CN220252097U - Automatic production line alignment device of semiconductor test equipment - Google Patents

Abstract

The utility model discloses an automatic production line alignment device of semiconductor test equipment, which comprises a capacitor module, an IGBT module, an automatic module, a fixing module, a base module and a test module corresponding to the IGBT module, wherein the capacitor module is connected with the IGBT module; the base module comprises a side door and a bottom plate vertically arranged at the opening of the side door, the capacitor module and the IGBT module are arranged on one side of the side door, and the test module and the automation module are arranged on the other side of the side door. This application is through setting up side door and bottom plate, and the two is perpendicular to be distributed, and wherein electric capacity module and IGBT module top are installed on the bottom plate, through realizing the spacing of X direction to the two, and test module installs at the side door, and the bottom is installed at the bottom plate, to realizing Y axle and X axle location to ensure that electric capacity module and test module carry out accurate counterpoint, and structural design is simple reasonable, and each department module demountable installation, convenient to detach changes the maintenance, accomplishes each department module locking after counterpoint, realizes that automatic part carries out test work.

Description

Automatic production line alignment device of semiconductor test equipment

Technical Field

The utility model relates to the technical field of power semiconductor testing, in particular to an automatic production line alignment device of semiconductor testing equipment.

Background

The moore's law drives the semiconductor industry to continuously develop, and the technical requirements of semiconductor equipment are also improved, and semiconductor test equipment cannot be avoided. The semiconductor test equipment belongs to the rear end part of the semiconductor equipment, belongs to the supporting link of the industrial chain of the semiconductor industry, and is of great importance in the industrial chain of the semiconductor. Automation has become a mainstream in semiconductor industry equipment, saving manpower, time or hardware data, and improving production efficiency.

In the IC test process, electrical components are arranged in an electrical cabinet, a test board card is often integrated in a square test head, and is clamped by a large mechanical arm and then aligned with an automatic production line, so that the whole equipment has high cost and is not suitable for testing semiconductor devices. However, along with the requirements of enterprises on power semiconductor testing efficiency and cost control, the power semiconductor testing is gradually changed from manual module replacement to automatic production line module replacement testing, the alignment process of the power semiconductor and the automatic production line becomes a technical difficulty, and a low-cost and high-precision positioning device becomes a manufacturing target.

Disclosure of Invention

The technical problems to be solved by the utility model are as follows: how to solve the problems of high testing difficulty, high cost, inaccurate positioning and the like existing in the conventional semiconductor test.

In order to solve the technical problems, the utility model provides the following technical scheme:

an automatic production line alignment device of semiconductor test equipment comprises a capacitor module, an IGBT module, an automatic module, a fixing module, a base module and a test module corresponding to the IGBT module; the base module comprises a side door and a bottom plate vertically arranged at the opening of the side door, the capacitor module and the IGBT module are arranged at one side of the side door, and the test module and the automation module are arranged at the other side of the side door; wherein IGBT module and electric capacity module all demountable installation are to the bottom plate on, and the bottom plate realizes spacing of X axis direction to the IGBT module.

This application is through setting up the side door and installing the bottom plate on the side door, the two perpendicular distributions, realize respectively that the system of vertical direction (Y axle direction) and horizontal direction (X axle direction), wherein capacitive module and IGBT module top are installed on the bottom plate, through realizing spacing to the two, and test module installs at the side door, the bottom is installed at the bottom plate, to realizing Y axle and X axle location, thereby ensure capacitive module and test module and carry out accurate counterpoint, and structural design is simple reasonable, each module demountable installation, the maintenance is changed to convenient to detach, capacitive module after the completion counterpoint, IGBT module, base module, test module everywhere locks, realize that automated part carries out test work, and this application is to current regulator cubicle type test machine, do not add other accessory modules, realize low cost on its basis, high accuracy is to the position, can cooperate with automated production line, and each subassembly is convenient for dismantle and is changed the maintenance.

As a further scheme of the utility model: the test module comprises a test board, a test board bottom plate and a test supporting board, wherein the bottom of the test board is arranged on the test board bottom plate; the one end of test board bottom plate is connected to internal support, and wherein internal support realizes the spacing of Y axle direction to the test board, and the test backup pad is connected at the both ends of internal support, and wherein the test backup pad realizes the spacing of Z axle direction to the test board.

As a further scheme of the utility model: the bottom of test backup pad is installed on the bottom plate, and the one end of test backup pad is connected to on the side door through outer contact plate, the one end of test board bottom plate is connected with interior support through test board support piece.

As a further scheme of the utility model: the top of test board bottom plate just is located the below of test board and installs the module bottom plate, linear slide rail is installed at the both ends of test board bottom plate, and the slide rail mounting panel is installed at the top of linear slide rail.

As a further scheme of the utility model: and one end of the test board, which is close to the IGBT module, is provided with a test board butt joint part connected with the test board, and handles are arranged on two sides of the test board.

As a further scheme of the utility model: the IGBT module comprises an IGBT device, an IGBT disassembly plate, an IGBT fixing plate, an IGBT supporting beam and an IGBT tool column, wherein the bottoms of the IGBT supporting beam and the IGBT tool column are mounted on the top of a bottom plate, the IGBT fixing plate is mounted on the tops of the IGBT supporting beam and the IGBT tool column, and the top of the IGBT fixing plate is detachably connected with the IGBT device through the IGBT disassembly plate.

As a further scheme of the utility model: the capacitor module comprises a capacitor fixing plate, a capacitor mounting plate, a capacitor and a busbar, wherein one side of the capacitor fixing plate is connected with a bottom plate through the capacitor mounting plate, the bottom of the capacitor is mounted on the capacitor fixing plate, the top of the capacitor is connected with the busbar, and an IGBT device is further connected below the busbar.

As a further scheme of the utility model: and one side of the busbar close to the side door is provided with busbar butt joint, wherein the busbar butt joint is connected with a test board butt joint part on the test module.

As a further scheme of the utility model: the fixing module comprises a cross beam, a supporting beam and a supporting plate, wherein the supporting beams are arranged on two sides of the top of the supporting plate, the bottom plate is supported by the top of the supporting beam, and the cross beam is arranged on two sides of the bottom of the supporting plate.

Compared with the prior art, the utility model has the beneficial effects that:

firstly, the capacitor module and the IGBT module are vertically distributed through the side door and the bottom plate arranged on the side door, the capacitor module and the IGBT module are vertically distributed, the balance of the vertical direction (Y-axis direction) and the horizontal direction (X-axis direction) is respectively realized, the top of the capacitor module and the top of the IGBT module are arranged on the bottom plate, the limit of the X-direction is realized through the capacitor module and the IGBT module, the test module is arranged on the side door, the bottom of the capacitor module and the bottom of the IGBT module are arranged on the bottom plate, the Y-axis and the X-axis of the capacitor module and the test module are positioned, so that the capacitor module and the test module are accurately aligned, the structural design is simple and reasonable, the modules are detachably arranged, the replacement and the maintenance are convenient, the capacitor module, the IGBT module, the base module and the test module are locked everywhere after the alignment are completed, the test operation is performed by an automatic part, and the test operation is realized for an existing electric cabinet type tester, the low-cost and high-precision alignment is realized on the basis of the capacitor module, and the components are convenient to be detached, the replacement and the maintenance are convenient to replace;

secondly, the IGBT supporting beam and the IGBT tooling columns are arranged on two sides of the top of the bottom plate, the IGBT fixing plate and the IGBT device are arranged on the tops of the IGBT supporting beam and the IGBT tooling columns, meanwhile, the busbar is connected with the IGBT device, the limit of the Y axis direction of the busbar is realized by the IGBT device, the limit of the Z axis direction of the busbar is realized by the IGBT supporting beam and the IGBT tooling columns, the limit of the X axis direction of the bottom plate is matched, and therefore fixation of multiple directions of the busbar can be realized, the stability of the busbar is ensured, and the accuracy of the busbar is realized when the busbar is connected with the butt joint part of the test board;

finally, this application is through the bottom both sides installation test backup pad at test board bottom plate, realizes the location to test board Z axle direction, and cooperation side door and bottom plate are to realizing Y axle and X axle location to can ensure that the test board realizes the fixed of a plurality of directions, ensure its steadiness, and follow-up accuracy when being connected with female row.

Drawings

FIG. 1 is a schematic diagram of an automated line alignment apparatus for semiconductor test equipment according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram illustrating the structure of FIG. 1 according to another view angle according to an embodiment of the present utility model;

FIG. 3 is an exploded view of FIG. 2 in accordance with an embodiment of the present utility model;

FIG. 4 is a schematic structural diagram of a fixing module and a capacitor module according to an embodiment of the present utility model;

FIG. 5 is an exploded view of FIG. 4 in accordance with an embodiment of the present utility model;

FIG. 6 is a schematic diagram of a test module according to an embodiment of the utility model;

FIG. 7 is an exploded view of FIG. 6 in accordance with an embodiment of the present utility model;

reference numerals illustrate: 1. a fixed module; 101. a cross beam; 102. a support beam; 103. a support plate; 2. a capacitance module; 201. a capacitor fixing plate; 202. a capacitor mounting plate; 203. a capacitor; 204. a busbar; 205. the busbar is in butt joint; 3. an IGBT module; 301. an IGBT device; 302. an IGBT disassembly plate; 303. an IGBT fixing plate; 304. an IGBT support beam; 305. IGBT tool posts; 4. a base module; 401. a side door; 402. a bottom plate; 5. a test module; 501. an outer contact plate; 502. a test support plate; 503. an inner support; 504. a slide rail mounting plate; 505. a linear slide rail; 506. a handle; 507. a test board; 508. a test board butt joint part; 509. a test plate support; 510. a test board base plate; 6. an automation module; 601. a module base plate.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described in the following in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 and 2, an automated production line alignment apparatus of a semiconductor test device includes a fixing module 1, a capacitor module 2, an IGBT module 3, a base module 4, a test module 5, and an automation module 6; the base module 4 includes a side door 401 and a bottom plate 402, wherein an opening is provided in the middle of the side door 401, and the bottom plate 402 penetrates and is mounted at the opening.

The fixed module 1, the capacitor module 2 and the IGBT module 3 are positioned on one side of the side door 401, the test module 5 and the automation module 6 are positioned on the other side of the side door 401, wherein the fixed module 1, the capacitor module 2, the IGBT module 3 and the test module 5 are all connected with the bottom plate 402, and the automation module 6 is connected with the test module 5.

Wherein the fixed module 1 is installed at the bottom of the bottom plate 402, the capacitor module 2 and the IGBT module 3 are installed above the bottom plate 402 and on one side of the side door 401, and the capacitor module 2 and the IGBT module 3 are connected, and the test module 5 is installed at the top of the bottom plate 402 and on the other side of the side door 401.

Referring to fig. 3 and 4, the fixing module 1 includes a beam 101, a supporting beam 102 and a supporting plate 103, wherein each component in the capacitor module 2 is detachably mounted, the supporting beam 102 is disposed on two sides of the top of the supporting plate 103, the bottom plate 402 is supported by the top of the supporting beam 102, and the beam 101 is mounted on two sides of the bottom of the supporting plate 103.

Referring to fig. 4 and 5, the capacitor module 2 includes a capacitor fixing plate 201, a capacitor mounting plate 202, a capacitor 203 and a busbar 204, wherein each component in the capacitor module 2 is detachably mounted, one side of the capacitor fixing plate 201 is connected with the front side of a bottom plate 402 through the capacitor mounting plate 202, the bottom of the capacitor 203 is mounted on the capacitor fixing plate 201, the top is connected with the busbar 204, and an IGBT device 301 is further connected below the busbar 204; the busbar 204 is provided with a busbar docking 205 on a side of the side door 401, wherein the busbar docking 205 is connected with a test board docking portion 508 on the test module 5.

Referring to fig. 5, the IGBT module 3 includes an IGBT device 301, an IGBT removing plate 302, an IGBT fixing plate 303, an IGBT supporting beam 304, and an IGBT tooling column 305, where each component in the IGBT module 3 is detachably mounted, the bottoms of the IGBT supporting beam 304 and the IGBT tooling column 305 are mounted on two sides of the top of the bottom plate 402, and used to support the IGBT fixing plate 303, that is, the IGBT fixing plate 303 is mounted on the tops of the IGBT supporting beam 304 and the IGBT tooling column 305, and the top of the IGBT fixing plate 303 is detachably connected with the IGBT device 301 through the IGBT removing plate 302, where it should be noted that the IGBT supporting beam 304 and the IGBT tooling column 305 are used to implement the fixation of the GBT fixing plate 303 in the Z-axis direction, and the IGBT fixing plate 303 and the bottom plate 402 are used to implement the fixation of the GBT fixing plate 303 in the X-axis direction, and the IGBT removing plate 302 is used to implement the fixation of the GBT fixing plate 303 in the Y-axis direction.

Referring to fig. 1-4, the base module 4 includes a side door 401 and a bottom plate 402, wherein each component in the base module 4 is detachably mounted, the side door 401 and the bottom plate 402 are vertically distributed, an opening is formed on the side door 401, the bottom plate 402 penetrates through the opening, a part of the bottom plate is left on one side of the side door 401, another part of the bottom plate is left on the other side of the side door 401, the capacitor module 2 and the IGBT module 3 are mounted on the bottom plate 402 and located on one side of the side door 401, and the test module 5 is mounted on the bottom plate 402 and located on the other side of the side door 401 (as shown in fig. 1 and 2).

Referring to fig. 1-4, the test module 5 includes an outer contact plate 501, a test support plate 502, an inner support 503, a slide rail mounting plate 504, a linear slide rail 505, a handle 506, a test plate 507, a test plate docking portion 508, a test plate support 509, and a test plate bottom plate 510, wherein each component in the test module 5 is detachably mounted, and the bottom of the test plate 507 is mounted on the test plate bottom plate 510; one end of the test board bottom plate 510, which is close to the capacitor module 2, is connected with the inner support 503, wherein the inner support 503 limits the test board 507 in the Y-axis direction, and two ends of the inner support 503 are connected with the test supporting board 502, wherein the test supporting board 502 limits the test board 507 in the Z-axis direction.

Further, the bottom of the test support plate 502 is mounted to the bottom plate 402, one end of the test support plate 502 is detachably connected to the side door 401 through the outer contact plate 501, and one end of the test plate bottom plate 510 is connected to the inner support 503 through the test plate support 509.

The top of the test board base plate 510 and the module base plate 601 below the test board 507 mounted to the automation module 6 are provided with linear slide rails 505 at both ends of the test board base plate 510, and the top of the linear slide rails 505 is provided with a slide rail mounting plate 504. One end of the test board 507, which is close to the IGBT module 3, is provided with a test board butt joint part 508 connected with the test board 507, and handles 506 are arranged on two sides of the test board 507.

The specific operating principle of the application is as follows: in the working state, the busbar butt joint 205 and the test board butt joint 508 are aligned, after alignment, the capacitor module 2, the IGBT module 3, the base module 4 and the test module 5 are locked everywhere, the whole is arranged on the automation module 6, the whole is precisely arranged on the automation module 6 through the pin holes of the bottom plate 402, the bottom plate 402 is supported by the fixing module 1, the everywhere is locked, alignment work is completed, and the automation part performs test work.

In the second working state, the test board 507 can be pulled out through the handle 506 to replace the test PCB board card, and the alignment precision of the busbar butt joint 205 and the test board butt joint 508 is still reliable when the test PCB board card is pushed after pulled out.

In the third working state, the IGBT device 301 in the IGBT module 3 can be replaced, the IGBT support beam 304 and the IGBT dismounting plate 302 are removed, the IGBT tooling column 305 is used for supporting, and the replacement of the IGBT device 301 is completed.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (9)

1. The automatic production line alignment device of the semiconductor test equipment comprises a capacitor module (2), an IGBT module (3) and an automatic module (6), and is characterized by further comprising a fixing module (1), a base module (4) and a test module (5) corresponding to the IGBT module (3);

the base module (4) comprises a side door (401) and a bottom plate (402) which is vertical to the opening of the side door (401), the capacitor module (2) and the IGBT module (3) are arranged on one side of the side door (401), and the test module (5) and the automation module (6) are arranged on the other side of the side door (401);

wherein IGBT module (3) and electric capacity module (2) are all installed on bottom plate (402), and bottom plate (402) are to the spacing of IGBT module (3) realization X axis direction.

2. The automated production line alignment apparatus of semiconductor test equipment of claim 1, wherein: the test module (5) comprises a test board (507), a test board bottom board (510) and a test supporting board (502), wherein the bottom of the test board (507) is arranged on the test board bottom board (510);

one end of the test board bottom plate (510) is connected with the inner support (503), wherein the inner support (503) limits the test board (507) in the Y-axis direction, two ends of the inner support (503) are connected with the test supporting plate (502), and the test supporting plate (502) limits the test board (507) in the Z-axis direction.

3. The automated production line alignment apparatus of semiconductor test equipment of claim 2, wherein: the bottom of the test supporting plate (502) is mounted on the bottom plate (402), one end of the test supporting plate (502) is connected to the side door (401) through the outer contact plate (501), and one end of the test plate bottom plate (510) is connected with the inner support (503) through the test plate support piece (509).

4. The automated production line alignment apparatus of semiconductor test equipment of claim 2, wherein: the top of test board bottom plate (510) and be located the below of test board (507) and install module bottom plate (601), linear slide rail (505) are installed at the both ends of test board bottom plate (510), and slide rail mounting panel (504) are installed at the top of linear slide rail (505).

5. The automated production line alignment apparatus of semiconductor test equipment of claim 2, wherein: one end of the test board (507) close to the IGBT module (3) is provided with a test board butt joint part (508) connected with the test board, and handles (506) are arranged on two sides of the test board (507).

6. The automated production line alignment apparatus of semiconductor test equipment of claim 1, wherein: IGBT module (3) is including IGBT device (301), IGBT dismantlement board (302), IGBT fixed plate (303), IGBT supporting beam (304) and IGBT frock post (305), wherein the top of bottom plate (402) is installed to the bottom of IGBT supporting beam (304) and IGBT frock post (305), and IGBT fixed plate (303) are installed at the top of IGBT supporting beam (304) and IGBT frock post (305), the top of IGBT fixed plate (303) is dismantled board (302) and is connected with IGBT device (301) dismantlement through IGBT.

7. The automated production line alignment apparatus of claim 6, wherein: the capacitor module (2) comprises a capacitor fixing plate (201), a capacitor mounting plate (202), a capacitor (203) and a busbar (204), wherein one side of the capacitor fixing plate (201) is connected with a bottom plate (402) through the capacitor mounting plate (202), the bottom of the capacitor (203) is mounted on the capacitor fixing plate (201), the top of the capacitor is connected with the busbar (204), and an IGBT device (301) is further connected below the busbar (204).

8. The automated production line alignment apparatus of claim 7, wherein: and a busbar butt joint (205) is arranged on one side of the busbar (204) close to the side door (401), wherein the busbar butt joint (205) is connected with a test board butt joint part (508) on the test module (5).

9. The automated production line alignment apparatus of semiconductor test equipment of claim 1, wherein: the fixing module (1) comprises a cross beam (101), a supporting beam (102) and a supporting plate (103), wherein the supporting beam (102) is arranged on two sides of the top of the supporting plate (103), the bottom plate (402) is supported by the top of the supporting beam (102), and the cross beam (101) is arranged on two sides of the bottom of the supporting plate (103).