CN220154574U

CN220154574U - Semiconductor assembly line testing device

Info

Publication number: CN220154574U
Application number: CN202320577895.XU
Authority: CN
Inventors: 陈长贵
Original assignee: Taizhou Haitian Electronic Technology Co ltd
Current assignee: Taizhou Haitian Electronic Technology Co ltd
Priority date: 2023-03-22
Filing date: 2023-03-22
Publication date: 2023-12-08
Anticipated expiration: 2033-03-22

Abstract

The utility model discloses a semiconductor assembly line testing device which comprises a base, wherein a telescopic rod is arranged at the rear end of the top of the base, a top testing mechanism is fixedly arranged at the upper end of the front face of the telescopic rod, a bottom testing mechanism is arranged right below the top side mechanism at the top of the base, and a piece taking mechanism is fixedly arranged at the left side of the top of the base. According to the utility model, the transverse rod at the top of the semiconductor storage frame is driven to rotate through the rotation of the telescopic cylinder, at the moment, the negative pressure pipe at the bottom of the negative pressure pump moves to the top of the heater, the semiconductor can be adsorbed through the sucking disc by starting the telescopic cylinder to shrink and simultaneously restarting the negative pressure pump to operate, then the telescopic cylinder is rotated to rotate the semiconductor to the other side, at the moment, the negative pressure pump is closed, and the semiconductor can fall into the inner side of the storage frame at the top of the storage frame, so that the technical scheme is more convenient to take materials compared with the prior art, and has stronger practicability and higher safety.

Description

Semiconductor assembly line testing device

Technical Field

The utility model belongs to the technical field of semiconductor testing, and particularly relates to a semiconductor assembly line testing device.

Background

The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like at present, and the production of the semiconductor needs to uniformly carry out technological processes such as flow sheet, packaging, testing and the like.

When a worker uses the semiconductor high-temperature-resistant testing device to test the semiconductor, the sealing performance of the device is poor, the heat insulation performance and the safety of the device are easy to be low, high-temperature fragments are difficult to splash, safety accidents are easy to be caused, the semiconductor current testing effect is low, the working efficiency of the device is poor, the device is complex to operate, the testing data are easy to make mistakes, the accuracy is low, and the working efficiency of the worker is reduced;

the patent number is a semiconductor high temperature resistant testing arrangement of "CN202120960387.0", including electric lifter, base and platen, the middle part fixedly connected with platen of base upper end, and electric lifter sets up in the left side of base upper end, and platen surface welding has the operation panel, and the embedding of operation panel upper surface is provided with and loads the box, and electric lifter is inclined to one side upper end swing joint of platen has the locating rack, and locating rack keeps away from electric lifter one end fixedly connected with heater, the bottom fixedly connected with cage of heater. When the device is in actual use, the tightness of the device can be greatly improved, the heat insulation and the safety of the isolation cover are improved, the splashing of fragments caused by high-temperature explosion of a semiconductor can be effectively avoided, the current testing effect of the semiconductor can be effectively improved, the working efficiency of the device is improved, the controllability and the convenience of the device can be improved, and the testing data of semiconductor testing can be effectively increased; the prior art scheme can play a better role in protection during use, but needs to heat the semiconductor during testing, and after the testing is completed, the temperature of the semiconductor is higher, so that the semiconductor is difficult to take out manually, a human body is easy to scald, and the use is inconvenient, so that the semiconductor needs to be improved.

Disclosure of Invention

Aiming at the problems in the background art, the utility model aims to provide a semiconductor assembly line testing device which can solve the problems that in the prior art, although the device can play a better role in protection, the semiconductor needs to be heated during the testing period, the temperature of the semiconductor is higher after the testing is finished, the semiconductor is difficult to take out manually at the moment, the human body is easy to scald, and the use is inconvenient.

The technical aim of the utility model is realized by the following technical scheme:

the utility model provides a semiconductor equipment circuit testing arrangement, includes the base, the top rear end of base is equipped with the telescopic link, the positive upper end fixed mounting of telescopic link has a top to survey the mechanism, the top of base is located and is equipped with under the top side mechanism and surveys the mechanism, the top left side fixed mounting of base has a mechanism of getting, the bottom rear end fixed mounting of base has a mounting mechanism:

the telescopic rod guide rail is fixedly arranged at the rear end of the top of the base, the inner side of the guide rail is rotationally connected with a screw rod, the outer surface of the screw rod is in threaded connection with a sliding block, the front surface of the sliding block is fixedly connected with the back surface of the top measuring mechanism, the top of the guide rail is fixedly provided with a driving motor, and the bottom output end of the driving motor is fixedly connected with the top of the screw rod;

the jacking mechanism comprises a fixed plate, the fixed plate is fixedly arranged on the front surface of the sliding block, a frame body is fixedly arranged at the bottom of the fixed plate, limit springs are fixedly arranged at equal intervals on the inner sides of the frame body, heat-insulating inner shells are arranged at the bottoms of the limit springs, grooves are formed at equal intervals on the two sides of the heat-insulating inner shells, first copper sheets are arranged in the grooves, and electric heating pipes are fixedly arranged in the heat-insulating inner shells;

the bottom measuring mechanism comprises a base, the base is fixedly arranged in the middle of the top of the base, a square groove is formed in the top of the base, an inner heat insulation shell is fixedly arranged on the inner side of the square groove, a heater is fixedly arranged on the inner side of the inner heat insulation shell, and second copper sheets are arranged on the two sides of the heater at equal intervals;

the piece taking mechanism comprises a turntable, the turntable is rotationally connected to the left side of the top of the base, a telescopic cylinder is fixedly arranged at the top of the turntable, a cross rod is fixedly arranged at the top of the telescopic cylinder, a negative pressure pump is fixedly arranged at the left side of the top of the cross rod, a negative pressure pipe is arranged at the bottom input end of the negative pressure pump, a sucker is fixedly arranged at the bottom of the negative pressure pipe in a penetrating manner through the cross rod, and a handle is fixedly arranged at the right side of the cross rod.

Further, as a preferable technical scheme, support shafts are fixedly arranged on two sides of the top of the heat-insulation inner shell, and the upper ends of the support shafts penetrate through the frame body.

Further, as an optimal technical scheme, the overlook shape of the sliding block and the cross section shape of the inner side of the guide rail are both convex, and the outer surface of the sliding block is provided with a wear-resistant gasket.

Further, as the preferable technical scheme, the installation mechanism comprises a clamping seat, the clamping seat is fixedly installed at the rear end of the bottom of the base, the side surface of the clamping seat is L-shaped, fixing screws are connected with two sides of the bottom of the clamping seat in a threaded manner, and the top of each fixing screw penetrates through the clamping seat.

Further, as a preferable technical scheme, a knob is fixedly arranged at the bottom of the fixing screw, and anti-skid patterns are arranged on the outer surface of the knob.

Further, as the preferable technical scheme, antiskid plates are fixedly arranged at the tops of the fixing screws, and antiskid rubber pads are arranged at the tops of the antiskid plates.

Further, as a preferable technical scheme, a placement frame is fixedly installed on the left side of the top of the base, and a storage frame is placed on the inner side of the placement frame.

Further, as an optimal technical scheme, the side surfaces and the front surface of the storage frame are both inverted isosceles trapezoids, and bridge armrests are arranged on two sides of the top of the storage frame.

In summary, the utility model has the following advantages:

firstly, through setting up the cooperation of topside mechanism and end survey mechanism for when using, place the heater top on the base with the semiconductor, the accessible starts the drive and drives lead screw drive slider and move down, and then drive the fixed plate and move down, can assist to drive the heat preservation inner shell and move down through the fixed plate, the heat preservation inner shell is inserted into inside that interior heat preservation can, can make the semiconductor be located between heater and the electrothermal tube, start electrothermal tube and heater and heat this moment, simultaneously during this period, the second copper sheet inserts in the recess and first copper sheet junction switch on, can assist to test, during the test, through the supplementary conflict heat preservation inner shell of limit spring, can make the stable grafting of heat preservation inner shell in the inside of interior heat preservation shell, thereby play better protection heat preservation effect, the improvement protective capability, make this device detect the security stronger;

second, get a mechanism through setting up for when using, after the test finishes, only need start driving motor reversal can drive the fixed plate and shift up, alright separation bottom survey mechanism and topside mechanism this moment, drive the carousel through the pulling handle and rotate, can drive the flexible cylinder at top and rotate, rotate the horizontal pole that drives its top through flexible cylinder, the negative pressure pipe of negative pressure pump bottom removes the top of heater this moment, shrink and restart the negative pressure pump operation simultaneously through starting flexible cylinder, can adsorb the semiconductor through the sucking disc, then rotate flexible cylinder again and can rotate the opposite side with the semiconductor, close the negative pressure pump this moment, the semiconductor can fall into the storage frame inboard of placing the frame top, thereby make this technical scheme get material more convenient in prior art scheme, the practicality is stronger, the security is higher.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a top view of the present utility model;

FIG. 3 is a bottom view of the present utility model;

fig. 4 is an enlarged view of fig. 3 at a in accordance with the present utility model.

Reference numerals: 1. the device comprises a base, 2, a telescopic rod, 21, a guide rail, 22, a screw rod, 23, a sliding block, 24, a driving motor, 3, a jacking mechanism, 31, a fixed plate, 32, a frame body, 33, a limit spring, 34, a heat-preserving inner shell, 35, a groove, 36, a first copper sheet, 37, an electric heating tube, 38, a support shaft, 4, a bottom-measuring mechanism, 41, a base, 42, a square groove, 43, an inner heat-preserving shell, 44, a heater, 45, a second copper sheet, 5, a picking mechanism, 51, a turntable, 52, a telescopic cylinder, 53, a cross rod, 54, a negative pressure pump, 55, a negative pressure pipe, 56, a sucker, 6, a mounting mechanism, 61, a clamping seat, 62, a fixed screw, 63, a knob, 64, a antiskid plate, 7, a placing frame, 8, a storage frame, 9 and a bridge handrail.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1-4, a semiconductor assembly line testing device according to this embodiment includes a base 1, a telescopic rod 2 is provided at the rear end of the top of the base 1, a top testing mechanism 3 is fixedly mounted at the upper end of the front surface of the telescopic rod 2, a bottom testing mechanism 4 is provided under the top of the base 1 located under the top mechanism, a picking mechanism 5 is fixedly mounted at the left side of the top of the base 1, and a mounting mechanism 6 is fixedly mounted at the rear end of the bottom of the base 1:

the telescopic rod 2 is characterized in that a guide rail 21 is fixedly arranged at the rear end of the top of the base 1, a screw rod 22 is rotatably connected to the inner side of the guide rail 21, a sliding block 23 is connected to the outer surface of the screw rod 22 in a threaded manner, the front surface of the sliding block 23 is fixedly connected with the back surface of the top measuring mechanism 3, a driving motor 24 is fixedly arranged at the top of the guide rail 21, and the bottom output end of the driving motor 24 is fixedly connected with the top of the screw rod 22;

the jacking mechanism 3 comprises a fixed plate 31, the fixed plate 31 is fixedly arranged on the front surface of the sliding block 23, a frame 32 is fixedly arranged at the bottom of the fixed plate 31, a limit spring 33 is fixedly arranged at the inner side of the frame 32 at equal intervals, a heat-insulating inner shell 34 is arranged at the bottom of the limit spring 33, grooves 35 are formed at the two sides of the heat-insulating inner shell 34 at equal intervals, a first copper sheet 36 is arranged in the grooves 35, and an electric heating tube 37 is fixedly arranged in the heat-insulating inner shell 34;

the bottom measuring mechanism 4 comprises a base 41, the base 41 is fixedly arranged in the middle of the top of the base 1, a square groove 42 is formed in the top of the base 41, an inner heat preservation shell 43 is fixedly arranged on the inner side of the square groove 42, a heater 44 is fixedly arranged on the inner side of the inner heat preservation shell 43, and second copper sheets 45 are arranged on the two sides of the heater 44 at equal intervals;

the piece taking mechanism 5 comprises a rotary table 51, the rotary table 51 is rotatably connected to the left side of the top of the base 1, a telescopic cylinder 52 is fixedly arranged at the top of the rotary table 51, a cross rod 53 is fixedly arranged at the top of the telescopic cylinder 52, a negative pressure pump 54 is fixedly arranged at the left side of the top of the cross rod 53, a negative pressure pipe 55 is arranged at the bottom input end of the negative pressure pump 54, a sucker 56 is fixedly arranged at the bottom of the negative pressure pipe 55 penetrating through the cross rod 53, and a handle is fixedly arranged at the right side of the cross rod 53.

Example 2

Referring to fig. 1-4, in order to achieve the purpose of improving the detection stability of the device based on embodiment 1, the present embodiment innovates the heat-preserving inner shell 34, specifically, both sides of the top of the heat-preserving inner shell 34 are fixedly provided with support shafts 38, and the upper ends of the support shafts 38 penetrate through the frame 32; by providing the fulcrum 38, the heat-retaining inner shell 34 is supported in an auxiliary manner, thereby improving overall stability.

Referring to fig. 1-4, in order to achieve the purpose of improving the sliding stability of the slider 23 inside the guide rail 21, both the top-view shape of the slider 23 and the cross-sectional shape inside the guide rail 21 in this embodiment are convex, and the outer surface of the slider 23 is provided with a wear-resistant pad; by arranging the convex sliding block 23 and the inner side of the guide rail 21, the sliding stability of the sliding block 23 on the inner side of the guide rail 21 can be improved, and by arranging the wear-resistant gasket, the friction resistance of the sliding block 23 can be improved, and the use stability is improved.

Example 3

Referring to fig. 1-4, in this embodiment, in order to achieve the purpose of improving the installation convenience of the device based on embodiment 2, the installation mechanism 6 is innovatively designed, specifically, the installation mechanism 6 includes a clamping seat 61, the clamping seat 61 is fixedly installed at the bottom rear end of the base 1, the side surface of the clamping seat 61 is L-shaped, both sides of the bottom of the clamping seat 61 are in threaded connection with a fixing screw 62, and the top of the fixing screw 62 penetrates through the clamping seat 61; by arranging the clamping seat 61, the clamping seat can be clamped at a position required to be installed, for example, the side surface of the operation table surface or the edge of the table top frame body, and the position required to be installed can be fixed by tightening the fixing screw 62 to move upwards.

Referring to fig. 1 to 4, in order to achieve the purpose of improving the installation convenience and the installation stability, a knob 63 is fixedly installed at the bottom of a fixing screw 62 of the present embodiment, an anti-slip pattern is provided on the outer surface of the knob 63, an anti-slip plate 64 is fixedly installed at the top of the fixing screw 62, and an anti-slip rubber pad is provided at the top of the anti-slip plate 64; the friction force of the outer end of the fixing screw rod 62 can be improved through setting the knob 63 and the anti-skid patterns on the outer surface of the knob 63, so that the installation stability is improved, the anti-skid rubber pad is arranged at the top of the anti-skid plate 64, the stability of the top laminating installation position of the fixing screw rod 62 can be improved, and the installation stability of the device is improved.

Referring to fig. 1 to 4, for the purpose of facilitating collection of the tested semiconductors, a placement frame 7 is fixedly mounted on the left side of the top of the base 41 of the present embodiment, and a storage frame 8 is placed inside the placement frame 7; through setting up the storage frame 8 of placing frame 7 and inboard, can be convenient for place the semiconductor after the test, and set up bridge handrail 9, can be convenient for draw out and deposit frame 8, facilitate the use.

The use principle and the advantages are that: when in use, the clamping seat 61 is clamped on a tabletop or a tabletop rack, the knob 63 is tightened to drive the fixing screw 62 upwards, so that the anti-skid plate 64 is attached to the position required to be installed, the fixing can be completed, after the installation is completed, a semiconductor can be placed on the top of the heater 44 on the base 41, the screw rod 22 can be driven by starting driving to drive the sliding block 23 to move downwards, the fixing plate 31 can be driven to move downwards, the thermal insulation inner shell 34 can be driven to move downwards in an auxiliary manner through the fixing plate 31, the thermal insulation inner shell 34 is inserted into the thermal insulation inner shell, the semiconductor can be positioned between the heater 44 and the electric heating tube 37, the electric heating tube 37 and the heater 44 are started to heat at the moment, meanwhile, the second copper sheet 45 is inserted into the groove 35 and the joint of the first copper sheet 36 to be connected with a power supply during the test, the test can be assisted, the thermal insulation inner shell 34 is supported and abutted with the limit spring 33 in an auxiliary manner, the thermal insulation inner shell 34 is stably inserted into the inner thermal insulation shell 43, so that a better protection and insulation effect is achieved, the protection capability is improved, after the test is finished, the fixing plate 31 can be driven to move upwards only by starting the driving motor 24 to rotate reversely, the bottom measuring mechanism 4 and the top side mechanism can be separated at the moment, the turntable 51 is driven to rotate by pulling the handle, the telescopic cylinder 52 at the top can be driven to rotate, the transverse rod 53 at the top of the telescopic cylinder 52 is driven to rotate, the negative pressure pipe 55 at the bottom of the negative pressure pump 54 moves to the top of the heater 44, the semiconductor can be adsorbed by starting the telescopic cylinder 52 to shrink and starting the negative pressure pump 54 to operate, then the telescopic cylinder 52 is rotated to the other side, the negative pressure pump 54 is closed at the moment, the semiconductor can fall inside the storage frame 8 on top of the placement frame 7.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor assembly line testing device is characterized in that: the telescopic device comprises a base (1), wherein a telescopic rod (2) is arranged at the rear end of the top of the base (1), a top measuring mechanism (3) is fixedly arranged at the upper end of the front face of the telescopic rod (2), a bottom measuring mechanism (4) is arranged right below a top side mechanism at the top of the base (1), a fetching mechanism (5) is fixedly arranged at the left side of the top of the base (1), and a mounting mechanism (6) is fixedly arranged at the rear end of the bottom of the base (1):

the telescopic rod (2) is characterized by comprising a guide rail (21), wherein the guide rail (21) is fixedly arranged at the rear end of the top of the base (1), a screw rod (22) is rotatably connected to the inner side of the guide rail (21), a sliding block (23) is connected to the outer surface of the screw rod (22) in a threaded manner, the front surface of the sliding block (23) is fixedly connected with the back surface of the jacking mechanism (3), a driving motor (24) is fixedly arranged at the top of the guide rail (21), and the bottom output end of the driving motor (24) is fixedly connected with the top of the screw rod (22);

the jacking mechanism (3) comprises a fixed plate (31), the fixed plate (31) is fixedly arranged on the front surface of the sliding block (23), a frame body (32) is fixedly arranged at the bottom of the fixed plate (31), limit springs (33) are fixedly arranged at equal intervals on the inner sides of the frame body (32), heat-insulating inner shells (34) are arranged at the bottoms of the limit springs (33), grooves (35) are formed in the two sides of the heat-insulating inner shells (34) at equal intervals, first copper sheets (36) are arranged in the grooves (35), and electric heating pipes (37) are fixedly arranged in the heat-insulating inner shells (34);

the bottom measuring mechanism (4) comprises a base (41), the base (41) is fixedly arranged in the middle of the top of the base (1), a square groove (42) is formed in the top of the base (41), an inner heat insulation shell (43) is fixedly arranged on the inner side of the square groove (42), a heater (44) is fixedly arranged on the inner side of the inner heat insulation shell (43), and second copper sheets (45) are arranged on two sides of the heater (44) at equal intervals;

get a mechanism (5) including carousel (51), carousel (51) rotate and connect in the top left side of base (1), the top fixed mounting of carousel (51) has flexible cylinder (52), the top fixed mounting of flexible cylinder (52) has horizontal pole (53), the top left side fixed mounting of horizontal pole (53) has negative pressure pump (54), the bottom input of negative pressure pump (54) is equipped with negative pressure pipe (55), the bottom of negative pressure pipe (55) runs through horizontal pole (53) fixed mounting and has sucking disc (56), the right side fixed mounting of horizontal pole (53) has the handle.

2. The semiconductor package testing apparatus according to claim 1, wherein: and support shafts (38) are fixedly arranged on two sides of the top of the heat-insulating inner shell (34), and the upper ends of the support shafts (38) penetrate through the frame body (32).

3. The semiconductor package testing apparatus according to claim 2, wherein: the top view shape of the sliding block (23) and the cross section shape of the inner side of the guide rail (21) are both convex, and the outer surface of the sliding block (23) is provided with a wear-resistant gasket.

4. A semiconductor package testing apparatus according to claim 3, wherein: the mounting mechanism (6) comprises a clamping seat (61), the clamping seat (61) is fixedly mounted at the rear end of the bottom of the base (1), the side surface of the clamping seat (61) is L-shaped, fixing screws (62) are connected with two sides of the bottom of the clamping seat (61) in a threaded mode, and the tops of the fixing screws (62) penetrate through the clamping seat (61).

5. The semiconductor package assembly of claim 4, wherein: the bottom of the fixing screw rod (62) is fixedly provided with a knob (63), and the outer surface of the knob (63) is provided with anti-skid patterns.

6. The semiconductor package assembly of claim 5, wherein: the top of the fixed screw (62) is fixedly provided with a antiskid plate (64), and the top of the antiskid plate (64) is provided with an antiskid rubber mat.

7. The semiconductor package assembly of claim 6, wherein: the left side of the top of the base (41) is fixedly provided with a placement frame (7), and the inner side of the placement frame (7) is provided with a storage frame (8).

8. The semiconductor package testing apparatus of claim 7, wherein: the side and front of the storage frame (8) are both in the shape of an inverted isosceles trapezoid, and bridge armrests (9) are arranged on two sides of the top of the storage frame (8).