CN220171493U - Case with turnover heat dissipation device - Google Patents
Case with turnover heat dissipation device Download PDFInfo
- Publication number
- CN220171493U CN220171493U CN202321658740.5U CN202321658740U CN220171493U CN 220171493 U CN220171493 U CN 220171493U CN 202321658740 U CN202321658740 U CN 202321658740U CN 220171493 U CN220171493 U CN 220171493U
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- China
- Prior art keywords
- front panel
- motherboard
- mounting plate
- hinge piece
- mounting
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- 230000007306 turnover Effects 0.000 title abstract description 4
- 230000017525 heat dissipation Effects 0.000 title description 17
- 238000001179 sorption measurement Methods 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 230000002441 reversible effect Effects 0.000 claims abstract description 9
- 238000009423 ventilation Methods 0.000 claims abstract description 5
- 238000012423 maintenance Methods 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of computer equipment, in particular to a chassis of a reversible heat dissipating device, which comprises a chassis body, a front panel arranged at the front end of the chassis body and a motherboard fixing frame arranged in the chassis body; the front panel is rotatably connected with a mounting plate on one side close to the motherboard fixing frame, one end surface of the mounting plate close to the motherboard fixing frame is detachably connected with a plurality of cooling fans, and a plurality of ventilation holes are formed in the position, corresponding to the cooling fans, of the mounting plate; the mounting panel is provided with first adsorption equipment in one side of keeping away from the front panel, the motherboard mount is provided with and is used for absorbing the second adsorption equipment with first adsorption equipment. The utility model aims to provide a chassis of a reversible heat dissipating device, wherein a heat dissipating fan arranged on a motherboard mounting frame at one side of a motherboard is arranged on a turnover structure, and the heat dissipating fan can be turned and pulled out, so that the heat dissipating fan can be replaced and maintained conveniently.
Description
Technical Field
The utility model relates to the technical field of computer equipment, in particular to a chassis of a reversible heat dissipation device.
Background
With the continuous development of computer technology, personal computers are gradually entering into various households, and become an essential component in daily life of people. The personal computer is gradually changed into a personal computer DIY from the previous customization machines of various large-brand manufacturers; the economic conditions of people now also allow them to upgrade their personal computers and gradually appear as DIY manikins, such as "hardware fever friends".
In the existing computer case, the purpose of increasing the heat dissipation inside the case can be achieved by installing a plurality of heat dissipation fans, in general, the air channel inside the case can be increased by installing a plurality of heat dissipation fans on the motherboard mounting frame on one side of the motherboard, and the heat dissipation performance of the case is improved. However, if the cooling fan is to be replaced and maintained after the chassis is used for a period of time, the replacement and maintenance of the cooling fan are troublesome due to the influence of the internal wiring of the chassis, and the like, which is inconvenient.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the utility model aims to provide a chassis of a reversible heat dissipating device, wherein a heat dissipating fan arranged on a motherboard mounting frame at one side of a motherboard is arranged on a turnover structure, and the heat dissipating fan can be turned over and pulled out, so that the heat dissipating fan can be replaced and maintained conveniently.
The utility model is realized by the following technical scheme:
a chassis of a reversible heat dissipating device comprises a chassis body, a front panel arranged at the front end of the chassis body and a motherboard fixing frame arranged in the chassis body; the front panel is rotatably connected with a mounting plate on one side close to the motherboard fixing frame, one end surface of the mounting plate close to the motherboard fixing frame is detachably connected with a plurality of cooling fans, and a plurality of ventilation holes are formed in the position, corresponding to the cooling fans, of the mounting plate;
the mounting panel is provided with first adsorption equipment in one side of keeping away from the front panel, the motherboard mount is provided with and is used for absorbing the second adsorption equipment with first adsorption equipment.
Wherein, the mounting panel is connected with the front panel detachable rotation.
The case further comprises a hinge structure, the hinge structure comprises a first hinge piece and a second hinge piece, one end of the first hinge piece is connected with the front panel, one end of the second hinge piece is connected with the mounting plate, and the other end of the first hinge piece is connected with the other end of the second hinge piece in an inserting mode.
One end of the first hinge piece is detachably connected with the front panel.
The mounting plate is provided with an L-shaped connecting plate perpendicularly in the direction of approaching to the mainboard fixing frame from one side of the front panel, and the first adsorption piece is embedded in the L-shaped connecting plate.
Wherein, first adsorption equipment and second adsorption equipment are magnet.
The utility model has the beneficial effects that:
according to the chassis of the reversible heat dissipation device, the mounting plate is arranged, and the mounting plate is turned over after being mounted, so that the first adsorption piece and the second adsorption piece are adsorbed, and the heat dissipation fan on the mounting plate is opposite to the motherboard fixing frame of the chassis, so that the heat dissipation performance in the chassis is improved; when the radiator fan needs to be replaced and maintained, the first adsorption piece and the second adsorption piece are separated only by poking the mounting plate, and meanwhile, the mounting plate is turned over to enable the radiator fan to be suspended on one side of the case, so that the interference of wiring inside the case can be avoided, and the radiator fan is convenient to replace and maintain.
Drawings
The utility model will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the utility model, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
Fig. 1 is a schematic view of a chassis when the mounting plate is mounted.
Fig. 2 is a schematic view of the chassis when the mounting plate is turned over.
Fig. 3 is an exploded view of the front panel and the mounting plate.
Reference numerals
A case body-100, a front panel-101, a motherboard fixing frame-102, a second absorbing member-103,
mounting plate-200, cooling fan-201, ventilation hole-202, first hinge piece-203, second hinge piece-204, L-shaped connecting plate-205 and first adsorption piece-206.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
With the continuous development of computer technology, personal computers are gradually entering into various households, and become an essential component in daily life of people. The personal computer is gradually changed into a personal computer DIY from the previous customization machines of various large-brand manufacturers; the economic conditions of people now also allow them to upgrade their personal computers and gradually appear as DIY manikins, such as "hardware fever friends".
In the existing computer case, the purpose of increasing the heat dissipation inside the case can be achieved by installing a plurality of heat dissipation fans, in general, the air channel inside the case can be increased by installing a plurality of heat dissipation fans on the motherboard mounting frame on one side of the motherboard, and the heat dissipation performance of the case is improved. However, if the cooling fan is to be replaced and maintained after the chassis is used for a period of time, the replacement and maintenance of the cooling fan are troublesome due to the influence of the internal wiring of the chassis, and the like, which is inconvenient.
In order to solve the above-mentioned problems, the present embodiment discloses a chassis of a reversible heat dissipating device, the structure of which is shown in fig. 1 to 3, the chassis includes a chassis body 100, a front panel 101 disposed at the front end of the chassis body 100, and a motherboard fixing frame 102 disposed in the chassis body 100; a mounting plate 200 is rotatably connected to one side of the front panel 101, which is close to the motherboard fixing frame 102, a plurality of cooling fans 201 are detachably connected to one end surface of the mounting plate 200, which is close to the motherboard fixing frame 102, and a plurality of ventilation holes 202 are formed in positions, corresponding to the cooling fans 201, of the mounting plate 200; the side of the mounting board 200 far away from the front panel 101 is provided with a first absorbing member 206, the motherboard fixing frame 102 is provided with a second absorbing member 103 for absorbing with the first absorbing member 206, and in this embodiment, the first absorbing member 206 and the second absorbing member 103 are both magnets.
Specifically, in the case of the reversible heat dissipation device of the present embodiment, by providing the mounting board 200, when the mounting board 200 is mounted, the mounting board 200 is turned over to enable the first absorbing member 206 and the second absorbing member 103 to absorb, so that the heat dissipation fan 201 on the mounting board 200 faces the motherboard fixing frame 102 of the case, so as to improve the heat dissipation performance in the case; when the cooling fan 201 needs to be replaced and maintained, only the mounting plate 200 needs to be shifted to separate the first absorbing member 206 from the second absorbing member 103, and meanwhile, the mounting plate 200 turns over to suspend the cooling fan 201 on one side of the chassis, so that interference of wiring inside the chassis can be avoided, and replacement and maintenance of the cooling fan 201 are facilitated.
Further, the mounting plate 200 is detachably and rotatably connected with the front panel 101, so that the mounting plate 200 and the chassis body 100 can be quickly assembled and disassembled.
Specifically, the chassis further comprises a hinge structure, the hinge structure comprises a first hinge piece 203 and a second hinge piece 204, one end of the first hinge piece 203 is connected with the front panel 101, one end of the second hinge piece 204 is connected with the mounting plate 200, and the other end of the first hinge piece 203 is connected with the other end of the second hinge piece 204 in an inserting mode. As can be seen from fig. 3, the first hinge piece 203 is located below, and the second hinge piece 204 is located above, so that the mounting plate 200 is quickly attached to and detached from the front panel 101 while the mounting plate 200 is rotatably connected to the front panel 101 by inserting and extracting the first hinge piece 203 into and from the second hinge piece 204.
Further, one end of the first hinge piece 203 is detachably connected to the front panel 101. In this embodiment, the first hinge piece 203 is fixed to the front panel 101 by screws, so that the mounting plate 200 and the hinge structure can be removed from the chassis together, which is convenient for expansion.
Further, an L-shaped connection board 205 is vertically disposed on a side of the mounting board 200 away from the front panel 101 toward a direction close to the motherboard fixing frame 102, and the first absorbing member 206 is embedded into the L-shaped connection board 205, so that the connection between the mounting board 200 and the motherboard fixing frame 102 is more stable by the L-shaped connection board 205.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (6)
1. The utility model provides a can overturn heat abstractor's machine case, includes the machine case body, sets up in the front panel of machine case body front end and sets up in the motherboard mount of machine case body, its characterized in that: the front panel is rotatably connected with a mounting plate on one side close to the motherboard fixing frame, one end surface of the mounting plate close to the motherboard fixing frame is detachably connected with a plurality of cooling fans, and a plurality of ventilation holes are formed in the position, corresponding to the cooling fans, of the mounting plate;
the mounting panel is provided with first adsorption equipment in one side of keeping away from the front panel, the motherboard mount is provided with and is used for absorbing the second adsorption equipment with first adsorption equipment.
2. The enclosure of claim 1, wherein: the mounting plate is detachably connected with the front panel in a rotating way.
3. The enclosure of claim 2, wherein the enclosure further comprises: the machine case still includes hinge structure, hinge structure includes first hinge piece and second hinge piece, the one end and the front panel of first hinge piece are connected, the one end and the mounting panel of second hinge piece are connected, the other end and the other end grafting of second hinge piece of first hinge piece.
4. A cabinet of a reversible heat sink according to claim 3, wherein: one end of the first hinge piece is detachably connected with the front panel.
5. The enclosure of claim 1, wherein: the mounting board is kept away from the front panel one side and is provided with L type connecting plate perpendicularly towards the direction that is close to the motherboard mount, first adsorption equipment embedding sets up in L type connecting plate.
6. The enclosure of claim 1, wherein: the first absorbing part and the second absorbing part are magnets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321658740.5U CN220171493U (en) | 2023-06-28 | 2023-06-28 | Case with turnover heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321658740.5U CN220171493U (en) | 2023-06-28 | 2023-06-28 | Case with turnover heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220171493U true CN220171493U (en) | 2023-12-12 |
Family
ID=89055156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321658740.5U Active CN220171493U (en) | 2023-06-28 | 2023-06-28 | Case with turnover heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220171493U (en) |
-
2023
- 2023-06-28 CN CN202321658740.5U patent/CN220171493U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |