CN220312841U - Edging machine tool fixture - Google Patents

Abstract

The utility model discloses an edge grinder fixture, which comprises a clamping fixture for clamping and fixing a silicon wafer, and is characterized in that: still including being used for reserving the tight location frock of clamp of silicon chip polishing width, it includes the bottom plate to press from both sides tight location frock, the bottom plate rear side is equipped with the posterior lateral plate, posterior lateral plate bottom is equipped with the silicon chip and waits to polish the width and reserve the backing plate, press from both sides tight frock including placing the board, place the board and place on the bottom plate and wait to polish the width with the silicon chip and reserve the backing plate contact, the silicon chip is waited to polish the width and is reserved the thickness that the backing plate highly is less than placing the board, the left and right sides symmetry of placing the board is equipped with two sets of side direction limiting plates, side direction limiting plate top is equipped with the roof, there is fixed threaded rod through threaded connection on the roof. The utility model relates to the technical field of tool clamps, and particularly provides an edge grinder tool clamp which is simple in structure, convenient to operate, low in manufacturing cost, convenient to assemble and disassemble and convenient to accurately position a silicon wafer.

Description

Edging machine tool fixture

Technical Field

The utility model relates to the technical field of tool clamps, in particular to an edge grinder tool clamp.

Background

In the process of cleaning the inserting piece, some silicon wafers can fall off to generate defective products, and the side length of the silicon wafers falling off is required to be polished within the size range in order to reduce the cost and improve the yield, so that a set of fixture clamps of an edge grinder are required. The existing fixture clamp can only fix a silicon wafer, when the silicon wafer is polished, a worker is required to manually control the polishing width, however, the manual control of the polishing width is wasteful of the worker, the polishing precision is poor, and the silicon wafer quality is difficult to guarantee in the required size range of the silicon wafer during polishing.

Disclosure of Invention

Aiming at the situation, in order to overcome the defects of the prior art, the utility model provides the fixture for the edge grinder, which has the advantages of simple structure, convenient operation, low manufacturing cost, convenient disassembly and assembly and convenient accurate positioning of the silicon wafer.

The technical scheme adopted by the utility model is as follows: the utility model discloses a fixture for an edge grinder, which comprises a clamping fixture for clamping and fixing a silicon wafer, and is characterized in that: the clamping and positioning tool comprises a bottom plate, the clamping and positioning tool is arranged on the bottom plate, a rear side plate used for propping the silicon wafer is arranged on the rear side of the bottom plate, and a reserved base plate for the polishing width of the silicon wafer is arranged at the bottom of the rear side plate.

Further, press from both sides tight frock including placing the board, place the board and place on the bottom plate and wait to polish the width and reserve the backing plate contact with the silicon chip, the silicon chip waits to polish the width and reserve the thickness of backing plate and be less than placing the board, the left and right sides symmetry of placing the board is equipped with two sets of side direction limiting plates, side direction limiting plate top is equipped with the roof, there is fixed threaded rod through threaded connection on the roof, the rotation is equipped with the clamp plate that is used for carrying out the centre gripping to the silicon chip on the fixed threaded rod, be equipped with the guide bar on the clamp plate, guide bar and roof sliding connection.

Further, a spring is sleeved on the guide rod, and two ends of the spring are respectively arranged on the guide rod and the top plate.

Further, a plane thrust bearing is arranged at the joint of the pressing plate and the fixed threaded rod.

Further, the free end of the fixed threaded rod is provided with a clamping handle.

Further, the connecting block is detachably arranged on the bottom plate through bolts, and the positioning screw used for tightly propping the placing plate on the reserved base plate of the silicon wafer to be polished is connected to the connecting block through threads.

Further, the thickness of the reserved backing plate is 2CM.

Further, two groups of side plates are symmetrically arranged on the left side and the right side of the bottom plate.

The beneficial effects obtained by the utility model by adopting the structure are as follows: the scheme is provided with a clamping and positioning tool, before the silicon wafer is fixed, a placing plate is placed on a bottom plate and is rotated by a positioning screw, the placing plate is propped against a reserved pad plate of the width to be polished of the silicon wafer through the positioning screw, then the silicon wafer is placed below a pressing plate, one end of the silicon wafer is propped against a rear side plate, and due to the existence of the reserved pad plate of the width to be polished of the silicon wafer, a plurality of groups of silicon wafers stacked together can be reserved for the width to be polished of 2CM; the manual adjustment is not needed, so that the labor is saved; the clamping tool is arranged in the scheme, and the clamping tool is convenient for clamping and fixing a plurality of groups of stacked silicon wafers.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a perspective view of an embodiment of the present utility model;

FIG. 2 is a front view of an embodiment of the present utility model;

FIG. 3 is a cross-sectional view taken along section A-A in FIG. 2;

FIG. 4 is a left side view of an embodiment of the present utility model;

FIG. 5 is a top view of an embodiment of the present utility model;

FIG. 6 is a schematic structural diagram of a clamping and positioning tool according to an embodiment of the present utility model;

fig. 7 is a schematic structural diagram of a clamping tool according to an embodiment of the present utility model.

Wherein, 1, clamping and positioning tools, 2, clamping tools, 3, a bottom plate, 4, a rear side plate, 5, a reserved backing plate for the width of the silicon wafer to be polished, 6, a side plate, 7, a placing plate, 8, a lateral limiting plate, 9, a top plate, 10, a fixed threaded rod, 11, a pressing plate, 12, a guide rod, 13, a spring, 14, a plane thrust bearing, 15, a clamping handle, 16, a connecting block, 17 and a set screw.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

As shown in fig. 1 to 7, the fixture for an edge grinder of the present utility model includes a clamping fixture 2 for clamping and fixing a silicon wafer, and is characterized in that: the clamping and positioning tool 1 for reserving the polishing width of the silicon wafer is further included, the clamping and positioning tool 1 comprises a bottom plate 3, the clamping tool 2 is arranged on the bottom plate 3, a rear side plate 4 for propping the silicon wafer is arranged on the rear side of the bottom plate 3, and a reserved base plate 5 for reserving the polishing width of the silicon wafer is arranged at the bottom of the rear side plate 4; a connecting block 16 is detachably arranged on the bottom plate 3 through bolts, and a positioning screw 17 for tightly propping the placing plate 7 on the reserved base plate 5 of the silicon wafer to be polished is connected to the connecting block 16 through threads; the thickness of the reserved backing plate 5 is 2CM; two groups of side plates 6 are symmetrically arranged on the left side and the right side of the bottom plate 3.

The clamping tool 2 comprises a placing plate 7, the placing plate 7 is placed on a bottom plate 3 and is in contact with a silicon wafer to-be-polished width reserved base plate 5, the height of the silicon wafer to-be-polished width reserved base plate 5 is smaller than the thickness of the placing plate 7, two groups of lateral limiting plates 8 are symmetrically arranged on the left side and the right side of the placing plate 7, a top plate 9 is arranged on the top of the lateral limiting plates 8, a fixed threaded rod 10 is connected to the top plate 9 through threads, a pressing plate 11 for clamping and fixing the silicon wafer is rotationally arranged on the fixed threaded rod 10, a guide rod 12 is arranged on the pressing plate 11, and the guide rod 12 is in sliding connection with the top plate 9; a spring 13 is sleeved on the guide rod 12, and two ends of the spring 13 are respectively arranged on the guide rod 12 and the top plate 9; a plane thrust bearing 14 is arranged at the joint of the pressing plate 11 and the fixed threaded rod 10; the free end of the fixed threaded rod 10 is provided with a clamping handle 15.

When the clamp fixture is specifically used, the clamp fixture 2 with the proper size is selected according to the requirement of fixing the size of a silicon wafer, the selected clamp fixture 2 is placed on the bottom plate 3, then the set screw 17 is rotated, the placing plate 7 is propped against the reserved pad 5 with the width to be polished of the silicon wafer through the set screw 17, after the clamp fixture 2 is fixed, a plurality of groups of silicon wafers are arranged under the pressing plate 11, the silicon wafer is guaranteed to be close to the rear side plate 4 when the silicon wafer is placed, at the moment, the reserved pad 5 with the width to be polished of 2CM is reserved for the silicon wafer, after the silicon wafer is placed, the clamp handle 15 is rotated, the clamp handle 15 drives the pressing plate 11 to move downwards to clamp and fix the silicon wafer, after the silicon wafer is fixed, the set screw 17 is loosened, the clamp fixture 2 is taken down from the clamp fixture 1, then the clamp fixture 2 is placed on a hydraulic flat tongs of an edging machine, the clamp fixture 2 is clamped through the hydraulic flat tongs, and the reserved 2CM on the silicon wafer is polished by high-speed rotation of an alloy grinding wheel on the edging machine, and the falling part of the silicon wafer is polished.

In summary, the clamping and positioning tool 1 is provided, before the silicon wafer is fixed, the placing plate 7 is placed on the bottom plate 3 and the positioning screw 17 is turned, the placing plate 7 is propped against the reserved pad 5 of the width to be polished of the silicon wafer through the positioning screw 17, then the silicon wafer is placed below the pressing plate 11, one end of the silicon wafer is propped against the rear side plate 4, and due to the reserved pad 5 of the width to be polished of the silicon wafer, a plurality of groups of silicon wafers stacked together can be reserved for the width to be polished of 2CM; the manual adjustment is not needed, so that the labor is saved; the technical scheme is provided with the clamping tool 2, and the clamping tool 2 is convenient for clamping and fixing a plurality of groups of stacked silicon wafers.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (8)

1. The utility model provides an edging machine frock clamp, is including being used for carrying out the fixed clamp frock (2) of centre gripping to the silicon chip, its characterized in that: still including being used for reserving the tight location frock (1) of clamp of silicon chip polishing width, tight location frock (1) is including bottom plate (3), clamp and locate on bottom plate (3) tight frock (2), bottom plate (3) rear side is equipped with posterior lateral plate (4) that are used for pushing up the silicon chip, posterior lateral plate (4) bottom is equipped with silicon chip and waits to polish width reservation backing plate (5).

2. The edging machine tool holder of claim 1, characterized in that: the clamping tool (2) comprises a placing plate (7), the placing plate (7) is arranged on a bottom plate (3) and is contacted with a silicon wafer to be polished, the silicon wafer is arranged on the polishing width to be polished, the height of the silicon wafer to be polished is smaller than the thickness of the placing plate (7), two groups of lateral limiting plates (8) are symmetrically arranged on the left side and the right side of the placing plate (7), a top plate (9) is arranged on the top plate (8), a fixed threaded rod (10) is connected to the top plate (9) through threads, a pressing plate (11) for clamping and fixing the silicon wafer is rotationally arranged on the fixed threaded rod (10), a guide rod (12) is arranged on the pressing plate (11), and the guide rod (12) is in sliding connection with the top plate (9).

3. The edging machine tool holder of claim 2, characterized in that: the guide rod (12) is sleeved with a spring (13), and two ends of the spring (13) are respectively arranged on the guide rod (12) and the top plate (9).

4. An edging machine tool holder as claimed in claim 3, characterized in that: a plane thrust bearing (14) is arranged at the joint of the pressing plate (11) and the fixed threaded rod (10).

5. The edging machine tool holder of claim 4, wherein: the free end of the fixed threaded rod (10) is provided with a clamping handle (15).

6. The edging machine tool holder of claim 5, wherein: the base plate (3) is detachably provided with a connecting block (16) through a bolt, and the connecting block (16) is connected with a set screw (17) which is used for tightly pushing the placing plate (7) on the reserved base plate (5) of the silicon wafer to be polished in width through threads.

7. The edging machine tool holder of claim 6, characterized in that: the thickness of the reserved backing plate (5) of the silicon wafer to be polished is 2CM.

8. The edging machine tool holder of claim 7, characterized in that: two groups of side plates (6) are symmetrically arranged on the left side and the right side of the bottom plate (3).