CN220197403U - Semiconductor die detection jig - Google Patents

Semiconductor die detection jig Download PDF

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Publication number
CN220197403U
CN220197403U CN202321111900.4U CN202321111900U CN220197403U CN 220197403 U CN220197403 U CN 220197403U CN 202321111900 U CN202321111900 U CN 202321111900U CN 220197403 U CN220197403 U CN 220197403U
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CN
China
Prior art keywords
wall
clamping
main body
jig
semiconductor die
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Active
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CN202321111900.4U
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Chinese (zh)
Inventor
顾健
顾剑辉
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Suzhou Shuangyuan Electronic Technology Co ltd
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Suzhou Shuangyuan Electronic Technology Co ltd
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Abstract

The utility model discloses a semiconductor die detection jig which comprises a jig main body, wherein a clamping mechanism convenient to adjust comprises a movable base which is arranged in two first sliding grooves in a sliding manner, adjusting grooves are formed in the top ends of the two movable bases, clamping grooves are formed in two sides of the inner walls of the two adjusting grooves, second sliding grooves are formed in the bottoms of the inner walls of the two adjusting grooves, buckles are arranged on the inner walls of the two second sliding grooves in a sliding manner, and an electric telescopic rod is arranged on one side of the inner walls of the two second sliding grooves in a clamping manner. According to the clamping structure, the screw rod, the belt pulley and the belt strips are matched, the motor is started to enable the screw rod to rotate so as to move the clamping structure in the first sliding groove, then the clamping plate is abutted with the connecting plate at one end of the clamping plate through the buckle in the second sliding groove, the electric telescopic rod is started to enable the clamping plate to be pushed by the buckle so as to achieve mutual approaching and clamping, and the whole clamping structure is convenient to adjust in position and clamping strength, so that the convenience of using the device is improved.

Description

Semiconductor die detection jig
Technical Field
The utility model relates to the technical field of detection jigs, in particular to a semiconductor die detection jig.
Background
The utility model discloses a detection tool of semiconductor die part is proposed to chinese patent number CN215767005U, can fix a position when detecting through detecting the locating component to die part, stability of placing when making die part detect is high, improve die part and detect quality and efficiency, and a whole simple structure, and convenient to use, the detection of die part fix a position effectually, have higher practicality, can assist the die part location through locating baffle and location clamp plate, make whole location more stable, but current tool equipment is when the centre gripping semiconductor workpiece, the regulation of its upper end is nimble inadequately, makes the accuracy location not be done to its docking equipment during machine processing, thereby the convenience of reducing device use.
Disclosure of Invention
In order to solve the above-mentioned problems, an object of the present utility model is to provide a semiconductor die inspection jig for solving the above-mentioned problems.
In order to achieve the above-mentioned purpose, the utility model provides a semiconductor die detection jig, which comprises a jig main body, wherein clamping mechanisms convenient to adjust are arranged at two ends of the jig main body, first sliding grooves are formed in two sides of the top end of the jig main body and mainly act on moving supports of the clamping mechanisms, the clamping mechanisms convenient to adjust comprise moving bases which are slidably arranged in the two first sliding grooves, adjusting grooves are formed in the top ends of the two moving bases, clamping grooves are formed in two sides of the inner walls of the adjusting grooves, second sliding grooves are formed in the bottoms of the inner walls of the two adjusting grooves, buckles are slidably arranged on the inner walls of the two second sliding grooves, electric telescopic rods are respectively clamped on one sides of the inner walls of the two second sliding grooves, and the output ends of the two electric telescopic rods are fixedly connected with one sides of the two buckles respectively.
In one example, screw holes are formed in one side of the outer walls of the two movable bases, screw rods are rotatably arranged on the inner walls of the two first sliding grooves, and the outer walls of the two screw rods are in threaded connection with the inner walls of the two screw holes respectively.
In one example, two ends of one side of the outer wall of the jig main body are respectively provided with a belt pulley in a rotating mode, one ends of the two screw rods are respectively fixedly connected with one sides of the two belt pulleys, and a belt strip is arranged between the two belt pulleys in a transmission mode.
In an example, the motor is fixedly arranged at one end of the other side of the outer wall of the jig main body, the other end of one screw rod is fixedly connected with the output end of the motor, and the butt-joint screws are fixedly arranged at four corners of the bottom of the jig main body.
In one example, two the inner wall of adjustment tank all slides and is equipped with the connecting plate, and the outer wall at two connecting plate both ends is connected with the inner wall block of four draw-in grooves respectively, two the draw-in hole has all been seted up to the bottom of connecting plate, and the outer wall of two buckles is connected with the inner wall block of two draw-in holes respectively, two the one end of connecting plate is all fixed and is equipped with splint.
In an example, the fixed switch panel that is equipped with in one side of tool main part outer wall, electric telescopic handle switch and motor switch have been seted up respectively to one side of switch panel, and electric telescopic handle all passes through electric telescopic handle switch and motor and external power supply electric connection through motor switch.
The semiconductor die detection jig provided by the utility model has the following beneficial effects:
this semiconductor die detects tool, through being provided with the clamping structure of being convenient for that comprises removal base, adjustment tank, draw-in groove, second spout, buckle and electric telescopic handle, during the use, cooperation lead screw, belt pulley and belt strip's use, starter motor makes the lead screw rotatory and then removes this clamping structure in first spout, then through the buckle in the second spout and the connecting plate butt joint of splint one end, starts electric telescopic handle and makes splint by the buckle promotion and then realize being close to each other and centre gripping, and whole clamping structure conveniently adjusts position and clamping strength, thereby improve the convenience that the device used.
This semiconductor die detects tool through being provided with the mounting type clamping structure of constituteing by connecting plate, draw-in hole and splint etc. at the centre gripping in-process, carries out the butt joint with the buckle that has the splint of connecting plate through the draw-in hole of its upper end and remove the base upper end, also conveniently dismantle it when later maintenance simultaneously and maintain or change convenient structure's installation to reduce staff's operation burden, thereby improve the practicality of device.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a movable base and a clip with adjustable clamping structure according to the present utility model;
fig. 3 is a schematic view of the structure of the clamping plate and the movable clamping of the connecting plate.
In the figure: 1. a jig main body; 2. a first chute; 3. a movable base; 4. an adjustment tank; 5. a clamping groove; 6. a second chute; 7. a buckle; 8. an electric telescopic rod; 9. a screw hole; 10. a screw rod; 11. a belt pulley; 12. pi Daitiao; 13. a motor; 14. docking the screw; 15. a connecting plate; 16. a clamping hole; 17. and (3) clamping plates.
Detailed Description
In order to more clearly illustrate the general inventive concept, a detailed description is given below by way of example with reference to the accompanying drawings.
In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. In the description of the present specification, the description with reference to the terms "one aspect," "some aspects," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the aspect or example is included in at least one aspect or example of the present utility model. In this specification, the schematic representations of the above terms are not necessarily for the same scheme or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more aspects or examples.
The first embodiment of the utility model provides a semiconductor die detection jig as shown in fig. 1-3, which comprises a jig main body 1, screw holes 9 are formed in one side of the outer walls of two movable bases 3, screw rods 10 are respectively and rotatably arranged on the inner walls of two first sliding grooves 2, the outer walls of the two screw rods 10 are respectively and rotatably connected with the inner walls of the two screw holes 9, belt pulleys 11 are respectively and rotatably arranged at two ends of one side of the outer wall of the jig main body 1, one end of each screw rod 10 is respectively and fixedly connected with one side of each belt pulley 11, a belt strip 12 is arranged between the two belt pulleys 11 in a transmission manner, a motor 13 is fixedly arranged at one end of the other side of the outer wall of the jig main body 1, the other end of each screw rod 10 is fixedly connected with the output end of the motor 13, butt joint screws 14 are respectively and fixedly arranged at four corners of the bottom of the jig main body 1, a switch panel is respectively arranged on one side of the outer wall of the jig main body 1, an electric telescopic rod switch and the electric telescopic rod 8 is respectively and electrically connected with an external power supply through the electric telescopic rod switch and the motor 13;
the second embodiment of the utility model provides a semiconductor die detection jig as shown in fig. 2, wherein two ends of a jig main body 1 are respectively provided with a clamping mechanism convenient to adjust, two sides of the top end of the jig main body 1 are respectively provided with a first chute 2 which mainly acts on the movable support of the clamping mechanism, the clamping mechanism convenient to adjust comprises a movable base 3 which is slidably arranged in two first chutes 2, the top ends of the two movable bases 3 are respectively provided with an adjusting groove 4, two sides of the inner walls of the two adjusting grooves 4 are respectively provided with a clamping groove 5, the bottoms of the inner walls of the two adjusting grooves 4 are respectively provided with a second chute 6, the inner walls of the two second chutes 6 are respectively slidably provided with a buckle 7, one side of the inner walls of the two second chutes 6 is respectively provided with an electric telescopic rod 8 in a clamping way, and the output ends of the two electric telescopic rods 8 are respectively fixedly connected with one sides of the two buckles 7;
in a third embodiment, the present utility model provides a semiconductor die inspection jig as shown in fig. 3: the inner wall of two adjustment tank 4 all slides and is equipped with connecting plate 15, and the outer wall at two connecting plate 15 both ends is connected with the inner wall block of four draw-in grooves 5 respectively, and draw-in hole 16 has all been seted up to the bottom of two connecting plates 15, and the outer wall of two buckles 7 is connected with the inner wall block of two draw-in holes 16 respectively, and the one end of two connecting plates 15 is all fixed and is equipped with splint 17.
Working principle: when using the semiconductor die detection tool in this design, at first, need install the fixture of device upper end in the both sides of tool main part 1 through first spout 2, make the device can be normal use, and through being provided with the clamping structure of the convenient to adjust of compriseing moving base 3 in this design, adjusting bath 4, draw-in groove 5, second spout 6, buckle 7 and electric telescopic handle 8 etc. during the use, cooperation lead screw 10, belt pulley 11 and belt strip 12's use, starter motor 13 makes lead screw 10 rotatory and then remove this clamping structure in first spout 2, then buckle 7 and the connecting plate 15 butt joint of splint 17 one end through in the second spout 6, then start electric telescopic handle 8 makes splint 17 promoted and then realize being close to each other and centre gripping, and whole clamping structure conveniently adjusts position and clamping strength, thereby improve the convenience that the device used, and be provided with the installation type clamping structure of compriseing connecting plate 15, draw-in hole 16 and splint 17 etc. on this device, in the centre gripping in-process, with the clamping structure that has the connecting plate 15 carries out the end of clamp 17 through its end through buckle 7 and the connecting plate 15's of clamp 7, thereby can be convenient to detach the device and detach with the maintenance of the machine when the device is convenient to use at the end of the butt joint device through its end is also realized at the end of clamp 7 in the second spout 6, the butt joint device is convenient to be used to be convenient to detach and install the end at the end and the end of the end to be convenient to use.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.
The foregoing is merely exemplary of the present utility model and is not intended to limit the present utility model. Various modifications and variations of the present utility model will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are to be included in the scope of the claims of the present utility model.

Claims (6)

1. A semiconductor die inspection jig comprising:
the jig comprises a jig main body (1), wherein clamping mechanisms convenient to adjust are arranged at two ends of the jig main body (1), and first sliding grooves (2) which mainly act on moving supports of the clamping mechanisms are formed in two sides of the top end of the jig main body (1);
the method is characterized in that: the fixture of convenient regulation is including sliding mobile base (3) of setting in two first spouts (2), two adjustment tank (4) have all been seted up on the top of mobile base (3), two draw-in groove (5) have all been seted up to the both sides of adjustment tank (4) inner wall, two second spout (6) have all been seted up to the bottom of adjustment tank (4) inner wall, two the inner wall of second spout (6) is all slided and is equipped with buckle (7), two the equal block in one side of second spout (6) inner wall is equipped with electric telescopic handle (8), and the output of two electric telescopic handle (8) respectively with one side fixed connection of two buckles (7).
2. The semiconductor die inspection jig according to claim 1, wherein: screw holes (9) are formed in one side of the outer walls of the two movable bases (3), screw rods (10) are rotatably arranged on the inner walls of the two first sliding grooves (2), and the outer walls of the two screw rods (10) are respectively in threaded connection with the inner walls of the two screw holes (9).
3. The semiconductor die inspection jig according to claim 2, wherein: the jig is characterized in that belt pulleys (11) are rotatably arranged at two ends of one side of the outer wall of the jig main body (1), one ends of two screw rods (10) are fixedly connected with one sides of the two belt pulleys (11) respectively, and a belt strip (12) is arranged between the two belt pulleys (11) in a transmission mode.
4. A semiconductor die inspection jig according to claim 3, wherein: one end of the other side of the outer wall of the jig main body (1) is fixedly provided with a motor (13), the other end of one screw rod (10) is fixedly connected with the output end of the motor (13), and four corners of the bottom of the jig main body (1) are fixedly provided with butt screws (14).
5. The semiconductor die inspection jig according to claim 1, wherein: two the inner wall of adjustment tank (4) all slides and is equipped with connecting plate (15), and the outer wall at two connecting plate (15) both ends is connected with the inner wall block of four draw-in grooves (5) respectively, and two draw-in holes (16) have all been seted up to the bottom of connecting plate (15), and the outer wall of two buckles (7) is connected with the inner wall block of two draw-in holes (16) respectively, two the one end of connecting plate (15) is all fixed and is equipped with splint (17).
6. The semiconductor die inspection jig according to claim 4, wherein: the jig is characterized in that a switch panel is fixedly arranged on one side of the outer wall of the jig main body (1), an electric telescopic rod switch and a motor switch are respectively arranged on one side of the switch panel, and the electric telescopic rod (8) is electrically connected with an external power supply through the electric telescopic rod switch and the motor (13) through the motor switch.
CN202321111900.4U 2023-05-10 2023-05-10 Semiconductor die detection jig Active CN220197403U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321111900.4U CN220197403U (en) 2023-05-10 2023-05-10 Semiconductor die detection jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321111900.4U CN220197403U (en) 2023-05-10 2023-05-10 Semiconductor die detection jig

Publications (1)

Publication Number Publication Date
CN220197403U true CN220197403U (en) 2023-12-19

Family

ID=89138192

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321111900.4U Active CN220197403U (en) 2023-05-10 2023-05-10 Semiconductor die detection jig

Country Status (1)

Country Link
CN (1) CN220197403U (en)

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