CN220166306U

CN220166306U - Nickel plating device for PCB circuit board production

Info

Publication number: CN220166306U
Application number: CN202321611986.7U
Authority: CN
Inventors: 张纪辉
Original assignee: Yangzhou Juyuan Electronics Technology Co ltd
Current assignee: Yangzhou Juyuan Electronics Technology Co ltd
Priority date: 2023-06-25
Filing date: 2023-06-25
Publication date: 2023-12-12
Anticipated expiration: 2033-06-25

Abstract

The utility model discloses a nickel plating device for producing a PCB (printed Circuit Board), which relates to the technical field of PCB processing and comprises a liquid storage tank, wherein a nickel plating groove is arranged at the top of the liquid storage tank, a frame body is arranged at the top of one side of an inner cavity of the nickel plating groove, a screw rod is connected between the bottom of the frame body and the inner bottom wall of the nickel plating groove through a bearing, a servo motor for driving the screw rod to rotate is arranged in the inner cavity of the frame body, a screw nut is connected with the outer wall of the screw rod in a threaded manner, a limit component is arranged at one end of the inner cavity of the screw rod, which is far away from the screw rod, a placement component is arranged between the screw nut and the limit component, and the left end of the top of the liquid storage tank is connected with a pump body. According to the utility model, the lead screw, the screw nut, the limiting component, the frame body and the servo motor are matched, so that the placing component can be driven to move upwards, a user can conveniently take the circuit board body, the user does not need to manually visit the plating solution to take materials, the safety and convenience are improved, and the problem that the existing circuit board taking mode is not convenient and safe enough is solved.

Description

Nickel plating device for PCB circuit board production

Technical Field

The utility model relates to the technical field of PCB (printed circuit board) processing, in particular to a nickel plating device for PCB production.

Background

The PCB circuit board, i.e. the printed circuit board, is one of the important components of the electronic industry, almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronic devices, military weapon systems, and as long as there are electronic components such as integrated circuits, etc., the PCB circuit board is used for electrical interconnection between the components, and in order to reduce contact resistance, improve conductivity and prevent corrosion during the processing of the PCB circuit board, a nickel plating process is generally performed.

The utility model discloses a device for chemical nickel plating of a printed circuit board, which comprises a plating tank, a hanging basket and a circulating device, wherein the plating tank is divided into an area A and an area B, the two areas are respectively connected with two ends of the circulating device, the area A is provided with a plating solution jet box for jetting nickel plating solution from the circulating device into the area B, the hanging basket is used for placing the printed circuit board to be plated in the area B, the flowing direction of the plating solution is more consistent and uniform, plating solution exchange among each piece of PCB is uniform, concentration difference and temperature difference phenomenon between the upper position, the lower position, the left position, the right position, the front position and the rear position of the nickel tank are avoided, and when a plurality of circuit board plating solutions are needed to be taken out after the plating solution is finished, the plating solution is easy to adhere and adhere to the hands of workers, so that the device is not safe and environment-friendly.

Disclosure of Invention

In order to solve the problems that when a plurality of circuit board plating solutions are taken out after the device is used, the hand of a worker is easy to adhere the plating solution and the device is not safe and environment-friendly enough due to the fact that the worker manually drags the plating solution.

The utility model provides a nickel plating device for producing a PCB, which adopts the following technical scheme:

the utility model provides a nickel plating device is used in production of PCB circuit board, includes the liquid reserve tank, the nickel plating tank is installed at the top of liquid reserve tank, the framework is installed at the top of nickel plating tank inner chamber one side, the bottom of framework with be connected with the lead screw through the bearing between the interior bottom wall of nickel plating tank, the inner chamber of framework is installed and is used for the drive lead screw pivoted servo motor, the outer wall threaded connection of lead screw has the screw, the lead screw inner chamber is kept away from the one end of lead screw is provided with spacing subassembly, the screw with be provided with between the spacing subassembly and place the subassembly, the left end at liquid reserve tank top is connected with the pump body, the input of the pump body with be connected with the drawing liquid pipe between the liquid reserve tank, be connected with the liquid feeding pipe between the output of pump body with be connected with the catheter between the nickel plating tank, the bottom on liquid reserve tank top with be connected with the back flow between the liquid reserve tank, the inner chamber of back flow is provided with the solenoid valve.

Through adopting above-mentioned technical scheme, start servo motor, servo motor during operation drives the lead screw and rotates, the lead screw rotates and drives the nut and move down, the nut moves down and drives and place the subassembly and move down, until place the bottom of subassembly removal to the nickel plating tank inner chamber, start the pump body this moment, the pump body is through the extraction of the plating solution of liquid suction pipe to the liquid storage tank in, until the plating solution submerges the circuit board, thereby accomplish nickel plating work, after the plating solution finishes, remove the lid from the top of nickel plating tank, and start servo motor reverse rotation again, and then drive the lead screw reverse rotation, make place the subassembly and move up constantly, until the partly nickel plating tank that stretches out of circuit board, so that the user takes the circuit board, do not need the manual material of exploring in the plating solution of user, it is safer and more convenient, current circuit board take out mode is convenient and safe inadequately has been solved.

Optionally, place the subassembly and including placing the otter board, place the otter board and install the screw is close to one side in nickel plating groove center, the top equidistant separation otter board that is connected with of placing the otter board has placed circuit board body nickel plating work between the adjacent separation otter board.

By adopting the technical scheme, the circuit board bodies are placed between the adjacent separation net plates one by one, so that a plurality of circuit board bodies can be carried out.

Optionally, the spacing subassembly includes the connecting plate, the connecting plate is connected the top of nickel plating tank inner chamber right side wall, the connecting plate with be connected with the slide bar between the interior bottom wall of nickel plating tank, the outer wall cover of slide bar is equipped with the sliding sleeve, the sliding sleeve be close to one side in nickel plating tank center with place the right-hand member fixed connection of otter board.

Through adopting above-mentioned technical scheme, can drive the sliding sleeve and slide along the slide bar when placing the otter board and remove to can carry out spacingly to placing the otter board.

Optionally, the top of nickel plating tank is provided with the lid, the both ends of lid bottom all are connected with the inserted block, the both ends at nickel plating tank top all seted up with inserted block grafting complex slot.

Through adopting above-mentioned technical scheme, the device is at the during operation, with the inserted block grafting in the slot that corresponds to can close the lid at the top of nickel plating tank, avoid plating solution in-process impurity to fall into the inner chamber of nickel plating tank as far as possible.

Optionally, a first observation window is installed on the surface of the nickel plating tank, and a second observation window is installed on the surface of the liquid storage tank.

Through adopting above-mentioned technical scheme, can observe the liquid level height of plating solution of nickel plating tank inner chamber through first observation window, guarantee that the plating solution can submerge the circuit board body completely, can observe the inner chamber plating solution volume of liquid reserve tank through the second observation window, conveniently in time add the plating solution.

Optionally, a filter screen is installed at one end of the inner cavity of the liquid storage tank, which is close to the liquid suction pipe.

By adopting the technical scheme, the recovered plating solution can be filtered through the filter screen.

Optionally, the top of filter screen stretches out the liquid reserve tank and installs the arm-tie, the bottom of filter screen is connected with the lug, the interior bottom wall of liquid reserve tank install with lug grafting complex recess body.

Through adopting above-mentioned technical scheme, when filter screen after a period of use, pull-up arm-tie, the arm-tie drives the filter screen and upwards moves to can drive lug and upwards move and the separation of recess body, and then conveniently take out the filter screen and clear up.

In summary, the present utility model includes at least one of the following beneficial effects:

(1) Through the cooperation setting of lead screw, spacing subassembly, framework and servo motor to can drive and place the subassembly and upwards move, so that the user takes the circuit board body, does not need the manual material of getting in the plating bath of penetrating of user, safer convenient, solved the current circuit board and taken out the not enough convenient safe problem of mode.

(2) Through the cooperation setting of nickel plating groove, pump body, drawing liquid pipe, back flow and solenoid valve, unnecessary liquid can flow into the inner chamber of liquid reserve tank again through the back flow to can retrieve the recycle to the liquid, embody the device and have resource-saving's advantage.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic cross-sectional view of the present utility model;

FIG. 2 is a schematic elevational view of the present utility model;

FIG. 3 is a schematic top view of the placement module of the present utility model;

fig. 4 is a schematic diagram of the structure a in fig. 1 according to the present utility model.

In the figure: 1. a screw rod; 2. a nickel plating tank; 3. a catheter; 4. a nut; 5. pulling a plate; 6. a pump body; 7. a liquid suction pipe; 8. a filter screen; 9. a bump; 10. a groove body; 11. placing the assembly; 1101. placing a screen plate; 1102. a circuit board body; 1103. a separation screen; 12. a liquid storage tank; 13. a liquid adding tube; 14. a return pipe; 15. an electromagnetic valve; 16. a limit component; 1601. a sliding sleeve; 1602. a slide bar; 1603. a connecting plate; 17. a cover body; 18. a first viewing window; 19. a second viewing window; 20. inserting blocks; 21. a slot; 22. a frame; 23. a servo motor.

Detailed Description

The utility model is described in further detail below with reference to fig. 1-4.

Referring to fig. 1 and 4 of the drawings, one embodiment of the present utility model is provided: the utility model provides a nickel plating device is used in production of PCB circuit board, includes liquid reserve tank 12, and the top fixed mounting of liquid reserve tank 12 has nickel plating tank 2, and the top of nickel plating tank 2 is provided with lid 17, and the equal fixedly connected with inserted block 20 in both ends of lid 17 bottom, and slot 21 with inserted block 20 grafting complex is all seted up at the both ends at nickel plating tank 2 top. When the device works, the plug 20 is inserted into the corresponding slot 21, so that the cover 17 can be combined at the top of the nickel plating tank 2, and impurities are prevented from falling into the inner cavity of the nickel plating tank 2 as much as possible in the plating solution process.

Referring to fig. 1 and 2 of the drawings, a first viewing window 18 is provided on the surface of the nickel plating tank 2, and a second viewing window 19 is provided on the surface of the liquid storage tank 12. The liquid level of the plating solution in the inner cavity of the nickel plating tank 2 can be observed through the first observation window 18, the circuit board body 1102 can be completely immersed in the plating solution, the plating solution in the inner cavity of the liquid storage tank 12 can be observed through the second observation window 19, and the plating solution can be conveniently and timely added.

Referring to fig. 1 and 3 of the drawings, a frame 22 is mounted at the top of one side of an inner cavity of a nickel plating tank 2, a screw rod 1 is rotatably connected between the bottom of the frame 22 and the inner bottom wall of the nickel plating tank 2 through a bearing, a servo motor 23 for driving the screw rod 1 to rotate is mounted in the inner cavity of the frame 22, a screw nut 4 is connected to the outer wall of the screw rod 1 in a threaded manner, a limit component 16 is arranged at one end, far away from the screw rod 1, of the inner cavity of the screw rod 1, a placement component 11 is arranged between the screw nut 4 and the limit component 16, the placement component 11 comprises a placement screen 1101, the placement screen 1101 is horizontally mounted at one side, close to the center of the nickel plating tank 2, a plurality of separation screen 1103 are connected at equal intervals at the top of the placement screen 1101, and a circuit board body 1102 is placed between adjacent separation screen 1103 to work. The circuit board bodies 1102 are placed one by one between the adjacent partition webs 1103, so that a plurality of circuit board bodies 1102 can be performed.

Referring to fig. 1 of the drawings, the limiting assembly 16 includes a connecting plate 1603, the connecting plate 1603 is connected to the top of the right side wall of the inner cavity of the nickel plating tank 2, a sliding rod 1602 is vertically connected between the connecting plate 1603 and the inner bottom wall of the nickel plating tank 2, a sliding sleeve 1601 is sleeved on the outer wall of the sliding rod 1602 in a sliding manner, and one side of the sliding sleeve 1601 close to the center of the nickel plating tank 2 is fixedly connected with the right end of the placement screen 1101. When the placement screen 1101 moves, the sliding sleeve 1601 can be driven to slide along the sliding rod 1602, so that the placement screen 1101 can be limited.

Referring to fig. 1 of the drawings, a pump body 6 is fixedly connected to the left end of the top of a liquid storage tank 12, a liquid suction pipe 7 is fixedly connected between the input end of the pump body 6 and the liquid storage tank 12, the bottom of the liquid suction pipe 7 extends into the bottom of the inner cavity of the liquid storage tank 12, and a filter screen 8 is mounted at one end, close to the liquid suction pipe 7, of the inner cavity of the liquid storage tank 12. So that the recovered plating solution can be filtered through the filter screen 8.

Referring to fig. 1 of the drawings, the top of a filter screen 8 extends out of a liquid storage tank 12 and is provided with a pull plate 5, the bottom of the filter screen 8 is fixedly connected with a convex block 9, and the inner bottom wall of the liquid storage tank 12 is provided with a groove body 10 which is in plug-in fit with the convex block 9. When the filter screen 8 is used for a period of time, the pull plate 5 is pulled up, and the pull plate 5 drives the filter screen 8 to move upwards, so that the convex blocks 9 can be driven to move upwards to be separated from the groove body 10, and the filter screen 8 can be taken out conveniently and cleaned.

Referring to fig. 1 of the drawings, a liquid guide tube 3 is connected between an output end of a pump body 6 and a nickel plating tank 2, a liquid adding tube 13 is fixedly connected to a right end of a top of a liquid storage tank 12, a return tube 14 is fixedly connected between a bottom of the right side of the nickel plating tank 2 and the liquid storage tank 12, and an electromagnetic valve 15 is arranged in an inner cavity of the return tube 14.

Working principle: when the device is used, an external power supply is connected, the circuit board body 1102 is sequentially placed between the adjacent separation net plates 1103, then the servo motor 23 is started, the servo motor 23 drives the screw rod 1 to rotate when working, the screw rod 1 rotates to drive the screw nut 4 to move downwards, the screw nut 4 moves downwards to drive the placement assembly 11 to move downwards until the placement net plates 1101 move to the bottom of the inner cavity of the nickel plating tank 2, the pump body 6 is started at the moment, the pump body 6 extracts plating solution in the liquid storage tank 12 through the liquid suction pipe 7 and conveys the plating solution to the inner cavity of the nickel plating tank 2 through the liquid guide pipe 3 until the plating solution submerges the circuit board body 1102, and therefore nickel plating work is completed.

In the process of plating solution, the insert 20 at the bottom of the cover body 17 is inserted into the corresponding slot 21, so that the nickel plating tank 2 can be plugged through the cover body 17, impurities are prevented from entering the inner cavity of the nickel plating tank 2 as much as possible, after the device is finished, the electromagnetic valve 15 is opened, the rest of plating solution enters the inner cavity of the liquid storage tank 12 through the return pipe 14 for storage, and impurities in the plating solution can be filtered through the arrangement of the filter screen 8, so that the plating solution is convenient to recycle in the later stage.

Then the cover 17 is removed from the top of the nickel plating tank 2, the servo motor 23 is started to reversely rotate again, and then the screw rod 1 is driven to reversely rotate, so that the placement component 11 continuously moves upwards until a part of the circuit board body 1102 extends out of the nickel plating tank 2, a user can conveniently take the circuit board body 1102, the user does not need to manually visit into the plating solution to take materials, the safety and convenience are improved, and the problem that the existing circuit board taking mode is not convenient and safe enough is solved.

The above embodiments are not intended to limit the scope of the present utility model, so: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.

Claims

1. The utility model provides a nickel plating device is used in production of PCB circuit board, includes liquid reserve tank (12), its characterized in that: the top of the liquid storage tank (12) is provided with a nickel plating groove (2), the top of one side of the inner cavity of the nickel plating groove (2) is provided with a frame body (22), a screw rod (1) is connected between the bottom of the frame body (22) and the inner bottom wall of the nickel plating groove (2) through a bearing, the inner cavity of the frame body (22) is provided with a servo motor (23) for driving the screw rod (1) to rotate, the outer wall of the screw rod (1) is in threaded connection with a screw nut (4), one end of the inner cavity of the screw rod (1) away from the screw rod (1) is provided with a limiting component (16), be provided with between screw (4) with spacing subassembly (16) and place subassembly (11), the left end at liquid reserve tank (12) top is connected with pump body (6), the input of pump body (6) with be connected with drawing liquid pipe (7) between liquid reserve tank (12), the output of pump body (6) with be connected with catheter (3) between nickel plating tank (2), the right-hand member at liquid reserve tank (12) top is connected with liquid feeding pipe (13), the bottom on nickel plating tank (2) right side with be connected with back flow (14) between liquid reserve tank (12), the inner chamber of back flow (14) is provided with solenoid valve (15).

2. The nickel plating apparatus for producing a PCB circuit board according to claim 1, wherein: the placing assembly (11) comprises a placing screen (1101), the placing screen (1101) is installed on one side, close to the center of the nickel plating groove (2), of the screw (4), the top of the placing screen (1101) is connected with a separating screen (1103) at equal intervals, and a circuit board body (1102) is placed between the adjacent separating screens (1103).

3. The nickel plating apparatus for producing a PCB circuit board according to claim 2, wherein: spacing subassembly (16) are including connecting plate (1603), connecting plate (1603) are connected at the top of nickel plating tank (2) inner chamber right side wall, connecting plate (1603) with be connected with slide bar (1602) between the interior bottom wall of nickel plating tank (2), the outer wall cover of slide bar (1602) is equipped with sliding sleeve (1601), sliding sleeve (1601) are close to one side at nickel plating tank (2) center with place the right-hand member fixed connection of otter board (1101).

4. The nickel plating apparatus for producing a PCB circuit board according to claim 1, wherein: the top of nickel plating tank (2) is provided with lid (17), the both ends of lid (17) bottom all are connected with inserted block (20), both ends at nickel plating tank (2) top all offer with inserted block (20) grafting complex slot (21).

5. The nickel plating apparatus for producing a PCB circuit board according to claim 1, wherein: the surface of the nickel plating tank (2) is provided with a first observation window (18), and the surface of the liquid storage tank (12) is provided with a second observation window (19).

6. The nickel plating apparatus for producing a PCB circuit board according to claim 1, wherein: a filter screen (8) is arranged at one end of the inner cavity of the liquid storage tank (12) close to the liquid suction pipe (7).

7. The nickel plating apparatus for producing a PCB as defined in claim 6, wherein: the top of filter screen (8) stretches out liquid reserve tank (12) and installs arm-tie (5), the bottom of filter screen (8) is connected with lug (9), interior bottom wall of liquid reserve tank (12) install with lug (9) grafting complex recess body (10).