CN220290787U - Clamp for full-pressure joint type semiconductor device chip table top corrosion - Google Patents
Clamp for full-pressure joint type semiconductor device chip table top corrosion Download PDFInfo
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- CN220290787U CN220290787U CN202321953604.9U CN202321953604U CN220290787U CN 220290787 U CN220290787 U CN 220290787U CN 202321953604 U CN202321953604 U CN 202321953604U CN 220290787 U CN220290787 U CN 220290787U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 230000007797 corrosion Effects 0.000 title claims abstract description 18
- 238000005260 corrosion Methods 0.000 title claims abstract description 18
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims description 14
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 10
- 238000012797 qualification Methods 0.000 abstract description 4
- 239000004411 aluminium Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007906 compression Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of clamps, in particular to a clamp for corrosion of a full-pressure joint type semiconductor device chip table top, which comprises a base, wherein the upper end of the base is fixedly connected with two symmetrical vertical plates, the inner sides of the two vertical plates are fixedly connected with supporting plates, the two supporting plates are respectively and fixedly connected with two sides of a lower clamp, the upper end of the lower clamp is provided with an upper clamp, and the rear end of the base is fixedly connected with a fixing plate; the clamping mechanism comprises a telescopic cylinder fixedly connected to the upper end of the fixing plate. According to the utility model, the protection mechanism is matched with the clamping mechanism, so that the protection plate is favorably and tightly attached to the aluminum layer, the aluminum layer part is conveniently protected, the table top can be exposed, the table top is conveniently subjected to table top corrosion operation, the corrosion quality of the semiconductor device chip table top is improved, and the qualification rate of products is greatly improved.
Description
Technical Field
The utility model relates to the technical field of clamps, in particular to a clamp for corrosion of a full-pressure joint type semiconductor device chip table top.
Background
The full-compression joint type semiconductor device chip is a chip for compressing molybdenum sheets, aluminum and silicon wafers together and comprises a rectifying tube chip, a thyristor chip and the like. The mesa corrosion generally corrodes the polished chip mesa, changes the polished rough surface into a smooth surface through chemical reaction, eliminates mechanical damage and surface defects, simultaneously eliminates pollutants and metal ions attached to the surface of the mesa, achieves the effect of stabilizing the electric characteristics of the surface of the semiconductor device chip, and is an indispensable key link in the manufacturing process of the full-pressure-connection semiconductor device chip.
After the existing full-compression-joint type semiconductor device chip is molded by a table top, the table top corrosion is required to be carried out by clamping the chip through a clamp, when the table top corrosion is carried out on the chip, the parts, except the table top, of the two sides of the chip are required to be effectively protected, only the table top is exposed to carry out the table top corrosion, how to only the table top is corroded, the parts except the table top are protected, the key of the problem is that the parts except the table top are protected, the clamping effect of the existing clamp is poor, the chip is easy to slide, and then the chip is damaged.
Therefore, a clamp for etching the table top of a full-pressure-bonding type semiconductor device chip is provided.
Disclosure of Invention
The utility model aims to provide a clamp for etching the table top of a full-pressure-joint type semiconductor device chip, which solves the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the clamp for the full-pressure joint type semiconductor device chip table top corrosion comprises a base, wherein the upper end of the base is fixedly connected with two symmetrical vertical plates, the inner sides of the two vertical plates are fixedly connected with supporting plates, the two supporting plates are respectively and fixedly connected with two sides of a lower clamp, the upper end of the lower clamp is provided with an upper clamp, and the rear end of the base is fixedly connected with a fixing plate;
the clamping mechanism comprises a telescopic cylinder fixedly connected to the upper end of the fixed plate, a piston rod at the upper end of the telescopic cylinder is fixedly connected with one end of a connecting plate, and the other end of the connecting plate is fixedly connected to the middle part of the lifting plate;
the protection mechanism comprises an operation groove arranged at the bottom end of the lower clamp and the upper end of the upper clamp, and a protection plate is arranged in the operation groove.
Preferably, the bottom fixedly connected with symmetry of lifter plate is two sets of pull rods, and the bottom of two sets of pull rods all runs through the riser and fixedly connected with limiting plate, and two sets of limiting plate are fixed connection in the both sides of last anchor clamps respectively.
Preferably, the outside of limiting plate all blocks the inside of establishing at the riser, and the outside cover of pull rod is equipped with first spring, and first spring sets up between riser and limiting plate.
Preferably, the upper end of the lower clamp is provided with a first clamping groove, two groups of chips are arranged in the first clamping groove, the upper ends of the two groups of chips are clamped in a second clamping groove, and the size of the chips is matched with the second clamping groove.
Preferably, the chip is composed of a molybdenum sheet, an aluminum layer and a mesa, the chip comprising the molybdenum sheet as an anode and the aluminum layer as a cathode and the mesa being provided at the side edges.
Preferably, the bottom of the lower clamp and the upper end of the upper clamp are fixedly connected with one ends of two groups of symmetrical supporting rods, and the other ends of the two groups of supporting rods are fixedly connected to the supporting plate.
Preferably, the outside of chip is pasted and is equipped with the guard plate, and the upper end fixedly connected with push rod's of guard plate one end, the other end of push rod run through the layer board and fixedly connected with limiting plate.
Preferably, the outer side of the push rod is sleeved with a limiting plate, and the limiting plate is arranged between the supporting plate and the protection plate.
The utility model has the beneficial effects that:
1. according to the utility model, the clamping mechanism is designed, the telescopic cylinder can control the lower clamp and the upper clamp to be opened, the first spring restoring force can drive the upper clamp to be matched with the lower clamp to clamp the chip, the chip is convenient to move and put into the lower clamp, the upper clamp is matched with the lower clamp to clamp the chip, the chip is convenient to fix, the operation is simple and quick, and the production efficiency is greatly improved.
2. According to the utility model, the protection mechanism is matched with the clamping mechanism, and the restoring force of the second spring can drive the protection plate to cling to the aluminum layer on the chip, so that the protection plate can resist the position of the aluminum layer, the protection plate can be favorably and tightly attached to the aluminum layer, the aluminum layer part can be conveniently protected, the table top can be exposed, the table top can be conveniently subjected to table top corrosion operation, the corrosion quality of the table top of the semiconductor device chip is improved, and the qualification rate of products is greatly improved.
Drawings
In order to more clearly illustrate the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only of the utility model and that other drawings can be obtained from them without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of a whole of a clamp for etching a mesa of a full-pressure semiconductor device according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram showing a second overall perspective view of a clamp for etching a mesa of a full-compression semiconductor device according to an embodiment of the present utility model;
FIG. 3 is an overall explosion schematic of a clamp for etching a mesa of a full-compression semiconductor device in accordance with an embodiment of the present utility model;
fig. 4 is a schematic cross-sectional view of a portion A-A of fig. 1 showing a clamp for etching a mesa of a chip of a full-pressure semiconductor device according to an embodiment of the present utility model.
Marked in the figure as: 1. a base; 2. a vertical plate; 3. a support plate; 4. a lower clamp; 5. a clamp is arranged; 6. a fixing plate; 7. a telescopic cylinder; 8. a connecting plate; 9. a lifting plate; 10. a pull rod; 11. a first spring; 12. a limiting plate; 13. a first clamping groove; 14. a chip; 15. a molybdenum sheet layer; 16. an aluminum layer; 17. a table top; 18. a second clamping groove; 19. an operation groove; 20. a support rod; 21. a supporting plate; 22. a protection plate; 23. a push rod; 24. a limiting plate; 25. and a second spring.
Detailed Description
The present utility model will be further described in detail with reference to specific embodiments in order to make the objects, technical solutions and advantages of the present utility model more apparent.
It is to be noted that unless otherwise defined, technical or scientific terms used herein should be taken in a general sense as understood by one of ordinary skill in the art to which the present utility model belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
As shown in fig. 1 to 4, a specific embodiment of the present utility model provides a clamp for etching a table top of a full-pressure-bonding semiconductor device chip, which comprises a base 1, wherein two symmetrical vertical plates 2 are fixedly connected to the upper end of the base 1, support plates 3 are fixedly connected to the inner sides of the two vertical plates 2, the two support plates 3 are respectively and fixedly connected to two sides of a lower clamp 4, an upper clamp 5 is arranged at the upper end of the lower clamp 4, and a fixing plate 6 is fixedly connected to the rear end of the base 1;
the clamping mechanism comprises a telescopic cylinder 7 fixedly connected to the upper end of the fixed plate 6, a piston rod at the upper end of the telescopic cylinder 7 is fixedly connected with one end of a connecting plate 8, and the other end of the connecting plate 8 is fixedly connected to the middle part of a lifting plate 9;
the protection mechanism comprises an operation groove 19 formed in the bottom end of the lower clamp 4 and the upper end of the upper clamp 5, and a protection plate 22 is arranged in the operation groove 19.
By adopting the technical scheme, the utility model is provided with the clamping mechanism and the protection mechanism, the clamping mechanism can clamp the chip 14 by matching the upper clamp 5 with the lower clamp 4, so that the chip 14 is convenient to fix, and the protection mechanism can enable the protection plate 22 to be tightly attached to the aluminum layer 16, so that the aluminum layer 16 is convenient to protect.
Specifically, as shown in fig. 2 and 3, two groups of symmetrical pull rods 10 are fixedly connected to the bottom end of the lifting plate 9, the bottom ends of the two groups of pull rods 10 penetrate through the vertical plate 2 and are fixedly connected with limiting plates 12, the two groups of limiting plates 12 are respectively and fixedly connected to two sides of the upper clamp 5, the outer sides of the limiting plates 12 are clamped inside the vertical plate 2, a first spring 11 is sleeved outside the pull rods 10, the first spring 11 is arranged between the vertical plate 2 and the limiting plates 12, a first clamping groove 13 is formed in the upper end of the lower clamp 4, two groups of chips 14 are arranged inside the first clamping groove 13, the upper ends of the two groups of chips 14 are clamped inside a second clamping groove 18, the size of the chips 14 is matched with that of the second clamping groove 18, the chips 14 consist of a molybdenum sheet layer 15, an aluminum layer 16 and a table top 17, and the chips 14 comprise a molybdenum sheet layer 15 serving as an anode, an aluminum layer 16 serving as a cathode, and the side surface 17 arranged at the side edge.
Through adopting above-mentioned technical scheme, during operation, start flexible cylinder 7, flexible cylinder 7 passes through connecting plate 8 and drives lifter plate 9 and rise, lifter plate 9 passes through first spring 11 and limiting plate 12 and drives upward anchor clamps 5 and rise then, the side that has molybdenum sheet layer 15 on two sets of chips 14 pastes each other and establishes together, then put into the first draw-in groove 13 of lower anchor clamps 4 upper end with two sets of chips 14, close flexible cylinder 7 at last, the restoring force of first spring 11 passes through limiting plate 12 and drives upward anchor clamps 5 bottom card and establish in the upper end of lower anchor clamps 4, make the upper end card of chip 14 establish in the second draw-in groove 18 of last anchor clamps 5 bottom, be favorable to removing the position of going up anchor clamps 5, be convenient for put into lower anchor clamps 4 with chip 14, and go up anchor clamps 5 cooperation lower anchor clamps 4 and press from both sides tightly the chip 14, be convenient for fix the chip 14, easy operation is swift, production efficiency has been improved by a wide margin.
Specifically, as shown in fig. 2 and fig. 4, the bottom end of the lower fixture 4 and the upper end of the upper fixture 5 are fixedly connected with one ends of two symmetrical groups of support rods 20, the other ends of the two groups of support rods 20 are fixedly connected to the supporting plate 21, a protection plate 22 is attached to the outer side of the chip 14, one end of a push rod 23 is fixedly connected to the upper end of the protection plate 22, the other end of the push rod 23 penetrates through the supporting plate 21 and is fixedly connected with a limiting plate 24, a limiting plate 24 is sleeved on the outer side of the push rod 23, and the limiting plate 24 is arranged between the supporting plate 21 and the protection plate 22.
Through adopting above-mentioned technical scheme, when clamp 4 and last anchor clamps 5 clamp down, the aluminium layer 16 face extrusion guard plate 22 on the chip 14, guard plate 22 upwards contracts in operating groove 19, then the restoring force of second spring 25 promotes guard plate 22 and the inseparable laminating of aluminium layer 16 on the chip 14 through the steady rest that bracing piece 20 and bracing piece 20 provided, last guard plate 22 carries out spacingly through the limiting plate 24 of push rod 23 upper end, be favorable to making guard plate 22 closely laminate on aluminium layer 16, be convenient for protect aluminium layer 16 position, and can make mesa 17 expose, be convenient for carry out mesa corrosion operation to mesa 17, the corrosion quality of semiconductor device chip mesa has been improved, the qualification rate of product has been improved by a wide margin.
Working principle: when the device is in operation, the telescopic air cylinder 7 is started, the telescopic air cylinder 7 drives the lifting plate 9 to lift through the connecting plate 8, then the lifting plate 9 drives the upper clamp 5 to lift through the first spring 11 and the limiting plate 12, then the side surfaces of the molybdenum sheet layers 15 on the two groups of chips 14 are mutually stuck together, then the two groups of chips 14 are placed into the first clamping groove 13 at the upper end of the lower clamp 4, finally the telescopic air cylinder 7 is closed, the restoring force of the first spring 11 drives the bottom end of the upper clamp 5 to be clamped at the upper end of the lower clamp 4 through the limiting plate 12, the upper end of the chip 14 is clamped in the second clamping groove 18 at the bottom end of the upper clamp 5, the position of the upper clamp 5 is facilitated to be moved, the chips 14 are conveniently placed into the lower clamp 4, the chips 14 are conveniently fixed by the upper clamp 5 in cooperation with the lower clamp 4, the operation is simple and quick, and the production efficiency is greatly improved;
when the lower clamp 4 and the upper clamp 5 are clamped, the surface of the aluminum layer 16 on the chip 14 extrudes the protection plate 22, the protection plate 22 is contracted upwards in the operation groove 19, then the restoration force of the second spring 25 pushes the protection plate 22 to be tightly attached to the aluminum layer 16 on the chip 14 through the support rods 20 and the stable support provided by the support rods 20, and finally the protection plate 22 is limited through the limiting plate 24 at the upper end of the push rod 23, so that the protection plate 22 is tightly attached to the aluminum layer 16, the aluminum layer 16 is protected conveniently, the table top 17 can be exposed, the table top 17 is conveniently subjected to table top corrosion operation, the corrosion quality of the semiconductor device chip table top is improved, and the qualification rate of products is greatly improved.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the utility model (including the claims) is limited to these examples; the technical features of the above embodiments or in the different embodiments may also be combined within the idea of the utility model, the steps may be implemented in any order and there are many other variations of the different aspects of the utility model as described above, which are not provided in detail for the sake of brevity.
The present utility model is intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omission, modification, equivalent replacement, improvement, etc. of the present utility model should be included in the scope of the present utility model.
Claims (8)
1. The clamp for the full-pressure joint type semiconductor device chip table top corrosion comprises a base, and is characterized in that the upper end of the base is fixedly connected with two symmetrical groups of vertical plates, the inner sides of the two groups of vertical plates are fixedly connected with supporting plates, the two groups of supporting plates are respectively and fixedly connected to two sides of a lower clamp, the upper end of the lower clamp is provided with an upper clamp, and the rear end of the base is fixedly connected with a fixing plate;
the clamping mechanism comprises a telescopic cylinder fixedly connected to the upper end of the fixed plate, a piston rod at the upper end of the telescopic cylinder is fixedly connected with one end of a connecting plate, and the other end of the connecting plate is fixedly connected to the middle part of the lifting plate;
the protection mechanism comprises an operation groove formed in the bottom end of the lower clamp and the upper end of the upper clamp, and a protection plate is arranged in the operation groove.
2. The clamp for etching the chip table surface of the full-pressure semiconductor device according to claim 1, wherein two groups of symmetrical pull rods are fixedly connected to the bottom end of the lifting plate, the bottom ends of the two groups of pull rods penetrate through the vertical plate and are fixedly connected with limiting plates, and the two groups of limiting plates are respectively and fixedly connected to two sides of the upper clamp.
3. The clamp for etching the chip table surface of the full-pressure semiconductor device according to claim 2, wherein the outer sides of the limiting plates are clamped in the vertical plates, the outer sides of the pull rods are sleeved with first springs, and the first springs are arranged between the vertical plates and the limiting plates.
4. The clamp for etching the chip table surface of the full-pressure-bonding semiconductor device according to claim 3, wherein a first clamping groove is formed in the upper end of the lower clamp, two groups of chips are arranged in the first clamping groove, the upper ends of the two groups of chips are clamped in a second clamping groove, and the size of the chips is matched with that of the second clamping groove.
5. The fixture for etching a mesa of a full-pressure semiconductor device chip of claim 4, wherein the chip is composed of a molybdenum sheet layer, an aluminum layer and a mesa, and the chip comprises the molybdenum sheet layer as an anode, the aluminum layer as a cathode and the mesa provided at a side edge.
6. The fixture for etching the top surface of the chip of the full-pressure semiconductor device according to claim 5, wherein the bottom end of the lower fixture and the upper end of the upper fixture are fixedly connected with one ends of two symmetrical groups of supporting rods, and the other ends of the two groups of supporting rods are fixedly connected to the supporting plate.
7. The fixture for etching the mesa of a fully pressed semiconductor device chip of claim 6, wherein a protection plate is attached to the outer side of the chip, one end of a push rod is fixedly connected to the upper end of the protection plate, and the other end of the push rod penetrates through the supporting plate and is fixedly connected with the limiting plate.
8. The fixture for etching the top surface of the chip of the full-pressure semiconductor device according to claim 7, wherein a limiting plate is sleeved outside the push rod, and the limiting plate is arranged between the supporting plate and the protection plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321953604.9U CN220290787U (en) | 2023-07-24 | 2023-07-24 | Clamp for full-pressure joint type semiconductor device chip table top corrosion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321953604.9U CN220290787U (en) | 2023-07-24 | 2023-07-24 | Clamp for full-pressure joint type semiconductor device chip table top corrosion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220290787U true CN220290787U (en) | 2024-01-02 |
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ID=89340790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321953604.9U Active CN220290787U (en) | 2023-07-24 | 2023-07-24 | Clamp for full-pressure joint type semiconductor device chip table top corrosion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220290787U (en) |
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2023
- 2023-07-24 CN CN202321953604.9U patent/CN220290787U/en active Active
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