CN220189629U - U-shaped installation radiator for high-voltage diode - Google Patents
U-shaped installation radiator for high-voltage diode Download PDFInfo
- Publication number
- CN220189629U CN220189629U CN202321768637.6U CN202321768637U CN220189629U CN 220189629 U CN220189629 U CN 220189629U CN 202321768637 U CN202321768637 U CN 202321768637U CN 220189629 U CN220189629 U CN 220189629U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- radiating
- extension
- heat
- supporting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009434 installation Methods 0.000 title claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The utility model provides a U-shaped mounting radiator for a high-voltage diode, which comprises two groups of radiating pieces and a high-voltage silicon stack diode, wherein the radiating pieces comprise a radiating supporting part, a heat conducting connecting part, an extending part and a supporting part, the heat conducting connecting part is fixed at the top of the radiating supporting part, pins at two ends of the high-voltage silicon stack diode are respectively connected with the two heat conducting connecting parts, the extending part comprises a radiating extending part I and a radiating extending part II, the radiating extending part I and the radiating extending part II are respectively positioned at two sides of the bottom end of the radiating supporting part, the supporting part comprises a radiating supporting part I and a radiating supporting part II, the bottom end of the radiating extending part I is connected with the radiating supporting part I, and the bottom end of the radiating extending part II is connected with the radiating supporting part II. The beneficial effects are that: through the setting of radiating portion, the effect of radiating portion can give off the heat that high-voltage silicon stack diode produced fast.
Description
Technical Field
The utility model relates to a U-shaped mounting radiator for a high-voltage diode, and belongs to the field of diode heat dissipation.
Background
The high voltage silicon stack is also called a silicon column. It is a silicon high-frequency high-voltage rectifier diode. The operating voltage is between several kilovolts and several tens of thousands of volts. It can have such high withstand voltage because its interior is composed of several silicon high-frequency diodes whose pipe cores are serially connected. The outside is encapsulated with high frequency ceramic.
With the technical development, the equipment power is larger and larger, the working frequency is also gradually increased, and the rated current and the rated voltage of the high-voltage silicon stack are required to be increased by the power increase; the increase in operating frequency requires a short reverse recovery time for the high-voltage silicon stack, which is inversely proportional to the forward voltage of the high-voltage silicon stack.
The high-voltage silicon stack has the advantages of good insulating property and high mechanical strength, and the defects that the high-current silicon stack is difficult to realize and poor in heat dissipation.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model aims to provide a U-shaped mounting radiator of a high-voltage diode. In order to achieve the above object, the present utility model is realized by the following technical scheme: the utility model provides a high-voltage diode U type installation radiator, includes two sets of radiating pieces and high-voltage silicon stack diode, the radiating piece includes heat dissipation supporting part, heat conduction connecting portion, extension and leg portion, heat conduction connecting portion fix the top of heat dissipation supporting part, the both ends pin of high-voltage silicon stack diode respectively with two heat conduction connecting portion are connected, the extension includes heat dissipation extension one and heat dissipation extension two, heat dissipation extension one with heat dissipation extension two are located respectively the bottom both sides of heat dissipation supporting part, the leg portion includes heat dissipation leg portion one and heat dissipation leg portion two, the bottom of heat dissipation extension one is connected with heat dissipation leg portion one, the bottom of heat dissipation extension two is connected with heat dissipation leg portion two.
Further, the heat conduction connecting portion is composed of two inclined plates and an arc-shaped plate, the bottom ends of the two inclined plates are fixed to the top of the heat dissipation supporting portion, and the two inclined plates and the arc-shaped plate form an inverted V-shaped structure.
Further, the radiating support part, the extending part and the supporting leg part form an inverted U-shaped structure, and both sides of the radiating support part, which are far away from the first radiating extending part and the second radiating extending part, are respectively provided with a chamfer structure.
Further, the heat dissipation supporting portion, the heat conduction connecting portion, the first heat dissipation extending portion, the second heat dissipation extending portion, the first heat dissipation supporting portion and the second heat dissipation supporting portion are made of red copper.
Further, the distance between the two pins of the high-voltage silicon stack diode is larger than or equal to 2.7mm, the end parts of the pins are square or arc-shaped, and the included angle between the pins and the horizontal plane is in the range of 0-7 degrees.
The utility model has the beneficial effects that:
through the setting of heat dissipation supporting part, the effect of heat dissipation supporting part can give off the heat that high-voltage silicon stack diode produced fast.
The first radiating leg part and the second radiating leg part can support the radiating piece.
The two heat conduction connecting parts are used for being connected with two pins of the high-voltage silicon stack diode, so that heat generated by the high-voltage silicon stack diode can be quickly conducted out.
Drawings
Other features, objects and advantages of the present utility model will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of the overall structure of a U-shaped high voltage diode mounting heat sink according to the present utility model;
FIG. 2 is a schematic side view of a U-shaped high voltage diode heat sink according to the present utility model;
FIG. 3 is a schematic diagram of a U-shaped radiator with a high voltage diode according to the present utility model;
in the figure: 1. a heat radiation support part; 2. a heat conductive connection portion; 3. a high voltage silicon stack diode; 4. pins; 5. a first heat dissipation extension part; 6. a second heat dissipation extension part; 7. a first heat dissipation branch part; 8. a second heat dissipation branch part; 9. a bevel panel; 10. an arc-shaped plate.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
Referring to fig. 1-3, the present utility model provides a technical solution for a U-shaped mounting radiator of a high voltage diode: the utility model provides a high-voltage diode U type installation radiator, includes two sets of heat dissipation pieces and high-voltage silicon stack diode 3, the heat dissipation piece includes heat dissipation supporting part 1, heat conduction connecting portion 2, extension and a foot, heat conduction connecting portion 2 are fixed the top of heat dissipation supporting part 1, through the setting of heat dissipation supporting part 1, the effect of heat dissipation supporting part 1 can distribute away the heat that high-voltage silicon stack diode 3 produced fast, the both ends pin 4 of high-voltage silicon stack diode 3 are connected with two respectively heat conduction connecting portion 2, and the effect of two heat conduction connecting portions 2 is connected with two pins 4 of high-voltage silicon stack diode 3 to can be quick with the heat conduction that high-voltage silicon stack diode 3 produced come out, the extension includes heat dissipation extension first 5 and heat dissipation extension second 6, both are located respectively the bottom both sides of heat dissipation supporting part 1, the foot portion includes a first foot 7 and a second foot 8, the effect of heat dissipation first foot is connected with a second foot 8 of heat dissipation extending first foot 7 and a second foot 8, a heat dissipation second foot 8 has a heat dissipation effect of heat dissipation connecting portion second foot 8.
Referring to fig. 1-3, the heat conducting connection portion 2 is composed of two inclined panels 9 and an arc 10, the bottom ends of the two inclined panels 9 are fixed at the top of the heat dissipating support portion 1, the two inclined panels 9 and the arc 10 form an inverted V-shaped structure, the heat dissipating support portion 1, the extending portion and the supporting leg portion form an inverted U-shaped structure, and both sides of the heat dissipating support portion 1, which are far away from the first end of the heat dissipating extending portion 5 and one end of the second end of the heat dissipating extending portion 6, are respectively provided with a chamfer structure.
Referring to fig. 1-3, the heat dissipation supporting portion 1, the heat conduction connecting portion 2, the first heat dissipation extending portion 5, the second right heat dissipation extending portion 6, the first heat dissipation supporting portion 7, and the second heat dissipation supporting portion 8 are made of red copper, a distance between the two pins 4 of the high-voltage silicon stack diode 3 is greater than or equal to 2.7mm, an end portion of the pin 4 is one of square or arc, and an included angle between the pin 4 and a horizontal plane ranges from 0 ° to 7 °.
When the high-voltage silicon stack diode is used, heat generated by the high-voltage silicon stack diode 3 is quickly conducted to the heat conduction connecting part 2 through the pin 4, the heat conduction connecting part 2 transmits the heat to the heat dissipation supporting part 1, the heat dissipation supporting part 1 quickly dissipates the heat, and the first heat dissipation supporting part 7 and the second heat dissipation supporting part 8 can support the radiator.
Although the present disclosure describes embodiments, not every embodiment is described in terms of a single embodiment, and such description is for clarity only, and one skilled in the art will recognize that the embodiments described in the disclosure as a whole may be combined appropriately to form other embodiments that will be apparent to those skilled in the art.
Claims (5)
1. A U-shaped installation radiator of a high-voltage diode is characterized in that: including two sets of radiating parts and high-voltage silicon stack diode (3), the radiating parts is including heat dissipation supporting part (1), heat conduction connecting portion (2), extension and branch foot, heat conduction connecting portion (2) are fixed the top of heat dissipation supporting part (1), both ends pin (4) of high-voltage silicon stack diode (3) are connected with two respectively with heat conduction connecting portion (2), the extension includes heat dissipation extension one (5) and heat dissipation extension two (6), heat dissipation extension one (5) with heat dissipation extension two (6) both are located respectively the bottom both sides of heat dissipation supporting part (1), the branch foot includes heat dissipation branch foot one (7) and heat dissipation branch foot two (8), the bottom of heat dissipation extension one (5) is connected with heat dissipation branch foot one (7), the bottom of heat dissipation extension two (6) is connected with heat dissipation branch foot two (8).
2. A high voltage diode U-mount heat sink as defined in claim 1 wherein: the heat conduction connecting part (2) consists of two inclined plates (9) and an arc-shaped plate (10), the bottom ends of the two inclined plates (9) are fixed at the top of the heat dissipation supporting part (1), and the two inclined plates (9) and the arc-shaped plate (10) form an inverted V-shaped structure.
3. A high voltage diode U-mount heat sink as claimed in claim 2 wherein: the heat dissipation supporting part (1), the extension part and the support leg part form an inverted U-shaped structure, and both sides of one end of the heat dissipation supporting part (1) far away from the heat dissipation extension part I (5) and the heat dissipation extension part II (6) are respectively provided with a chamfer structure.
4. A high voltage diode U-mount heat sink in accordance with claim 3 wherein: the heat dissipation support part (1), the heat conduction connection part (2), the first heat dissipation extension part (5), the second right heat dissipation extension part (6), the first heat dissipation support part (7) and the second heat dissipation support part (8) are made of red copper.
5. The high voltage diode U-mount heat sink of claim 4 wherein: the distance between the two pins (4) of the high-voltage silicon stack diode (3) is larger than or equal to 2.7mm, the end parts of the pins (4) are square or arc-shaped, and the included angle between the pins (4) and the horizontal plane is 0-7 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321768637.6U CN220189629U (en) | 2023-07-06 | 2023-07-06 | U-shaped installation radiator for high-voltage diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321768637.6U CN220189629U (en) | 2023-07-06 | 2023-07-06 | U-shaped installation radiator for high-voltage diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220189629U true CN220189629U (en) | 2023-12-15 |
Family
ID=89112909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321768637.6U Active CN220189629U (en) | 2023-07-06 | 2023-07-06 | U-shaped installation radiator for high-voltage diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220189629U (en) |
-
2023
- 2023-07-06 CN CN202321768637.6U patent/CN220189629U/en active Active
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