CN220166317U - Electroplating cathode conductive structure - Google Patents

Electroplating cathode conductive structure Download PDF

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Publication number
CN220166317U
CN220166317U CN202321597715.0U CN202321597715U CN220166317U CN 220166317 U CN220166317 U CN 220166317U CN 202321597715 U CN202321597715 U CN 202321597715U CN 220166317 U CN220166317 U CN 220166317U
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China
Prior art keywords
roller
electroplating
copper
conducting rod
box body
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Active
Application number
CN202321597715.0U
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Chinese (zh)
Inventor
周保平
张顺
刘健
许宝文
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Baotou INST Magnetic New Material Co Ltd
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Baotou INST Magnetic New Material Co Ltd
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Priority to CN202321597715.0U priority Critical patent/CN220166317U/en
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Abstract

The utility model relates to the technical field of electroplating, in particular to an electroplating cathode conductive structure, which comprises the following components: the box body and V-shaped conductive base, the inboard of box body is fixed with V-shaped conductive base through the bolt, the symmetry is provided with the connector on the V-shaped conductive base, the connector inboard is provided with conductive cylinder, the last rotation of conductive cylinder is connected with the copper roller. According to the copper roller and the roller conducting rod rolling type copper powder electroplating device, friction between the copper roller and the roller conducting rod can be reduced, so that copper powder falling caused by friction is effectively reduced, meanwhile, wiping cotton is used for wiping cotton on the roller conducting rod through the gland, and copper powder falling along the roller conducting rod in an electroplating pool can be prevented from affecting electroplating effect.

Description

Electroplating cathode conductive structure
Technical Field
The utility model relates to the technical field of electroplating, in particular to an electroplating cathode conductive structure.
Background
The electroplating process of the rare earth permanent magnet product is an electrochemical deposition process and is also an oxidation-reduction process. The basic process of electrodeposition is to dip the part to be plated in a metal salt aqueous solution as a cathode, a metal plate as an anode, and deposit a metal coating on the part to be plated after the direct current power supply is turned on. The electrodeposition process requires good electrical conductivity to ensure proper plating.
In the production of neodymium iron boron barrel plating, the perfect fit of the conductive V-shaped conductive base of the groove body and the conductive rod of the roller is the key for ensuring smooth production, so most manufacturers on the market spend more cost to produce the V-shaped conductive base of pure copper. However, in the electroplating of other plating species, copper powder scraps generated by friction between the rod body and the conductive V-shaped conductive base can enter the electroplating pool along the roller conductive rod, so that impurities of other solutions can be formed, and the electroplating effect is affected.
To this end, we propose an electroplated cathode conductive structure to solve the above mentioned problems.
Disclosure of Invention
The utility model aims to provide an electroplating cathode conductive structure which is used for solving the problem that copper powder generated by friction between a conductive V-shaped conductive base and a roller conductive rod enters an electroplating pool to influence electroplating.
In order to achieve the above purpose, the present utility model provides the following technical solutions: an electroplated cathode conductive structure comprising: the box body and V-shaped conductive base, the inboard of box body is fixed with V-shaped conductive base through the bolt, the symmetry is provided with the connector on the V-shaped conductive base, the connector inboard is provided with conductive cylinder, the last rotation of conductive cylinder is connected with the copper roller.
Preferably, the box body is connected with a gland through a hinge.
Preferably, wiping cotton is arranged on the inner wall of the gland.
Preferably, the gland is fixed with a balancing weight.
Compared with the prior art, the utility model has the beneficial effects that:
according to the copper roller and the roller conducting rod rolling type copper powder electroplating device, friction between the copper roller and the roller conducting rod can be reduced, so that copper powder falling caused by friction is effectively reduced, meanwhile, wiping cotton is used for wiping cotton on the roller conducting rod through the gland, and copper powder falling along the roller conducting rod in an electroplating pool can be prevented from affecting electroplating effect.
Drawings
FIG. 1 is a cross-sectional view of the overall structure of the present utility model;
FIG. 2 is a top view of the overall structure of the present utility model;
in the figure: 1 box body, 2V type conductive base, 21 connector, 22 conductive cylinder, 23 copper roller, 3 gland, 31 wiping cotton, 32 balancing weight.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 and 2, an electroplated cathode conductive structure is shown, comprising: the box body 1 and the V-shaped conductive base 2 are fixed on the inner side of the box body 1 through bolts, the V-shaped conductive base 2 is symmetrically provided with a connecting port 21, a conductive cylinder 22 is arranged on the inner side of the connecting port 21, a copper roller 23 is rotationally connected to the conductive cylinder 22, the copper roller 23 is rotationally connected to the conductive roller 23, and when the roller rotates on the copper roller 23, the copper roller 23 can rotate along the conductive cylinder 22 to reduce friction between the copper roller and the roller, so that copper powder is effectively prevented from falling.
The box body 1 is connected with a gland 3 in a hinge manner, and the gland 3 is connected with the hinge, overturns and rotates to cover the roller conducting rod.
The inner wall of the gland 3 is provided with wiping cotton 31, and the roller can be wiped through the wiping cotton 31 to prevent copper powder from entering the electroplating pool along the roller.
The weight block 32 is fixed on the gland 3, the weight of the gland 3 is increased through the weight block 32, the wiping cotton 31 can be tightly attached to the roller conducting rod, the roller conducting rod is wiped in the rotating process, and copper powder is prevented from entering the electroplating pool through the roller conducting rod.
The conductive structure is used in the following steps: the copper roller 23 rotates between and is connected with the cylinder, can reduce the friction between cylinder and the copper roller 23 to effectually prevent dropping of copper powder, increase the weight of gland 3 through balancing weight 32 simultaneously, can make the cotton 31 of cleaning hug closely the cylinder conducting rod, clean the cylinder conducting rod in the rotation in-process, avoid copper powder to get into electroplating the pond through the cylinder conducting rod in, can effectually avoid copper powder to drop in electroplating the pond in the use.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. An electroplated cathode conductive structure, comprising:
the novel box comprises a box body (1) and a V-shaped conductive base (2), wherein the V-shaped conductive base (2) is fixed on the inner side of the box body (1) through bolts, connecting ports (21) are symmetrically arranged on the V-shaped conductive base (2), conductive cylinders (22) are arranged on the inner sides of the connecting ports (21), and copper rollers (23) are rotationally connected to the conductive cylinders (22).
2. The electroplated cathode conductive structure of claim 1, wherein: the box body (1) is connected with a gland (3) through a hinge.
3. The electroplated cathode conductive structure of claim 2, wherein: the inner wall of the gland (3) is provided with wiping cotton (31).
4. The electroplated cathode conductive structure of claim 2, wherein: a balancing weight (32) is fixed on the gland (3).
CN202321597715.0U 2023-06-21 2023-06-21 Electroplating cathode conductive structure Active CN220166317U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321597715.0U CN220166317U (en) 2023-06-21 2023-06-21 Electroplating cathode conductive structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321597715.0U CN220166317U (en) 2023-06-21 2023-06-21 Electroplating cathode conductive structure

Publications (1)

Publication Number Publication Date
CN220166317U true CN220166317U (en) 2023-12-12

Family

ID=89060508

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321597715.0U Active CN220166317U (en) 2023-06-21 2023-06-21 Electroplating cathode conductive structure

Country Status (1)

Country Link
CN (1) CN220166317U (en)

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