CN220303754U - Electric heating wallboard system - Google Patents
Electric heating wallboard system Download PDFInfo
- Publication number
- CN220303754U CN220303754U CN202320630091.1U CN202320630091U CN220303754U CN 220303754 U CN220303754 U CN 220303754U CN 202320630091 U CN202320630091 U CN 202320630091U CN 220303754 U CN220303754 U CN 220303754U
- Authority
- CN
- China
- Prior art keywords
- wallboard
- positive
- copper strip
- calcium silicate
- strip electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005485 electric heating Methods 0.000 title claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 36
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229910052918 calcium silicate Inorganic materials 0.000 claims abstract description 24
- 239000000378 calcium silicate Substances 0.000 claims abstract description 24
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000002131 composite material Substances 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004060 metabolic process Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Central Heating Systems (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Abstract
The utility model discloses an electric heating wallboard system, which comprises positive and negative copper strip electrodes, wherein the positive and negative copper strip electrodes are fixedly connected with a wall body; the composite wallboard comprises a calcium silicate wallboard panel and a carbon nano heating material coating arranged on the back surface of the calcium silicate wallboard panel; wherein, the calcium silicate board wall panel is connected with the wall body, and the carbon nanometer heating material coating is electrically connected with the positive and negative copper strip electrodes. The application provides an electric heating wallboard system, it is compound to generate heat the product with the shingle nail, utilizes the heat conductivility of calcium silicate board to conduct the produced heat of the product that generates heat to the product surface for the product produces heat energy, promotes air temperature, reaches indoor heating effect. The circuit connection between the plates is avoided, the material of the heating layer is reduced, the installation steps are reduced, the thickness of the composite wallboard is reduced, and the whole room space and the environment are better utilized.
Description
Technical Field
The utility model relates to the technical field of building decoration, in particular to an electric heating wallboard system.
Background
The electric heating wallboard is healthy and comfortable and enjoys zero pollution heating. The electric heating wallboard only heats, does not redly emit light, does not emit sound, does not have wind, and does not consume oxygen. The air heater prevents the floating of the particulate dust generated by heating the air, does not emit any harmful substances, and is an ideal indoor heating device at present. The carbon crystal has special far infrared health care function, can accelerate metabolism of human body, activate water molecules and improve immunity of human body.
Most of electric heating wallboards in the current market use carbon fiber wires as heating materials through a heating layer and are connected with an external power supply through copper wires, and a metal panel layer is adopted for the surface layer board, so that the heat conducting performance is better. However, the composite wallboard has single surface layer material and high cost, and the metal surface layer is easy to cause excessive heat and scald. In addition, the spliced connection between the composite boards is easy to cause short circuit through the electric wires.
Disclosure of Invention
The utility model provides an electric heating wallboard system.
The utility model provides the following scheme:
an electrothermal wallboard system, comprising:
the positive and negative copper strip electrodes are used for being fixedly connected with the wall body;
the composite wallboard comprises a calcium silicate wallboard panel and a carbon nano heating material coating arranged on the back surface of the calcium silicate wallboard panel;
wherein, the calcium silicate board wall panel is connected with the wall body, and the carbon nanometer heating material coating is electrically connected with the positive and negative copper strip electrodes.
Preferably: the contact surface of the positive and negative copper strip electrodes and the carbon nano heating material coating is provided with a conductive adhesive layer, and the carbon nano heating material coating and the positive and negative copper strip electrodes are electrically connected through the conductive adhesive layer.
Preferably: the conductive adhesive layer is a high-temperature-resistant conductive adhesive layer.
Preferably: the carbon nano heating material coating is arranged on the back surface of the calcium silicate board wall panel in a fully distributed state.
Preferably: the copper strip welding machine further comprises an external power supply and a control assembly, wherein the external power supply is connected with the control assembly, and the positive and negative copper strip electrodes are connected with the control assembly.
Preferably: the composite wallboard also comprises a silicon controlled rectifier or a solid relay and a plurality of first temperature sensors, wherein the first temperature sensors are connected with different positions of the composite wallboard; the external power supply and the control component are connected with the controllable silicon or the solid-state relay;
the first temperature sensors are connected with the control assembly; and the silicon controlled rectifier or the solid relay is connected with the positive and negative copper strip electrodes.
Preferably: the temperature sensor is used for acquiring room temperature, and the temperature sensor is connected with the control assembly.
According to the specific embodiment provided by the utility model, the utility model discloses the following technical effects:
according to the utility model, an electric heating wallboard system can be realized, and in one implementation mode, the system can comprise positive and negative copper strip electrodes, wherein the positive and negative copper strip electrodes are used for being fixedly connected with a wall body; the composite wallboard comprises a calcium silicate wallboard panel and a carbon nano heating material coating arranged on the back surface of the calcium silicate wallboard panel; wherein, the calcium silicate board wall panel is connected with the wall body, and the carbon nanometer heating material coating is electrically connected with the positive and negative copper strip electrodes. The application provides an electric heating wallboard system, it is compound to generate heat the product with the shingle nail, utilizes the heat conductivility of calcium silicate board to conduct the produced heat of the product that generates heat to the product surface for the product produces heat energy, promotes air temperature, reaches indoor heating effect. The circuit connection between the plates is avoided, the material of the heating layer is reduced, the installation steps are reduced, the thickness of the composite wallboard is reduced, and the whole room space and the environment are better utilized.
Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electrothermal wallboard system according to an embodiment of the present utility model;
fig. 2 is a block diagram of connection of components provided in an embodiment of the present utility model.
In the figure: positive and negative copper strip electrodes 1, composite wall boards 2, calcium silicate board wall panels 21, carbon nano heating material coatings 22, conductive adhesive layers 3, an external power supply 4, a control component 5, a silicon controlled rectifier or solid state relay 6, a first temperature sensor 7, a second temperature sensor 8 and a wall 9.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.
Examples
Referring to fig. 1 and 2, an electrothermal wallboard system according to an embodiment of the present utility model, as shown in fig. 1 and 2, may include:
the positive and negative copper strip electrodes 1 are used for being fixedly connected with the wall 9;
a composite wallboard 2, wherein the composite wallboard 2 comprises a calcium silicate board wall panel 21 and a carbon nano heating material coating 22 arranged on the back surface of the calcium silicate board wall panel 21;
wherein, the calcium silicate board wall panel 21 is connected with the wall 9, and the carbon nano heating material coating 22 is electrically connected with the positive and negative copper strip electrode 1.
The electric heating wallboard system provided by the embodiment of the application adopts the positive and negative copper electrode arranged on the wall body to supply power for the carbon nano heating material coating, and can solve the problem that short circuit is easy to cause by connecting wires when splicing and connecting the composite boards in the prior art. The decorative surface adopts the calcium silicate board wall panel, and the calcium silicate board wall panel has the advantages of good insulation effect, excellent heat conduction performance, rich surface decorative patterns and the like.
In order to ensure that the positive and negative copper strip electrodes provided by the embodiment of the application can be tightly connected with the carbon nano heating material coating and provide conductivity, the embodiment of the application can also provide that the contact surface of the positive and negative copper strip electrode 1 and the carbon nano heating material coating 22 is provided with a conductive adhesive layer 3, and the carbon nano heating material coating 22 and the positive and negative copper strip electrode 1 are electrically connected through the conductive adhesive layer 3. Further, the conductive adhesive layer 3 is a high-temperature resistant conductive adhesive layer. The SECrosslink-6077 high-temperature resistant conductive adhesive can be selected, has high-temperature resistance, can be used at the temperature of more than 300 ℃, and has excellent bonding performance on materials such as metal, plastic, glass and the like. The adhesive is used for the parts needing to be bonded, such as electronic components, ceramics, glass, silicon chips, metal and the like, and is suitable for dispensing or printing processes.
In order to further ensure the heating uniformity of the composite wallboard, the embodiment of the present application may further provide that the carbon nano heating material coating 22 is disposed on the back surface of the calcium silicate board wall panel 21 in a fully-distributed state.
In order to accurately control the heating temperature of the composite wallboard provided by the embodiment of the application, the embodiment of the application can further provide an external power supply 4 and a control assembly 5, wherein the external power supply 4 is connected with the control assembly 5, and the positive and negative copper strip electrodes 1 are connected with the control assembly 5. Further, the composite wallboard further comprises a silicon controlled rectifier or solid state relay 6 and a plurality of first temperature sensors 7, wherein the first temperature sensors 7 are connected with different positions of the composite wallboard 2; the external power supply 4 and the control component 5 are connected with the silicon controlled rectifier or the solid-state relay 6;
a plurality of first temperature sensors 7 are connected with the control assembly 5; and the silicon controlled rectifier or solid relay 6 is connected with the positive and negative copper strip electrode 1.
The adoption of the silicon controlled rectifier or the solid relay for control can realize mute control and also can realize frequent control so as to ensure that the temperature difference of the carbon nano heating material coating is smaller. Meanwhile, each carbon nano heating material coating is provided with a temperature sensor, the control component can acquire the actual temperature of each carbon nano heating material coating in real time, and the heating power of the carbon nano heating material coating is controlled through a silicon controlled rectifier or a solid relay respectively, so that the temperature of the carbon nano heating material coating is balanced and the temperature of the carbon nano heating material coating cannot exceed the temperature. Thus, the problem of uneven temperature on the surface of the bottom plate and overheating of the carbon nano heating material coating can be solved. And then can maintain the carbon nanometer heating material coating at a constant temperature so as to improve the temperature regulating effect of the intelligent temperature control circuit of the whole electric heating wallboard system.
In order to further achieve the purpose of achieving control and adjustment of the heating temperature of the composite wallboard through obtaining the indoor temperature, the embodiment of the application can further provide a second temperature sensor 8, wherein the second temperature sensor 8 is used for obtaining the room temperature, and the second temperature sensor 8 is connected with the control component 5.
In a word, the electric heating wallboard system that this application provided, to electric heating product and shingle nail compound, utilize the heat conductivility of calcium silicate board with the produced heat conduction of electric heating product to the product surface for the product produces heat energy, promotes air temperature, reaches indoor heating effect. The circuit connection between the plates is avoided, the material of the heating layer is reduced, the installation steps are reduced, the thickness of the composite wallboard is reduced, and the whole room space and the environment are better utilized.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model are included in the protection scope of the present utility model.
Claims (7)
1. An electrothermal wallboard system, comprising:
the positive and negative copper strip electrodes are used for being fixedly connected with the wall body;
the composite wallboard comprises a calcium silicate wallboard panel and a carbon nano heating material coating arranged on the back surface of the calcium silicate wallboard panel;
wherein, the calcium silicate board wall panel is connected with the wall body, and the carbon nanometer heating material coating is electrically connected with the positive and negative copper strip electrodes.
2. The electrothermal wallboard system of claim 1, wherein the contact surface of the positive and negative copper strip electrodes and the carbon nano heating material coating is provided with a conductive adhesive layer, and the carbon nano heating material coating and the positive and negative copper strip electrodes are electrically connected through the conductive adhesive layer.
3. The electrical wallboard system of claim 2, wherein the conductive adhesive layer is a high temperature resistant conductive adhesive layer.
4. The electric heating wall panel system according to claim 1, wherein the carbon nano heating material coating is provided on the back surface of the calcium silicate panel in a state of being fully distributed.
5. The electrothermal wallboard system of claim 1, further comprising an external power source and a control assembly, the external power source being coupled to the control assembly, the positive and negative copper strip electrodes being coupled to the control assembly.
6. The electrothermal wallboard system of claim 5, further comprising a thyristor or solid state relay and a plurality of first temperature sensors, the plurality of first temperature sensors being connected to different locations of the composite wallboard; the external power supply and the control component are connected with the controllable silicon or the solid-state relay;
the first temperature sensors are connected with the control assembly; and the silicon controlled rectifier or the solid relay is connected with the positive and negative copper strip electrodes.
7. The electrothermal wallboard system of claim 6, further comprising a second temperature sensor for acquiring room temperature, the second temperature sensor being coupled to the control assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320630091.1U CN220303754U (en) | 2023-03-28 | 2023-03-28 | Electric heating wallboard system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320630091.1U CN220303754U (en) | 2023-03-28 | 2023-03-28 | Electric heating wallboard system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220303754U true CN220303754U (en) | 2024-01-05 |
Family
ID=89349070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320630091.1U Active CN220303754U (en) | 2023-03-28 | 2023-03-28 | Electric heating wallboard system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220303754U (en) |
-
2023
- 2023-03-28 CN CN202320630091.1U patent/CN220303754U/en active Active
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