CN220198473U - Improve radiating mould - Google Patents

Improve radiating mould Download PDF

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Publication number
CN220198473U
CN220198473U CN202321958137.9U CN202321958137U CN220198473U CN 220198473 U CN220198473 U CN 220198473U CN 202321958137 U CN202321958137 U CN 202321958137U CN 220198473 U CN220198473 U CN 220198473U
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China
Prior art keywords
insert
beryllium copper
water
die
embedded
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CN202321958137.9U
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Chinese (zh)
Inventor
卓秋平
黄海深
魏剑
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Jiale Electronic Technology Guangdong Co ltd
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Jiale Electronic Technology Guangdong Co ltd
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Priority to CN202321958137.9U priority Critical patent/CN220198473U/en
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Abstract

The utility model relates to the technical field of dies, in particular to a die for improving heat dissipation, which comprises a front die, a rear die and an embedded insert, wherein the front die and the rear die are oppositely arranged, the embedded insert is arranged in the rear die, the die also comprises a beryllium copper insert, a mounting groove is formed in the embedded insert and penetrates through the bottom of the embedded insert, the beryllium copper insert is arranged in the mounting groove, a water channel is formed in the beryllium copper insert, and a water blocking sheet is fixedly connected in the middle of the water channel. The beryllium copper insert is additionally arranged at the bottom of the embedded insert, and the cooling water is transported through the waterway in the beryllium copper insert, so that the heat energy in the area is taken away by utilizing the characteristic of efficient heat dissipation of the beryllium copper, the problem of uneven cooling of a die is improved, the production efficiency is improved, the production rate of defective products is reduced, and the water-separating sheets in the waterway of the beryllium copper insert separate the water inlet direction and the water outlet direction of the waterway, so that a water-transporting loop achieves the effect of cooling, and the heat dissipation effect and the stability of the beryllium copper insert are improved.

Description

Improve radiating mould
Technical Field
The utility model relates to the technical field of dies, in particular to a die capable of improving heat dissipation.
Background
The mould is a mechanical processing device with the name of 'industrial mother', and mainly adopts the methods of injection moulding, blow moulding, extrusion, die casting or forging, smelting, stamping and the like to obtain various moulds and tools of the required products. At present, in the mould production process, because the temperature of the formed workpiece and the mould is high, the formed workpiece and the mould are naturally cooled and then taken out of the mould, but the natural cooling mode can only adapt to small-scale production, and for mass production, the production requirement of the mould can be improved only by improving the heat dissipation speed of the mould, so that two technical categories of air cooling and liquid cooling are gradually developed under the technical purview of related technological staff.
Many small inserts of back mould in current mould can't walk to carry water, lead to the radiating efficiency of back mould lower, appear the uneven problem of mould cooling easily in the injection molding process, influence the production efficiency of product, and make the defective products rate rise.
In order to solve the above problems, a mold for improving heat dissipation is now designed.
Disclosure of Invention
The utility model aims to provide a die for improving heat dissipation so as to solve the problems.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an improve radiating mould, includes front mould, back mould and embedding mold insert, front mould and back mould set up in opposite directions, the embedding mold insert is arranged in the back mould, still including beryllium copper mold insert, set up the mounting groove on the embedding mold insert, the mounting groove runs through the bottom of embedding mold insert, beryllium copper mold insert is installed in the mounting groove, the water route has been seted up in the beryllium copper mold insert, the middle fixedly connected with water proof piece in water route.
Optionally, at least two positioning pins are arranged on the beryllium copper insert, positioning grooves corresponding to the positioning pins in position are formed in the mounting grooves, and the positioning grooves are fixedly connected with the positioning pins.
Optionally, a water pipe for conveying cooling water into the waterway is arranged on the outer side of the rear die, and a sealing waterproof ring is arranged at the position where the waterway is arranged on the beryllium copper insert.
Optionally, the embedded insert is provided with a plurality of guide holes, the guide holes penetrate through two ends of the embedded insert, and the guide holes are internally provided with ejector pins for ejecting products.
Optionally, the top of the beryllium copper insert is provided with a bearing surface, and the bearing surface is abutted with the end parts of the plurality of ejector pins.
Optionally, a plurality of mounting holes corresponding to positions are formed between the beryllium copper insert and the bottom of the embedded insert.
Compared with the prior art, the utility model has the following beneficial effects: according to the utility model, the beryllium copper insert is additionally arranged at the bottom of the embedded insert, and then the cooling water is conveyed through the waterway in the beryllium copper insert, so that the heat energy in the area is taken away by utilizing the characteristic of efficient heat dissipation of the beryllium copper, the problem of uneven cooling of a die is solved, the production efficiency is improved, the production rate of defective products is reduced, and the water-separating sheets in the waterway of the beryllium copper insert separate the water inlet direction and the water outlet direction of the waterway, so that a water conveying loop is formed to achieve the effect of cooling, and the heat dissipation effect and the stability of the beryllium copper insert are improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a schematic view of the structure of the present utility model at another angle;
FIG. 3 is a schematic view of the insert of the present utility model;
fig. 4 is a schematic structural view of the water barrier sheet of the present utility model.
In the figure: 1. a rear mold; 2. embedding an insert; 3. beryllium copper insert; 4. a waterway; 5. a water barrier sheet; 6. a positioning pin; 7. sealing the waterproof ring; 8. and (5) a thimble.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 4, the embodiment of the utility model provides a mold for improving heat dissipation, which comprises a front mold, a rear mold 1 and an embedded insert 2, wherein the front mold and the rear mold 1 are arranged in opposite directions, the embedded insert 2 is arranged in the rear mold 1, the mold further comprises a beryllium copper insert 3, a mounting groove is formed in the embedded insert 2, the mounting groove penetrates through the bottom of the embedded insert 2, the beryllium copper insert 3 is arranged in the mounting groove, a waterway 4 is formed in the beryllium copper insert 3, and a water-proof sheet 5 is fixedly connected in the middle of the waterway 4.
Specifically, through adding the beryllium copper mold insert 3 in the bottom of embedding mold insert 2, the water route 4 in the rethread beryllium copper mold insert 3 walks the cooling water, utilize the high-efficient radiating characteristic of beryllium copper, take away this regional heat energy, improve the uneven problem of mould cooling, improve production efficiency, reduce the rate of production of defective products, and the water proof piece 5 in the beryllium copper mold insert 3 water route 4 separates the inflow direction and the play water direction of water route 4, make the water circuit and reach refrigerated effect, be favorable to utilizing and improve beryllium copper mold insert 3 radiating effect and stability.
Furthermore, at least two positioning pins 6 are arranged on the beryllium copper insert 3, positioning grooves corresponding to the positioning pins 6 are formed in the mounting grooves, and the positioning grooves are fixedly connected with the positioning pins 6.
Specifically, when the beryllium copper insert 3 is installed, the beryllium copper insert 3 is fixedly connected in the installation groove through the connection of the locating pin 6 and the locating groove, the connection of the beryllium copper insert 3 and the embedded insert 2 can be completed, and when the beryllium copper insert is disassembled, the separation of the beryllium copper insert 3 and the embedded insert 2 can be completed by removing the locating pin 6, so that the radiating effect of the embedded insert 2 is improved, the installation difficulty of the beryllium copper insert 3 is reduced, the use by a user is facilitated, and the use cost is reduced.
Further, a water pipe for conveying cooling water into the water channel 4 is arranged on the outer side of the rear mold 1, and a sealing waterproof ring 7 is arranged at the position where the water channel 4 is arranged on the beryllium copper insert 3.
Specifically, when the raceway carries cooling water to water route 4, the cooling water is in water route 4 interior flow band heat removal, reaches radiating purpose, through the cooperation with sealed waterproof circle 7 use, improved the leakproofness of being connected between water route 4 and the external structure, reduce the equipment loss problem that the cooling water leakage brought.
Further, in order to improve the coordination and stability between the structures and facilitate the demolding of the product, a plurality of guide holes are formed in the embedded insert 2, a plurality of guide holes penetrate through two ends of the embedded insert 2, and a plurality of ejector pins 8 for ejecting the product are arranged in the guide holes in a penetrating manner.
Further, the top of the beryllium copper insert 3 is provided with a bearing surface, the bearing surface is abutted with the end parts of the plurality of ejector pins 8, and the ejector pins 8 are fixed on the embedded insert 2 through the abutting of the bearing surface and the end parts of the ejector pins 8.
Further, in order to facilitate the installation of the beryllium copper insert 3 and the embedded insert 2, a plurality of installation holes corresponding to positions are formed between the beryllium copper insert 3 and the bottom of the embedded insert 2.
The working principle of the utility model is as follows: through adding beryllium copper mold insert 3 in the bottom of embedding mold insert 2, when the raceway carries the cooling water, walk the cooling water through the water route 4 in beryllium copper mold insert 3, the cooling water is walked the heat in the interior band pass of water route 4, utilize beryllium copper high-efficient radiating characteristic, take away this regional heat energy, improve the uneven problem of mould cooling, improve production efficiency, reduce the rate of production of defective products, and the water proof piece 5 in beryllium copper mold insert 3 water route 4 separates the water inlet direction and the play water direction of water route 4, make the water circuit and reach refrigerated effect, be favorable to utilizing and improve beryllium copper mold insert 3 radiating effect and stability.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides an improve radiating mould, includes front mould, rear mould (1) and embedding mold insert (2), front mould and rear mould (1) set up in opposite directions, embedding mold insert (2) are arranged in rear mould (1), its characterized in that: the novel beryllium copper mold insert is characterized by further comprising a beryllium copper mold insert (3), wherein a mounting groove is formed in the embedded mold insert (2), the mounting groove penetrates through the bottom of the embedded mold insert (2), the beryllium copper mold insert (3) is mounted in the mounting groove, a waterway (4) is formed in the beryllium copper mold insert (3), and a water-proof sheet (5) is fixedly connected in the middle of the waterway (4).
2. A heat dissipation enhancing die as defined in claim 1, wherein: at least two locating pins (6) are arranged on the beryllium copper insert (3), locating grooves corresponding to the locating pins (6) are formed in the mounting grooves, and the locating grooves are fixedly connected with the locating pins (6).
3. A heat dissipation enhancing die as defined in claim 1, wherein: the outer side of the rear die (1) is provided with a water pipe for conveying cooling water into the waterway (4), and a sealing waterproof ring (7) is arranged at the position where the waterway (4) is arranged on the beryllium copper insert (3).
4. A heat dissipation enhancing die as defined in claim 1, wherein: the embedded insert (2) is provided with a plurality of guide holes, the guide holes penetrate through two ends of the embedded insert (2), and ejector pins (8) for ejecting products are arranged in the guide holes in a penetrating mode.
5. The heat dissipation enhancing mold of claim 4, wherein: the top of the beryllium copper insert (3) is provided with a bearing surface, and the bearing surface is abutted with the end parts of the plurality of ejector pins (8).
6. A heat dissipation enhancing die as defined in claim 1, wherein: and a plurality of mounting holes corresponding to positions are formed between the beryllium copper insert (3) and the bottom of the embedded insert (2).
CN202321958137.9U 2023-07-25 2023-07-25 Improve radiating mould Active CN220198473U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321958137.9U CN220198473U (en) 2023-07-25 2023-07-25 Improve radiating mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321958137.9U CN220198473U (en) 2023-07-25 2023-07-25 Improve radiating mould

Publications (1)

Publication Number Publication Date
CN220198473U true CN220198473U (en) 2023-12-19

Family

ID=89138325

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321958137.9U Active CN220198473U (en) 2023-07-25 2023-07-25 Improve radiating mould

Country Status (1)

Country Link
CN (1) CN220198473U (en)

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