, a corner is formed between the first connection section 110 and the second connection section 120, the corner is greater than or equal to ninety degrees, and is not limited herein, the corner can have a supporting effect on the second connection section 120, so that the second connection section 120 can be further prevented from collapsing due to stress with different thermal expansion coefficients between materials, and the reliability of the photoelectric coupler is further improved.

In a specific embodiment, referring to fig. 4 and 5, an included angle is formed between the first connection section 110 and the second connection section 120, and the included angle is 90 °. Specifically, the first connecting section 110 is fixedly connected with the second connecting section 120, and an included angle is formed between the first connecting section 110 and the second connecting section 120, and the included angle is a corner of the bonding wire 100.

In this embodiment, the included angle is set to 90 °, so that the first connection section 110 is vertically connected with the second connection section 120, and the bonding wire 100 is in an integrally formed structure, so that before the bonding wire 100 is bonded with the chip 200 and the lead 300, the bonding wire 100 is bent by 90 ° by using a robot or manually to form the first connection section 110 and the second connection section 120, and the operation is simple, and the included angle structure of 90 ° further makes the second connection section 120 not easy to collapse, so that a wire collapse phenomenon is not easy to occur in a middle line segment of the bonding wire 100, so as to ensure normal operation of the photoelectric coupler.

In an embodiment, referring to fig. 4 and 5, the pin 300 includes a mounting portion 310, the chip 200 is disposed on the mounting portion 310, and the other end of the third connecting section 130 is fixedly connected to the mounting portion 310.

Specifically, the pin 300 is used as an input end or an output end of the optocoupler for signal transmission, the pin 300 includes an installation portion 310, the chip 200 is disposed on the installation portion 310, and the other end of the third connection section 130 is fixedly connected with the installation portion 310, so that the first connection section 110 is fixedly connected with one end of the chip 200, the first connection section 110 extends to be connected with the second connection section 120 in a direction away from the installation portion 310, the second connection section 120 is connected with the first connection section 110 and the third connection section 130, the other end of the third connection section 130 is fixedly connected with the installation portion 310, and therefore the third connection section 130 is formed by extending one end connected with the second connection section 120 towards the direction of the installation portion 310, that is, a certain angle is formed between the first connection section 110 and the second connection section 120, and a certain bending angle is formed between the third connection section 130 and the second connection section 120, so that the second connection section 120 is further bent, and the wire buckling phenomenon of the second connection section 120 is avoided.

Meanwhile, the third connecting section 130 is fixedly connected with the mounting portion 310, so that the length of the third connecting section 130 can be reduced, thereby reducing the production cost.

In a specific embodiment, referring to fig. 4 and 5, the optocoupler further includes an organic adhesive 400, and the organic adhesive 400 is wrapped outside the chip 200 and the bonding wire 100.

Specifically, the organic glue 400 plays a role in isolating the chip 200 and the bonding wire 100, and the organic glue 400 may be a reflective glue, a light-guiding glue, or the like, which is not limited herein. The organic glue 400 wraps the chip 200 and the bonding wire 100, so that the chip 200 and the bonding wire 100 are both positioned in the organic glue 400, and the problem of product quality caused by wire collapse of the bonding wire 100 or detachment of the bonding wire 100 from the chip 200 due to different thermal expansion coefficients between the optical medium 720 and the bonding wire 100 of the photoelectric coupler is prevented, thereby further improving the reliability of the photoelectric coupler.

In an embodiment, referring to fig. 4, the optocoupler includes an input module 510 and an output module 520, the input module 510 and the output module 520 are disposed corresponding to the output module 520, the input module 510 and the output module 520 each include the chip 200, the lead 300, and the bonding wire 100, the organic adhesive 400 extends from the mounting portion 310 of the input module 510 to the mounting portion 310 of the output module 520, and the chip 200 and the bonding wire 100 of the input module 510, and the chip 200 and the bonding wire 100 of the output module 520 are all located in the organic adhesive 400.

Specifically, the optocoupler includes an input module 510 and an output module 520, where the input module 510 converts an electrical signal into an optical signal, and the output module 520 converts an optical signal into an electrical signal, and in this embodiment, the input module 510 and the output module 520 of the optocoupler adopt a structure stacked up and down, that is, the input module 510 and the output module 520 are correspondingly disposed up and down, and the mounting portion 310 of the input module 510 and the mounting portion 310 of the output module 520 correspond to each other.

The organic glue 400 extends from one end of the mounting portion 310 of the input module 510 to one end of the mounting portion 310 of the output module 520, so that the chip 200 of the input module 510, the bonding wire 100, and the chip 200 of the output module 520, and the bonding wire 100 are all located in the organic glue 400, thereby preventing the bonding wire 100 of the input module 510 and the bonding wire 100 of the output module 520 from collapsing or separating from the chip 200, and the organic glue 400 is distributed between the input module 510 and the mounting portion 310 of the output module 520, the range of the organic glue 400 is large, the organic glue 400 is more conveniently arranged when the photoelectric coupler is produced, and the organic glue 400 with a large range can ensure the isolation function, so as to effectively prevent the bonding wire 100 from collapsing or separating.

In a specific embodiment, referring to fig. 4 and 5, the optocoupler further includes an insulating layer 600, where the insulating layer 600 is fixedly connected to the end of the chip 200, which is adjacent to the third connection section 130 and connected to the pin 300.

Specifically, the optocoupler further includes an insulating layer 600, and the insulating layer 600 is used for insulating the bonding wire 100 when it contacts the chip 200 or the lead 300, so that the insulating layer 600 may be made of a material having an insulating effect, such as rubber, ceramic, etc., which is not limited herein.

The insulating layer 600 is disposed at one end of the chip 200, which is close to the connection between the third connection section 130 and the lead 300, and the insulating layer 600 is disposed along the height of the chip 200, when the bonding wire 100 collapses or breaks away from the chip 200, the pulled bonding wire 100 falls on the insulating layer 600, so that the bonding wire 100 is prevented from contacting the chip 200 or the lead 300, and therefore, the insulating layer 600 can prevent a short circuit caused by the collapse or break away of the bonding wire 100, thereby ensuring that the safety of the photoelectric coupler is higher, the product quality is better, and the reliability is higher.

In an embodiment, referring to fig. 4 and 5, the optocoupler further includes a plastic sealing layer 710, a light guiding medium 720 and a buffer layer 730, wherein the plastic sealing layer 710 encloses to form a closed space, the light guiding medium 720 is fully distributed in the closed space, the buffer layer 730 is disposed between the light guiding medium 720 and the plastic sealing layer 710 along a circumferential direction of the plastic sealing layer 710, and a thermal expansion coefficient of the buffer layer 730 is between a thermal expansion coefficient of the light guiding medium 720 and a thermal expansion coefficient of the plastic sealing layer 710.

Specifically, in order to ensure the normal use of the optocoupler, the optocoupler needs to be packaged, so that the plastic layer 710 is used to package the internal parts of the optocoupler, the plastic layer 710 forms a closed space, and meanwhile, the input and output are performed through the pins 300, and the light guiding medium 720 fills the closed space, so that a difference in thermal expansion coefficient exists between the light guiding medium 720 and the plastic layer 710.

When the photoconductive medium 720 is heated, the bonding wire 100 is separated from the chip 200 due to the fact that the bonding wire 100 is easily disconnected from the chip 200 due to the colloid expansion, so that the quality problem of the product is generated.

Therefore, a buffer layer 730 is disposed between the plastic sealing layer 710 and the photoconductive medium 720, and the buffer layer 730 is disposed along the circumferential direction of the plastic sealing layer 710, so that the buffer layer 730 isolates the plastic sealing layer 710 from contacting the photoconductive medium 720, and the thermal expansion coefficient of the buffer layer 730 should be between the thermal expansion coefficient of the plastic sealing layer 710 and the thermal expansion coefficient of the photoconductive medium 720, so that the buffer layer 730 can buffer the internal damage of the optocoupler caused by the difference of the thermal expansion coefficients of the photoconductive medium 720 and the plastic sealing layer 710, and prevent the bonding wire 100 from being separated from the chip 200, so as to further improve the reliability of the optocoupler.

In a specific embodiment, the buffer layer 730 is made of a ceramic material. Specifically, there are many materials having a thermal expansion coefficient between that of the photoconductive medium 720 and that of the plastic sealing layer 710, and in this embodiment, ceramic is used as a specific material of the buffer layer 730, and since ceramic has a thermal expansion coefficient more stable than that of the plastic sealing layer 710 and a thermal expansion coefficient more than that of the photoconductive medium 720, the ceramic is used as a main material of the buffer layer 730, so that a buffer effect can be better achieved, and metal is not selected as a main material of the buffer layer 730, so that metal conduction is prevented to interfere with a normal function of the photocoupler.

In particular, the buffer layer 730 is added between the plastic sealing layer 710 and the photoconductive medium 720, so as to encapsulate the optocoupler, and the specific process links are as follows: after the basic frames such as the chip 200, the leads 300, the bonding wires 100, the organic glue 400, etc. of the optocoupler are built, a layer of buffer layer 730 is built on the outer side of the frame before the optocoupler is encapsulated, in this embodiment, a ceramic layer is built, and enough use space of the photoconductive medium 720 is reserved inside, and then a plastic encapsulation process is performed.

The embodiment also provides an electronic device, which includes a photo-coupler, where the photo-coupler may adopt any of the photo-couplers provided by the present utility model, and since the specific structure and the working principle of the photo-coupler have been described in detail in the foregoing description, for brevity of description, details are not repeated herein.

The electronic device in the embodiment can improve the reliability of the electronic device due to the adoption of the photoelectric coupler provided by the utility model, thereby improving the working efficiency and the product quality of the electronic device.

While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims (10)

1. An optoelectronic coupler, comprising:

a chip;

the bonding wire comprises a first connecting section, a second connecting section and a third connecting section, one end of the first connecting section is connected with the chip, the other end of the first connecting section is connected with one end of the second connecting section, and the second connecting section extends from one end of the first connecting section to the direction of the third connecting section horizontally to be connected with one end of the third connecting section.

2. The optocoupler of claim 1 further comprising a pin, one side of the chip being fixedly connected to the pin, the first connection section extending from an end connected to the chip in a direction away from the side of the chip fixedly connected to the pin to be connected to the second connection section.

3. The optocoupler of claim 2 wherein the first connection section and the second connection section form an included angle therebetween, the included angle being 90 °.

4. The optocoupler of claim 2 wherein the pins include a mounting portion, the chip being disposed on the mounting portion, the other end of the third connection section being fixedly connected to the mounting portion.

5. The optocoupler of claim 4 further comprising an organic glue that is wrapped outside the chip and the bond wires.

6. The optocoupler of claim 5, wherein the optocoupler comprises an input module and an output module, the input module and the output module are disposed corresponding to each other, the input module and the output module each comprise the chip, the leads, and the bonding wires, the organic glue extends from a mounting portion of the input module to a mounting portion of the output module, and the chip and the bonding wires of the input module, the chip and the bonding wires of the output module are located in the organic glue.

7. The optocoupler of claim 2 further comprising an insulating layer fixedly connected to the end of the chip adjacent to the third connection section to which the pin is connected.

8. The optocoupler of claim 1 further comprising a plastic layer, a photoconductive medium, and a buffer layer, the plastic layer enclosing a closed space, the photoconductive medium being disposed in the closed space, the buffer layer being disposed between the photoconductive medium and the plastic layer along a circumferential direction of the plastic layer, a coefficient of thermal expansion of the buffer layer being between a coefficient of thermal expansion of the photoconductive medium and a coefficient of thermal expansion of the plastic layer.

9. The optocoupler of claim 8 wherein the buffer layer is a ceramic material.

10. An electronic device, comprising:

a photo-coupler as claimed in any one of claims 1 to 9.