CN220306217U

CN220306217U - Sapphire wafer processing is with wasing tool

Info

Publication number: CN220306217U
Application number: CN202321847989.0U
Authority: CN
Inventors: 肖迪; 王凯涵; 张兴姿
Original assignee: Qingdao Xinkang Semiconductor Technology Co ltd
Current assignee: Qingdao Xinkang Semiconductor Technology Co ltd
Priority date: 2023-07-14
Filing date: 2023-07-14
Publication date: 2024-01-05
Anticipated expiration: 2033-07-14

Abstract

The utility model relates to the technical field of sapphire processing, and discloses a cleaning jig for processing a sapphire wafer. According to the utility model, the electric push rod is utilized to push the butt clamps of the two groups of butt clamp mechanisms, so that the sapphire wafer can be automatically clamped, fixed cleaning is not needed to be carried out by manual holding, and in the cleaning process of the sapphire wafer, the sapphire wafer can be driven to automatically rotate and turn over by utilizing the rotary drive of the rotary motor in the clamp mechanism, so that the comprehensive automatic cleaning work is carried out on the sapphire wafer.

Description

Sapphire wafer processing is with wasing tool

Technical Field

The utility model relates to the technical field of sapphire processing, in particular to a cleaning jig for sapphire wafer processing.

Background

Sapphire is a single crystal of aluminum oxide, is a material with second hardness in nature, and is inferior to diamond; the sapphire has good light transmittance, high strength, collision resistance, wear resistance, corrosion resistance, high temperature and high pressure resistance and biocompatibility, and is an ideal material for manufacturing semiconductor optoelectronic devices.

In the process of processing a sapphire wafer, a layer of wax needs to be spin-coated on the back surface of the wafer before the wafer is sheared and polished, so that the wafer is attached to a ceramic disc, and the preparation work of the sheared and polished is realized, the wafer needs to be waxed down after the sheared and polished is finished, even if the wafer is separated from the ceramic disc, and after the waxing down is finished, the wafer needs to be manually scrubbed on two sides so as to ensure the cleaning of the upper surface and the lower surface of the wafer, and a cleaning jig is often adopted for cleaning the sapphire wafer, for example, the prior art shows that: through retrieving, chinese patent net discloses the tool of wasing the wafer (public announcement number CN 217691092U), and this kind of device is through placing the wafer inside the washing tank, as wasing the carrier, carries out portable cleaning to the wafer, need not the manual hand and washs, avoids the manual handling wafer and causes the pollution to the wafer.

However, there are some disadvantages to the above-mentioned published patents and the tools for cleaning wafers adopted in the prior market: the mode that the cleaning tank is adopted as the wafer cleaning carrier replaces the traditional manual hand-held mode for cleaning, but in the cleaning and turning process, the turning cleaning work still needs to be carried out by manual operation, so that on one hand, the situation of polluting the wafer is easy to occur in the turning process, and on the other hand, frequent turning is inconvenient, and the cleaning progress is influenced. Therefore, a cleaning tool for processing a sapphire wafer is provided by a person skilled in the art to solve the problems set forth in the background art.

Disclosure of Invention

The utility model mainly aims to provide a cleaning jig for processing a sapphire wafer, which can effectively solve the problem that the existing cleaning jig in the background art is inconvenient for cleaning the sapphire wafer.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the utility model provides a sapphire wafer processing is with wasing tool, includes installation base and mount pad, it is fixed through installing in two sets of lift guide arms at its both ends between installation base and the mount pad, two sets of lift guide arm upper half cover is equipped with the lift balladeur train, the support top of lift balladeur train is the symmetry form and installs two sets of electric putter that are connected with the mount pad, and installs the cover below the support of lift balladeur train and establish the outside push down extension board at the lift guide arm, two sets of lift guide arm lower half cover is equipped with decides the extension board, and decides the extension board and all installs fixture mechanism in the plate frame end of push down the extension board in the symmetry form.

As still further aspects of the utility model: the fixture mechanism comprises two groups of rotating motors which are symmetrically arranged at the middle parts of the fixed support plate and the downward-pressing support plate frame, a guide rail frame is arranged at the output end of each rotating motor, a butt-clamping screw rod is rotatably connected inside a track of each guide rail frame, two groups of butt-clamping sliding tables are symmetrically sleeved at the shaft rod ends of the butt-clamping screw rods, and two groups of butt-clamping seats are symmetrically arranged at the upper output ends of the butt-clamping sliding tables.

As still further aspects of the utility model: the output end of one end of the opposite clamping screw rod is provided with an inner hexagonal shaft sleeve, the opposite clamping screw rod is bounded by a central line, two sides of the central line are respectively provided with positive and negative screw teeth which are symmetrically arranged with each other, and the opposite clamping screw rod is symmetrically sleeved with two groups of opposite clamping sliding tables through the positive and negative screw teeth.

As still further aspects of the utility model: the butt-clamping surface of the butt-clamping seat is of a trapezoid groove structure, and the butt-clamping seat is made of a natural rubber material member.

As still further aspects of the utility model: the telescopic ends of the two groups of electric push rods are fixedly connected with the mounting top seat.

As still further aspects of the utility model: and guide sliding sleeves which are guided by the lifting guide rods are arranged at both ends of the support of the pressing support plate and the fixing support plate.

As still further aspects of the utility model: compression springs are sleeved at the bottom ends of the arm rods of the two groups of lifting guide rods, and the fixed support plate is elastically clamped with the lifting guide rods through the compression springs.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the clamping and correcting device, the clamping and correcting positions of the clamping seat in the clamping mechanism can be flexibly regulated and controlled, so that the clamping and correcting device is suitable for clamping sapphire wafers of different sizes, the flexible adaptability is higher, clamping and cleaning of the sapphire wafers of different sizes can be conveniently carried out, and the clamping and fixing of the frame of the sapphire wafer can be carried out by utilizing the clamping of the clamping seat, the cleaning quality is not affected, and the cleaning comprehensiveness of the sapphire wafer is ensured.

2. According to the utility model, the electric push rod is utilized to push the butt clamps of the two groups of butt clamp mechanisms, so that the sapphire wafer can be subjected to autonomous clamping operation without manual holding for fixed cleaning, and in the cleaning process of the sapphire wafer, the rotating motor in the clamp mechanism is utilized to rotate and turn over the sapphire wafer autonomously, so that the sapphire wafer is subjected to comprehensive cleaning operation, on one hand, the cleaning efficiency is improved, the cleaning time is saved, and on the other hand, the overturning is not needed manually, and the contamination on the surface of the wafer is avoided.

Drawings

FIG. 1 is a schematic diagram of a cleaning tool for processing a sapphire wafer according to the present utility model;

FIG. 2 is a schematic diagram of a fixture mechanism in a cleaning tool for sapphire wafer processing according to the present utility model;

fig. 3 is a schematic plan view of a fixture mechanism in a cleaning jig for sapphire wafer processing according to the present utility model.

In the figure: 1. a mounting base; 2. installing a top seat; 3. lifting guide rods; 4. an electric push rod; 5. lifting the sliding frame; 6. pressing down the support plate; 7. a fixed support plate; 8. a compression spring; 9. a clamp mechanism; 91. a rotating electric machine; 92. a guide rail frame; 93. an inner hexagonal sleeve; 94. a butt clamp sliding table; 95. a butt clamp clamping seat; 96. and (5) oppositely clamping the screw rod.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-3, a cleaning jig for processing a sapphire wafer includes a mounting base 1 and a mounting top seat 2, the mounting base 1 and the mounting top seat 2 are fixed by two groups of lifting guide rods 3 mounted at two ends of the mounting base, a lifting sliding frame 5 is sleeved on the upper half part of an arm rod of the two groups of lifting guide rods 3, two groups of electric push rods 4 connected with the mounting top seat 2 are symmetrically mounted above a bracket of the lifting sliding frame 5, telescopic ends of the two groups of electric push rods 4 are fixedly connected with the mounting top seat 2, after the clamp orientation of a clamp mechanism 9 is adjusted, a sapphire wafer to be cleaned is placed on the clamp mechanism 9 of a bottom fixed support plate 7, then the telescopic ends of the electric push rods 4 stretch out to push the lifting sliding frame 5 to slide down, the clamp mechanism 9 on the pressing support plate 6 downwards, the other group of clamp mechanism 9 forms a form a clamp-to-clamp mode, the sapphire wafer is clamped and fixed independently, after the sapphire wafer is clamped and is cleaned by using a cleaning solution in the cleaning device, and simultaneously, a motor is used for cleaning the sapphire wafer, and the wafer is completely cleaned by using the manual cleaning machine by using the two groups of clamp mechanisms to rotate, so that the manual cleaning efficiency of the wafer is not required to be completely polluted, on the surface of the wafer is avoided, on the one hand, and the wafer is completely cleaned by the wafer is cleaned by rotating and the wafer.

The support below of lift balladeur train 5 installs the cover and establishes the push down extension board 6 outside lift guide arm 3, the arm lower half cover of two sets of lift guide arms 3 is equipped with decides extension board 7, push down extension board 6 and the support both ends of deciding extension board 7 all are provided with the direction sliding sleeve that leads mutually with lift guide arm 3, the arm bottom of two sets of lift guide arms 3 all overlaps and is equipped with compression spring 8, decide extension board 7 through compression spring 8 and lift guide arm 3 elastic clamping, when push down extension board 6 moves down and decides extension board 7 keep involution, two sets of clamp mechanism 9 keep involution state, carry out the clamp work to the sapphire wafer, and when fixing to the sapphire butt clamp, through utilizing compression spring 8's elastic compression, can make push down extension board 6 and fix extension board 7 and keep synchronous elasticity down to move, in order to reduce the hard clamp strength of clamp mechanism 9 to the sapphire wafer clamp fixed stationarity.

The clamping mechanism 9 is installed to the grillage end of fixed extension board 7 and pushing down extension board 6 in the symmetry form, clamping mechanism 9 is including being the symmetry form and installing at two sets of rotating electrical machines 91 at fixed extension board 7 and pushing down extension board 6 grillage middle part, the output of rotating electrical machines 91 is provided with guide rail frame 92, the inside rotation of track of guide rail frame 92 is connected with to clamp lead screw 96, and the axostylus axostyle end symmetry cover of clamp lead screw 96 is equipped with two sets of clamp slip table 94, one end output of clamp lead screw 96 is provided with interior hexagonal axle sleeve 93, and clamp lead screw 96 regards the central line as the world, the both sides of central line are provided with the positive, the anti-thread tooth of mutual symmetry arrangement respectively, clamp lead screw 96 cup joints through positive, anti-thread tooth and two sets of clamp slip table 94 symmetry, when utilizing the cleaning jig to carry out the clamp cleaning operation to sapphire wafer, the staff can be according to the clamp seat interval of sapphire wafer's 9 the pre-adjustment, then insert hexagonal spanner into interior hexagonal axle sleeve 93, promote clamp lead screw 96 rotation, clamp lead screw 96 in the rotation, clamp lead screw 96 is in the rotation, through its rotation, through the rotation, the rotation of clamp lead screw 96, the rotation, the clamp lead screw 92 is adjusted for the two sets of adjacent pairs of slip table, the wafer is the horizontal clamp 95, the slip table is adjusted to the slip table is the big, and the slip table is used to the opposite to the adjacent pair of the wafer, the slip table is down along the horizontal direction of the sliding, and the slip table is matched with the sliding to the adjacent.

The upper output ends of the two groups of opposite clamping sliding tables 94 are symmetrically provided with two groups of opposite clamping seats 95, opposite clamping surfaces of the opposite clamping seats 95 are of a trapezoid groove structure, the opposite clamping seats 95 are made of natural rubber materials, and in the process of clamping and cleaning a sapphire wafer by using a cleaning jig, the opposite clamping of the sapphire wafer frame by using the trapezoid grooves of the opposite clamping surfaces of the opposite clamping seats 95 can not cover the sapphire wafer surface, so that the cleaning comprehensiveness of the sapphire wafer is ensured.

The working principle of the utility model is as follows: when the cleaning jig is used for clamping and cleaning the sapphire wafer, a worker can pre-adjust the clamping seat distance of the clamping mechanism 9 according to the size of the sapphire wafer, then inserts a hexagonal wrench into the inner hexagonal shaft sleeve 93, pushes the opposite clamping screw rod 96 to rotate in the process of rotation, converts rotation force into horizontal pushing force by utilizing positive and negative screw teeth of the opposite clamping screw rod, pushes two sets of opposite clamping sliding tables 94 to symmetrically slide along the horizontal direction of the guide rail frame 92, adjusts the opposite clamping distance between the two adjacent sets of opposite clamping seats 95, enables the clamping work of the sapphire wafer with different sizes to be matched, places the sapphire wafer to be cleaned on the clamping mechanism 9 of the bottom fixed supporting plate 7 after the clamping orientation of the clamping mechanism 9 is adjusted, pushes the telescopic end of the electric push rod 4 to slide down, pushes the clamping mechanism 9 on the supporting plate 6 downwards, forms a form of opposite clamping with the other set of clamping mechanism 9, and utilizes the upper and lower opposite clamping of the opposite clamping tables 95 to clean the sapphire wafer, simultaneously, and can clean the sapphire wafer by utilizing the self-rotation of the opposite clamping mechanism to clean the sapphire wafer by utilizing the clamping mechanism, and can clean the sapphire wafer in the cleaning machine, and can clean the wafer by the cleaning machine, and can clean the wafer automatically at the same time, and can clean the wafer by the cleaning machine.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a sapphire wafer processing is with wasing tool, includes installation base (1) and installation footstock (2), its characterized in that, install between base (1) and the installation footstock (2) through installing in two sets of lift guide arm (3) at its both ends fixed, two sets of the arm upper half cover of lift guide arm (3) is equipped with lift balladeur train (5), two sets of electric putter (4) that are connected with installation footstock (2) are installed to the support top of lift balladeur train (5) in the symmetry form, and install cover below the support of lift balladeur train (5) and establish push down extension board (6) in lift guide arm (3) outside, two sets of arm lower half cover of lift guide arm (3) is equipped with decides extension board (7), and decides extension board (7) and push down extension board (6) end and all install anchor clamps mechanism (9) in the symmetry form.

2. The cleaning jig for sapphire wafer processing according to claim 1, wherein the clamp mechanism (9) comprises two groups of rotating motors (91) symmetrically mounted on the middle of the fixing support plate (7) and the pressing support plate (6) frame, the output ends of the rotating motors (91) are provided with guide rail frames (92), opposite clamping screw rods (96) are rotatably connected in the rails of the guide rail frames (92), two groups of opposite clamping sliding tables (94) are symmetrically sleeved at the shaft rod ends of the opposite clamping screw rods (96), and two groups of opposite clamping seats (95) are symmetrically mounted at the upper output ends of the opposite clamping sliding tables (94).

3. The cleaning jig for processing the sapphire wafer according to claim 2, wherein an output end of one end of the opposite clamping screw rod (96) is provided with an inner hexagonal shaft sleeve (93), the opposite clamping screw rod (96) is bounded by a central line, two sides of the central line are respectively provided with positive and negative screw teeth which are symmetrically arranged with each other, and the opposite clamping screw rod (96) is symmetrically sleeved with two sets of opposite clamping sliding tables (94) through the positive and negative screw teeth.

4. The cleaning jig for processing the sapphire wafer according to claim 2, wherein the opposite clamping surfaces of the opposite clamping holder (95) are of a trapezoidal groove structure, and the opposite clamping holder (95) is made of a natural rubber material.

5. The cleaning jig for processing the sapphire wafer according to claim 1, wherein the telescopic ends of the two groups of electric push rods (4) are fixedly connected with the mounting top seat (2).

6. The cleaning jig for processing the sapphire wafer according to claim 1, wherein guide sliding sleeves which are guided by the lifting guide rods (3) are arranged at two ends of the support of the pressing support plate (6) and the fixing support plate (7).

7. The cleaning jig for processing the sapphire wafers according to claim 1, wherein compression springs (8) are sleeved at the bottom ends of the arm rods of the two groups of lifting guide rods (3), and the fixed support plates (7) are elastically clamped with the lifting guide rods (3) through the compression springs (8).