CN220210826U - Heat radiation system and chip tester - Google Patents

Abstract

The utility model relates to a heat dissipation system and a chip testing machine. The heat dissipation system includes: a first cooling circuit and a second cooling circuit thermally coupled by a heat exchanger; the flow control device is used for controlling the flow of the secondary refrigerant in the first cooling circuit and/or controlling the flow of the refrigerant in the second cooling circuit; the refrigerating module is communicated with the second cooling loop and is used for radiating heat to the heat-radiating area by utilizing the refrigerant subjected to heat exchange with the secondary refrigerant; a first sensor for detecting a physical parameter of the refrigerant to be flowed into the refrigeration module; and a controller configured to: the flow control device is controlled based on the detection signal of the first sensor. The heat dissipation system provided by the embodiment of the utility model has high energy efficiency ratio, can more accurately and effectively control the refrigeration effect, and is used for providing a stable temperature environment.

Description

Heat radiation system and chip tester

Technical Field

The utility model relates to the technical field of heat exchange, in particular to a heat dissipation system and a chip testing machine.

Background

With the deep development of internet technology, the requirement on computing processing capacity is higher and higher, and further, the requirement on the processing capacity of a chip is higher and higher.

Chips are typically tested before they are manufactured and shipped. And the heat density is higher in the test process of the high-performance chip, and the test temperature can be greatly increased under the condition of insufficient heat dissipation capacity. For example, in normal temperature test requirements, it is generally desirable to maintain the test temperature at a temperature of 15 ℃ to 35 ℃, and temperature rise may lead to undesirable and inaccurate test data.

Conventional air-cooled heat dissipation methods have difficulty in ensuring that the test temperature is within a desired range.

Disclosure of Invention

Based on this, it is necessary to provide a heat dissipation system and a chip tester for solving the problem of low cooling precision in the test environment of the chip.

The embodiment of the utility model provides a heat dissipation system, which comprises: a first cooling circuit and a second cooling circuit thermally coupled by a heat exchanger; the flow control device is used for controlling the flow of the secondary refrigerant in the first cooling circuit and/or controlling the flow of the refrigerant in the second cooling circuit; the refrigerating module is communicated with the second cooling loop and is used for radiating heat to the heat-radiating area by utilizing the refrigerant subjected to heat exchange with the secondary refrigerant; a first sensor for detecting a physical parameter of the refrigerant to be flowed into the refrigeration module; and a controller configured to: the flow control device is controlled based on the detection signal of the first sensor.

Compared with the traditional vapor compression refrigeration cycle, the two-stage heat dissipation of the heat dissipation system provided by the embodiment of the utility model can further improve the energy efficiency ratio, and the heat dissipation system can more accurately and effectively control the refrigeration effect and is used for providing a more stable temperature environment.

In some embodiments, the first cooling circuit further comprises a water inlet pipe for conveying a cooling medium to the heat exchanger; the flow control device includes a flow valve for controlling the flow of coolant in the inlet line.

This arrangement facilitates the communication of coolant from the external system and enables control of the flow of coolant through the heat exchanger. In addition, the liquid coolant has a higher capacity for short-term cold exchange, or short-term heat exchange, than air-cooled coolant.

In some embodiments, the first sensor includes a first temperature sensor for detecting a temperature of the refrigerant to be flowed into the refrigeration module; the controller includes: a first computing unit configured to: calculating an actual supply temperature difference delta Tg and a first temperature demand Tx, wherein delta Tg=Ta-Ts, tx= |Ta-Ts|/Ti, ta is a detection value of a first temperature sensor, ts is a set value of supply temperature, and Ti is a set value of supply temperature precision deviation; a first judgment unit configured to: judging whether the value of the first temperature requirement is larger than the first temperature requirement set value or not through a first judging step, and judging whether the value of the actual supply temperature difference is positive or negative through a second judging step; and a first control unit configured to: controlling the flow valve to increase the flow in response to the result of the first judging step being yes and the result of the second judging step being positive; and controlling the flow valve to reduce the flow in response to the result of the first judging step being yes and the result of the second judging step being negative.

By this arrangement, the refrigeration module can be controlled economically and efficiently by controlling the flow valve.

In some embodiments, the flow control device includes a variable frequency pump in communication with the second cooling circuit to control the flow of refrigerant.

Through setting up the variable frequency pump, can realize the control to the flow of refrigerant in a flexible way sensitively, guarantee the work effect of refrigeration module effectively.

In some embodiments, the first sensor comprises a first pressure sensor for detecting an outlet side pressure of the variable frequency pump; the variable frequency pump is used for pumping refrigerant to the refrigerating module; the controller includes: a second computing unit configured to: calculating a supply pressure deviation delta P and a pressure demand Px, wherein delta P=Pa-Ps, px= |Pa-Ps|/Pi, wherein Pa is a detection value of a first pressure sensor, ps is a set value of the supply pressure, and Pi is a set value of the supply pressure deviation; a second judgment unit configured to: judging whether the value of the pressure demand is larger than the pressure demand set value through a third judging step, and judging whether the value of the supply pressure deviation is positive or negative through a fourth judging step; and a second control unit configured to: responding to the result of the third judging step being positive and the result of the fourth judging step being negative, controlling the variable frequency pump to increase the circulation quantity; and controlling the variable frequency pump to reduce the circulation amount in response to the result of the third judging step being positive and the result of the fourth judging step being positive.

The arrangement is beneficial to controlling the variable frequency pump and directly and effectively ensuring the refrigeration working effect of the refrigeration module and ensuring the quick response of the heat radiation system to temperature change.

In some embodiments, the heat dissipating system further comprises a second pressure sensor for detecting an inlet side pressure of the variable frequency pump.

The pressure detection can be realized more comprehensively, and then the pressure supply force to the refrigerating module can be regulated and controlled more pertinently.

In some embodiments, the heat dissipation system further comprises a second temperature sensor for detecting a temperature of the refrigerant flowing out of the refrigeration module; the first sensor includes a first temperature sensor for detecting a temperature of the refrigerant to be flowed into the refrigeration module; the controller includes: a third computing unit configured to: calculating the actual deviation theta Th of the feedback temperature difference and the second temperature requirement Ty, theta Th= (Tb-Ta) -delta Tr, ty= | (Tb-Ta) -delta Tr|/Tj, wherein Ta is the detection value of the first temperature sensor, tb is the detection value of the second temperature sensor, delta Tr is the set value of the feedback temperature difference, and Tj is the set value of the precision deviation of the feedback temperature difference; a third judgment unit configured to: judging whether the value of the second temperature requirement is larger than the second temperature requirement set value or not through a fifth judging step, and judging whether the value of the actual deviation of the return temperature difference is positive or negative through a sixth judging step; and a third control unit configured to: controlling the variable frequency pump to increase the circulation amount in response to the result of the fifth judging step being yes and the result of the sixth judging step being positive; and controlling the variable frequency pump to reduce the circulation amount in response to the result of the fifth judging step being positive and the result of the sixth judging step being negative.

By the arrangement, the refrigerating state inside the refrigerating module can be measured more accurately, and supercooling or overheating can be prevented.

In some embodiments, the heat dissipation system further comprises a heater and a header tank, the header tank is used for collecting the refrigerant subjected to heat exchange, and the heater is used for heating the refrigerant in the header tank to flow into the refrigeration module; the controller includes: a fourth judgment unit configured to: judging whether the detection value of the first temperature sensor is lower than the lower limit of the temperature deviation or not through a seventh judging step; and a fourth control unit configured to: the structure in response to the seventh judging step is that the heater is controlled to heat.

By the arrangement, the temperature of the refrigerant can be adjusted more sensitively and rapidly. In addition, the buffer capacity of the heat dissipation system can be increased, and the continuous and stable supply of the insulating heat conducting medium can be ensured.

In some embodiments, the heat dissipation system further comprises a first valve, a second valve, and a pressure relief valve, the second cooling circuit comprising an input line and an output line; the input pipeline is used for conveying the refrigerant and is communicated with the inlet of the refrigeration module, the output pipeline is used for conveying the refrigerant and is communicated with the outlet of the refrigeration module, the first valve is used for controlling the on-off of the input pipeline, and the second valve is used for controlling the on-off of the output pipeline; the first temperature sensor is used for detecting the temperature of the refrigerant in the input pipeline; the pressure release valve is connected with the refrigeration module in parallel.

By the arrangement, the safety of the refrigerating module and the area to be radiated can be protected, and the safe and stable operation of the radiating system is ensured.

Illustratively, the insulating and thermally conductive medium is a fluorinated liquid in the liquid phase; the refrigeration module comprises a liquid cooling plate; the cooling medium comprises service water.

The two-stage liquid cooling heat exchange device can realize two-stage liquid cooling heat exchange, has large heat exchange quantity and good heat exchange performance, can ensure operation safety, and avoids influence on a heat dissipation area caused by liquid leakage and the like.

The present utility model provides in another aspect a chip tester comprising: the heat dissipation system; and the testing device is provided with a region to be heat-dissipated and used for testing the chip, and the testing device is thermally coupled with the heat dissipation system.

The chip tester can realize stable and reliable testing by ensuring stable and controllable temperature of the area to be cooled, and has better working performance.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation system provided by an embodiment of the present utility model;

FIG. 2 is a schematic circuit diagram of a heat dissipation system according to an embodiment of the present utility model;

FIG. 3 is a schematic block diagram of a controller according to an embodiment of the present utility model;

fig. 4 is a schematic block diagram of a chip tester according to an embodiment of the present utility model.

Reference numerals illustrate: 1. a heat exchanger; 2. a flow control device; 21. a variable frequency pump; 22. a flow valve; 3. a refrigeration module; 301. an inlet; 302. an outlet; 4. a first sensor; 41. a first temperature sensor; 42. a first pressure sensor; 5. a second sensor; 51. a second temperature sensor; 52. a second pressure sensor; 6. a heater; 7. a liquid collecting box; 8. a pressure release valve; 11. a first valve; 12. a second valve;

9. a controller; 901. a first calculation unit; 902. a first judgment unit; 903. a first control unit; 904. a second calculation unit; 905. a second judgment unit; 906. a second control unit; 907. a third calculation unit; 908. a third judgment unit; 909. a third control unit; 910. a fourth calculation unit; 911. a fourth judgment unit; 912. a fourth control unit;

10. a first cooling circuit; 20. a water return pipe; 30. a water inlet pipe; 40. a second cooling circuit; 50. an input pipeline; 60. an output line;

100. a heat dissipation system; 200. a testing device; 300. a chip; 400. a chip tester.

Detailed Description

In order that the above objects, features and advantages of embodiments of the present utility model may be more readily understood, a detailed description of embodiments of the present utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the utility model. The present embodiments may be embodied in many other forms other than those herein described, and similar modifications may be made by those skilled in the art without departing from the spirit of the utility model, so that the present embodiments are not limited to the specific examples of embodiments described below.

In the description of the embodiments of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present utility model and simplify description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of the present utility model.

In embodiments of the utility model, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. For example, the first sensor may also be referred to as a second sensor, and the second sensor may also be referred to as a first sensor. In the description of the embodiments of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "connected," "connected," and the like are to be construed broadly and include, for example, fixedly connected, detachably connected, or integrally formed therewith; can be flexible connection or rigid connection along at least one direction; can be mechanically or electrically connected; either directly, indirectly, through intermediaries, or both, or in which case the intermediaries are present, or in which case the two elements are in communication or in which case they interact, unless explicitly stated otherwise. The terms "mounted," "disposed," "secured," and the like may be construed broadly as connected. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those skilled in the art according to specific circumstances.

Referring to fig. 1, fig. 1 illustrates a heat dissipation system in an embodiment of the present utility model. The heat dissipation system 100 provided in the embodiment of the utility model may include a first cooling circuit 10, a second cooling circuit 40, a heat exchanger 1 and a refrigeration module 3.

The first cooling circuit 10 may be externally connected. The second cooling circuit 40 may be thermally coupled to the first cooling circuit 10 by the heat exchanger 1. The heat exchanger 1 may, for example, be a plate heat exchanger, the first cooling circuit 10 and the second cooling circuit 40 being in communication with different passages within the heat exchanger 1, respectively. The coolant in the first cooling circuit 10 can exchange heat with the coolant in the second cooling circuit 40.

The refrigeration module 3 communicates with a second cooling circuit 40. The refrigeration module 3 is used for radiating heat of the heat-radiating area or cooling the heat-radiating area. The passage in the refrigeration module 3 may be in communication with the second cooling circuit 40 so that the refrigerant may carry away heat from the heat to be dissipated. In the second cooling circuit 40, the refrigerant that has undergone heat exchange with the coolant is supplied to the refrigeration module 3, and the refrigerant output from the refrigeration module 3 can be delivered to the heat exchanger 1, for example, to transfer heat through the heat exchanger 1 to the coolant of the first cooling circuit 10.

Referring to fig. 2, fig. 2 shows a schematic circuit of a heat dissipation system in an embodiment of the present utility model. In some embodiments, the heat dissipation system 100 includes a flow control device 2, a first sensor 4, and a controller 9 (fig. 2). The controller 9 is communicatively coupled to the first sensor 4 and to the flow control device 2.

Optionally, the flow control device 2 is used to control the flow of coolant in the first cooling circuit 10 and/or to control the flow of coolant in the second cooling circuit 40.

The first sensor 4 is used to detect a physical parameter of the refrigerant to be flowed into the refrigeration module 3. The controller 9 is configured to: the flow control device 2 is controlled based on the detection signal of the first sensor 4. The performance of the refrigerant supplied to the refrigeration module 3 is controllable by the control of the controller 9, which ensures the heat dissipation requirement of the area to be heat-dissipated and at the same time helps to control the operation power consumption of the heat dissipation system 100.

The heat dissipation system provided by the utility model has higher energy efficiency ratio, and can accurately and effectively control the heat dissipation effect.

Illustratively, the first cooling circuit 10 includes a water inlet pipe 30 and a water return pipe 20. The water inlet pipe 30 is used for conveying the secondary refrigerant to the heat exchanger 1, and the water return pipe 20 is used for outputting the secondary refrigerant subjected to heat exchange to the heat exchanger 1. Illustratively, the coolant includes service water. The concentrated water supply of the plant is used as a terminal cold source, so that the tail end heat-discharging capability of the heat-dissipating system 100 can be effectively ensured.

In some alternative embodiments, the flow control device 2 includes a flow valve 22 for controlling the flow of coolant in the inlet tube 30. Illustratively, the flow valve 22 may be an electronically controlled ball valve, which may be specifically disposed in the inlet pipe 30, in communication with the first cooling circuit 10, and may have a controllable opening. The first sensor 4 may include a first temperature sensor 41. The first temperature sensor 41 is used to detect the temperature of the refrigerant to be flowed into the refrigeration module 3.

Referring to fig. 3, fig. 3 shows a block diagram of a controller according to an embodiment of the present utility model. The controller 9 includes: a first calculation unit 901, a first determination unit 902, and a first control unit 903.

The first computing unit 901 is configured to: the actual supply temperature difference δtg and the first temperature demand Tx are calculated. The following two formulas can be used: δtg=ta-Ts, tx= |ta-ts|/Ti, where Ta is the detection value of the first temperature sensor 41, ts is the set value of the supply temperature, and Ti is the set value of the supply temperature accuracy deviation. The supply temperature and the supply temperature precision deviation can be set according to the requirements of the heat dissipation area to be dissipated. The first computing unit 901 may be communicatively connected to the first judging unit 902.

The first judging unit 902 is configured to: judging whether the value of the first temperature requirement is larger than the first temperature requirement set value or not through a first judging step, and judging whether the value of the actual supply temperature difference is positive or negative through a second judging step. The first temperature demand set point is related to the set point Ti for the supply temperature accuracy deviation. For example, setting Ti to 2 ℃ while setting the temperature dead zone to 0.5 ℃ means that the first temperature demand set point is 25%.

The first control unit 903 is configured to: in response to the result of the first judging step being yes and the result of the second judging step being positive, controlling the flow valve 22 to increase the flow rate; and controlling the flow valve 22 to reduce the flow in response to the result of the first judging step being yes and the result of the second judging step being negative. Illustratively, the flow valve 22 may be controlled by a proportional adjustment, a proportional integral adjustment, or a proportional integral derivative adjustment.

For example, the initial opening of the flow valve 22 may be 20%. The supply temperature was set at 25 ℃, the supply temperature accuracy deviation was set at 2 ℃, and the first temperature demand set point was confirmed to be 25%. When the value of the first temperature demand Tx is 5% at 25.1 ℃ of the detection value of the first temperature sensor 41, the temperature deviation of the refrigerant is considered to be in the temperature dead zone, and the flow valve 22 is not adjusted to adjust the coolant; when the detected value of the first temperature sensor 41 is 26 ℃, the value of the first temperature demand Tx is 50%, and the actual supply temperature difference δtg is +1 ℃, the flow valve 22 needs to be controlled to increase the flow rate so as to enhance the heat exchange at the heat exchanger 1 and reduce the temperature of the refrigerant; when the detected value of the first temperature sensor 41 is 24 ℃, the value of the first temperature demand Tx is 50%, and the actual supply temperature difference δtg is-1 ℃, the flow valve 22 needs to be controlled to reduce the flow rate.

In some alternative embodiments, the flow control device 2 includes a variable frequency pump 21 for controlling the flow of refrigerant in the second cooling circuit 40. Illustratively, variable frequency pump 21 is used to pump refrigerant to refrigeration module 3. The first sensor 4 may comprise a first pressure sensor 42. The first pressure sensor 42 is for detecting the outlet side pressure of the variable frequency pump 21.

As shown in connection with fig. 3, the controller 9 includes: a second calculating unit 904, a second judging unit 905 and a second control unit 906.

The second calculation unit 904 is configured to: the supply pressure deviation δp and the pressure demand Px, δp=pa-Ps, px= |pa-ps|/Pi, pa being the detection value of the first pressure sensor 42, ps being the set value of the supply pressure, pi being the set value of the supply pressure deviation, are calculated. The supply pressure and the supply pressure deviation can be set according to the requirements of the heat dissipation area. The second computing unit 904 may be communicatively connected to a second determining unit 905.

The second judgment unit 905 is configured to: judging whether the value of the pressure demand is larger than the pressure demand set value through the third judging step, and judging whether the value of the supply pressure deviation is positive or negative through the fourth judging step. The pressure demand set point is related to the set point Pi of the supply pressure deviation. For example, setting the supply pressure deviation to 0.5bar, while setting the pressure dead zone to 0.1bar, means that the pressure demand set point is 20%.

The second control unit 906 is configured to: in response to the result of the third judging step being yes and the result of the fourth judging step being negative, controlling the variable frequency pump 21 to increase the circulation amount; and controlling the variable frequency pump 21 to reduce the circulation amount in response to the result of the third judging step being yes and the result of the fourth judging step being positive. Illustratively, the variable frequency pump 21 may be controlled by a proportional adjustment, a proportional integral adjustment, or a proportional integral derivative adjustment.

For example, the supply pressure may be set at 3.0bar, the supply pressure deviation may be set at 0.5bar, and the pressure demand set point may be identified as 20%. When the detection value of the first pressure sensor 42 is 3.0bar, the calculated pressure demand Px is 0%, and at this time, the pressure of the refrigerant is considered to be in the pressure dead zone, and the variable frequency pump 21 does not need to be adjusted; when the detected value of the first pressure sensor 42 is 3.3bar, the calculated pressure demand Px is 60%, the supply pressure deviation δp is +0.3bar, and the variable frequency pump 21 is controlled to decrease the circulation amount to decrease the pressure of the refrigerant; when the detected value of the first pressure sensor 42 is 2.8bar, the calculated pressure demand Px is 40%, the supply pressure deviation δp is-0.2 bar, and the variable frequency pump 21 is controlled to increase the circulation amount to increase the pressure of the refrigerant.

The heat radiation system 100 further comprises a second sensor 5, the second sensor 5 being adapted to detecting a physical parameter of the refrigerant flowing out of the refrigeration module 3 in the second cooling circuit 40. The second sensor 5 may include at least one of a second temperature sensor 51 and a second pressure sensor 52, for example. The second temperature sensor 51 detects the temperature of the refrigerant flowing out of the refrigeration module 3. When the variable frequency pump 21 is provided, the second pressure sensor 52 is used to detect the inlet-side pressure of the variable frequency pump 21.

Illustratively, the controller 9 includes: a third calculation unit 907, a third determination unit 908, and a third control unit 909.

The third computing unit 907 is configured to: the actual deviation θTh of the return temperature difference and the second temperature demand Ty, θTh= (Tb-Ta) - δTr, ty= | (Tb-Ta) - δTr|/Tj are calculated, ta is the detection value of the first temperature sensor 41, tb is the detection value of the second temperature sensor 51, δTr is the set value of the return temperature difference, and Tj is the set value of the return temperature difference precision deviation. The supply-back temperature difference and the precision deviation of the supply-back temperature difference can be set according to the requirements of the heat dissipation area to be dissipated. The third computing unit 907 and the third judging unit 908 can be communicatively connected.

The third judgment unit 908 is configured to: judging whether the value of the second temperature requirement is larger than the second temperature requirement set value or not through a fifth judging step, and judging whether the value of the actual deviation of the return temperature difference is positive or negative through a sixth judging step. The second temperature demand set point is related to the set point Tj for the return temperature difference accuracy deviation. For example, setting the accuracy deviation of the temperature difference for feedback to be 2 ℃ and setting the dead zone of the temperature difference to be 1.0 ℃ means that the second temperature requirement set value is 50%.

The third control unit 909 is configured to: in response to the result of the fifth judging step being yes and the result of the sixth judging step being positive, controlling the variable frequency pump 21 to increase the circulation amount; and controlling the variable frequency pump 21 to reduce the circulation amount in response to the result of the fifth judging step being yes and the result of the sixth judging step being negative.

For example, the supply back temperature difference may be set to 5 ℃, the supply back temperature difference accuracy deviation to 2 ℃, and the second temperature demand set point determined to be 50%. When the detection value of the first temperature sensor 41 is 20.0 ℃ and the detection value of the second temperature sensor 51 is 24.5 ℃, the actual deviation θTh of the feedback temperature difference is-0.5 ℃ and the second temperature requirement Ty is 25%, and the result of the fifth step is no, the feedback temperature difference can be considered to be in the temperature difference dead zone, and the variable frequency pump 21 can be not required to be regulated; when the detection value of the first temperature sensor 41 is 23.0 ℃ and the detection value of the second temperature sensor 51 is 29.5 ℃, the actual deviation θTh of the fed-back temperature difference is 1.5 ℃, and the second temperature requirement Ty is 75%, the variable frequency pump 21 can be controlled to increase the circulation volume; when the detection value of the first temperature sensor 41 is 20.0 ℃ and the detection value of the second temperature sensor 51 is 22.5 ℃, the actual deviation θTh of the feedback temperature difference is-2.5 ℃ and the second temperature demand Ty is 125%, the variable frequency pump 21 can be controlled to reduce the circulation amount.

Illustratively, the heat dissipating system 100 further includes a header tank 7. The header tank 7 is used for collecting the heat-exchanged refrigerant. The variable frequency pump 21 may draw refrigerant from the header tank 7 and pump it to the refrigeration module 3.

Illustratively, the heat dissipating system 100 further includes a heater 6. The heater 6 is used to heat the refrigerant to be flowed into the refrigeration module 3. The heater 6 may be provided at the header tank 7, alternatively at other piping locations upstream of the first temperature sensor 41.

In some embodiments, the controller 9 comprises: a fourth determination unit 911 and a fourth control unit 912.

The fourth determination unit 911 is configured to: it is determined whether or not the detection value of the first temperature sensor 41 is lower than the temperature deviation lower limit by the seventh determination step. The fourth determination unit 911 may be communicatively connected to the first calculation unit 901 or the third calculation unit 907. The lower limit of the temperature deviation can be obtained based on the set value Ts of the supply temperature and the set value Ti of the temperature accuracy deviation.

Illustratively, the controller 9 may include a fourth computing unit 910. The fourth calculation unit 910 is configured to: a difference obtained by subtracting the set value Ti of the temperature accuracy deviation from the set value Ts of the supply temperature is calculated as a temperature deviation lower limit. For example, if the supply temperature is set to 25 ℃, the supply temperature accuracy deviation is set to 2 ℃, and the lower limit of the temperature deviation is set to 23 ℃.

The fourth control unit 912 is configured to: the structure in response to the seventh judgment step is that the heater 6 is controlled to heat. For example, the fourth control unit 912 may be provided while the flow valve 22, the first control unit 903 are provided.

For example, the lower limit of the temperature deviation is set to 22 ℃, and the detection value of the first temperature sensor 41 is 20 ℃. The heater 6 can be controlled to heat at this time.

In some embodiments, the second cooling circuit 40 includes an input line 50 and an output line 60. The inlet line 50 is used for delivering refrigerant and is in communication with an inlet 301 of the refrigeration module 3, and the outlet line 60 is used for delivering refrigerant and is in communication with an outlet 302 of the refrigeration module 3.

The refrigerant may be a liquid phase fluorinated liquid. Thus, the refrigerating effect is ensured, and the influence on chips, circuit devices and the like after liquid leakage can be prevented. The refrigeration module 3 may comprise a liquid cooled panel. The second cooling circuit 40 may be in communication with a passage in a liquid cooling plate, which may be disposed in the region to be cooled, and perform better heat exchange.

The heat dissipation system 100 further includes a first valve 11, a second valve 12, and a pressure relief valve 8. The first valve 11 is used for controlling the on-off of the input pipeline 50, and the second valve 12 is used for controlling the on-off of the output pipeline 60. The first temperature sensor 41 is used to detect the temperature of the refrigerant in the input line 50. Illustratively, the first valve 11 and the second valve 12 may be disposed closer to the refrigeration module 3 than the sensor to ensure a shut-off effect. The first valve 11 and the second valve 12 may be ball valves. The pressure release valve 8 is connected with the refrigeration module 3 in parallel and is used for ensuring the normal operation of the refrigeration module 3.

Fig. 4 shows a chip tester provided by the utility model. The chip tester 400 may include: a heat dissipation system 100 and a test device 200. The test device 200 has a region to be heat-dissipated for testing the chip 300. The test device 200 is thermally coupled to the heat dissipation system 100. The heat dissipation system 100 may be partially located in the testing device 200, for dissipating heat from a heat dissipation area.

The chip tester provided by the utility model can test chips and can perform good heat dissipation aiming at chips with larger heating value and larger heat flux density.

The technical features of the embodiments disclosed above may be combined in any way, and for brevity, all of the possible combinations of the technical features of the embodiments described above are not described, however, they should be considered as the scope of the description provided in this specification as long as there is no contradiction between the combinations of the technical features.

In the embodiments disclosed above, the order of execution of the steps is not limited, and may be performed in parallel, or performed in a different order, unless explicitly stated and defined otherwise. The sub-steps of the steps may also be performed in an interleaved manner. Various forms of procedures described above may be used, and steps may be reordered, added, or deleted as long as the desired results of the technical solutions provided by the embodiments of the present disclosure are achieved, which are not limited herein.

The above disclosed examples represent only a few embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model, which is intended to be within the scope of the utility model as claimed. Accordingly, the scope of the utility model should be determined from the following claims.

Claims (10)

1. A heat dissipation system, comprising:

a first cooling circuit (10) and a second cooling circuit (40) which are thermally coupled by means of a heat exchanger (1);

flow control means (2) for controlling the flow of coolant in said first cooling circuit (10) and/or for controlling the flow of coolant in said second cooling circuit (40);

a refrigeration module (3) communicated with the second cooling loop (40) and used for radiating heat to a heat-radiating area by utilizing the refrigerant subjected to heat exchange with the secondary refrigerant;

a first sensor (4) for detecting a physical parameter of the refrigerant to be flowed into the refrigeration module (3); and

a controller (9) configured to: the flow control device (2) is controlled according to the detection signal of the first sensor (4).

2. A heat spreading system according to claim 1, wherein the first cooling circuit (10) comprises a water inlet pipe (30), the water inlet pipe (30) being adapted to convey the coolant to the heat exchanger (1);

the flow control device (2) includes a flow valve (22) for controlling the flow of coolant in the inlet conduit (30).

3. A heat radiation system according to claim 2, characterized in that the first sensor (4) comprises a first temperature sensor (41) for detecting the temperature of the refrigerant to be flowed into the refrigeration module (3);

the controller (9) includes:

a first computing unit configured to: calculating an actual supply temperature difference δtg and a first temperature requirement Tx, δtg=ta-Ts, tx= |ta-ts|/Ti, ta being a detection value of the first temperature sensor (41), ts being a set value of the supply temperature, ti being a set value of the supply temperature accuracy deviation;

a first judgment unit configured to: judging whether the value of the first temperature requirement is larger than a first temperature requirement set value or not through a first judging step, and judging whether the value of the actual supply temperature difference is positive or negative through a second judging step; and

a first control unit configured to: controlling the flow valve (22) to increase the flow in response to the result of the first judging step being yes and the result of the second judging step being positive; and controlling the flow valve (22) to reduce the flow in response to the result of the first judging step being yes and the result of the second judging step being negative.

4. The heat radiation system according to claim 1, characterized in that the flow control device (2) comprises a variable frequency pump (21) in communication with the second cooling circuit (40) to control the flow of the refrigerant.

5. The heat radiation system according to claim 4, characterized in that the first sensor (4) comprises a first pressure sensor (42), the first pressure sensor (42) being adapted to detect the outlet side pressure of the variable frequency pump (21);

-the variable frequency pump (21) is used for pumping the refrigerant to the refrigeration module (3);

the controller (9) includes:

a second computing unit configured to: calculating a supply pressure deviation δp and a pressure demand Px, δp=pa-Ps, px= |pa-ps|/Pi, pa being a detection value of the first pressure sensor (42), ps being a set value of the supply pressure, pi being a set value of the supply pressure deviation;

a second judgment unit configured to: judging whether the value of the pressure demand is larger than a pressure demand set value or not through a third judging step, and judging whether the value of the supply pressure deviation is positive or negative through a fourth judging step; and

a second control unit configured to: controlling the variable frequency pump (21) to increase the circulation amount in response to the result of the third judging step being yes and the result of the fourth judging step being negative; and controlling the variable frequency pump (21) to reduce the circulation amount in response to the result of the third judging step being yes and the result of the fourth judging step being positive.

6. The heat dissipation system according to claim 4, further comprising a second pressure sensor (52), the second pressure sensor (52) being configured to detect an inlet side pressure of the variable frequency pump (21).

7. The heat radiation system according to claim 4, further comprising a second temperature sensor (51) for detecting a temperature of the refrigerant flowing out of the refrigeration module (3);

the first sensor (4) comprises a first temperature sensor (41) for detecting the temperature of the refrigerant to be flowed into the refrigeration module (3);

the controller (9) includes:

a third computing unit configured to: calculating the actual deviation of the feedback temperature difference theta Th and a second temperature demand Ty, theta Th= (Tb-Ta) -delta Tr, ty= | (Tb-Ta) -delta Tr|/Tj, wherein Ta is the detection value of the first temperature sensor (41), tb is the detection value of the second temperature sensor (51), delta Tr is the set value of the feedback temperature difference, and Tj is the set value of the precision deviation of the feedback temperature difference;

a third judgment unit configured to: judging whether the value of the second temperature requirement is larger than a second temperature requirement set value or not through a fifth judging step, and judging whether the value of the actual deviation of the temperature difference is positive or negative through a sixth judging step; and

a third control unit configured to: controlling the variable frequency pump (21) to increase the circulation amount in response to the result of the fifth judging step being yes and the result of the sixth judging step being positive; and controlling the variable frequency pump (21) to reduce the circulation amount in response to the result of the fifth judging step being yes and the result of the sixth judging step being negative.

8. -the heat radiation system according to claim 3 or 7, characterized by further comprising a heater (6) and a header tank (7), the header tank (7) being adapted to collect the heat exchanged refrigerant, the heater (6) being adapted to heat the refrigerant within the header tank (7) to be flowed into the refrigeration module (3);

the controller (9) includes:

a fourth judgment unit configured to: judging whether the detection value of the first temperature sensor (41) is lower than a lower limit of temperature deviation or not by a seventh judging step; a kind of electronic device with high-pressure air-conditioning system

A fourth control unit configured to: and controlling the heater (6) to heat in response to the seventh judging step being yes.

9. The heat dissipation system according to claim 3 or 7, further comprising a first valve (11), a second valve (12) and a pressure relief valve (8), the second cooling circuit (40) comprising an input line (50) and an output line (60);

the input pipeline (50) is used for conveying the refrigerant and is communicated with an inlet (301) of the refrigerating module (3), the output pipeline (60) is used for conveying the refrigerant and is communicated with an outlet (302) of the refrigerating module (3), the first valve (11) is used for controlling the on-off of the input pipeline (50), and the second valve (12) is used for controlling the on-off of the output pipeline (60);

-the first temperature sensor (41) is adapted to detecting the temperature of the refrigerant in the inlet line (50);

the pressure release valve (8) is connected with the refrigeration module (3) in parallel;

the refrigerant is a liquid-phase fluoridation liquid; the refrigeration module (3) comprises a liquid cooling plate; the coolant includes service water.

10. Chip testing machine, its characterized in that includes:

the heat dissipation system (100) of any one of claims 1 to 9; a kind of electronic device with high-pressure air-conditioning system

-a testing device (200) having a region to be heat-dissipated for testing a chip (300), said testing device (200) being thermally coupled to said heat dissipation system (100).