CN220217016U - Cooling mechanism for main board processing - Google Patents
Cooling mechanism for main board processing Download PDFInfo
- Publication number
- CN220217016U CN220217016U CN202321625593.1U CN202321625593U CN220217016U CN 220217016 U CN220217016 U CN 220217016U CN 202321625593 U CN202321625593 U CN 202321625593U CN 220217016 U CN220217016 U CN 220217016U
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- China
- Prior art keywords
- cooling
- fixedly connected
- water
- cooling mechanism
- mainboard
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- 238000001816 cooling Methods 0.000 title claims abstract description 104
- 230000007246 mechanism Effects 0.000 title claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 84
- 238000003466 welding Methods 0.000 claims abstract description 18
- 238000011084 recovery Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 238000005086 pumping Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000000498 cooling water Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The utility model relates to a cooling mechanism for mainboard processing, which comprises a welding table, wherein the top of the welding table is provided with the cooling mechanism, the cooling mechanism comprises a workbench fixedly connected with the welding table, a cooling bin is arranged in the workbench, a mainboard body is arranged at the top of the workbench, a mounting frame is fixedly connected with the top of the welding table, a water tank is fixedly connected with the top of the mounting frame, a conveying pipe fixedly connected with the workbench is fixedly connected to the right side of the water tank, and an electromagnetic valve is arranged in the conveying pipe. This cooling mechanism of mainboard processing is through setting up cooling mechanism, utilizes water-cooling and air-cooled mutually supporting to cool down the mainboard, has improved cooling mechanism to the cooling effect of mainboard, has increased the efficiency of mainboard processing production, has solved the cooling mechanism of current mainboard processing, adopts the forced air cooling to cool down mostly, and cooling efficiency is slower, reduces the cooling effect of cooling mechanism to the mainboard, has influenced the problem of the efficiency of mainboard processing production.
Description
Technical Field
The utility model relates to the technical field of main board processing, in particular to a cooling mechanism for main board processing.
Background
The main board, also called motherboard, is one of the most basic and important components of the computer, and is generally a rectangular circuit board, on which the main circuit system forming the computer is mounted, and the main circuit system generally comprises elements such as a BIOS chip, an I/O control chip, a keyboard and panel control switch interface, an indicator light plug-in connector, an expansion slot, a direct-current power supply plug-in connector of the main board and a plug-in card.
At present, in the process of production and processing of a main board, the main board generally undergoes the processes of tin paste printing, bottom board surface mounting, reflow soldering, panel surface mounting, reflow soldering, plug-in components, wave soldering, post-soldering repair and test, and when a welding procedure is carried out on the main board, the surface temperature of the welded main board is higher, and a cooling mechanism is generally adopted to cool a sliding main board so as to accelerate heat dissipation of the main board.
However, the existing cooling mechanism for processing the main board mostly adopts air cooling, the cooling efficiency is slower, the cooling effect of the cooling mechanism on the main board is reduced, and the efficiency of processing and producing the main board is affected.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a cooling mechanism for processing a main board, which has the advantages of high efficiency, convenience and the like, and solves the problems that the existing cooling mechanism for processing the main board mostly adopts air cooling for cooling, the cooling efficiency is slower, the cooling effect of the cooling mechanism on the main board is reduced, and the efficiency of processing and producing the main board is influenced.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the cooling mechanism for the main board processing comprises a welding table, wherein the top of the welding table is provided with the cooling mechanism;
the cooling mechanism comprises a workbench fixedly connected with a welding table, a cooling bin is arranged in the workbench, a main board body is arranged at the top of the workbench, a mounting frame is fixedly connected to the top of the welding table, a water tank is fixedly connected to the top of the mounting frame, a conveying pipe fixedly connected with the workbench is fixedly connected to the right side of the water tank, an electromagnetic valve is arranged in the conveying pipe, a water pump is fixedly connected to the left side of the mounting frame, a first water pipe is fixedly connected to the input end of the water pump and fixedly connected with the workbench, a second water pipe is fixedly connected to the output end of the water pump and fixedly connected with the water tank, a cooling fin is fixedly connected to the back surface of the water tank, a cooling fan is fixedly connected to the front surface of the mounting frame, and a filter screen corresponding to the position of the cooling fan is fixedly connected to the inner side of the mounting frame.
Further, the right side of workstation has seted up the inlet opening, the conveyer pipe is linked together with cooling storehouse through the inlet opening.
Further, a water pumping port is formed in the right side of the workbench, and the first water pipe is communicated with the cooling bin through the water pumping port.
Further, a recovery port is formed in the left side of the water tank, and the second water pipe is communicated with the water tank through the recovery port.
Further, the mounting groove has been seted up to the inside of mounting bracket, the filter screen passes through mounting groove and mounting bracket fixed connection.
Further, a water inlet is formed in the top of the water tank, and a glass window is formed in the front face of the water tank.
Compared with the prior art, the technical scheme of the application has the following beneficial effects:
this cooling mechanism of mainboard processing utilizes water-cooling and air-cooled mutually supporting to cool down the mainboard through setting up cooling mechanism, has improved cooling mechanism and to the cooling effect of mainboard, has increased the cooling mechanism of mainboard processing production, has solved the cooling mechanism of current mainboard processing, adopts the forced air cooling mostly to cool down, and cooling efficiency is slower, reduces the cooling effect of cooling mechanism to the mainboard, has influenced the problem of the efficiency of mainboard processing production.
Drawings
FIG. 1 is a cross-sectional view of the structure of the present utility model;
fig. 2 is a rear view of the structure of the present utility model.
In the figure: 1. a welding table; 2. a work table; 201. cooling bin; 3. a main board body; 4. a mounting frame; 5. a water tank; 6. a water inlet; 7. a glass window; 8. a delivery tube; 9. an electromagnetic valve; 10. a water pump; 11. a first water pipe; 12. a second water pipe; 13. a heat sink; 14. a heat dissipation fan; 15. and (3) a filter screen.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, a cooling mechanism for motherboard processing in this embodiment includes a soldering station 1, and a cooling mechanism is disposed at the top of the soldering station 1.
In this embodiment, cooling mechanism includes workstation 2 with welding bench 1 fixed connection, the inside of workstation 2 is provided with cooling storehouse 201, mainboard body 3 has been placed at the top of workstation 2, the top fixed connection of welding bench 1 has mounting bracket 4, the top fixedly connected with water tank 5 of mounting bracket 4, the top of water tank 5 is provided with water inlet 6, the front of water tank 5 is provided with glass window 7, the user is through water inlet 6 to the inside cooling water that supplements of water tank 5, and can look over the water storage of water tank 5 inside through glass window 7, the conveyer pipe 8 of right side fixedly connected with and workstation 2 fixed connection of water tank 5, the inside of conveyer pipe 8 is provided with solenoid valve 9, the inlet opening has been seted up on the right side of workstation 2, conveyer pipe 8 is linked together with cooling storehouse 201 through the inlet opening, solenoid valve 9 is opened, the inside cooling water of water tank 5 gets into cooling storehouse 201 inside, carry out heat exchange to mainboard body 3, the left side fixedly connected with water pump 10 of mounting bracket 4, the input fixedly connected with first water pipe 11 with workstation 2 fixed connection of water pump 10.
Wherein, the water sucking mouth has been seted up on the right side of workstation 2, first water pipe 11 is linked together through water sucking mouth and cooling storehouse 201, the water pump 10 circular telegram, the cooling water through the inside absorption mainboard body 3 of first water pipe 11 in cooling storehouse 201 is slowly taken out, the speed that water pump 10 pumped is unanimous with the speed that conveyer pipe 8 carried cooling water, the second water pipe 12 of the output fixedly connected with and the water tank 5 fixed connection of water pump 10, the recovery mouth has been seted up in the left side of water tank 5, the second water pipe 12 is linked together with water tank 5 through the recovery mouth, the water pump 10 carries the inside of water tank 5 through second water pipe 12 with the cooling water, the heat dissipation of cooling water is accelerated to cooling storehouse 201 inside absorption mainboard body 3 through conveyer pipe 8 again, the back fixedly connected with fin 13 of water tank 5, the front fixedly connected with radiator fan 14 of mounting bracket 4, the inside fixedly top connection of mounting bracket 4 has been connected with and has been seted up with water tank 15 with the inside of water tank 5 fixed connection, 15 has been passed through mounting bracket and 4 fixed connection, the inside of 15 filters out in the air, the inside of air tank is filtered through 14, the inside of air tank is cooled down, the cooling fan 3 is accelerated in the cooling fan 3, the cooling fan 3 is cooled down, the air is cooled down in the air of the air fan is flowing outside the main body is accelerated, the air absorption of the dust is accelerated in the cooling fan 3.
It is to be noted that, through setting up cooling mechanism, utilize water-cooling and air-cooled mutually supporting to cool down the mainboard, improved cooling mechanism to the cooling effect of mainboard, increased the efficiency of mainboard processing production, solved the cooling mechanism of current mainboard processing, mostly adopted the forced air cooling to cool down, cooling efficiency is slower, reduces the cooling effect of cooling mechanism to the mainboard, has influenced the problem of the efficiency of mainboard processing production.
Specifically, when the mainboard after the welding is required to be cooled, the user solenoid valve 9 is opened, the cooling water in the water tank 5 enters the cooling bin 201 through the conveying pipe 8, heat exchange is carried out on the mainboard body 3, the mainboard body 3 is cooled, the water pump 10 is electrified, the cooling water in the cooling bin 201 is slowly pumped out by absorbing the heat of the cooling water in the mainboard body 3 through the first water pipe 11, the cooling fin 13 accelerates the heat dissipation of the cooling water, the cooled cooling water is conveyed to the cooling bin 201 again through the conveying pipe 8 to absorb the heat of the mainboard body 3, meanwhile, the cooling fan 14 is electrified to rotate, air flow is accelerated, the cooling of the mainboard body 3 is accelerated by utilizing the air flow, the filter screen 15 reduces dust adsorption on the outside of the mainboard body 3, thereby achieving the purposes of improving the cooling effect of the mainboard by the cooling mechanism and increasing the production and processing efficiency of the mainboard.
The working principle of the embodiment is as follows:
this cooling mechanism of mainboard processing, when the mainboard after the welding is cooled down, user solenoid valve 9 is opened, inside the cooling water of water tank 5 gets into cooling storehouse 201 through conveyer pipe 8, heat exchange carries out to mainboard body 3, cool down to mainboard body 3, the water pump 10 circular telegram, the inside cooling water that absorbs mainboard body 3 heat in cooling storehouse 201 is slowly taken out through first water pipe 11, and carry the inside to water tank 5 through second water pipe 12, the heat dissipation of cooling water is accelerated to fin 13, the cooling water after the cooling is carried cooling storehouse 201 inside again and is absorbed the heat of mainboard body 3 through conveyer pipe 8, simultaneously, the cooling fan 14 circular telegram rotates, accelerate the cooling of air flow, utilize the flow of air to accelerate the cooling to mainboard body 3, the filter screen 15 reduces the dust absorption in the outside of mainboard body 3, thereby reach the purpose that improves cooling mechanism to the mainboard, increase mainboard production machining efficiency.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a cooling mechanism of mainboard processing, includes welding bench (1), its characterized in that: a cooling mechanism is arranged at the top of the welding table (1);
the cooling mechanism comprises a workbench (2) fixedly connected with a welding table (1), a cooling bin (201) is arranged in the workbench (2), a main board body (3) is arranged at the top of the workbench (2), a mounting frame (4) is fixedly connected to the top of the welding table (1), a water tank (5) is fixedly connected to the top of the mounting frame (4), a conveying pipe (8) is fixedly connected to the right side of the water tank (5) and fixedly connected with the workbench (2), an electromagnetic valve (9) is arranged in the conveying pipe (8), a water pump (10) is fixedly connected to the left side of the mounting frame (4), a first water pipe (11) is fixedly connected to the input end of the water pump (10), a second water pipe (12) is fixedly connected to the output end of the water pump (10) and fixedly connected with the water tank (5), a cooling fin (13) is fixedly connected to the back of the water tank (5), a cooling fan (14) is fixedly connected to the front side of the mounting frame (4), and a cooling fan (15) is fixedly connected to the inner side of the mounting frame (4).
2. The cooling mechanism for motherboard processing according to claim 1, wherein: the right side of the workbench (2) is provided with a water inlet, and the conveying pipe (8) is communicated with the cooling bin (201) through the water inlet.
3. The cooling mechanism for motherboard processing according to claim 1, wherein: the right side of the workbench (2) is provided with a water pumping port, and the first water pipe (11) is communicated with the cooling bin (201) through the water pumping port.
4. The cooling mechanism for motherboard processing according to claim 1, wherein: the left side of water tank (5) has seted up the recovery mouth, second water pipe (12) are linked together with water tank (5) through the recovery mouth.
5. The cooling mechanism for motherboard processing according to claim 1, wherein: the inside of mounting bracket (4) has seted up the mounting groove, filter screen (15) are through mounting groove and mounting bracket (4) fixed connection.
6. The cooling mechanism for motherboard processing according to claim 1, wherein: the top of the water tank (5) is provided with a water inlet (6), and the front of the water tank (5) is provided with a glass window (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321625593.1U CN220217016U (en) | 2023-06-26 | 2023-06-26 | Cooling mechanism for main board processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321625593.1U CN220217016U (en) | 2023-06-26 | 2023-06-26 | Cooling mechanism for main board processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220217016U true CN220217016U (en) | 2023-12-22 |
Family
ID=89197990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321625593.1U Active CN220217016U (en) | 2023-06-26 | 2023-06-26 | Cooling mechanism for main board processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220217016U (en) |
-
2023
- 2023-06-26 CN CN202321625593.1U patent/CN220217016U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |