CN220202073U - Electroplating device for PCB processing - Google Patents
Electroplating device for PCB processing Download PDFInfo
- Publication number
- CN220202073U CN220202073U CN202321948070.0U CN202321948070U CN220202073U CN 220202073 U CN220202073 U CN 220202073U CN 202321948070 U CN202321948070 U CN 202321948070U CN 220202073 U CN220202073 U CN 220202073U
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- China
- Prior art keywords
- processing
- pcb
- liquid
- fixed
- electroplating device
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- 238000009713 electroplating Methods 0.000 title claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 44
- 239000003513 alkali Substances 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000008676 import Effects 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 2
- 230000002146 bilateral effect Effects 0.000 claims 1
- 208000002925 dental caries Diseases 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 abstract description 5
- 230000003213 activating effect Effects 0.000 abstract description 4
- 238000005192 partition Methods 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000004064 recycling Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000009975 flexible effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an electroplating device for PCB processing, which comprises a processing box, wherein the interior of the processing box is divided into three cavities by a partition plate, the cavities comprise an alkali liquor cleaning cavity, an acid liquor activating cavity and an electroplating liquid cavity, inlets are formed in the top of the processing box above the cavities, cover plates which are turned and opened by thrust are arranged on the surfaces of the inlets, first sliding grooves are symmetrically formed in two sides of the inlets, a plurality of groups of fixed sliding blocks are arranged on the first sliding grooves, a PCB fixing assembly is arranged on the fixed sliding blocks, a liquid inlet assembly is arranged on the front end surface of the processing box, a liquid outlet assembly is arranged on the rear end surface of the processing box, the device is provided with three cavities, the PCB can be pretreated before electroplating, the cover plates between the fixed clamping blocks and the sliding clamping blocks are pushed and turned through the telescopic action of a first telescopic rod and a second telescopic rod to extend into the interiors of the cavities for pretreatment and electroplating, the liquid outlet assembly is convenient for recycling waste liquid which is used repeatedly, and the liquid inlet assembly is convenient for replacing liquid.
Description
Technical Field
The utility model relates to the field of PCB production and processing, in particular to an electroplating device for PCB processing.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of certain metals by utilizing the electrolysis principle, and aims to prevent oxidation (such as rust) of the metals, improve the wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate) and the like, and improve the attractive effect.
Chinese patent discloses a PCB electroplates instrument (grant bulletin number is CN 217173918U), this patent technology adopts fixture to fix the PCB board and electroplates, the centre gripping mode compares traditional mode simple swift more, realized the centre gripping simultaneously to a plurality of PCB boards, and the device can be with the PCB board quick in the feeding electroplate the storehouse, also can be quick take off the PCB board that electroplates the completion, but the device can't carry out the preliminary treatment to the PCB, the spot department that exists on the PCB board can't be contacted with the plating solution, electroplating that leads to is incomplete. Therefore, a person skilled in the art provides an electroplating device for processing a PCB board, so as to solve the problems set forth in the background art.
Disclosure of Invention
In order to solve the technical problems, the utility model provides an electroplating device for PCB processing, which comprises a processing box, wherein the interior of the processing box is divided into three cavities by a partition board, each cavity comprises an alkali liquor cleaning cavity, an acid liquor activating cavity and an electroplating liquid cavity, the top of the processing box is positioned above each cavity, an inlet is formed in the top of each cavity, a cover plate which is turned and opened by thrust is arranged on the surface of each inlet, first sliding grooves are symmetrically arranged on two sides of each inlet, a plurality of groups of fixed sliding blocks are arranged on each first sliding groove, a PCB fixing assembly is arranged on each fixed sliding block, a liquid inlet assembly is arranged on the front end face of the processing box, and a liquid outlet assembly is arranged on the rear end face of the processing box.
Preferably: the liquid inlet assembly comprises a liquid inlet pipe penetrating into the treatment box, a chock is arranged at a liquid inlet of the liquid inlet pipe, and a grabbing block convenient to take down is arranged at the top of the chock.
Preferably: the liquid inlet assembly comprises a liquid outlet pipe penetrating into the treatment box, a small suction pump is arranged at the liquid inlet end of the liquid outlet pipe, and a control knob is arranged on a pipe body of the liquid outlet pipe outside the treatment box.
Preferably: the PCB fixing assembly comprises a first telescopic rod arranged on the fixing sliding block.
Preferably: the first telescopic rod is provided with a supporting plate, the supporting plate is provided with a second telescopic rod, and the end part of the second telescopic rod is fixedly provided with a fixing plate.
Preferably: the bottom surface of fixed plate is equipped with the fixed splint, the fixed plate is located the place ahead of fixed splint and is equipped with the second spout, be equipped with the sliding block on the second spout, fixedly connected with slip splint on the sliding block.
Preferably: the maximum clamping size of the fixed clamping plate and the sliding clamping plate is the size of the inlet.
The utility model has the technical effects and advantages that:
the device is equipped with three cavity, can carry out the preliminary treatment to the PCB board before electroplating, makes the PCB board between fixed clamp splice and the slip clamp splice promote the upset through the flexible effect of first telescopic link and second telescopic link and advances the import with the apron and stretch into the cavity inside and carry out preliminary treatment and electroplating, goes out the liquid subassembly and is convenient for retrieve the waste liquid of repetitious usage, and the feed liquor subassembly then is convenient for change new liquid.
Drawings
Fig. 1 is a schematic diagram of an external structure of an electroplating device for processing a PCB according to an embodiment of the present application;
fig. 2 is a schematic rear view of an electroplating device for PCB processing according to an embodiment of the present disclosure;
FIG. 3 is a schematic perspective view of the section A-A of FIG. 2 according to an embodiment of the present application;
FIG. 4 is a schematic perspective view of the section B-B in FIG. 2 according to an embodiment of the present application;
fig. 5 is a schematic cross-sectional structure of an electroplating device for PCB processing according to an embodiment of the present application.
In the figure: 1. a treatment box; 2. a partition plate; 3. an alkali liquor cleaning cavity; 4. an acid liquid activation cavity; 5. a plating solution chamber; 6. an inlet; 7. a cover plate; 8. a first chute; 9. a fixed slide block; 10. a liquid inlet pipe; 11. a chock; 12. grabbing the block; 13. a liquid outlet pipe; 14. a small suction pump; 15. a control knob; 16. a first telescopic rod; 17. a support plate; 18. a second telescopic rod; 19. a fixing plate; 20. a fixed clamping plate; 21. a second chute; 22. a sliding block; 23. sliding clamping plate.
Detailed Description
The utility model will be described in further detail with reference to the drawings and the detailed description. The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.
Examples
Referring to fig. 1-5, in this embodiment, an electroplating device for PCB board processing is provided, including a processing box 1, the interior of the processing box 1 is divided into three cavities by a partition board 2, the cavities include an alkali liquor cleaning cavity 3, an acid liquor activating cavity 4 and an electroplating liquid cavity 5, the top of the processing box 1 is located above each cavity, an inlet 6 is provided on the surface of the inlet 6, a cover plate 7 which is opened by thrust overturning is provided on the surface of the inlet 6, a first chute 8 is symmetrically provided on two sides of the inlet 6, a plurality of groups of fixed sliding blocks 9 are provided on the first chute 8, a PCB board fixing component is provided on the fixed sliding blocks 9, a liquid inlet component is provided on the front end face of the processing box 1, and a liquid outlet component is provided on the rear end face of the processing box 1.
The feed liquor subassembly is including running through the inside feed liquor pipe 10 of handling case 1, and feed liquor mouth department of feed liquor pipe 10 is equipped with chock 11, and the top of chock 11 is equipped with the piece 12 of snatching of being convenient for take off, and chock 11 can prevent outside dust entering when need not to supply the change with liquid, snatchs the piece 12 then be convenient for take off chock 11 fast, take off chock 11 when needs the inwards liquid feeding can.
The feed liquor subassembly is equipped with small-size suction pump 14 including penetrating into the drain pipe 13 of handling case 1 in the feed liquor end department of drain pipe 13, is equipped with control knob 15 on the outside pipe shaft of drain pipe 13 in handling case 1, and control knob 15 steerable drain pipe 13 outflow size, when needing to discharge and retrieve the waste liquid, open small-size suction pump 14, control knob 15 will outflow to the biggest can, and it is zero to adjust the outflow through control knob 15 when retrieving.
The PCB board fixing assembly includes a first telescopic rod 16 established on the fixing slider 9.
The first telescopic rod 16 is provided with a supporting plate 17, the supporting plate 17 is provided with a second telescopic rod 18, and the end part of the second telescopic rod 18 is fixedly provided with a fixing plate 19.
The bottom surface of fixed plate 19 is equipped with fixed splint 20, and fixed plate 19 is located the place ahead of fixed splint 20 and is equipped with second spout 21, is equipped with slider 22 on the second spout 21, fixedly connected with slip splint 23 on the slider 22, and slider 22 drives the motion of slip splint 23 and can fix the PCB board of equidimension not.
The maximum clamping size of the fixed clamping plate 20 and the sliding clamping plate 23 is the size of the inlet 6.
The working principle of the utility model is as follows:
when the PCB needs to be processed, the sliding block 22 on the second sliding groove 21 slides to a position far away from the fixed clamping plate 20, the PCB is tightly attached to the fixed clamping plate 20, the sliding block 22 drives the sliding clamping plate 23 to clamp the PCB, the first telescopic rod 16 is contracted to the minimum length, the second telescopic rod 18 starts to stretch, the PCB pushes the cover plate 7 to overturn to expose the inlet 6, the second telescopic rod 18 continues to stretch until the second telescopic rod stretches until the fixed plate 19 is tightly attached to the top surface of the processing box 1, the PCB can be completely soaked in processing liquid, then the fixed sliding block 9 sequentially enters the acid liquid activating cavity 4 and the electroplating liquid cavity 5 through the first sliding groove 8, and the sliding clamping plate 23 can be slid for downloading after the complete processing is finished.
It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present utility model without the inventive step, are intended to be within the scope of the present utility model. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (7)
1. Electroplating device is used in PCB board processing, including processing case (1), its characterized in that: the utility model discloses a treatment box, including processing case (1), baffle (2) are divided into three cavitys inside, the cavity includes alkali lye cleaning chamber (3), acidizing fluid activation chamber (4) and plating solution chamber (5), the top of processing case (1) is located each cavity top and all is equipped with import (6), the surface of import (6) is equipped with apron (7) that receive thrust upset to open, the bilateral symmetry of import (6) is equipped with first spout (8), be equipped with multiunit fixed slider (9) on first spout (8), be equipped with PCB board fixed subassembly on fixed slider (9), the preceding terminal surface of processing case (1) is equipped with the feed liquor subassembly, the rear end face of processing case (1) is equipped with out liquid subassembly.
2. The electroplating device for processing a PCB board according to claim 1, wherein: the liquid inlet assembly comprises a liquid inlet pipe (10) penetrating into the treatment box (1), a chock block (11) is arranged at a liquid inlet of the liquid inlet pipe (10), and a grabbing block (12) convenient to take down is arranged at the top of the chock block (11).
3. The electroplating device for processing a PCB board according to claim 1, wherein: the liquid inlet assembly comprises a liquid outlet pipe (13) penetrating into the treatment box (1), a small suction pump (14) is arranged at the liquid inlet end of the liquid outlet pipe (13), and a control knob (15) is arranged on a pipe body of the liquid outlet pipe (13) outside the treatment box (1).
4. The electroplating device for processing a PCB board according to claim 1, wherein: the PCB fixing assembly comprises a first telescopic rod (16) arranged on the fixing sliding block (9).
5. The electroplating device for processing a PCB board of claim 4, wherein: the telescopic device is characterized in that a supporting plate (17) is arranged on the first telescopic rod (16), a second telescopic rod (18) is arranged on the supporting plate (17), and a fixing plate (19) is fixedly arranged at the end part of the second telescopic rod (18).
6. The electroplating device for processing a PCB according to claim 5, wherein: the bottom surface of fixed plate (19) is equipped with fixed splint (20), fixed plate (19) are located the place ahead of fixed splint (20) and are equipped with second spout (21), be equipped with sliding block (22) on second spout (21), fixedly connected with slip splint (23) on sliding block (22).
7. The electroplating device for processing a PCB panel of claim 6, wherein: the maximum clamping size of the fixed clamping plate (20) and the sliding clamping plate (23) is the size of the inlet (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321948070.0U CN220202073U (en) | 2023-07-21 | 2023-07-21 | Electroplating device for PCB processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321948070.0U CN220202073U (en) | 2023-07-21 | 2023-07-21 | Electroplating device for PCB processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220202073U true CN220202073U (en) | 2023-12-19 |
Family
ID=89142211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321948070.0U Active CN220202073U (en) | 2023-07-21 | 2023-07-21 | Electroplating device for PCB processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220202073U (en) |
-
2023
- 2023-07-21 CN CN202321948070.0U patent/CN220202073U/en active Active
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