CN220190120U

CN220190120U - Laser sintering tool

Info

Publication number: CN220190120U
Application number: CN202321784788.0U
Authority: CN
Inventors: 邹支农
Original assignee: Suzhou Tfc Optical Communication Co ltd
Current assignee: Suzhou Tfc Optical Communication Co ltd
Priority date: 2023-07-07
Filing date: 2023-07-07
Publication date: 2023-12-15
Anticipated expiration: 2033-07-07

Abstract

The utility model discloses a laser sintering tool, which comprises: a base; the positioning plate comprises a mounting part, a positioning part and a connecting part for connecting the mounting part and the positioning part, which are arranged on the base, wherein the mounting part, the connecting part and the positioning part are surrounded into a positioning groove which is arranged downwards, and a plurality of positioning bulges are arranged on the positioning part; the base plate comprises a base plate, a first side plate, a second side plate and a positioning column, wherein the first side plate and the second side plate are arranged on two sides of the base plate, the positioning column is arranged between the first side plate and the second side plate, the positioning column is arranged in the positioning groove and is propped against the mounting part, the first side plate and/or the second side plate is propped against the side part of the positioning part, the bottom of the positioning part is propped against the base plate, a plurality of lasers are arranged on the base plate, and the lasers are propped against the positioning part and the positioning bulge respectively; the adjusting device is fixedly arranged on the base; and the plurality of groups of probes are fixedly arranged on the adjusting device, and each group of probes can be adjusted to be propped against the corresponding laser through the adjusting device. The utility model is convenient for positioning and pressing the substrate and the laser, and has better mounting precision.

Description

Laser sintering tool

Technical Field

The utility model belongs to the technical field of tools, and particularly relates to a laser sintering tool.

Background

In the production process of laser semiconductor products, the laser needs to be mounted and welded on the substrate, and the mounting and welding precision needs to be smaller than 30 μm, so that the substrate and the laser need to be positioned. Most of the existing tools commonly used in the market are realized by limiting edges on a substrate, or the positioning of the substrate and the lasers is realized by different positioning structures respectively to ensure the mounting precision, because the distance between each two lasers is only 0.5mm, the operation space is narrow, the operation is relatively unchanged, and because a plurality of positioning structures are arranged, tolerance accumulation is necessarily generated, so that the mounting precision cannot reach the mounting precision of 30 mu m.

Therefore, in view of the above technical problems, it is necessary to provide a laser sintering tool.

Disclosure of Invention

In view of the above, the present utility model is directed to a laser sintering tool.

In order to achieve the above object, an embodiment of the present utility model provides the following technical solution:

a laser sintering tool, the laser sintering tool comprising:

a base;

the positioning plate comprises a mounting part, a positioning part and a connecting part, wherein the mounting part and the positioning part are arranged on the base, the connecting part and the positioning part are enclosed to form a positioning groove which is downwards opened, and a plurality of positioning bulges are arranged on the positioning part;

the base plate comprises a base plate, a first side plate, a second side plate and a positioning column, wherein the first side plate and the second side plate are arranged on two sides of the base plate, the positioning column is arranged between the first side plate and the second side plate, the positioning column is arranged in the positioning groove and props against the mounting part, the first side plate and/or the second side plate props against the side part of the positioning part, the bottom of the positioning part props against the base plate, a plurality of lasers are arranged on the base plate, and the lasers respectively prop against the positioning part and the positioning bulge;

the adjusting device is fixedly arranged on the base;

and the plurality of groups of probes are fixedly arranged on the adjusting device, and each group of probes can be adjusted to be propped against the corresponding laser through the adjusting device.

In an embodiment, the base is provided with a limiting groove, the mounting part is mounted in the limiting groove, and two sides of the mounting part are respectively propped against the side wall of the limiting groove.

In an embodiment, the laser sintering tool comprises a first adjusting piece, the first adjusting piece comprises a head and a rod, the rod penetrates through the mounting portion and is in threaded connection with the base, the head abuts against the mounting portion, and an elastic piece is arranged between the base and the mounting portion.

In an embodiment, fixed mounting has first spacing post and second spacing post on the base, first spacing post and second spacing post are located the both sides of first regulating part, first spacing post and second spacing post all pass the installation department, be equipped with first elastic component on the first spacing post, the both ends of first elastic component offset with base and locating plate respectively, be equipped with the second elastic component on the second spacing post, the both ends of second elastic component offset with base and installation department respectively.

In one embodiment, the machining precision of the positioning plate is 10-15 μm.

In one embodiment, the probe comprises a cylinder connected with the adjusting device, a ball head propped against the laser, and a cone connecting the cylinder and the ball head.

In one embodiment, the adjusting device comprises: the first end of the first guide column and the first end of the second guide column are fixedly arranged on the base; the two ends of the cross beam are fixedly arranged at the second end of the first guide column and the second end of the second guide column respectively; the two ends of the floating plate are respectively movably arranged on the first guide column and the second guide column, and the floating plate is arranged between the base and the cross beam; the lower end of the second adjusting piece and the lower end of the third adjusting piece are propped against the floating plate; the third elastic piece is sleeved on the first guide column, and two ends of the third elastic piece are propped against the base and the floating plate; and the fourth elastic piece is sleeved on the second guide post, and two ends of the fourth elastic piece are propped against the base and the floating plate.

In one embodiment, the floating plate is provided with a mounting groove, the probe is inserted into the mounting groove, and the probe is provided with an abutting part which abuts against the lower surface of the floating plate.

In an embodiment, the base extends upward to form a first limiting portion and a second limiting portion.

In an embodiment, on a plane perpendicular to the base, the orthographic projection of the positioning plate is located beside the orthographic projections of the cross beam and the floating plate.

The utility model has the following beneficial effects:

the utility model provides a laser sintering tool, which optimizes the mode of positioning and clamping a laser and a substrate by reducing positioning parts for positioning the laser and the substrate, reduces tolerance accumulation and effectively improves the accuracy of mounting and welding;

the laser is pressed by the probe, so that the laser can be flatly attached to the substrate, and the solder is uniform and has no holes; meanwhile, the conventional standard probe is used, so that the cost is low, and the replacement is convenient;

the laser sintering tool can be positioned and adjusted under an electron microscope, so that the mounting precision is ensured, the real-time controllability is realized, and the generation of defective products is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.

FIG. 1 is a schematic view of a first angular perspective structure of a laser sintering tool according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a second perspective view of a laser sintering tool according to an embodiment of the present utility model;

FIG. 3 is a schematic perspective view of a positioning plate and a substrate according to an embodiment of the utility model;

FIG. 4 is a schematic top view of a positioning plate and a substrate according to an embodiment of the utility model;

FIG. 5 is a schematic side view of a positioning plate according to an embodiment of the utility model;

FIG. 6 is a schematic perspective view of a substrate according to an embodiment of the utility model;

FIG. 7 is a schematic top view of a laser sintering tool according to an embodiment of the present utility model;

FIG. 8 is a schematic cross-sectional view of the structure at A-A in FIG. 7;

FIG. 9 is a schematic cross-sectional view of the structure at B-B in FIG. 7;

FIG. 10 is a schematic perspective view of a floating plate according to an embodiment of the present utility model;

FIG. 11 is a schematic diagram showing a perspective structure of a probe according to an embodiment of the utility model.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the embodiments of the present utility model, it should be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate orientations or positional relationships based on those shown in the drawings, or those conventionally put in place when the product of the application is used, or those conventionally understood by those skilled in the art, merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the embodiments of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the description of the embodiments of the present utility model, it should be further noted that, as used herein, the terms "first," "second," and the like do not denote any order or sequence, but rather are merely used to distinguish one element or operation from another.

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

The technical scheme of the utility model will be described below with reference to the accompanying drawings.

Referring to fig. 1 to 6, a laser 4 sintering tool according to an embodiment of the present utility model includes:

a base 1;

the positioning plate 2 comprises an installation part 21, a positioning part 23 and a connecting part 22 for connecting the installation part 21 and the positioning part 23, which are installed on the base 1, wherein the installation part 21, the connecting part 22 and the positioning part 23 are enclosed to form a positioning groove which is opened downwards, and a plurality of positioning bulges 231 are arranged on the positioning part 23;

the substrate 3 comprises a bottom plate 31, a first side plate 32 and a second side plate 33 which are arranged on two sides of the bottom plate 31, and a positioning column 34 which is arranged between the first side plate 32 and the second side plate 33, wherein the positioning column 34 is arranged in a positioning groove and is propped against the mounting part 21, the first side plate 32 and/or the second side plate 33 is propped against the side part of the positioning part 23, the bottom of the positioning part 23 is propped against the bottom plate 31, a plurality of lasers 4 are arranged on the bottom plate 31, and the lasers 4 are propped against the positioning part 23 and the positioning bulge 231 respectively;

the adjusting device 5 is fixedly arranged on the base 1;

and a plurality of groups of probes are fixedly arranged on the adjusting device 5, and each group of probes can be adjusted to be propped against the corresponding laser 4 through the adjusting device 5.

According to the design, the substrate 3 can be positioned in a mode that the positioning column 34 of the substrate stretches into the positioning groove and abuts against the mounting part 21, and meanwhile, the positioning column 34 of the substrate abuts against the side part of the positioning part 23; the laser 4 on the substrate 3 is positioned by propping against the positioning part 23 and the positioning protrusion 231, so that the positioning of the substrate 3 and the laser 4 can be realized under the action of the positioning plate 2, the structure for positioning is simplified, the phenomenon of tolerance accumulation caused by using a plurality of parts is avoided, and the mounting precision of the laser 4 on the substrate 3 can be ensured.

Wherein the machining precision of the positioning plate 2 is 10-15 mu m. The mounting accuracy of the laser 4 to the substrate 3 is required to be less than 30 μm, and the actual mounting accuracy after using the positioning plate 2 is approximately 25 μm and less than 30 μm, so that the mounting accuracy requirement is satisfied.

In one or more embodiments, referring to fig. 2, in order to install the positioning plate 2 at a specified position of the base 1 so as to determine the position of the positioning plate 2, the base 1 in this embodiment is provided with a limiting groove 11, the mounting portion 21 is installed in the limiting groove 11, and two sides of the mounting portion 21 respectively abut against side walls of the limiting groove 11.

In one or more embodiments, referring to fig. 8, in order to implement lifting adjustment of the positioning plate 2, the sintering tool of the laser 4 includes a first adjusting member 7, where the first adjusting member 7 includes a head 71 and a rod 72, the rod 72 penetrates through the mounting portion 21 and is screwed into the base 1, the head 71 abuts against the upper surface of the mounting portion 21, and an elastic member is disposed between the base 1 and the mounting portion 21.

Specifically, the base 1 in this embodiment is provided with a threaded hole 12, the mounting portion 21 is provided with a mounting hole 211 coaxial with the threaded hole 12, and the laser 4 sintering tool further includes a first adjusting member 7, where the first adjusting member 7 penetrates through the mounting hole 211 and is screwed into the threaded hole 12. Since the mounting portion 21 is defined by the limit groove 11, the positioning plate 2 does not rotate about the axis of the first regulating member 7 when the first regulating member 7 is rotated, and thus the height of the positioning plate 2 can be regulated by the rotation of the first regulating member 7.

Preferably, referring to fig. 8, in this embodiment, a first limiting post 131 and a second limiting post 141 are fixedly mounted on the base 1, two sides of a first adjusting member, that is, two sides of a threaded hole 12, of the first limiting post 131 and the second limiting post 141 pass through the mounting portion 21, a first elastic member 132 is disposed on the first limiting post 131, two ends of the first elastic member 132 respectively abut against the base 1 and the positioning plate 2, a second elastic member 142 is disposed on the second limiting post 141, and two ends of the second elastic member 142 respectively abut against the base 1 and the mounting portion 21. It should be explained that the first elastic member 132 may enable the first side of the mounting portion 21 to always have a trend away from the base 1, and the second elastic member 142 may enable the second side of the mounting portion 21 to always have a trend away from the base 1, and the head 71 of the first adjusting member 7 is always abutted against the upper surface of the positioning plate 2, so when the height of the positioning plate 2 is adjusted by the first adjusting member 7, the positioning plate 2 may be maintained in a horizontal state by the first elastic member 132 and the second elastic member 142, and the positioning plate 2 may be restored to an initial height by the first elastic member 132 and the second elastic member 142.

When the substrate 3 needs to be adjusted, the positioning plate 2 is moved upwards through the first adjusting piece 7 to separate the upper surfaces of the positioning portion 23 and the bottom plate 31, an operator can manually adjust the positioning plate to the position that the positioning column 34 abuts against the mounting portion 21 and one side portion of the first side plate 32 abuts against one side portion of the positioning portion 23 so as to finish positioning the substrate 3, and after the substrate 3 is positioned to a determined position, the positioning plate 2 is moved downwards through the first adjusting piece 7 again so that the upper surfaces of the positioning portion 23 and the bottom plate 31 abut against one another to press the substrate 3, so that the substrate 3 is prevented from moving. At this time, the substrate 3 is positioned by the positioning plate 2 and is fixedly clamped by the positioning plate 2 and the base 1.

Further, referring to fig. 8, in order to install the first elastic member 132 and the second elastic member 142, the base 1 is provided with a first countersink 13 and a second countersink 14, the positioning plate 2 is provided with a third countersink 212 coaxial with the first countersink 13 and a fourth countersink 213 coaxial with the second countersink 14, both ends of the first elastic member 132 are respectively disposed in the first countersink 13 and the third countersink 212, and both ends of the second elastic member 142 are respectively disposed in the second countersink 14 and the fourth countersink 213.

In one or more embodiments, referring to fig. 11, the probe in this embodiment includes a cylinder connected to the adjusting device 5, a ball head abutting against the laser 4, and a cone connecting the cylinder and the ball head. By the design, the scratch of the probe to the laser 4 can be reduced as much as possible while the probe provides ideal thrust to the laser 4.

Preferably, as shown in fig. 2, in order to reliably compress the lasers 4 and prevent the lasers 4 from moving, each group of probes is 4 and respectively abuts against the upper surfaces of the corresponding lasers 4. When the laser 4 sintering tool is placed into a reflow oven for welding, as the solder sheets are arranged between the laser 4 and the bottom plate 31, the solder sheets can be melted in the reflow oven to attach the laser 4 on the bottom plate 31, the laser 4 is tightly pressed by the probe, the solder in a melted state can be evenly distributed in the bottom plate 31 and the laser 4, the solder is uniform and has no holes, and the laser 4 is prevented from being uneven after the attachment is completed.

Furthermore, the probe in the embodiment is of a conventional standard structure, is low in cost and is convenient to replace.

In one or more embodiments, referring to fig. 9, the adjusting device 5 in this embodiment includes: a first guide post 51 and a second guide post 52, the first end of the first guide post 51 and the first end of the second guide post 52 are fixedly mounted on the base 1; the cross beam 53, two ends of the cross beam 53 are fixedly mounted on the second end of the first guide post 51 and the second end of the second guide post 52 respectively; the floating plate 54, two ends of the floating plate 54 are movably mounted on the first guide post 51 and the second guide post 52 respectively, and the floating plate 54 is arranged between the base 1 and the cross beam 53; the second adjusting piece 55 and the third adjusting piece 56 are respectively in threaded connection with two ends of the cross beam 53, and the lower end of the second adjusting piece 55 and the lower end of the third adjusting piece 56 are propped against the floating plate 54; the third elastic piece 57 is sleeved on the first guide post 51, and two ends of the third elastic piece 57 are propped against the base 1 and the floating plate 54; the fourth elastic member 58 is sleeved on the second guide post 52, and two ends of the fourth elastic member 58 are propped against the base 1 and the floating plate 54.

According to the design, the second adjusting piece 55 and the third adjusting piece 56 can be rotated, the second adjusting piece 55 and the third adjusting piece 56 move downwards, the lower ends of the second adjusting piece 55 and the third adjusting piece 56 are propped against the floating plate 54 and drive the floating plate 54 to move downwards, so that the pressing force of the probe on the laser 4 can be controlled carefully, and the probe is pressed with the laser plate. When the floating plate 54 is reset, the floating plate 54 can be reset upwards to the initial position by the combined action of the third elastic piece 57 and the fourth elastic piece 58.

Preferably, in order to install the third elastic member 57 and the fourth elastic member 58, the base 1 in this embodiment is provided with the fifth counterbore 15 and the sixth counterbore 16, the end portion of the third elastic member 57 away from the floating plate 54 is disposed in the fifth counterbore 15, and the end portion of the fourth elastic member 58 away from the floating plate 54 is disposed in the sixth counterbore 16.

In order to fix the probe, referring to fig. 10 and referring to fig. 11, the floating plate 54 in this embodiment is provided with a mounting groove 541, the probe is inserted into the mounting groove 541, the probe is provided with an abutting portion abutting against the lower surface of the floating plate 54, and the abutting portion is provided on the column. The probe is thus prevented from moving upwards when the laser 4 is compressed.

Further, referring to fig. 9, in order to prevent the floating plate 54 from being adjusted to be too downward, the base 1 is extended upward with a first limiting portion 81 and a second limiting portion 82. According to this design, the lower surface of the floating plate 54 can be respectively abutted against the first limit portion 81 and the second limit portion 82 when limiting the downward movement of the floating plate 54.

In one or more embodiments, referring to fig. 7, the orthographic projection of the positioning plate 2 in this embodiment is located beside the orthographic projections of the beam 53 and the floating plate 54 on a plane perpendicular to the base 1. That is, the beam 53 and the floating plate 54 do not cover the side of the positioning plate 2 where the positioning projection 231 is provided in a plan view, and it is possible to determine whether the laser 4 is positioned at a predetermined position by observing whether the laser 4 is in contact with the positioning plate 2 and the positioning projection 231. According to the design, the sintering tool of the laser 4 can be arranged below the electron microscope, the whole process of positioning the laser 4 can be observed through the electron microscope above, and the mounting accuracy of the laser 4 on the substrate 3 is ensured to reach the standard.

Under the condition that the base plate 3 is positioned and clamped to a designated position by the positioning plate 2, the floating plate 54 moves upwards under the action of the third elastic piece 57 and the fourth elastic piece 58 through the upward movement of the second adjusting piece 55 and the third adjusting piece 56, the probe is far away from the upper surface of the laser 4, and the lasers 4 are fluctuated through tweezers, so that the lasers 4 are abutted against the positioning part 23 and the positioning protrusion 231, and the positioning of the lasers 4 is realized; the floating plate 54 is then moved down until the probe compresses the laser 4; then observing whether the laser 4 is completely abutted with the positioning part 23 and the positioning bulge 231 under an electron microscope, and if so, putting the laser 4 sintering tool into a reflow oven; if the contact is not complete, the previous operation is repeated until all the lasers 4 are observed to be in contact with the positioning portions 23 and the positioning projections 231 under the electron microscope.

Preferably, the first elastic member 132 and the second elastic member 142 may be any structure capable of being elastically deformed, such as a spring, an air bag, a spring plate, etc., and providing a force to the positioning plate 2 in a direction away from the base 1; the third elastic member 57 and the fourth elastic member 58 are any structures capable of being elastically deformed by a spring, an air bag, a spring piece, or the like, and providing a force to the floating plate 54 in a direction away from the base 1, as will be understood and accepted by those skilled in the art.

The technical scheme shows that the utility model has the following beneficial effects:

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments in terms of embodiments, not every embodiment is provided with a separate technical solution, and this description is for clarity only, and those skilled in the art should consider the disclosure as a whole, and the technical solutions in the embodiments may be combined appropriately to form other embodiments that can be understood by those skilled in the art.

Claims

1. A laser sintering tool, the laser sintering tool comprising:

a base;

the adjusting device is fixedly arranged on the base;

2. The laser sintering tool according to claim 1, wherein the base is provided with a limiting groove, the mounting portion is mounted in the limiting groove, and two sides of the mounting portion respectively abut against the side wall of the limiting groove.

3. The laser sintering tool according to claim 2, comprising a first adjusting member, the first adjusting member comprising a head portion and a rod portion, the rod portion penetrating the mounting portion and being screwed into the base, the head portion being in abutment with the mounting portion, an elastic member being provided between the base and the mounting portion.

4. The laser sintering tool according to claim 3, wherein a first limit post and a second limit post are fixedly installed on the base, the first limit post and the second limit post are arranged on two sides of the first adjusting piece, the first limit post and the second limit post penetrate through the installation portion, a first elastic piece is arranged on the first limit post, two ends of the first elastic piece are respectively propped against the base and the locating plate, a second elastic piece is arranged on the second limit post, and two ends of the second elastic piece are respectively propped against the base and the installation portion.

5. The laser sintering tool according to claim 1, wherein the machining precision of the positioning plate is 10-15 μm.

6. The laser sintering tool according to claim 1, wherein the adjusting means comprises: the first end of the first guide column and the first end of the second guide column are fixedly arranged on the base; the two ends of the cross beam are fixedly arranged at the second end of the first guide column and the second end of the second guide column respectively; the two ends of the floating plate are respectively movably arranged on the first guide column and the second guide column, and the floating plate is arranged between the base and the cross beam; the lower end of the second adjusting piece and the lower end of the third adjusting piece are propped against the floating plate; the third elastic piece is sleeved on the first guide column, and two ends of the third elastic piece are propped against the base and the floating plate; and the fourth elastic piece is sleeved on the second guide post, and two ends of the fourth elastic piece are propped against the base and the floating plate.

7. The laser sintering tool according to claim 6, wherein the floating plate is provided with a mounting groove, the probe is inserted into the mounting groove, and the probe is provided with an abutting part abutting against the lower surface of the floating plate.

8. The laser sintering tool of claim 6, wherein the base extends upwardly with a first limit and a second limit.

9. The laser sintering tool of claim 6, wherein the orthographic projection of the locating plate is located beside the orthographic projections of the beam and floating plate on a plane perpendicular to the base.

10. The laser sintering tool according to claim 1, wherein the probe comprises a cylinder connected to an adjusting device, a ball head abutting against the laser, and a cone connecting the cylinder and the ball head.