CN220302298U - Heat abstractor for be used for air compressor - Google Patents
Heat abstractor for be used for air compressor Download PDFInfo
- Publication number
- CN220302298U CN220302298U CN202321908500.6U CN202321908500U CN220302298U CN 220302298 U CN220302298 U CN 220302298U CN 202321908500 U CN202321908500 U CN 202321908500U CN 220302298 U CN220302298 U CN 220302298U
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- China
- Prior art keywords
- air compressor
- sound
- sound insulation
- heat
- rubber block
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- 238000009413 insulation Methods 0.000 claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 238000010521 absorption reaction Methods 0.000 claims abstract description 11
- 238000013016 damping Methods 0.000 claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 230000035939 shock Effects 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 230000009931 harmful effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Abstract
The application relates to the technical field of heat dissipation, specifically is a heat abstractor for air compressor, comprising a base plate, be equipped with sound insulation and shock absorption mechanism on the bottom plate, sound insulation and shock absorption mechanism includes a rubber block of fixed mounting in bottom plate upper surface, a rubber block upper surface fixed mounting has a damping pole that quantity is two, damping pole top fixed mounting has No. two rubber blocks, surface fixed mounting has the mounting panel on the rubber block, surface fixed mounting has the sound-proof housing and is located the air compressor of sound-proof housing on the mounting panel. This a heat abstractor for air compressor, through be equipped with on the bottom plate and give sound insulation and shake the noise and the vibration that the mechanism can produce when air compressor work alleviate the processing, be favorable to reducing the air compressor during operation and bring for the surrounding environment harmful effect, be equipped with semiconductor refrigeration piece and heat conduction layer simultaneously on the sound insulation cover and can dispel the heat to air compressor.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device for an air compressor.
Background
The air compressor is a device for compressing gas, and is similar to a water pump in structure, most of the air compressors are reciprocating pistons, rotary blades or rotary screws, and can be divided into a plurality of types according to working principles, lubrication modes, performances and the like, and when the air compressor is used, a large amount of heat can be generated, and if the air compressor is not timely cooled, the air compressor is easily damaged, so that the existing air compressor is provided with a heat dissipation device.
Chinese patent CN114278567B discloses a heat dissipating device for an air compressor, comprising a housing, wherein the ends of both sides of the housing are respectively provided with a front end cover and a rear end cover, the inside of the front end cover is provided with an air inlet, and an air inlet pipe is arranged between the front end cover and a fan; in addition, the air inlet pipe is positioned in the cooling air flow, so that the hottest part of the air inlet pipe can be radiated; through setting up preceding balancing weight and back balancing weight in heat abstractor, two balancing weights can balance the eccentric moment of inertia that the rotor produced, and then effectively reduce vibration and the noise that air compressor produced.
The above patent is directed to an RPK-160 air compressor in the prior art, and since the RPK-160 air compressor does not use a cooling fan and a structural device such as heat dissipation of a housing, a large amount of heat is generated during the working process, so that the temperature of the cavity wall of the compressor is increased, the power consumption of the compressor is increased, the performance of the compressor is reduced, and another embodiment is provided for the problem proposed in the above patent.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides a heat dissipation device for an air compressor, which solves the problems that the existing air compressor has single function when in use, and because the air compressor does not use a cooling fan, a shell dissipates heat and other structural devices, a large amount of heat is generated in the working process, so that the temperature of the cavity wall of the compressor is increased, and the power consumption and the performance of the compressor are reduced.
In summary, the present application provides the following technical solutions: a heat dissipating double-fuselage used for air compressor, including the bottom plate, there are sound insulation and shock absorbing mechanisms on the said bottom plate;
the sound insulation and shock absorption mechanism comprises a first rubber block fixedly arranged on the upper surface of a bottom plate, two damping rods are fixedly arranged on the upper surface of the first rubber block, a second rubber block is fixedly arranged on the top of the damping rods, a mounting plate is fixedly arranged on the upper surface of the rubber block, a sound insulation cover and an air compressor positioned in the sound insulation cover are fixedly arranged on the upper surface of the mounting plate, semiconductor refrigerating sheets extending into the sound insulation cover are fixedly arranged on the left side surface and the right side surface of the sound insulation cover, a heat conducting layer is arranged on one side surface of the semiconductor refrigerating sheets positioned in the sound insulation cover, and one side surface of the heat conducting layer, far away from the semiconductor refrigerating sheets, is contacted with the surface of the air compressor.
Further, the lower surface of the bottom plate is provided with five air inlets, and the distances between every two adjacent air inlets are equal.
The beneficial effects of adopting the further scheme are as follows: the outside air is convenient to enter the sound-proof housing, and the air compressor is convenient to operate.
Further, the thickness of the heat conduction layer is not less than one millimeter and not more than two millimeters.
The beneficial effects of adopting the further scheme are as follows: the heat dissipation of the air compressor is prevented from being influenced by the excessive thickness of the heat conducting layer.
Further, the number of the first rubber block and the second rubber block is four.
The beneficial effects of adopting the further scheme are as follows: the four corners of the mounting plate are convenient to support.
Further, sound absorption holes are formed in the upper surface of the inner cavity of the sound insulation cover.
The beneficial effects of adopting the further scheme are as follows: and the noise generated by the air compressor is conveniently absorbed.
Further, the refrigerating side of the semiconductor refrigerating sheet is positioned in the sound-proof housing, and the heating side of the semiconductor refrigerating sheet is positioned outside the sound-proof housing.
The beneficial effects of adopting the further scheme are as follows: facilitating the channeling of heat generated by the air compressor to the exterior surface of the sound enclosure.
Compared with the prior art, the technical scheme of the application has the following beneficial effects:
this a heat abstractor for air compressor, through be equipped with on the bottom plate and give sound insulation and shake the noise and the vibration that the mechanism can produce when air compressor work alleviate the processing, be favorable to reducing the air compressor during operation and bring for the harmful effects of surrounding environment, be equipped with semiconductor refrigeration piece and heat conduction layer simultaneously on the sound insulation cover and can dispel the heat to air compressor, the function singleness when having solved current heat abstractor when using, vibration and the noise that can't produce when air compressor work are handled, the lower problem of practicality.
Drawings
FIG. 1 is a schematic view of the interior of the present utility model;
fig. 2 is a schematic view of the appearance of the present utility model.
Reference numerals illustrate:
1. a bottom plate; 2. a first rubber block; 3. a damping rod; 4. a second rubber block; 5. a mounting plate; 6. a soundproof cover; 7. a semiconductor refrigeration sheet; 8. a heat conducting layer; 9. an air compressor; 10. an air inlet hole; 11. and the sound absorption holes are formed in the base.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1-2, a heat dissipating device for an air compressor in this embodiment includes a base plate 1, and a sound insulation and damping mechanism is disposed on the base plate 1. Wherein, give sound insulation and slow shock mechanism includes fixed mounting in rubber piece 2 No. one of bottom plate 1 upper surface, and fixed surface installs the damping pole 3 that is two in quantity on the rubber piece 2 No. one, and damping pole 3 top fixed mounting has No. two rubber pieces 4, and fixed surface installs mounting panel 5 on the rubber piece 4, and the quantity of rubber piece 2 No. one and No. two rubber pieces 4 is four, is convenient for support four angles of mounting panel 5.
Simultaneously, fixed mounting has the sound-proof housing 6 and is located the air compressor 9 of sound-proof housing 6 on mounting panel 5 upper surface, the inlet port 10 that is five is offered to bottom plate 1 lower surface, interval between two adjacent inlet ports 10 all equals, in the external air admission sound-proof housing 6 of being convenient for, air compressor 9 operation of being convenient for, sound absorption hole 11 has been offered to sound absorption housing 6 inner chamber upper surface, the noise that air compressor 9 produced of being convenient for, sound wave can go deep into sound absorbing material inside and hole edge and take place the friction along sound absorption hole 11, thereby convert the acoustic energy into heat energy, according to the energy conservation law, the heat energy is more, the acoustic energy just has been reduced.
In addition, the semiconductor refrigerating sheet 7 extending into the sound-proof housing 6 is fixedly arranged on the left side surface and the right side surface of the sound-proof housing 6, one refrigerating side of the semiconductor refrigerating sheet 7 is positioned in the sound-proof housing 6, one heating side of the semiconductor refrigerating sheet 7 is positioned outside the sound-proof housing 6, the heat generated by the air compressor 9 is conveniently guided to the outer surface of the sound-proof housing 6, the heat conducting layer 8 is coated on the surface of one side of the heat semiconductor refrigerating sheet 7 positioned in the sound-proof housing 6, the thickness of the heat conducting layer 8 is not less than one millimeter and not more than two millimeters, the heat dissipation of the air compressor 9 is prevented from being influenced by the excessive thickness of the heat conducting layer 8, and the surface of one side of the heat conducting layer 8 far away from the semiconductor refrigerating sheet 7 is contacted with the surface of the air compressor 9.
It should be noted that, in this embodiment, the heat conducting layer 8 is made of a heat conducting silicone grease material.
The sound-proof housing 6 in this embodiment is made of a wood wool sound-absorbing board. The air compressor in this embodiment is an RPK-160 air compressor.
The working principle of the embodiment is as follows:
when the air compressor 9 is used, the semiconductor refrigerating sheet 7 is electrified to enable current to pass through the thermocouple pair formed by the connection of the N-type semiconductor material and the P-type semiconductor material in the semiconductor refrigerating sheet 7, heat transfer is generated between two sides of the semiconductor refrigerating sheet 7, heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end and a hot end, the heat on the surface of the air compressor 9 is dissipated out of the sound insulation cover 6 through the heat conduction layer 8, noise generated during the working of the air compressor 9 is isolated and absorbed through the sound insulation cover 6 and the sound absorption holes 11, and vibration generated during the working of the air compressor 9 is buffered through the actions of the first rubber block 2, the damping rod 3 and the second rubber block 4, so that the purpose of further reducing the noise is achieved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A heat dissipating device for an air compressor, comprising a base plate (1), characterized in that: the base plate (1) is provided with a sound insulation and shock absorption mechanism;
the sound insulation and shock absorption mechanism comprises a first rubber block (2) fixedly mounted on the upper surface of a base plate (1), damping rods (3) with two numbers are fixedly mounted on the upper surface of the first rubber block (2), a second rubber block (4) is fixedly mounted on the top of each damping rod (3), a mounting plate (5) is fixedly mounted on the upper surface of each rubber block (4), a sound insulation cover (6) and an air compressor (9) located in the sound insulation cover (6) are fixedly mounted on the upper surface of each mounting plate (5), semiconductor refrigerating sheets (7) extending into the sound insulation cover (6) are fixedly mounted on the left side surface and the right side surface of the sound insulation cover (6), a heat conducting layer (8) is arranged on the surface of one side of each semiconductor refrigerating sheet (7) located in the sound insulation cover (6), and one side surface of each heat conducting layer (8) is far away from the semiconductor refrigerating sheets (7) to be contacted with the surface of the air compressors (9).
2. A heat sink for an air compressor as defined in claim 1, wherein: the lower surface of the bottom plate (1) is provided with five air inlets (10), and the distances between two adjacent air inlets (10) are equal.
3. A heat sink for an air compressor as defined in claim 1, wherein: the thickness of the heat conducting layer (8) is not less than one millimeter and not more than two millimeters.
4. A heat sink for an air compressor as defined in claim 1, wherein: the number of the first rubber block (2) and the second rubber block (4) is four.
5. A heat sink for an air compressor as defined in claim 1, wherein: the upper surface of the inner cavity of the sound-proof cover (6) is provided with sound-absorbing holes (11).
6. A heat sink for an air compressor as defined in claim 1, wherein: the refrigerating side of the semiconductor refrigerating sheet (7) is positioned in the sound-proof housing (6), and the heating side of the semiconductor refrigerating sheet (7) is positioned outside the sound-proof housing (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321908500.6U CN220302298U (en) | 2023-07-20 | 2023-07-20 | Heat abstractor for be used for air compressor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321908500.6U CN220302298U (en) | 2023-07-20 | 2023-07-20 | Heat abstractor for be used for air compressor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220302298U true CN220302298U (en) | 2024-01-05 |
Family
ID=89353920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321908500.6U Active CN220302298U (en) | 2023-07-20 | 2023-07-20 | Heat abstractor for be used for air compressor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220302298U (en) |
-
2023
- 2023-07-20 CN CN202321908500.6U patent/CN220302298U/en active Active
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