CN220253219U - Bearing disc and detection equipment - Google Patents
Bearing disc and detection equipment Download PDFInfo
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- CN220253219U CN220253219U CN202321542264.0U CN202321542264U CN220253219U CN 220253219 U CN220253219 U CN 220253219U CN 202321542264 U CN202321542264 U CN 202321542264U CN 220253219 U CN220253219 U CN 220253219U
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- 238000001514 detection method Methods 0.000 title claims abstract description 7
- 238000007789 sealing Methods 0.000 claims abstract description 124
- 238000001179 sorption measurement Methods 0.000 claims abstract description 13
- 235000012431 wafers Nutrition 0.000 description 68
- 238000000034 method Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000011109 contamination Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Abstract
The utility model discloses a bearing disc and detection equipment. Wherein: the tray body has a central region and an edge region surrounding the central region; the main sealing ring is arranged in the edge area; the auxiliary sealing ring is arranged in the middle area and divides the middle area into a plurality of sealing areas, and the plurality of sealing areas are provided with bump structures and vacuum adsorption holes. When the wafer is used, as the wafer is warped, the position of the wafer close to the center is firstly contacted with the bump structure, the gap between the wafer and the auxiliary sealing ring is gradually enlarged from the center to the edge area, and when the vacuum adsorption holes of the sealing areas are communicated with negative pressure, the wafer is gradually adsorbed and deformed smoothly from the center to the edge, and complete sealing is formed, so that the planeness of the wafer is improved.
Description
Technical Field
The utility model relates to the technical field of bearing, in particular to a bearing disc and detection equipment.
Background
In the process of inspecting the wafer, the wafer is inevitably warped, and the warpage may be convex (as shown in fig. 1), concave (as shown in fig. 2) or wavy (as shown in fig. 3). Therefore, it is necessary to provide a carrier tray which can absorb warpage of various shapes and reduce contamination as much as possible. In order to adapt to the above requirements, different methods for treating warpage are adopted in the industry, and common treatment methods are a method of adding a sealing ring and adding a local suction nozzle. However, in the above-mentioned processing method, the wafer is in flexible contact with the sealing ring and the suction nozzle, so that the back of the wafer is free from supporting force, and the flatness of the wafer is reduced.
Therefore, how to improve the flatness of the wafer after the wafer is adsorbed is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present utility model provides a carrier tray and a detecting apparatus for improving the flatness of a wafer after being adsorbed.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a bearing disc, which comprises a disc body, a main sealing ring and an auxiliary sealing ring, wherein:
the tray body has a central region and an edge region surrounding the central region;
the main sealing ring is arranged in the edge area;
the auxiliary sealing ring is arranged in the middle area and divides the middle area into a plurality of sealing areas, and the plurality of sealing areas are provided with bump structures and vacuum adsorption holes.
Optionally, in the bearing disc of the present utility model, the height of the bump structure is greater than the height of the auxiliary sealing ring and is equal to the height of the main sealing ring.
Optionally, in the bearing disc of the present utility model, the bump structure is a structure protruding outwards from the surface of the disc body, and the bump structure is a cylinder structure, a prism structure, a prismatic table structure, a conical table structure or a hemispherical structure.
Alternatively, in the carrier tray of the present utility model, the bump structures in each sealing region are uniformly distributed, or the bump structures in the entire middle region are uniformly distributed.
Optionally, in the bearing disc of the present utility model, the width of the auxiliary sealing ring is smaller than the width of the main sealing ring; alternatively, the width of the auxiliary seal ring is smaller than the distance between adjacent bump structures.
Optionally, in the bearing disc of the present utility model, the number of the auxiliary sealing rings is two, and the number is a first auxiliary sealing ring and a second auxiliary sealing ring respectively, where the first auxiliary sealing ring is closer to the main sealing ring than the second auxiliary sealing ring, the second auxiliary sealing ring is closer to the center of the disc body than the first auxiliary sealing ring, the first auxiliary sealing ring and the second auxiliary sealing ring divide the central area into a first sealing area, a second sealing area and a third sealing area, and the first sealing area, the second sealing area and the third sealing area are sequentially arranged from the edge of the disc body to the center of the disc body.
Optionally, in the bearing disc of the present utility model, the first auxiliary sealing ring is disposed at 2/3 of the diameter of the disc body, and the second auxiliary sealing ring is disposed at 1/3 of the diameter of the disc body.
Optionally, in the carrier tray of the present utility model, the height difference between the auxiliary seal ring and the main seal ring ranges from 0.05mm to 0.15 mm.
Optionally, in the bearing disc of the present utility model, the height of the outermost auxiliary sealing ring is greater than the height dimension of the auxiliary sealing ring near the center.
The utility model also provides a detection device comprising a carrier disc as defined in any one of the above.
According to the technical scheme, when the bearing disc is used, the wafer is warped, the position, close to the center, of the wafer is firstly contacted with the bump structure, gaps between the wafer and the auxiliary sealing ring are gradually enlarged from the center to the edge area, and when the vacuum adsorption holes of the sealing areas are communicated with negative pressure, the wafer is gradually adsorbed and deformed smoothly from the center to the edge, and complete sealing is formed, so that the planeness of the wafer is improved.
In addition, since the bump structure is higher than the auxiliary sealing ring, the auxiliary sealing ring is not contacted with the back of the wafer, so that extra wafer back particles and metal pollution are not brought, and the wafer pollution is reduced.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a wafer warpage structure disclosed in an embodiment of the present utility model;
FIG. 2 is a schematic view of another wafer warpage configuration disclosed in an embodiment of the present utility model;
FIG. 3 is a schematic view of a third wafer warpage configuration disclosed in an embodiment of the present utility model;
FIG. 4 is a schematic diagram of a disc disclosed in an embodiment of the present utility model;
FIG. 5 is a schematic view of a carrier tray according to an embodiment of the present utility model;
FIG. 6 is a schematic view of another embodiment of a carrier tray disclosed herein;
FIG. 7 is a schematic cross-sectional view of a carrier tray disclosed in an embodiment of the utility model;
FIG. 8 is an enlarged schematic view of the portion A of FIG. 7;
FIG. 9 is a schematic diagram of the operation of a carrier tray disclosed in an embodiment of the present utility model;
wherein 100 is a wafer, 200 is a carrier plate, 201 is a plate body, 202 is a main sealing ring, 203 is an auxiliary sealing ring, 204 is a vacuum adsorption hole, 205 is a bump structure, and 201a is a middle region and 201b is an edge region.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
A semiconductor wafer (simply referred to as a wafer) is a silicon wafer used for manufacturing a silicon semiconductor circuit, and the raw material thereof is silicon. The high-purity polysilicon is dissolved and then doped with silicon crystal seed crystal, and then slowly pulled out to form a cylindrical silicon crystal bar. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer.
The wafer carrying tray (simply called as carrying tray) is a structure for carrying wafers in the wafer detecting device, and the wafers are detected by adsorbing the wafers.
Since the wafer 100 is inevitably warped during inspection, the warpage may be convex (as shown in fig. 1), concave (as shown in fig. 2), or wavy (as shown in fig. 3). Therefore, it is necessary to provide a carrier tray 200 that can absorb warpage of various shapes and minimize contamination. In order to adapt to the above requirements, different methods for treating warpage are adopted in the industry, and common treatment methods are a method of adding a sealing ring and adding a local suction nozzle. However, in the above-described processing method, the wafer 100 is in flexible contact with the sealing ring and the suction nozzle, so that the back of the area of the wafer 100 is not supported, and the flatness of the area is reduced.
In addition, due to the material characteristics of the seal ring, contact traces are easily left on the back of the wafer 100, and the wafer 100 is contaminated. Again, due to the seal ring and the size limitations of the suction nozzle, it occupies a relatively large space of the carrier tray 200.
In order to solve the above technical problems, the present utility model discloses a carrier tray 200 and a detecting device, so as to improve the flatness of the wafer 100 after being absorbed.
Referring to fig. 4 to 6, a carrier tray 200 according to an embodiment of the present utility model includes a tray body 201, a main seal ring 202, and an auxiliary seal ring 203, wherein:
the tray 201 has a central region 201a and an edge region 201b surrounding the central region 201 a;
the main seal ring 202 is disposed at the edge region 201b;
the auxiliary seal ring 203 is disposed in the middle region 201a and partitions the middle region 201a into a plurality of seal regions, each of which is provided with a bump structure 205 and a vacuum suction hole 204.
When the wafer 100 is loaded by the loading tray 200, due to the warpage of the wafer 100, the position of the wafer 100 near the center is firstly contacted with the bump structure 205, the gap between the wafer 100 and the auxiliary sealing ring 203 is gradually increased from the center to the edge region 201b, and when the vacuum adsorption holes 204 of the sealing regions are communicated with negative pressure, the wafer 100 is gradually adsorbed and deformed from the center to the edge, and a complete seal is formed, so that the flatness of the wafer 100 is improved.
Note that, the bump structure 205 is a structure protruding outward from the surface of the disc 201, and may be a cylinder structure, a prism structure, a truncated pyramid structure, a truncated cone structure, a semicircle structure, or the like. Preferably, the bump structure 205 is a half-round structure, so that the bump structure 205 contacts the wafer 100 in a point-to-surface manner, thereby further reducing the contamination to the wafer 100.
The dimensions of the tray may be selected to be 12 inches, 8 inches, or other suitable dimensions depending on the particular dimensions of the wafer 100.
In the embodiment of the present utility model, in order to further improve the flatness of the wafer 100 after adsorption, the bump structures 205 in each sealing area are uniformly distributed. Further, all bump structures 205 are uniformly distributed throughout the middle region 201 a.
In order to reduce the influence of the uniformity of the bump structures 205, in some embodiments of the present utility model, the width of the auxiliary seal ring 203 is smaller than the width of the main seal ring 202, and further, the width of the auxiliary seal ring 203 is smaller than the distance between adjacent bump structures 205, so that the bump structures 205 are avoided when the auxiliary seal ring 203 is disposed, the uniformity of the bump structures 205 in the whole middle area 201a is not affected, and the flatness of the wafer 100 after final absorption is further improved.
The width b2 of the auxiliary seal ring 203 is the difference between the inner diameter and the outer diameter of the auxiliary seal ring 203; the height H1 of the main seal ring 202 is the distance between the top surface of the main seal ring 202 and the surface of the disk 201 in the thickness direction of the disk 201, and can be understood as the thickness of the main seal ring 202; the width b1 of the primary seal ring 202 is the difference between the inner and outer diameters of the primary seal ring 202, as shown in fig. 9.
The auxiliary sealing ring 203 is disposed on the disc 201 through an adhesion process, or other process auxiliary sealing rings 203 are disposed on the disc 201. Since the disc 201 is a hard body and the auxiliary sealing ring 203 is also a hard body, the use strength of the auxiliary sealing ring 203 is not affected by too small width.
The number of the auxiliary sealing rings 203 is plural, and the bump structures 205 and the vacuum suction holes 204 are provided in different sealing areas. By forming a plurality of sealing regions, the wafer 100 can be adsorbed step by step, and the flatness of the wafer 100 during the adsorption can be improved. In the embodiment of the utility model, the number of the auxiliary sealing rings 203 is two, namely a first auxiliary sealing ring 203 and a second auxiliary sealing ring 203, wherein the first auxiliary sealing ring 203 is closer to the main sealing ring 202 than the second auxiliary sealing ring 203, the second auxiliary sealing ring 203 is closer to the center of the disc 201 than the first auxiliary sealing ring 203, the first auxiliary sealing ring 203 and the second auxiliary sealing ring 203 divide the central area into a first sealing area, a second sealing area and a third sealing area, and the first sealing area, the second sealing area and the third sealing area are sequentially arranged from the edge of the disc 201 to the center of the disc 201. Preferably, the first auxiliary sealing ring 203 is arranged at 2/3 of the diameter of the disc 201, and the second auxiliary sealing ring 203 is arranged at 1/3 of the diameter of the disc 201.
The terms "first" and "second" are used above for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
In some embodiments of the present utility model, the height H3 of the bump structure 205 is greater than the height H2 of the auxiliary seal ring 203 and is equal to the height H1 of the main seal ring 202. Since the bump structure 205 is higher than the auxiliary seal ring 203, the auxiliary seal ring 203 does not contact the back of the wafer 100, so that additional wafer back particles and metal contamination are not brought, and the wafer 100 contamination is reduced.
Note that, the height H3 of the bump structure 205 is the distance between the top surface of the bump in the thickness direction of the tray 201 and the surface of the tray 201; the height H2 of the auxiliary seal ring 203 is a distance between the top surface of the auxiliary seal ring 203 and the performance of the disk 201 in the thickness direction of the disk 201, and can be understood as the thickness of the auxiliary seal ring 203.
The auxiliary sealing ring 203 has a height difference from the main sealing ring 202 for performing auxiliary suction on the warped wafer 100, and the height of the auxiliary sealing ring 203 is smaller than that of the main sealing ring 202. Preferably, the height of the auxiliary seal ring 203 and the height of the main seal ring 202 are in the range of 0.05mm to 0.15mm (including 0.05 and 0.15 mm), and specifically, the height of the auxiliary seal ring 203 and the height of the main seal ring 202 are in the range of 0.1mm.
The auxiliary sealing ring 203 is optionally in a circular ring structure, and a plurality of auxiliary sealing rings 203 are concentrically distributed. Further, the height of the outermost auxiliary seal ring 203 is greater than the height dimension of the auxiliary seal ring 203 near the center. Further, the distance between the adjacent auxiliary sealing rings 203 is consistent, and the distance between the adjacent auxiliary sealing rings 203 is consistent, so that the wafer is more uniform in the process of being adsorbed and deformed, and the flatness of the wafer during adsorption is further improved.
The vacuum adsorption holes 204 are connected with a vacuum pipeline in an external mode, so that negative pressure is formed in the sealing areas, and the wafer 100 is finally adsorbed on the carrying disc 200. In fig. 6, on the tray 201, all the vacuum adsorption holes 204 are arranged in a straight line in the middle area 201a, and the arrangement difficulty of the external connection pipeline of the vacuum adsorption holes 204 can be reduced by the straight line arrangement.
Referring to fig. 9, a carrier tray 200 according to an embodiment of the present utility model is described by taking a wafer 100 with a concave-shaped warp as an example:
the number of the auxiliary sealing rings 203 is two, the two auxiliary sealing rings 203 are a first auxiliary sealing ring 203 and a second auxiliary sealing ring 203 respectively, and the central area is divided into a first sealing area, a second sealing area and a third sealing area. When the wafer 100 is placed on the carrier tray 200, the gap L1 between the main seal ring 202 and the wafer 100, the gap L2 between the first auxiliary seal ring 203 and the wafer 100, and the gap L3 between the second auxiliary seal ring 203 and the wafer 100 satisfy L3 < L2 < L1. When the vacuum suction holes 204 in each sealing area are communicated with negative pressure, the wafer 100 with extremely small gap between the second auxiliary sealing ring 203 and the wafer 100 is deformed under the suction action of the negative pressure and then attached to the bump structure 205, at this time, the gap L2 between the first auxiliary sealing ring 203 and the wafer 100 is reduced due to the flat suction deformation of the 1/3 area in the center of the wafer 100, the suction action of all the vacuum holes in the 2/3 area and the suction flattening of the innermost 1/3 area under the combined action of the vacuum flowing to the 2/3 area are performed, the gap L3 between the second auxiliary sealing ring 203 and the wafer 100 is processed, and finally the height of the main sealing ring 202 is equal to the height of the bump structure 205, so that a complete seal is formed between the carrier 200 and the wafer 100, and the wafer 100 is sucked flatly.
The utility model also discloses a detection device, which applies the bearing disc 200. Since the above-mentioned carrier tray has the above advantageous effects, the carrier tray 200 has corresponding effects.
The above description is only illustrative of the preferred embodiments of the present utility model and the technical principles applied, and is not intended to limit the present utility model. Various modifications and variations of the present utility model will be apparent to those skilled in the art. The scope of the utility model is not limited to the specific combination of the above technical features, but also covers other technical features formed by any combination of the above technical features or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present utility model (but not limited to) having similar functions are replaced with each other.
Claims (10)
1. The utility model provides a bear dish, its characterized in that, bear the dish and include disk body, main sealing ring and auxiliary sealing ring, wherein:
the tray body has a central region and an edge region surrounding the central region;
the main sealing ring is arranged in the edge area;
the auxiliary sealing ring is arranged in the middle area and divides the middle area into a plurality of sealing areas, and a plurality of the sealing areas are respectively provided with a bump structure and vacuum adsorption holes.
2. The carrier platter of claim 1 wherein the height of said bump structure is greater than the height of said auxiliary seal ring and equal to the height of said main seal ring.
3. The carrier tray of claim 2, wherein the bump structure is a structure protruding outward from the tray body surface, and the bump structure is a cylindrical structure, a prismatic table structure, a truncated cone structure, or a hemispherical structure.
4. The carrier platter of claim 1 wherein said bump structures in each of said sealing regions are uniformly distributed; alternatively, the bump structures are uniformly distributed throughout the middle region.
5. The carrier platter of claim 1 wherein the width of said auxiliary seal ring is less than the width of said primary seal ring; alternatively, the width of the auxiliary sealing ring is smaller than the distance between the adjacent bump structures.
6. The carrier tray of claim 1, wherein the number of auxiliary sealing rings is two, a first auxiliary sealing ring and a second auxiliary sealing ring, respectively, wherein the first auxiliary sealing ring is closer to the main sealing ring than the second auxiliary sealing ring, the second auxiliary sealing ring is closer to the center of the tray body than the first auxiliary sealing ring, the first auxiliary sealing ring and the second auxiliary sealing ring divide the center area into a first sealing area, a second sealing area and a third sealing area, and the first sealing area, the second sealing area and the third sealing area are sequentially arranged from the edge of the tray body to the center of the tray body.
7. The carrier platter of claim 6 wherein said first auxiliary sealing ring is disposed at 2/3 of said platter diameter and said second auxiliary sealing ring is disposed at 1/3 of said platter diameter.
8. The carrier tray of any one of claims 1 to 7, wherein the height difference of the auxiliary seal ring from the main seal ring ranges between 0.05mm and 0.15 mm.
9. The carrier tray of any one of claims 1 to 7, wherein the height of the outermost auxiliary seal ring is greater than the height dimension of the auxiliary seal ring near the center.
10. A detection apparatus comprising a carrier tray according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321542264.0U CN220253219U (en) | 2023-06-15 | 2023-06-15 | Bearing disc and detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321542264.0U CN220253219U (en) | 2023-06-15 | 2023-06-15 | Bearing disc and detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220253219U true CN220253219U (en) | 2023-12-26 |
Family
ID=89226890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321542264.0U Active CN220253219U (en) | 2023-06-15 | 2023-06-15 | Bearing disc and detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220253219U (en) |
-
2023
- 2023-06-15 CN CN202321542264.0U patent/CN220253219U/en active Active
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