CN220261812U - Flip-chip composite die - Google Patents
Flip-chip composite die Download PDFInfo
- Publication number
- CN220261812U CN220261812U CN202321732674.1U CN202321732674U CN220261812U CN 220261812 U CN220261812 U CN 220261812U CN 202321732674 U CN202321732674 U CN 202321732674U CN 220261812 U CN220261812 U CN 220261812U
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- die
- flip
- clamp plate
- terrace
- chip composite
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- 239000002131 composite material Substances 0.000 title claims abstract description 20
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 239000002699 waste material Substances 0.000 claims description 17
- 238000001746 injection moulding Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 13
- 238000001125 extrusion Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000110 cooling liquid Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 11
- 230000007774 longterm Effects 0.000 abstract description 6
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 10
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000010009 beating Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a flip-chip composite die, and belongs to the technical field of dies. For solving flip-chip mould simple structure, the structure that adopts spring and push rod can't satisfy structural position stability, influences the problem of long-term use, a flip-chip compound mould, including bed die, last mould, terrace die and die, install electronic jar between terrace die and the last mould, the below of terrace die is provided with the clamp plate, and the upper end of clamp plate is provided with spacing slide, and semiconductor cooling fin is installed to the below of die, and the externally mounted of semiconductor cooling fin has the coolant circulation pipe. The electric cylinder stretches out and draws back, can drive the terrace die and remove, and the terrace die drives the clamp plate activity, and the clamp plate activity in-process can improve the movable range of terrace die through the clamp plate, can keep the active site stability of clamp plate through spacing slide, during the use, can adjust work through the mounting groove, makes the position between last mould and the terrace die more stable, improves work quality.
Description
Technical Field
The utility model relates to the technical field of dies, in particular to a flip-chip composite die.
Background
The inverted compound die usually adopts a rigid pushing device, the pushing device is formed by combining a beating rod and a pushing block into a whole, and then the pressing device pushes out the workpiece.
In the prior art, for example, chinese patent publication No. CN 203044667U: the flip-chip composite die comprises a lower die holder, an upper die holder, a guide post, a guide sleeve, a stripper plate, a movable stop pin, a male die fixing plate, a connecting push rod, a push plate, a punching rod, a die shank, a punching male die, a blanking female die, a male die, a backing plate, a pushing piece, a pin, a screw, a fixing plate, a spring, a stripper screw and a guide pin, wherein the male die and the female die are arranged on the lower die holder; the stripper plate is connected with the lower die holder through a stripper screw and a spring sleeved on the stripper screw; a connecting push rod is arranged between the pushing piece block and the push plate. The die cutting device is simple in structure, convenient to operate, high in machining efficiency, suitable for producing blanking parts with large batch and high precision requirements, and capable of reducing production cost.
However, in the above technology, the existing flip-chip die has a simple structure, and the structure adopting the spring and the push rod cannot meet the structural position stability, so that the long-term use is affected.
In view of these drawbacks, it is necessary to design a flip-chip composite mold.
Disclosure of Invention
The utility model aims to provide a flip-chip composite die, which is used for solving the problems that the structure of a flip-chip die in the prior art is simple, the structure adopting a spring and a push rod cannot meet the structural position stability, and long-term use is influenced.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the inverted composite die comprises a lower die, an upper die, a male die and a female die, wherein the upper die is arranged above the lower die, the male die is arranged above the upper die, and the female die is arranged above the lower die;
an electric cylinder is arranged between the male die and the upper die, a pressing plate is arranged below the male die, a limiting slide plate is arranged at the upper end of the pressing plate, and the limiting slide plate extends into the male die and is connected with the male die in a sliding manner;
the semiconductor cooling fin is installed below the female die, and a cooling liquid circulating pipe is installed outside the semiconductor cooling fin.
Preferably, the lower terminal surface of bed die installs the access panel, the access panel passes through the fixed screw with the bed die and connects, the support column is installed to the below of access panel.
Preferably, the upper end face of the lower die is provided with an integrally formed sliding hole, a sliding rod is arranged in the sliding hole, the lower end of the sliding rod extends to the inside of the sliding hole to be in sliding connection with the lower die, and the upper end of the sliding rod is fixedly connected with the upper die.
Preferably, the upper end of the upper die is provided with a positioning cover plate, the upper end of the positioning cover plate is provided with a sealing ring, and an injection molding pipe is arranged in the sealing ring.
Preferably, the lower terminal surface of going up the mould is provided with integrated into one piece's mounting groove, the inside and last mould sliding connection of upper end embedding mounting groove of terrace die, the both sides of terrace die all are provided with integrated into one piece's through-hole, the through-hole is used for spacing slide.
Preferably, the upper end surface of the female die is provided with an integrally formed forming cavity, and an extrusion hole is formed below the inner part of the forming cavity.
Preferably, a discharge box is installed below the lower die, a heater is installed outside the discharge box, a waste discharge pipe is arranged at one end of the discharge box, and a connecting pipe is installed between the discharge box and the female die. Compared with the prior art, the utility model has the following beneficial effects:
1. this flip-chip composite mold, the electronic jar is flexible, can drive the terrace die and remove, and the terrace die drives the clamp plate activity, and the clamp plate activity in-process can improve the range of motion of terrace die through the clamp plate, can keep the active site stability of clamp plate through spacing slide, during the use, can adjust work through the mounting groove, makes the position between last mould and the terrace die more stable, improves work quality.
2. This flip-chip composite mold can reduce the temperature of die fast through the semiconductor cooling fin, improves the drawing of patterns effect to through extrusion die, make the waste liquid squeeze into the connecting pipe through the extrusion hole, inside leading-in row's magazine through the connecting pipe, improve row's magazine temperature through the heater, make the mobility of waste liquid promote, so that discharge the waste material, improve injection moulding effect, in order to continuous operation.
Drawings
FIG. 1 is a top perspective view of the present utility model;
FIG. 2 is an isometric view of the front view of the present utility model;
FIG. 3 is a bottom isometric view of the present utility model;
FIG. 4 is an isometric view of a female die of the present utility model from above;
fig. 5 is an isometric view of a female die of the present utility model from below.
In the figure: 1. a lower die; 101. an access panel; 102. a support column; 103. a sliding hole; 2. an upper die; 201. positioning a cover plate; 202. a seal ring; 203. injection molding a tube; 204. a mounting groove; 205. a slide bar; 3. a male die; 301. a pressing plate; 302. a through port; 303. an electric cylinder; 304. a limit sliding plate; 4. a female die; 401. a molding cavity; 402. extruding the hole; 403. a semiconductor cooling fin; 404. a cooling liquid circulation pipe; 5. a discharge box; 501. a waste discharge pipe; 502. a heater; 503. and (5) connecting pipes.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In order to solve the technical problems that in the prior art, the flip-chip die is simple in structure, the structure adopting a spring and a push rod cannot meet the structural position stability and influence long-term use, please refer to fig. 1-5, the following technical scheme is provided:
the flip-chip composite die comprises a lower die 1, an upper die 2, a male die 3 and a female die 4, wherein the upper die 2 is arranged above the lower die 1, the male die 3 is arranged above the upper die 2, the female die 4 is arranged above the lower die 1, injection molding is carried out by adopting the male die 3 and the female die 4, the flip-chip composite die has a simple structure, and a rod-beating device of a press can be directly utilized for pushing a part, so that the flip-chip composite die is reliable in unloading and convenient to operate;
an electric cylinder 303 is arranged between the male die 3 and the upper die 2, a pressing plate 301 is arranged below the male die 3, a limit sliding plate 304 is arranged at the upper end of the pressing plate 301, the limit sliding plate 304 extends into the male die 3 to be in sliding connection with the male die 3, the electric cylinder 303 stretches out and draws back to drive the male die 3 to move, the male die 3 drives the pressing plate 301 to move, in the moving process of the pressing plate 301, the moving range of the male die 3 can be increased through the pressing plate 301, and the moving position of the pressing plate 301 can be kept stable through the limit sliding plate 304;
the semiconductor cooling fin 403 is installed below the die 4, the cooling liquid circulating pipe 404 is installed outside the semiconductor cooling fin 403, and the pressing plate 301 presses down the raw material, so that the raw material is extruded out of the die 4, the temperature of the die 4 can be quickly reduced through the semiconductor cooling fin 403, and the demolding effect is improved.
The up end of bed die 1 is provided with integrated into one piece's slide hole 103, and the internally mounted of slide hole 103 has slide bar 205, and slide bar 205's lower extreme extends to inside slide hole 103 and bed die 1 sliding connection, and slide bar 205's upper end and last mould 2 fixed connection, bed die 1 and last mould 2 can slide through slide bar 205 in the removal in-process, makes the mould position remain stable.
The lower terminal surface of going up mould 2 is provided with integrated into one piece's mounting groove 204, and the upper end embedding mounting groove 204 inside of terrace die 3 and go up mould 2 sliding connection, during the use, can adjust the work through mounting groove 204, make the position between upper mould 2 and the terrace die 3 more stable, improve operating quality, the both sides of terrace die 3 all are provided with integrated into one piece's through-hole 302, and through-hole 302 is used for spacing limiting slide 304, and in long-term operation, through limiting slide 304 location terrace die 3, the position of keeping terrace die 3 to improve the work effect.
Specifically, the electric cylinder 303 stretches out and draws back, can drive the terrace die 3 and remove, and terrace die 3 drives clamp plate 301 activity, and clamp plate 301 activity in-process can improve the range of motion of terrace die 3 through clamp plate 301, can keep clamp plate 301's active site stable through spacing slide 304, during the use, can adjust work through mounting groove 204, makes the position between upper die 2 and the terrace die 3 more stable, improves work quality.
In order to solve the technical problems that in the prior art, the functionality of the die is generally unfavorable for long-term use and affects continuous operation, referring to fig. 2-5, the following technical scheme is provided:
the lower terminal surface of bed die 1 installs access panel 101, and access panel 101 passes through set screw connection with bed die 1, and the bed die 1 is conveniently installed and removed through access panel 101, maintains the maintenance work to cooling body, and support column 102 is installed to the below of access panel 101.
The upper end of the upper die 2 is provided with a positioning cover plate 201, the upper end of the positioning cover plate 201 is provided with a sealing ring 202, the inside of the sealing ring 202 is provided with an injection molding pipe 203, liquid plastic is led into the die through the injection molding pipe 203 to perform injection molding, and the cavities inside the upper die 2 and the lower die 1 are subjected to injection molding.
The up end of die 4 is provided with integrated into one piece's shaping chamber 401, and shaping chamber 401's inside below is provided with extrusion hole 402, can discharge the waste material out die 4 through extrusion hole 402, and the plastics after the pressurized can improve the smoothness of up end through flip-chip die structure.
The lower part of the lower die 1 is provided with a discharge box 5, the outside of the discharge box 5 is provided with a heater 502, one end of the discharge box 5 is provided with a waste discharge pipe 501, a connecting pipe 503 is arranged between the discharge box 5 and the female die 4, waste liquid is extruded into the connecting pipe 503 through an extrusion hole 402 by the extrusion die, the waste liquid is led into the discharge box 5 through the connecting pipe 503, the temperature of the discharge box 5 is increased by the heater 502, the fluidity of the waste liquid is improved, so that waste materials are discharged, and the injection molding effect is improved.
Specifically, the temperature of the female die 4 can be quickly reduced by the semiconductor cooling fin 403, the demolding effect is improved, and the waste liquid is extruded into the connecting pipe 503 through the extrusion hole 402 by the extrusion die, is led into the discharging box 5 through the connecting pipe 503, the temperature of the discharging box 5 is improved by the heater 502, the fluidity of the waste liquid is improved, so that the waste material is discharged, the injection molding effect is improved, and the continuous operation is facilitated.
Working principle: during the use, through leading-in mould inside with liquid plastics through injection molding pipe 203, carry out injection molding work, make the cavity of upper mould 2 and lower mould 1 inside carry out injection molding work, electric cylinder 303 stretches out and draws back, can drive terrace die 3 and remove, terrace die 3 drives clamp plate 301 activity, clamp plate 301 activity in-process can improve terrace die 3's range of motion through clamp plate 301, can keep clamp plate 301's active site stability through spacing slide 304, adopt terrace die 3 and die 4 to carry out injection molding work, flip-chip compound die simple structure, can directly utilize the beating rod device of press again to carry out the ejector sleeve, the reliable unloading, the operation of being convenient for, lower mould 1 and upper mould 2 can slide through slide bar 205 in the removal process, make the mould position remain stable, can discharge die 4 with the waste material through extrusion hole 402, the plastics after the pressure can improve the smoothness of up end through flip-chip die structure, through extrusion die, make the waste liquid squeeze into 503 through 503 leading-in the inside of box 5, improve box 5 temperature through heater 502, make the mobility promote, so that the mobility is so that the ejection, the semiconductor cooling effect is improved, the semiconductor cooling effect is cooled down by the die 403.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a flip-chip composite mold, includes bed die (1), goes up mould (2), terrace die (3) and die (4), its characterized in that: the upper die (2) is arranged above the lower die (1), the male die (3) is arranged above the upper die (2), the female die (4) is arranged above the lower die (1), an electric cylinder (303) is arranged between the male die (3) and the upper die (2), a pressing plate (301) is arranged below the male die (3), a limiting sliding plate (304) is arranged at the upper end of the pressing plate (301), the limiting sliding plate (304) extends to the inside of the male die (3) to be in sliding connection with the male die (3), a semiconductor cooling fin (403) is arranged below the female die (4), and a cooling liquid circulating pipe (404) is arranged outside the semiconductor cooling fin (403).
2. A flip-chip composite mold according to claim 1, wherein: an access plate (101) is installed on the lower end face of the lower die (1), the access plate (101) is connected with the lower die (1) through a set screw, and a supporting column (102) is installed below the access plate (101).
3. A flip-chip composite mold according to claim 1, wherein: the upper end face of the lower die (1) is provided with an integrally formed sliding hole (103), a sliding rod (205) is mounted in the sliding hole (103), the lower end of the sliding rod (205) extends to the inside of the sliding hole (103) to be in sliding connection with the lower die (1), and the upper end of the sliding rod (205) is fixedly connected with the upper die (2).
4. A flip-chip composite mold according to claim 1, wherein: the upper end of the upper die (2) is provided with a positioning cover plate (201), the upper end of the positioning cover plate (201) is provided with a sealing ring (202), and an injection molding pipe (203) is arranged in the sealing ring (202).
5. A flip-chip composite mold according to claim 1, wherein: the lower terminal surface of last mould (2) is provided with integrated into one piece's mounting groove (204), the inside and last mould (2) sliding connection of upper end embedding mounting groove (204) of terrace die (3), the both sides of terrace die (3) all are provided with integrated into one piece's through-hole (302), through-hole (302) are used for spacing slide (304).
6. A flip-chip composite mold according to claim 1, wherein: the upper end face of the female die (4) is provided with an integrally formed forming cavity (401), and an extrusion hole (402) is formed in the lower portion of the inside of the forming cavity (401).
7. The flip-chip composite mold according to claim 6, wherein: the lower die is characterized in that a discharge box (5) is arranged below the lower die (1), a heater (502) is arranged outside the discharge box (5), a waste discharge pipe (501) is arranged at one end of the discharge box (5), and a connecting pipe (503) is arranged between the discharge box (5) and the female die (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321732674.1U CN220261812U (en) | 2023-07-04 | 2023-07-04 | Flip-chip composite die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321732674.1U CN220261812U (en) | 2023-07-04 | 2023-07-04 | Flip-chip composite die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220261812U true CN220261812U (en) | 2023-12-29 |
Family
ID=89297945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321732674.1U Active CN220261812U (en) | 2023-07-04 | 2023-07-04 | Flip-chip composite die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220261812U (en) |
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2023
- 2023-07-04 CN CN202321732674.1U patent/CN220261812U/en active Active
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