CN220257752U - Indium phosphide wafer polishing solution batching preparation facilities - Google Patents
Indium phosphide wafer polishing solution batching preparation facilities Download PDFInfo
- Publication number
- CN220257752U CN220257752U CN202321399821.8U CN202321399821U CN220257752U CN 220257752 U CN220257752 U CN 220257752U CN 202321399821 U CN202321399821 U CN 202321399821U CN 220257752 U CN220257752 U CN 220257752U
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- pipe
- batching
- polishing solution
- indium phosphide
- upper side
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- 238000005498 polishing Methods 0.000 title claims abstract description 106
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 238000003756 stirring Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000007599 discharging Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 32
- 238000009826 distribution Methods 0.000 description 10
- 230000008878 coupling Effects 0.000 description 9
- 238000010168 coupling process Methods 0.000 description 9
- 238000005859 coupling reaction Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 6
- 238000009472 formulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000011344 liquid material Substances 0.000 description 2
- 238000011176 pooling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The utility model discloses an indium phosphide wafer polishing solution batching preparation device, which comprises a stirring and mixing mechanism and a polishing solution batching tank body, wherein the stirring and mixing mechanism is fixedly arranged at the middle position of the upper end of the polishing solution batching tank body, a left batching inlet pipe is arranged at the left end of the polishing solution batching tank body, a right batching inlet pipe is arranged at the right end of the polishing solution batching tank body, an electromagnetic valve is arranged at the lower end of the polishing solution batching tank body, a middle homogenizing pipe is arranged at the lower end of the electromagnetic valve, a bottom tank body is arranged at the lower end of the middle homogenizing pipe, a discharging valve pipe is arranged at the outer end of the bottom tank body, an installation bottom plate is arranged at the lower end of the bottom tank body, and the stirring and mixing mechanism, the electromagnetic valve and the discharging valve pipe are electrically connected with an external controller through connecting wires. The preparation device for the indium phosphide wafer polishing solution disclosed by the utility model has the technical effect of preparing the material by uniformly mixing the polishing solution.
Description
Technical Field
The utility model relates to the field of semiconductors, in particular to a preparation device for an indium phosphide wafer polishing solution.
Background
Indium phosphide wafers are an important semiconductor material that enables optical systems to provide the performance required for data centers, mobile backhaul, subways, and long distance applications, and indium phosphide wafers require polishing the outside of an indium phosphide wafer during production processing, so that polishing equipment for the indium phosphide wafer is required, and in polishing, a polishing liquid for the indium phosphide wafer is required, so that polishing is facilitated by the polishing equipment, and a polishing liquid preparation apparatus for the indium phosphide wafer is required during processing.
The conventional preparation device for the polishing solution of the indium phosphide wafer can not effectively and uniformly mix two mixed polishing materials together when preparing the solution, so that the problem that the indium phosphide wafer is damaged during polishing due to the fact that the two materials cannot be uniformly mixed easily occurs during preparation of the solution.
Disclosure of Invention
The utility model discloses an indium phosphide wafer polishing solution batching preparation device, which aims to solve the technical problems that two mixed polishing materials cannot be effectively and uniformly mixed together when the conventional indium phosphide wafer polishing solution batching preparation device is used for batching, so that two materials are easy to be mixed uniformly when batching preparation is carried out, and the indium phosphide wafer is damaged when polishing is caused.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides an indium phosphide wafer polishing solution batching preparation facilities, includes stirring mixing mechanism and polishing solution batching jar body, stirring mixing mechanism installs and fixes on the upper end intermediate position of polishing solution batching jar body, the left end of polishing solution batching jar body is provided with left side batching and advances the pipe, the right-hand member of polishing solution batching jar body is provided with right side batching and advances the pipe, the lower extreme of polishing solution batching jar body is provided with electromagnetic valve, electromagnetic valve's lower extreme is provided with middle even flow pipe, middle even flow pipe's lower extreme is provided with the bottom box, the outer end of bottom box is provided with the discharge valve pipe, the lower extreme of bottom box is provided with mounting plate, stirring mixing mechanism, electromagnetic valve and discharge valve pipe pass through connecting wire and external control ware electric connection.
Through being provided with mounting plate structure to be convenient for through the fix with screw on the appointed position, then left side batching feed tube can receive first indium phosphide wafer polishing solution batching material, thereby the pooling is in the polishing solution batching jar body, right side batching feed tube then can receive second indium phosphide wafer polishing solution batching material, thereby pooling is in the polishing solution batching jar body, the material in the polishing solution batching jar body is because of the effective stirring of stirring mixing mechanism mixes, when electromagnetic valve opens, then be convenient for discharge the indium phosphide wafer polishing solution in the polishing solution batching jar body, like this in the effective even flow mixing of intermediate even flow pipe, thereby in carrying to the bottom box, when opening the discharge valve pipe, then be convenient for discharge to appointed container.
In a preferred scheme, the mounting bottom plate comprises a metal circular plate, an upper protruding column and an outer square block, wherein the upper side protruding column is arranged at the upper end of the metal circular plate, the outer square block is arranged at the two ends of the metal circular plate, and the metal circular plate is connected to the bottom box body through the upper protruding column.
Through being provided with mounting plate structure to be convenient for install and place the use.
In a preferred scheme, the right batching advances the pipe and includes outside inclined tube, upside pipe and upside flange ring, the lower extreme of upside flange ring is provided with the upside pipe, the lower extreme of upside pipe is provided with outside inclined tube, outside inclined tube connects on the polishing solution batching jar body.
Through being provided with right side batching pipe inlet structure to be convenient for receive outside polishing solution and carry and use.
In a preferred scheme, the middle uniform flow pipe comprises a lower uniform flow plate, an upper uniform flow plate and a pipe body shell, wherein the upper side of the inside of the pipe body shell is provided with the upper uniform flow plate, the lower side of the upper uniform flow plate is positioned on the pipe body shell, the upper end of the pipe body shell is connected to the electromagnetic valve, and the lower end of the pipe body shell is connected to the bottom box.
The middle uniform flow pipe structure is arranged, so that uniform flow mixing is convenient.
In a preferred scheme, stirring and mixing mechanism includes shaft coupling, driving motor, outside end pole and middle mobile jib, driving motor's output shaft lower extreme is provided with the shaft coupling, the lower extreme of shaft coupling is provided with middle mobile jib, the outside of middle mobile jib is provided with outside end pole, driving motor connects on the polishing solution batching jar body.
Through being provided with stirring mixing mechanism structure, be convenient for like this stir the mixed use.
In a preferred scheme, the left batching inlet pipe and the right batching inlet pipe have the same structure, and the left batching inlet pipe and the right batching inlet pipe are symmetrically arranged on the polishing solution batching tank body.
Through being provided with left side batching and advance pipe and right side batching and advance the pipe structure to be convenient for carry two kinds of polishing liquids to the polishing liquid batching jar body in carry out the preparation of mixing ingredients.
In a preferred scheme, the middle flow homogenizing pipe is connected with the bottom box body through screws, and the connection part of the middle flow homogenizing pipe and the bottom box body is communicated.
By providing an intermediate flow homogenizing pipe structure, uniform flow mixing is facilitated and can be transported to the bottom tank for storage.
From the above, an indium phosphide wafer polishing solution batching preparation facilities, including stirring mixing mechanism and polishing solution batching jar body, stirring mixing mechanism installs and fixes on the upper end intermediate position of polishing solution batching jar body, the left end of polishing solution batching jar body is provided with left side batching feed tube, the right-hand member of polishing solution batching jar body is provided with right side batching feed tube, the lower extreme of polishing solution batching jar body is provided with electromagnetic valve, electromagnetic valve's lower extreme is provided with middle homogeneity pipe, intermediate homogeneity pipe's lower extreme is provided with the bottom box, the outer end of bottom box is provided with the discharge valve pipe, the lower extreme of bottom box is provided with mounting plate, stirring mixing mechanism, electromagnetic valve and discharge valve pipe pass through connecting wire and external control ware electric connection. The preparation device for the indium phosphide wafer polishing solution has the technical effect of preparing the material by uniformly mixing the polishing solution.
Drawings
Fig. 1 is a schematic perspective view of an apparatus for preparing an indium phosphide wafer polishing liquid according to the present utility model.
Fig. 2 is a schematic view of the structure of a mounting base plate of the apparatus for preparing a polishing solution for an indium phosphide wafer according to the present utility model.
Fig. 3 is a schematic diagram of a right-side batching pipe feeding structure of an indium phosphide wafer polishing solution batching and preparing device according to the present utility model.
Fig. 4 is a schematic diagram of an intermediate flow homogenizing pipe of an apparatus for preparing an indium phosphide wafer polishing liquid according to the present utility model.
Fig. 5 is a schematic structural diagram of a stirring and mixing mechanism of an apparatus for preparing a polishing solution of an indium phosphide wafer according to the present utility model.
In the accompanying drawings: 1. a left side batching inlet pipe; 2. a stirring and mixing mechanism; 21. a coupling; 22. a driving motor; 23. an outer end bar; 24. a middle main rod; 3. feeding materials into the pipe at the right side; 31. an outer inclined tube; 32. an upper side pipe; 33. an upper flange ring; 4. a polishing solution batching tank body; 5. an electromagnetic valve; 6. a middle homogenizing pipe; 61. a lower flow homogenizing plate; 62. an upper uniform flow plate; 63. a tube body housing; 7. a bottom box; 8. a discharge valve tube; 9. a mounting base plate; 91. a metal circular plate; 92. an upper boss; 93. and an outer square.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-5, an indium phosphide wafer polishing liquid batching preparation device comprises a stirring and mixing mechanism 2 and a polishing liquid batching tank body 4, wherein the stirring and mixing mechanism 2 is fixedly arranged at the middle position of the upper end of the polishing liquid batching tank body 4, a left batching feed pipe 1 is arranged at the left end of the polishing liquid batching tank body 4, a right batching feed pipe 3 is arranged at the right end of the polishing liquid batching tank body 4, an electromagnetic valve 5 is arranged at the lower end of the polishing liquid batching tank body 4, an intermediate homogenizing pipe 6 is arranged at the lower end of the electromagnetic valve 5, a bottom box body 7 is arranged at the outer end of the intermediate homogenizing pipe 6, a mounting bottom plate 9 is arranged at the lower end of the bottom box body 7, the stirring and mixing mechanism 2, the electromagnetic valve 5 and the discharging valve pipe 8 are electrically connected with an external controller through connecting wires, and when in use, the bottom box body 7 is fixed at the designated position through screws, and then the left batching feed pipe 1 can receive a first polishing liquid batching material, and thus the polishing liquid batching feed pipe 4 can receive a polishing liquid batching material, when the polishing liquid batching tank body 4 is filled into the polishing liquid batching tank body 4, the right side of the polishing liquid batching tank body 4 can be conveniently discharged into the polishing liquid batching tank body 4 through the electromagnetic valve 4, and the electromagnetic valve 3 when the stirring and the polishing liquid batching tank body is conveniently discharged into the polishing liquid batching tank body 4, and the polishing liquid can be conveniently discharged into the wafer batching tank 4 through the intermediate homogenizing pipe through the designated electromagnetic valve 4, and the mixing valve.
Referring to fig. 1 and 2, in a preferred embodiment, the mounting plate 9 includes a metal circular plate 91, an upper side protruding column 92 and an outer side square 93, the upper end of the metal circular plate 91 is provided with the upper side protruding column 92, both ends of the metal circular plate 91 are provided with the outer side square 93, the metal circular plate 91 is connected to the bottom case 7 through the upper side protruding column 92, the metal circular plate 91 of the mounting plate 9 is connected to the bottom case 7 through the upper side protruding column 92 in a sleeved mode, so that the welding of the metal circular plate 91 and the bottom case 7 is more convenient, and the metal circular plate 91 is convenient to fix at a designated position through screws due to the outer side square 93 at both ends during fixing.
Referring to fig. 1 and 3, in a preferred embodiment, the right dispensing inlet pipe 3 includes an outer inclined pipe 31, an upper pipe 32 and an upper flange ring 33, the upper flange ring 33 is provided with the upper pipe 32 at a lower end thereof, the upper pipe 32 is provided with the outer inclined pipe 31 at a lower end thereof, the outer inclined pipe 31 is connected to the polishing solution dispensing tank 4, and the outer inclined pipe 31 of the right dispensing inlet pipe 3 is welded to the polishing solution dispensing tank 4, so that the outer inclined pipe 31 is conveniently connected to an external polishing solution material pipe due to the upper flange ring 33 of the upper pipe 32 at an upper end thereof.
Referring to fig. 1 and 4, in a preferred embodiment, the intermediate homogenizing pipe 6 comprises a lower homogenizing plate 61, an upper homogenizing plate 62 and a pipe housing 63, the upper homogenizing plate 62 is provided on the inner upper side of the pipe housing 63, the lower homogenizing plate 61 is provided on the pipe housing 63 below the upper homogenizing plate 62, the upper end of the pipe housing 63 is connected to the electromagnetic valve 5, the lower end of the pipe housing 63 is connected to the bottom tank 7, the upper end of the pipe housing 63 of the intermediate homogenizing pipe 6 is connected to the electromagnetic valve 5, so that the pipe housing 63 can receive the indium phosphide wafer polishing liquid material mixed and flowed in above the electromagnetic valve 5, so that the upper homogenizing plate 62 and the lower homogenizing plate 61 are passed therethrough to effect uniform flow mixing, so that uniform flow mixing is more sufficient, and the lower end of the pipe housing 63 is connected to the bottom tank 7, so that the uniformly mixed indium phosphide wafer polishing liquid material can be transferred to the bottom tank 7 for storage.
Referring to fig. 1 and 5, in a preferred embodiment, the stirring and mixing mechanism 2 includes a coupling 21, a driving motor 22, an outer end rod 23 and an intermediate main rod 24, the coupling 21 is disposed at the lower end of the output shaft of the driving motor 22, the intermediate main rod 24 is disposed at the lower end of the coupling 21, the outer end rod 23 is disposed at the outer side of the intermediate main rod 24, the driving motor 22 is connected to the polishing solution formulation tank 4, and the driving motor 22 of the stirring and mixing mechanism 2 is connected to the polishing solution formulation tank 4 through a screw, so that the driving motor 22 is convenient for stable placement, and when the output shaft of the driving motor 22 rotates, the coupling 21 can be driven to rotate, and then the coupling 21 can be driven to rotate the intermediate main rod 24 and the outer end rod 23, so that stirring and mixing in the polishing solution formulation tank 4 are facilitated.
Referring to fig. 1, in a preferred embodiment, the left and right ingredient feed pipes 1 and 3 are identical in structure, and the left and right ingredient feed pipes 1 and 3 are symmetrically disposed on the slurry formulation tank 4 so as to facilitate the reception of external slurry materials into the slurry formulation tank 4 for mixing.
Referring to fig. 1, in a preferred embodiment, the middle flow homogenizing pipe 6 and the bottom case 7 are connected by screws, and the connection of the middle flow homogenizing pipe 6 and the bottom case 7 is penetrated, thereby facilitating installation and fixation, and also facilitating penetration transportation and use.
Working principle: when the polishing solution distribution tank is used, the bottom tank body 7 is conveniently fixed at a designated position through the mounting bottom plate 9 at the lower end, the material distribution inlet pipe 1 at the rear left side can receive the material distributed by the first indium phosphide wafer polishing solution and is converged into the polishing solution distribution tank body 4, the material distributed by the second indium phosphide wafer polishing solution can be converged into the polishing solution distribution tank body 4 through the material distribution inlet pipe 3 at the right side, the materials in the polishing solution distribution tank body 4 are effectively stirred and mixed through the stirring and mixing mechanism 2, the indium phosphide wafer polishing solution in the polishing solution distribution tank body 4 is conveniently discharged when the electromagnetic valve 5 is opened, and thus the indium phosphide wafer polishing solution is effectively uniformly mixed through the middle uniform flow pipe 6 when the material distribution tank body is conveyed into the bottom tank body 7, and the material distribution valve pipe 8 is opened, the material distribution into the designated container is conveniently discharged.
The above description is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto. The substitutions may be partial structures, devices, or method steps, or may be a complete solution. The technical proposal and the utility model concept are equivalent to or changed in accordance with the utility model, and the utility model is covered in the protection scope of the utility model.
Claims (7)
1. The utility model provides an indium phosphide wafer polishing solution batching preparation facilities, includes stirring mixing mechanism (2) and polishing solution batching jar body (4), its characterized in that, stirring mixing mechanism (2) are installed and are fixed on the upper end intermediate position of polishing solution batching jar body (4), the left end of polishing solution batching jar body (4) is provided with left side batching and advances pipe (1), the right-hand member of polishing solution batching jar body (4) is provided with right side batching and advances pipe (3), the lower extreme of polishing solution batching jar body (4) is provided with electromagnetic valve (5), the lower extreme of electromagnetic valve (5) is provided with middle riser (6), the lower extreme of middle riser (6) is provided with bottom box (7), the outer end of bottom box (7) is provided with row material valve pipe (8), the lower extreme of bottom box (7) is provided with mounting plate (9), electromagnetic valve (5) and row material valve pipe (8) pass through connecting wire and external control ware electric connection.
2. The preparation device of the indium phosphide wafer polishing liquid according to claim 1, wherein the mounting base plate (9) comprises a metal circular plate (91), an upper side convex column (92) and an outer side square block (93), the upper end of the metal circular plate (91) is provided with the upper side convex column (92), the two ends of the metal circular plate (91) are provided with the outer side square block (93), and the metal circular plate (91) is connected to the bottom box body (7) through the upper side convex column (92).
3. An indium phosphide wafer polishing liquid preparation device as claimed in claim 1, characterized in that the right side dispensing inlet pipe (3) comprises an outer inclined pipe (31), an upper side pipe (32) and an upper side flange ring (33), the lower end of the upper side flange ring (33) is provided with the upper side pipe (32), the lower end of the upper side pipe (32) is provided with the outer inclined pipe (31), and the outer inclined pipe (31) is connected to the polishing liquid dispensing tank (4).
4. An indium phosphide wafer polishing liquid preparation device as claimed in claim 1, characterized in that the intermediate flow homogenizing pipe (6) comprises a lower side flow homogenizing plate (61), an upper side flow homogenizing plate (62) and a pipe body casing (63), the upper side of the inside of the pipe body casing (63) is provided with the upper side flow homogenizing plate (62), the lower side flow homogenizing plate (61) is arranged on the pipe body casing (63) below the upper side flow homogenizing plate (62), the upper end of the pipe body casing (63) is connected to the electromagnetic valve (5), and the lower end of the pipe body casing (63) is connected to the bottom box (7).
5. An indium phosphide wafer polishing liquid preparation device as claimed in claim 1, characterized in that the stirring and mixing mechanism (2) comprises a coupler (21), a driving motor (22), an outer side end rod (23) and an intermediate main rod (24), wherein the coupler (21) is arranged at the lower end of an output shaft of the driving motor (22), the intermediate main rod (24) is arranged at the lower end of the coupler (21), the outer side of the intermediate main rod (24) is provided with the outer side end rod (23), and the driving motor (22) is connected to the polishing liquid preparation tank (4).
6. An indium phosphide wafer polishing liquid preparation device as claimed in claim 1, characterized in that the left side batching feed tube (1) and the right side batching feed tube (3) are identical in structure, and the left side batching feed tube (1) and the right side batching feed tube (3) are symmetrically arranged on the polishing liquid batching tank body (4).
7. An indium phosphide wafer polishing liquid preparation device as claimed in claim 1, characterized in that the intermediate homogenizing pipe (6) and the bottom box (7) are connected by screws, and the junction of the intermediate homogenizing pipe (6) and the bottom box (7) is through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321399821.8U CN220257752U (en) | 2023-06-02 | 2023-06-02 | Indium phosphide wafer polishing solution batching preparation facilities |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321399821.8U CN220257752U (en) | 2023-06-02 | 2023-06-02 | Indium phosphide wafer polishing solution batching preparation facilities |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220257752U true CN220257752U (en) | 2023-12-29 |
Family
ID=89318390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321399821.8U Active CN220257752U (en) | 2023-06-02 | 2023-06-02 | Indium phosphide wafer polishing solution batching preparation facilities |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220257752U (en) |
-
2023
- 2023-06-02 CN CN202321399821.8U patent/CN220257752U/en active Active
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