CN220272236U - NTC thermistor epoxy packaging hardware - Google Patents

NTC thermistor epoxy packaging hardware Download PDF

Info

Publication number
CN220272236U
CN220272236U CN202321756656.7U CN202321756656U CN220272236U CN 220272236 U CN220272236 U CN 220272236U CN 202321756656 U CN202321756656 U CN 202321756656U CN 220272236 U CN220272236 U CN 220272236U
Authority
CN
China
Prior art keywords
base
cavity
heating pipe
ntc thermistor
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202321756656.7U
Other languages
Chinese (zh)
Inventor
阴卫华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Jinggeer Electronics Co ltd
Original Assignee
Anhui Jinggeer Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Jinggeer Electronics Co ltd filed Critical Anhui Jinggeer Electronics Co ltd
Priority to CN202321756656.7U priority Critical patent/CN220272236U/en
Application granted granted Critical
Publication of CN220272236U publication Critical patent/CN220272236U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Package Closures (AREA)

Abstract

The utility model discloses an NTC thermistor epoxy packaging device which comprises a base, wherein a frame is connected to the base, a lifting plate is connected to the frame through a first driving piece in a driving mode, a packaging machine is connected to the upper side of the lifting plate, an upper die is connected to the lower side of the lifting plate, a lower die is arranged in a matched mode, the lower die is connected to the base, a heating pipe and a cooling pipe are connected to the base, the heating pipe and the cooling pipe are communicated with a cavity, a piston plate is connected to the cavity in a sliding mode, and the piston plate is used for sealing a pipe orifice of the heating pipe. The utility model has the advantages that: the device connects heating pipe and cooling tube on the base, carries hot-blast to the cavity through the heating pipe, carries the coolant liquid to the cavity through the cooling tube in, and this device adopts the piston plate to switch hot-blast and coolant liquid in the cavity, plays the effect to lower mould intensification or cooling, and not only simple structure, equipment cost reduces, and hot-blast and coolant liquid switch in addition is convenient.

Description

NTC thermistor epoxy packaging hardware
Technical Field
The utility model relates to the technical field of thermistors, in particular to an NTC thermistor epoxy packaging device.
Background
The existing packaging equipment is inconvenient to preheat and heat up the lower die for packaging the NTC thermistor when packaging the NTC thermistor, and the defect that the packaging liquid on the lower die is easy to form when contacting with the die is caused, so that the defect rate of the NTC thermistor after packaging operation is increased, meanwhile, the existing packaging equipment is inconvenient to cool down and cool down the die for packaging the NTC thermistor, and the NTC thermistor after die assembly packaging is inconvenient to quickly cool and form, so that the operation efficiency of the NTC thermistor during packaging is reduced.
The traditional Chinese patent with the application number of CN202111638000.0 discloses an NTC thermistor epoxy packaging device, which comprises a processing table, a mounting frame arranged at the top of the processing table, electric pushing cylinders penetrating through two sides of the top of the mounting frame, a lifting plate horizontally arranged in the upper part of the mounting frame and a packaging machine arranged at the top of the lifting plate, wherein an upper die is arranged at the bottom of the lifting plate, a mounting seat penetrates through the middle part of the top surface of the processing table, and a lower die is arranged at the top of the mounting seat; the bottom surface of the inside of the processing table is provided with a transmission box, and the inside of the mounting seat is provided with an adjusting mechanism for cooling and heating the lower die; a transmission mechanism for driving the adjusting mechanism is arranged in the transmission box; a heat supply machine matched with the adjusting mechanism is arranged on the inner bottom surface of the processing table; the processing bench top of mount pad one side runs through and is equipped with both ends confined installation section of thick bamboo, and the installation section of thick bamboo is inside to be equipped with and is used for drive mechanism driven link gear. The device makes the bed die intensify when drip irrigation the encapsulation to thermistor, can cool down the cooling after the compound die, and though can shorten the shaping duration after the thermistor drips irrigation the encapsulation, improves the work efficiency of encapsulation operation, but the structure of the device is too complicated, and is very troublesome when making and installing, and equipment cost is also too high relatively.
Disclosure of Invention
The utility model aims to solve the defects in the prior art, and provides an NTC thermistor epoxy packaging device.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides an NTC thermistor epoxy packaging hardware, includes the base, connects the frame on the base, connects the lifter plate through first driving piece drive in the frame, connects the packaging machine in the upside of lifter plate, connects the mould in the downside of lifter plate, and the mould cooperation sets up the bed die, and the bed die is connected on the base, connect heating pipe and cooling tube on the base, heating pipe and cooling tube intercommunication the cavity, sliding connection piston board in the cavity, the piston board is used for shutoff the mouth of pipe of heating pipe.
Preferably, the heating pipe is connected with a hot air device.
Preferably, the cooling pipe is connected with a cooling liquid tank, and the cooling liquid tank is connected to the rack.
Preferably, a second driving member is connected to the base, the second driving member being for driving the piston plate.
Preferably, a set of through holes is provided in the upper side of the cavity.
Preferably, a heat insulating plate is connected to a side of the piston plate facing the heating pipe.
The utility model has the advantages that: according to the NTC thermistor epoxy packaging device provided by the utility model, the heating pipe and the cooling pipe are connected on the base, hot air is conveyed into the cavity through the heating pipe, and cooling liquid is conveyed into the cavity through the cooling pipe.
Drawings
Fig. 1 is a schematic diagram of the principle structure of an NTC thermistor epoxy packaging device provided by the present utility model;
fig. 2 is a schematic view of the internal structure of the base.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
As shown in fig. 1, the NTC thermistor epoxy packaging device provided by the utility model comprises a base 1, wherein a frame 2 is connected to the base 1, a lifting plate 4 is connected to the frame 2 through a first driving piece 3 in a driving manner, a packaging machine 5 is connected to the upper side of the lifting plate 4, an upper die 6 is connected to the lower side of the lifting plate 4, a lower die 7 is arranged on the upper die 6 in a matched manner, the lower die 7 is connected to the base 1, and the upper die 6 is driven to descend through the first driving piece 3, so that the upper die 6 and the lower die 7 are clamped.
As shown in fig. 2, a cavity 8 is provided in the base 1, the cavity 8 is connected with a heating pipe 9 and a cooling pipe 10, the heating pipe 9 is connected with a hot air device 12, the hot air device 12 is a conventional device, hot air can be generated and conveyed into the cavity 8 through the heating pipe 9, and the temperature of the lower die 7 is raised through the hot air.
The cooling pipe 10 is connected with the cooling liquid tank 13, the cooling liquid tank 13 is connected to the frame 2, the cooling liquid tank 13 is located above the base 1, the cooling pipe 10 is connected to the downside of the cooling liquid tank 13, cooling liquid in the cooling liquid tank 13 can enter the cavity 8 along the cooling pipe 10, and cooling is carried out on the lower die 7 through the cooling liquid.
A group of through holes 8.1 are arranged on the upper side in the cavity 8, and when hot air or cooling liquid enters the cavity 8, the temperature of the lower die 7 can be raised or cooled through the through holes 8.1.
The second driving piece 1.1 is connected to an end face of the base 1 far away from the hot air device 12, the second driving piece 1.1 can be an oil cylinder, an air cylinder or an electric push rod, in the embodiment, the second driving piece 1.1 is an electric push rod, a through hole is formed in the end face of the base 1, a driving rod of the second driving piece 1.1 penetrates through the through hole, a piston plate 11 is connected to the driving rod of the second driving piece 1.1, the piston plate 11 slides in the cavity 8, the piston plate 11 is used for blocking a pipe orifice of the heating pipe 9, and a heat insulation plate 14 is connected to one side face of the piston plate 11 facing the heating pipe 9, so that heat can be better insulated through the heat insulation plate 14.
When the second driving piece 1.1 drives the piston plate 11 to move towards the heating pipe 9, the cooling liquid in the cooling liquid tank 13 can be pumped into the cavity 8, and when the second driving piece 1.1 drives the piston plate 11 to be far away from the heating pipe 9, the cooling liquid in the cavity 8 is extruded through the piston plate 11, so that the cooling liquid in the cavity 8 returns to the cooling liquid tank 13 again.
When the device is used, hot air device 12 conveys hot air into cavity 8 through heating pipe 9, heat up lower mould 7, prevent the condition of packing liquid rapid prototyping from appearing, when last mould 7 and lower mould 6 compound die, drive piston board 11 shutoff heating pipe 9 through driving piece 1.1, it is isolated hot-blast, prevent hot-blast entering cavity 8, when piston board 11 moves to the direction of heating pipe 9, coolant liquid in coolant tank 13 gets into cavity 8 through cooling tube 10, cool off lower mould 7, shorten NTC thermistor's shaping duration after drip irrigation encapsulation, this device can realize the intensification and the cooling of lower mould 7 through simple structure, it is more convenient when making the manufacturing, reduce equipment cost, hot-blast and coolant liquid switch over conveniently moreover.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. The utility model provides an NTC thermistor epoxy packaging hardware, includes base (1), connects frame (2) on base (1), connects lifter plate (4) through first driving piece (3) drive in frame (2), connects packagine machine (5) in the upside of lifter plate (4), connects mould (6) in the downside of lifter plate (4), goes up mould (6) cooperation and sets up bed die (7), and bed die (7) are connected on base (1), its characterized in that: the base (1) is internally provided with a cavity (8), the base (1) is connected with a heating pipe (9) and a cooling pipe (10), the heating pipe (9) and the cooling pipe (10) are communicated with the cavity (8), a piston plate (11) is slidably connected in the cavity (8), and the piston plate (11) is used for sealing a pipe orifice of the heating pipe (9).
2. The NTC thermistor epoxy packaging apparatus of claim 1, further comprising: the heating pipe (9) is connected with a hot air device (12).
3. The NTC thermistor epoxy packaging apparatus of claim 1, further comprising: the cooling pipe (10) is connected with a cooling liquid tank (13), and the cooling liquid tank (13) is connected to the frame (2).
4. The NTC thermistor epoxy packaging apparatus of claim 1, further comprising: a second drive element (1.1) is connected to the base (1), the second drive element (1.1) being used to drive the piston plate (11).
5. The NTC thermistor epoxy packaging apparatus of claim 1, further comprising: a group of through holes (8.1) are arranged on the upper side in the cavity (8).
6. The NTC thermistor epoxy packaging apparatus of claim 1, further comprising: a heat insulating plate (14) is connected to the piston plate (11) on the side facing the heating pipe (9).
CN202321756656.7U 2023-07-06 2023-07-06 NTC thermistor epoxy packaging hardware Active CN220272236U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321756656.7U CN220272236U (en) 2023-07-06 2023-07-06 NTC thermistor epoxy packaging hardware

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321756656.7U CN220272236U (en) 2023-07-06 2023-07-06 NTC thermistor epoxy packaging hardware

Publications (1)

Publication Number Publication Date
CN220272236U true CN220272236U (en) 2023-12-29

Family

ID=89305444

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321756656.7U Active CN220272236U (en) 2023-07-06 2023-07-06 NTC thermistor epoxy packaging hardware

Country Status (1)

Country Link
CN (1) CN220272236U (en)

Similar Documents

Publication Publication Date Title
CN210925961U (en) High-power LED wire bonding machine
CN220272236U (en) NTC thermistor epoxy packaging hardware
CN219705860U (en) Quick cooling molding plastic envelope press
CN213500424U (en) Steam foaming device
CN215151573U (en) Vehicle part preparation mould with heat-resisting protection architecture
CN215587828U (en) Long-life heat balance die casting die
CN210333993U (en) Stamping die with cooling function
CN213891045U (en) Injection mold with heat dissipation function
CN212238927U (en) Thermal-insulated aluminium alloy forming device
CN215356131U (en) Multi-layer plate-level shielding part mold
CN220095438U (en) Injection mold cooling device
CN218286005U (en) Die casting machine is used in refractory material production
CN220659184U (en) Novel casting mould
CN219786533U (en) Copper alloy preparation is with mould with heat dissipation function
CN215283229U (en) Panel injection mould easy to radiate heat
CN216992853U (en) Injection mold with cooling structure
CN112872200B (en) Die cavity dual-cycle refrigeration type plate numerical control bending machine
CN219381486U (en) Injection mold for accelerating mold forming
CN220741829U (en) SMC pressing die
CN214395298U (en) Injection molding machine mould cooling device
CN220864553U (en) Plastic part hot pressing device
CN219745969U (en) Automobile stamping die with cooling function
CN215544742U (en) Circular overware mould of electrothermal tube punching press formula
CN216032312U (en) Injection molding machine with self-cooling injection molding machine head
CN217414792U (en) Plastic package mold with high production efficiency

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant