CN220280309U - Cleaning brush for semiconductor packaging injection molding machine - Google Patents
Cleaning brush for semiconductor packaging injection molding machine Download PDFInfo
- Publication number
- CN220280309U CN220280309U CN202321166405.3U CN202321166405U CN220280309U CN 220280309 U CN220280309 U CN 220280309U CN 202321166405 U CN202321166405 U CN 202321166405U CN 220280309 U CN220280309 U CN 220280309U
- Authority
- CN
- China
- Prior art keywords
- injection molding
- molding machine
- cleaning brush
- foreign matters
- lower die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001746 injection moulding Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 238000004140 cleaning Methods 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000004033 plastic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000007246 mechanism Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 210000004209 hair Anatomy 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 210000000416 exudates and transudate Anatomy 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model provides a cleaning brush for a semiconductor packaging injection molding machine, which comprises a central shaft and bristles surrounding the central shaft, wherein a bristle abdicating part is arranged in the middle of the brush, and the bristle abdicating part is equivalent to the lower die center block of the packaging injection molding machine in length. The beneficial effects of the utility model are as follows: the yielding of the brush to the position of the center block of the lower die ensures that the position of the center block of the lower die is not cleaned when the lower die is cleaned, the film-shaped foreign matters are not brushed and broken, the film-shaped foreign matters cannot be blown into the die surface due to slight air flow in the die cavity, the contribution ratio of the film-shaped foreign matters of the center block to the foreign matters and the concave substrate is reduced, and the quality benefit is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging injection molding, in particular to a cleaning brush for a semiconductor packaging injection molding machine.
Background
The manufacturing process of semiconductor products mainly includes Front-End wafer manufacturing (Front-End) and Back-End package testing (Back-End). The general packaging process can be roughly divided into the steps of back thinning, wafer cutting, wafer mounting, wire bonding, plastic packaging, laser printing, rib cutting forming, finished product testing and the like. The plastic packaging refers to placing the chip and the lead frame which are subjected to lead bonding in a die cavity of a semiconductor packaging injection molding machine, and then injecting plastic packaging compound epoxy resin for wrapping gold wires on a wafer and the lead frame, so that the wafer element and the gold wires are protected. Preventing the gas from oxidizing the internal chip; ensure the safety and stability of the product. After a period of time, the surface of the lower die needs to be cleaned, but because resin is injected to two sides through a center block of the die during machine operation, wax and other exudates in resin components can be accumulated at the center block and formed into thin-film foreign matters, the conventional cleaning method directly cleans the lower die through a continuous brush, the foreign matters can be decomposed into a plurality of foreign matters fragments in the process, a part of foreign matters adhere to the brush to have secondary pollution risk on the die surface, and the other part of foreign matters and pits on the substrate surface are formed after the die is clamped by air flow.
Disclosure of Invention
The utility model aims to solve the problem of providing a cleaning brush for a semiconductor packaging injection molding machine and the semiconductor packaging injection molding machine.
The aim of the utility model is achieved by the following technical scheme:
the cleaning brush for the semiconductor packaging injection molding machine comprises a central shaft and bristles encircling the central shaft, wherein a bristle abdicating part is arranged in the middle of the brush, and the bristle abdicating part is equivalent to the lower die center block of the packaging injection molding machine in length.
Preferably, the bristles are spirally wound on the central shaft.
Preferably, the gaps between adjacent bristles are equal.
Preferably, the gap between adjacent bristles is 6-10mm.
Preferably, both ends of the central shaft are respectively provided with a mounting lock catch for being connected with the packaging injection molding machine.
The beneficial effects of the utility model are as follows: the yielding of the brush to the position of the center block of the lower die ensures that the position of the center block of the lower die is not cleaned when the lower die is cleaned, the film-shaped foreign matters are not brushed and broken, the film-shaped foreign matters cannot be blown into the die surface due to slight air flow in the die cavity, the contribution ratio of the film-shaped foreign matters of the center block to the foreign matters and the concave substrate is reduced, and the quality benefit is improved.
Drawings
Fig. 1: the cleaning brush structure of the utility model is schematically shown.
Fig. 2: the cleaning brush of the utility model is structurally schematic with the space between the dies when in use.
1 central shaft, 2 bristles, 12 bristle abdicating parts, 11 mounting lock catches, 3 upper dies, 4 lower dies, 5 glue squeezing rods and 41 lower die central blocks.
Description of the embodiments
The following description of the embodiments of the present utility model will be further described with reference to examples and drawings, so that the technical solution of the present utility model is easier to understand and master.
The utility model discloses a cleaning brush for a semiconductor packaging injection molding machine, which is shown in fig. 1, and comprises a central shaft 1 and bristles 2 surrounding the central shaft 1, wherein a bristle abdication part 12 is arranged in the middle of the brush, and the bristle abdication part 12 is equivalent to the length of a lower die center block of the packaging injection molding machine, so that the damage to thin-film-shaped foreign matters formed at the position of the lower die center block is avoided when the brush cleans the surface of the lower die. The gaps between the adjacent bristles 2 are equal.
In this embodiment, the bristles 2 are spirally wound around the central shaft 1. The spiral mode can prolong the service life of the brush hair, and meanwhile, the brush hair is quicker to install and has a compact structure. The gap between adjacent bristles is 6-10mm, preferably 8mm. So that the brush hairs are more compact, and the cleaning effect is better. The distance between the bristles can be adjusted according to the actual application of the mold. Adjacent bristles herein refer to the distance between adjacent bristle bars.
The installation mode of the hairbrush is the same as that of the prior art, namely, installation locking buckles 11 are respectively arranged at two ends of the central shaft 1 to be connected with a driving mechanism.
For a better understanding of the cleaning principle of the present utility model, the following description is made with reference to fig. 2: the encapsulation injection molding machine is the same with the prior art, and all includes upper mould 3 and lower mould 4 that mutually support from top to bottom, lower mould 4 middle part is provided with lower mould center piece 41, the below of lower mould center piece 41 is provided with crowded gum stick 5, the resin glue is gone into the product that is arranged in the die cavity in the lower mould center piece 41 through crowded gum stick 5 and is annotated the glue, and the injection molding mode is the same with the prior art also, and no more detailed here.
After the plastic injection is carried out for a period of time, the hairbrush is driven by a mechanical clamping jaw or a mechanical arm or other mechanisms to be arranged above the lower die, and the lower die is cleaned and brushed, because the epoxy resin can generate thin film-shaped foreign matters at the center block, the cleaning hairbrush is used for giving way, and the hairbrush is not used for brushing the die nearby the center block, the thin film-shaped foreign matters cannot be brushed into a large number of foreign matter fragments, the hairbrush cannot be adhered to the hairbrush to carry out secondary pollution on the die surface, and meanwhile, the hairbrush cannot be easily blown to the surface of the lower die by air flow in the die cavity. The film-shaped foreign matters can be sucked and removed through vacuum dust collection of the suction mechanism.
Of course, the brush can be installed in combination with different equipment according to actual requirements, and the actual use of the brush is not affected. For example, when enterprises produce, a plurality of packaging injection molding machines are simultaneously carried out to carry out pipelining operation so as to improve injection molding efficiency. When the first injection molding machine completes injection molding, the upper die and the lower die are opened, the material is taken by the material taking mechanism, the hairbrush can be arranged on the material taking mechanism, and the lower die is cleaned by the hairbrush after the injection molding product is taken away along with the material taking mechanism through a proper connecting mechanism. Similarly, the vacuum dust-collecting and material-absorbing mechanism can also be connected to the material-taking mechanism, namely, the material-taking mechanism can absorb the material through the vacuum dust-collecting and material-absorbing mechanism after the brush is cleaned. After the mold surface is cleaned, the injection of the next product to be injected can be performed. The utility model greatly reduces the contribution ratio of the thin film-shaped foreign matters of the center block to the foreign matters and the concave pits of the substrate through the abdication treatment, and has strong practicability.
In the description of the present utility model, it should be noted that, the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Of course, various modifications and variations can be made by those skilled in the art without departing from the scope of the utility model, and all technical solutions resulting from the use of equivalent substitutions or equivalent transformations fall within the scope of the claimed utility model. There are various embodiments of the present utility model, which are not specifically described herein.
Claims (5)
1. The cleaning brush for the semiconductor packaging injection molding machine is characterized in that: the novel plastic packaging injection molding machine comprises a central shaft (1) and bristles (2) arranged on the central shaft (1) in a surrounding mode, wherein bristle abdicating parts (12) are arranged in the middle of the bristles, and the bristle abdicating parts (12) are equivalent to the lower die center block of the packaging injection molding machine in length.
2. A cleaning brush for semiconductor package injection molding machines according to claim 1, characterized in that the bristles (2) are spirally wound on the central shaft (1).
3. A cleaning brush for a semiconductor package injection molding machine according to claim 2, wherein gaps between adjacent ones of the bristles (2) are equal.
4. A cleaning brush for semiconductor package injection molding machines according to claim 3, characterized in that the gap between adjacent bristles (2) is 6-10mm.
5. The cleaning brush for semiconductor package injection molding machine according to claim 4, wherein both ends of the center shaft (1) are respectively provided with mounting catches (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321166405.3U CN220280309U (en) | 2023-05-16 | 2023-05-16 | Cleaning brush for semiconductor packaging injection molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321166405.3U CN220280309U (en) | 2023-05-16 | 2023-05-16 | Cleaning brush for semiconductor packaging injection molding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220280309U true CN220280309U (en) | 2024-01-02 |
Family
ID=89343997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321166405.3U Active CN220280309U (en) | 2023-05-16 | 2023-05-16 | Cleaning brush for semiconductor packaging injection molding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220280309U (en) |
-
2023
- 2023-05-16 CN CN202321166405.3U patent/CN220280309U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |